CN108505042A - A kind of the PCB thinned copper liquid of high speed and preparation method - Google Patents
A kind of the PCB thinned copper liquid of high speed and preparation method Download PDFInfo
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- CN108505042A CN108505042A CN201810502612.9A CN201810502612A CN108505042A CN 108505042 A CN108505042 A CN 108505042A CN 201810502612 A CN201810502612 A CN 201810502612A CN 108505042 A CN108505042 A CN 108505042A
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- thinned
- high speed
- copper
- copper liquid
- stabilizer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a kind of PCB high speeds, and copper liquid and preparation method is thinned, and is applied to copper and etching process is thinned, the etching solution includes accelerating agent, surfactant, PH conditioning agents, H2O2Stabilizer and solvent, based on etching solution described in every L, the accelerator content is 30 36g, and the surface-active contents are 12 18g, and the PH conditioning agents are the 50% concentration sulphuric acid solution of 100 140ml, and the solvent is the water of 700 740ml, the H2O2Stabilizer includes three kinds of components, wherein first group is divided into 35 45ml, second group is divided into 15 21ml, and third component is 50 54g, wherein the H2O2Stabilizer is for reducing H2O2Decomposition rate, improve the high speed be thinned copper liquid copper ion patience.
Description
Technical field
The present invention relates to chemical medicinal liquid fields more particularly to a kind of PCB high speeds, and copper liquid and preparation method is thinned.
Background technology
High frequency with electronic product and fining, PCB (Printed Circuit Board, printed wiring board) productions
The accounting of HF link plate and HDI (High Density Interconnector, high density interconnection) wiring board in industry by
Year increases, and the fine-line on high frequency plate and HDI plates is needed using fast-etching processing procedure to ensure circuit precision, at present in the industry
In common dioxysulfate aqueous systems micro-corrosion liquid, due to the high-copper ionic environment residing for etch process, play main etch
H2O2Homogeneous and heterogeneous catalysis is generated in high concentration copper ion environment, accelerates H2O2Decomposition rate, and then cause to etch
The reduction of rate is unsatisfactory for the required fast-etching making technology of fine-line.
To solve the above problems, the mode for being typically employed in increase water supply in fast-etching processing procedure in the industry is passively controlled
Copper ion concentration in etching solution processed, to slow down H2O2Decomposition rate, but with due in etch process copper ion it is continuous tired
Product needs copper ion concentration control to waste a large amount of water in ideal range, also results in the row of etching sewage
High-volume increase, it is extremely unfriendly to environment.
Invention content
The embodiment of the present invention provides a kind of the PCB thinned copper liquid of high speed and preparation method, can effectively reduce dioxysulfate water
H in system micro-corrosion liquid2O2Decomposition rate, ensure the required fast etch rate of fine-line, meet fine-line make institute
The fast-etching needed makes.
In a first aspect, the embodiment of the present invention provides a kind of thinned copper liquid of high speed, it is applied to copper and etching process is thinned, subtract at a high speed
Thin copper liquid includes accelerating agent, surfactant, PH conditioning agents, H2O2Copper liquid is thinned at a high speed by described in every L in stabilizer and solvent
Meter, accelerator content 30-36g, surface-active contents 12-18g, PH conditioning agent are the 50% concentration sulphur of 100-140ml
Acid solution, solvent are the water of 700-740ml, H2O2Stabilizer includes three kinds of components, wherein first group is divided into 35-45ml, second group
It is divided into 15-21ml, third component 50-54g, wherein H2O2Stabilizer is for reducing H2O2Decomposition rate, improve the erosion
Carve the copper ion patience of liquid medicine.
Second aspect, the embodiment of the present invention provide a kind of preparation method of the thinned copper liquid of high speed, including：
60% solvent is added into reaction vessel to scale；
Accelerating agent, H is added into the reaction vessel successively to scale2O2Stabilizer, surfactant and PH are adjusted
Agent；
Stirring to component dissolves；
Residual solvent is added to the reaction vessel.
Copper liquid and preparation method, belonging sulfuric acid+H is thinned with high speed in a kind of PCB provided in an embodiment of the present invention2O2Etching
Liquid system, wherein accelerating agent and PH conditioning agents constitute main high speed and copper liquid ingredient are thinned, and realize the etching to PCB fine-lines,
Accelerating agent assists PH conditioning agents to be co-stretched the etching to pcb board face copper, ensures that faster micro-etching speed, surfactant are used for
Ensure the uniform adsorption during microetch, the uniformity in pcb board face after microetch is improved, in addition, H2O2Stabilizer is by improving high speed
H in copper liquid is thinned2O2To the patience of copper ion concentration, the H that high speed is thinned in copper liquid is reduced2O2Decomposition rate ensures fine lines
It is lasting that the required fast etch rate in road is stablized, not the rapid decrease due to rising of copper ion concentration, and then meets fine lines
Road makes required fast-etching and makes.
Description of the drawings
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to needed in embodiment description
Attached drawing is briefly described, it should be apparent that, drawings in the following description are some embodiments of the invention, for this field skill
For art personnel, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is the schematic flow diagram that copper liquid preparation method is thinned with high speed by a kind of PCB of the embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
It should be appreciated that ought use in this specification and in the appended claims, term " comprising " and "comprising" instruction
Described feature, entirety, step, operation, the presence of element and/or component, but one or more of the other feature, whole is not precluded
Body, step, operation, element, component and/or its presence or addition gathered.
It is also understood that the term used in this description of the invention is merely for the sake of the mesh for describing specific embodiment
And be not intended to limit the present invention.As description of the invention and it is used in the attached claims, unless on
Other situations are hereafter clearly indicated, otherwise " one " of singulative, "one" and "the" are intended to include plural form.
It will be further appreciated that the term "and/or" used in description of the invention and the appended claims is
Refer to any combinations and all possible combinations of one or more of associated item listed, and includes these combinations.
The embodiment of the present invention provides a kind of PCB thinned copper liquids of high speed, and etch process is thinned in the copper for being applied to the fields PCB,
It includes accelerating agent, surfactant, PH conditioning agents, H that copper liquid, which is thinned, in high speed2O2Stabilizer and solvent are subtracted at a high speed as described in every L
Thin copper liquid meter, the accelerator content are 30-36g, and the surface-active contents are 12-18g, and the PH conditioning agents are 100-
The 50% concentration sulphuric acid solution of 140ml, the solvent are the water of 700-740ml, the H2O2Stabilizer includes three kinds of components,
In first group be divided into 35-45ml, second group is divided into 15-21ml, third component 50-54g, wherein the H2O2Stabilizer is used for
Reduce H2O2Decomposition rate, improve the high speed be thinned copper liquid copper ion patience.
Copper liquid, belonging sulfuric acid+H is thinned in high speed provided in an embodiment of the present invention2O2Etching solution system, wherein accelerating agent and
PH conditioning agents constitute main etch liquid ingredient, realize that the etching to PCB fine-lines, accelerating agent assist PH conditioning agents to be co-stretched
Etching to pcb board face copper ensures that faster micro-etching speed, surfactant are used to ensure the uniform adsorption during microetch,
The uniformity in pcb board face after raising microetch, in addition, in the prior art, sulfuric acid+H2O2Etching solution system has faster etching
Rate and be widely used, main disadvantage is just H2O2It is relatively low to the patience of copper ion concentration, it is generally the case that when
When copper ion concentration in etching solution is more than 40g/L, the H in the system2O2Decomposition faster will occur, so as to cause erosion
The rapid decrease of etching speed, the embodiment of the present invention add H by being thinned in copper liquid in high speed2O2Stabilizer improves high speed and copper is thinned
H in liquid2O2To the patience of copper ion concentration, the H that high speed is thinned in copper liquid is reduced2O2Decomposition rate ensures needed for fine-line
It is lasting that the fast etch rate wanted is stablized, not the rapid decrease due to rising of copper ion concentration, and then preferably meets fine lines
Road makes required fast-etching and makes.
Alternatively, in the embodiment of the present invention, accelerating agent selects sodium thiosulfate；Sodium thiosulfate is selected to make
For accelerating agent, main function is the starting reaction for assisting high speed that copper liquid is thinned, and it is double to react composition sulfuric acid jointly with sulfuric acid solution
Liquid system is carved in oxygen water erosion.
Alternatively, in the embodiment of the present invention, surfactant selects tetrasodium ethylenediamine tetraacetate；Ethylenediamine
For four sodium of tetraacethyl as surfactant, main function is to ensure that the main function ingredient of copper liquid is thinned in pcb board table in high speed
The uniform adsorption in face, to make pcb board surface obtain the preferably etching uniformity.
Alternatively, the H of the embodiment of the present invention2O2In stabilizer, first group is divided into antifebrin, second group
It is divided into ethylene glycol, third component is natrium phenolsulfonicum；
Specifically, as in background technology and previous embodiment it is found that dioxysulfate water erosion carve liquid system in often be faced with H2O2
Because of copper ion concentration rising the problem of fast decoupled, the copper ion tolerance that liquid system is carved in common dioxysulfate water erosion is
40g/L or so, when etching the copper ion concentration in liquor more than the value, because of H2O2Fast decoupled, etching solution is to PCB
The etch-rate of plate face copper can drop in the section of 5-8um/min, the reduction of etch-rate, not only result in etching support
Duration increases, and the influence of bigger is when being etched for precise circuit so that the accurate control for etching degree is not easy to hold, to life
Production. art brings puzzlement and uncertainty, by increasing the H provided in the embodiment of the present invention2O2Stabilizer, can be effectively by sulphur
H in sour hydrogen peroxide etching solution system2O2The copper ion tolerance of ingredient is promoted near 65g/L, by repeatedly testing and testing
Card, the copper ion can substantially meet the copper ion environment in the support of PCB microetches, and then can be in conjunction with the operation on production line
Parameter adjustment, the etch-rate that system high speed is thinned to copper liquid are maintained at some constant rate of speed in the sections 5-13um/min
On, to improve the stability of attenuation etching liquid, constant micro-etching speed is realized, it is not big because of the increase of copper ion concentration
Width declines so that entire etch process is more controllable, corresponding, and uniformity is also more preferable at the time of pcb board surface.
Alternatively, solvent used in the embodiment of the present invention is deionized water.
Referring to Fig. 1, a kind of preparation method of the thinned copper liquid of high speed provided in an embodiment of the present invention, including：
S11：60% solvent is added into reaction vessel to scale；
S12：Accelerating agent, H is added into the reaction vessel successively to scale2O2Stabilizer, surfactant and PH tune
Save agent；
S13：Stirring to component dissolves；
S14：Residual solvent is added to the reaction vessel.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can readily occur in various equivalent modifications or replace
It changes, these modifications or substitutions should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with right
It is required that protection domain subject to.
Claims (6)
1. copper liquid is thinned with high speed in a kind of PCB, it is applied to copper and etching process is thinned, which is characterized in that copper liquid is thinned in the high speed
Including accelerating agent, surfactant, PH conditioning agents, H2O2Stabilizer and solvent, by described in every L at a high speed be thinned copper liquid based on, it is described
Accelerator content is 30-36g, and the surface-active contents are 12-18g, and the PH conditioning agents are the 50% dense of 100-140ml
Sulfuric acid solution is spent, the solvent is the water of 700-740ml, the H2O2Stabilizer includes three kinds of components, wherein first group is divided into
35-45ml, second group is divided into 15-21ml, third component 50-54g, wherein the H2O2Stabilizer is for reducing H2O2Point
Rate is solved, the copper ion patience of the etching solution is improved.
2. copper liquid is thinned with high speed in PCB according to claim 1, which is characterized in that the accelerating agent is sodium thiosulfate.
3. copper liquid is thinned with high speed in PCB according to claim 1, which is characterized in that the surfactant is ethylenediamine
Four sodium of tetraacethyl.
4. copper liquid is thinned with high speed in PCB according to claim 1, which is characterized in that the H2O2In stabilizer, described
One group is divided into antifebrin, and described second group is divided into ethylene glycol, and the third component is natrium phenolsulfonicum.
5. copper liquid is thinned with high speed in PCB according to claim 1, which is characterized in that the solvent is deionized water.
6. the preparation method of copper liquid is thinned with high speed by a kind of PCB, which is characterized in that the preparation method includes：
60% solvent is added into reaction vessel to scale；
Accelerating agent, H is added into the reaction vessel successively to scale2O2Stabilizer, surfactant and PH conditioning agents；
Stirring to component dissolves；
Residual solvent is added to the reaction vessel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810502612.9A CN108505042A (en) | 2018-05-23 | 2018-05-23 | A kind of the PCB thinned copper liquid of high speed and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810502612.9A CN108505042A (en) | 2018-05-23 | 2018-05-23 | A kind of the PCB thinned copper liquid of high speed and preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108505042A true CN108505042A (en) | 2018-09-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810502612.9A Pending CN108505042A (en) | 2018-05-23 | 2018-05-23 | A kind of the PCB thinned copper liquid of high speed and preparation method |
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| CN (1) | CN108505042A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110983336A (en) * | 2019-11-15 | 2020-04-10 | 哈焊所华通（常州）焊业股份有限公司 | Deplating solution for copper-plated welding wire and copper deplating method thereof |
| CN112351593A (en) * | 2020-11-16 | 2021-02-09 | 珠海联鼎化工设备有限公司 | OSP microetching pretreatment liquid for printed circuit board and microetching method |
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| EP1903081A2 (en) * | 2006-09-19 | 2008-03-26 | Poligrat Gmbh | Stabiliser for acid, metallic polishing baths |
| CN103966606A (en) * | 2014-05-06 | 2014-08-06 | 汕头超声印制板（二厂）有限公司 | Copper reduction etching liquid for printed circuit boards |
| CN105765107A (en) * | 2013-11-25 | 2016-07-13 | 松下知识产权经营株式会社 | Multilayer-film etchant, concentrated etchant, and etching method |
| CN108060420A (en) * | 2017-12-27 | 2018-05-22 | 上海新阳半导体材料股份有限公司 | A kind of etching liquid and its preparation method and application |
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2018
- 2018-05-23 CN CN201810502612.9A patent/CN108505042A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1903081A2 (en) * | 2006-09-19 | 2008-03-26 | Poligrat Gmbh | Stabiliser for acid, metallic polishing baths |
| CN105765107A (en) * | 2013-11-25 | 2016-07-13 | 松下知识产权经营株式会社 | Multilayer-film etchant, concentrated etchant, and etching method |
| CN103966606A (en) * | 2014-05-06 | 2014-08-06 | 汕头超声印制板（二厂）有限公司 | Copper reduction etching liquid for printed circuit boards |
| CN108060420A (en) * | 2017-12-27 | 2018-05-22 | 上海新阳半导体材料股份有限公司 | A kind of etching liquid and its preparation method and application |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110983336A (en) * | 2019-11-15 | 2020-04-10 | 哈焊所华通（常州）焊业股份有限公司 | Deplating solution for copper-plated welding wire and copper deplating method thereof |
| CN110983336B (en) * | 2019-11-15 | 2021-12-10 | 哈焊所华通（常州）焊业股份有限公司 | Deplating solution for copper-plated welding wire and copper deplating method thereof |
| CN112351593A (en) * | 2020-11-16 | 2021-02-09 | 珠海联鼎化工设备有限公司 | OSP microetching pretreatment liquid for printed circuit board and microetching method |
| CN112351593B (en) * | 2020-11-16 | 2022-07-12 | 珠海联鼎化工设备有限公司 | OSP microetching pretreatment liquid for printed circuit board and microetching method |
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Application publication date: 20180907 |