CN108503873A - A kind of preparation method of metal substrate filling perforation film - Google Patents
A kind of preparation method of metal substrate filling perforation film Download PDFInfo
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- CN108503873A CN108503873A CN201810286464.1A CN201810286464A CN108503873A CN 108503873 A CN108503873 A CN 108503873A CN 201810286464 A CN201810286464 A CN 201810286464A CN 108503873 A CN108503873 A CN 108503873A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2461/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2461/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a kind of preparation methods of metal substrate filling perforation film, include the following steps：The preparation of S1, resin adhesive liquid；The preparation of S2, film；S3, the surface that above-mentioned resin adhesive liquid is applied to PET films using precision coating machine, film be set between metallic plate and copper foil, then carry out seven section oven drieds to get.The compounding that the present invention passes through novolac epoxy resin, polyfunctional epoxy resin, linear phenol-aldehyde resin, toughener and high heat conduction filler, suitable curing agent, accelerating agent, solvent and other auxiliary agents are added to be prepared, with good fillibility, proof voltage energy, machining property, heat resistance and heat resistant performance, high voltage, height heat dissipation, the requirement of pb-free solder can be met.
Description
Technical field
The present invention relates to a kind of metal substrate filling perforation film, the preparation method of specifically a kind of metal substrate filling perforation film.
Background technology
In recent years, the illumination of light emitting diode and backlight technology are gradually matured, and its Related product also begin to it is general
And.A large amount of thermal energy can be supervened while generating light by being currently known light emitting diode, if thermal energy can not be effective at this time
It is discharged by light emitting diode, it will reduce the luminous efficiency of light emitting diode.In this regard, traditional printed circuit board is due to heat transfer
Rate is not high, needed for the substrate for not applying the high light emitting diode of radiating requirements gradually, therefore uses the higher metal of radiating efficiency
Substrate or metal core (core) substrate are preferably selection.
In general, the structure of metal substrate mainly contains a metallic plate, surface is sequentially covered with insulating materials and copper
Foil, and it can be made as single or double plate.At present make double-sided metal substrate when, need to be drilled, filling perforation, secondary drilling and
Plating and etc., it mainly first passes through machinery or laser mode forms first through hole through metal substrate, and with insulating resin
Or insulating heat-conductive resin filling perforation, after resin baking-curing, then the second smaller through-hole of an aperture is bored, finally in the second through-hole
Filling conductive materials form conductive layer using plating, are connected with the conducting wire for reaching two-sided.
Existing metal substrate filling perforation film has the disadvantages that：Proof voltage energy, machining property, heat resistance and
Heat resistant performance is poor, cannot preferably meet high voltage, height radiates and the requirement of pb-free solder.
Invention content
The purpose of the present invention is to provide a kind of preparation methods of metal substrate filling perforation film, to solve above-mentioned background technology
The problem of middle proposition.
To achieve the above object, the present invention provides the following technical solutions：
A kind of preparation method of metal substrate filling perforation film, includes the following steps：
The preparation of S1, resin adhesive liquid：Take a certain proportion of novolac epoxy resin, polyfunctional epoxy resin, toughener, line style
Phenolic resin and accelerating agent are stirred 0.5-1 hours after dispersion grinding；Then organic solvent, curing agent, auxiliary agent is added and leads
Hot filler is stirred 8 hours, then places 12 hours, spare；
The preparation of S2, film；
Then it is dry to carry out seven section ovens for S3, the surface that above-mentioned resin adhesive liquid is applied to PET films using precision coating machine
It is dry to get.
As a further solution of the present invention：Step S1 includes 39-45 parts of novolac epoxy resin, polyfunctional epoxy resin
3.7-4.9 parts, 0.072-0.093 parts of toughener, 7.8-8.9 parts of linear phenol-aldehyde resin, 0.55-0.59 parts of accelerating agent, heat conduction fills out
32-42 parts of material, 0.027-0.035 parts of auxiliary agent, 0.12-0.25 parts of curing agent.
As a further solution of the present invention：The thickness of film is 35-50 microns in step S2.
As a further solution of the present invention：The thickness for the resin adhesive liquid that film upper and lower surface is coated in step S3
It is 50-200 microns.
As a further solution of the present invention：The temperature of seven section ovens sets gradually as 70-80 DEG C, 70-80 in step S3
DEG C, 100-110 DEG C, 120-130 DEG C, 140-150 DEG C, 160 DEG C and 160 DEG C.
Compared with prior art, the beneficial effects of the invention are as follows：
The present invention passes through novolac epoxy resin, polyfunctional epoxy resin, linear phenol-aldehyde resin, toughener and high heat conduction filler
Compounding, add suitable curing agent, accelerating agent, solvent and other auxiliary agents and be prepared, have good fillibility, proof voltage
Performance, machining property, heat resistance and heat resistant performance, can meet high voltage, and height heat dissipation, pb-free solder are wanted
It asks.
Specific implementation mode
The technical solution of this patent is described in more detail With reference to embodiment.
Embodiment 1
A kind of preparation method of metal substrate filling perforation film, includes the following steps：
The preparation of S1, resin adhesive liquid：According to parts by weight take 39 parts of novolac epoxy resin, 3.7 parts of polyfunctional epoxy resin,
0.55 part of 0.072 part of toughener, 7.8 parts of linear phenol-aldehyde resin and accelerating agent are stirred 0.5 hour after dispersion grinding；Then
100 parts of 32 parts of heat filling, 0.027 part of auxiliary agent, 0.12 part of curing agent and organic solvent is added, is stirred 8 hours, then puts
It sets 12 hours, it is spare；
The preparation of S2, film；The thickness of film is 35 microns；
S3, the surface that above-mentioned resin adhesive liquid is applied to PET films using precision coating machine, film upper and lower surface
The thickness of the resin adhesive liquid of coating is 50 microns；Then carry out seven section oven drieds to get.The temperature of seven section ovens is set successively
It is set to 70 DEG C, 70 DEG C, 100 DEG C, 120 DEG C, 140 DEG C, 160 DEG C and 160 DEG C.
Embodiment 2
A kind of preparation method of metal substrate filling perforation film, includes the following steps：
The preparation of S1, resin adhesive liquid：According to parts by weight take 45 parts of novolac epoxy resin, 4.9 parts of polyfunctional epoxy resin,
0.59 part of 0.093 part of toughener, 8.9 parts of linear phenol-aldehyde resin and accelerating agent are stirred 1 hour after dispersion grinding；Then plus
Enter 150 parts of 42 parts of heat filling, 0.035 part of auxiliary agent, 0.25 part of curing agent and organic solvent, is stirred 8 hours, then places
It is 12 hours, spare；
The preparation of S2, film；The thickness of film is 50 microns；
S3, the surface that above-mentioned resin adhesive liquid is applied to PET films using precision coating machine, film upper and lower surface
The thickness of the resin adhesive liquid of coating is 200 microns；Then carry out seven section oven drieds to get.The temperature of seven section ovens is successively
It is set as 80 DEG C, 80 DEG C, 110 DEG C, 130 DEG C, 150 DEG C, 160 DEG C and 160 DEG C.
Embodiment 3
A kind of preparation method of metal substrate filling perforation film, includes the following steps：
The preparation of S1, resin adhesive liquid：42 parts of novolac epoxy resin is taken according to parts by weight, 4 parts of polyfunctional epoxy resin, is increased
0.57 part of tough dose 0.08 part, 8.2 parts of linear phenol-aldehyde resin and accelerating agent are stirred 0.8 hour after dispersion grinding；Then it is added
88 parts of 38 parts of heat filling, 0.03 part of auxiliary agent, 0.15 part of curing agent and organic solvent are stirred 8 hours, it is small then to place 12
When, it is spare；
The preparation of S2, film；The thickness of film is 45 microns；
S3, the surface that above-mentioned resin adhesive liquid is applied to PET films using precision coating machine, film upper and lower surface
The thickness of the resin adhesive liquid of coating is 150 microns；Then carry out seven section oven drieds to get.The temperature of seven section ovens is successively
It is set as 70 DEG C, 80 DEG C, 105 DEG C, 125 DEG C, 145 DEG C, 160 DEG C and 160 DEG C.
Embodiment 4
A kind of preparation method of metal substrate filling perforation film, includes the following steps：
The preparation of S1, resin adhesive liquid：According to parts by weight take 41 parts of novolac epoxy resin, 4.3 parts of polyfunctional epoxy resin,
0.56 part of 0.088 part of toughener, 8.5 parts of linear phenol-aldehyde resin and accelerating agent are stirred 0.9 hour after dispersion grinding；Then
125 parts of 34 parts of heat filling, 0.032 part of auxiliary agent, 0.21 part of curing agent and organic solvent is added, is stirred 8 hours, then puts
It sets 12 hours, it is spare；
The preparation of S2, film；The thickness of film is 43 microns；
S3, the surface that above-mentioned resin adhesive liquid is applied to PET films using precision coating machine, film upper and lower surface
The thickness of the resin adhesive liquid of coating is 120 microns；Then carry out seven section oven drieds to get.The temperature of seven section ovens is successively
It is set as 73 DEG C, 78 DEG C, 108 DEG C, 128 DEG C, 146 DEG C, 160 DEG C and 160 DEG C.
The better embodiment of this patent is explained in detail above, but this patent is not limited to above-mentioned embodiment party
Formula, one skilled in the relevant art within the scope of knowledge, can also be under the premise of not departing from this patent objective
Various changes can be made.
Claims (5)
1. a kind of preparation method of metal substrate filling perforation film, which is characterized in that include the following steps：
The preparation of S1, resin adhesive liquid：Take a certain proportion of novolac epoxy resin, polyfunctional epoxy resin, toughener, line style phenolic aldehyde
Resin and accelerating agent are stirred 0.5-1 hours after dispersion grinding；Then organic solvent, curing agent, auxiliary agent and heat conduction is added to fill out
Material is stirred 8 hours, then places 12 hours, spare；
The preparation of S2, film；
Then S3, the surface that above-mentioned resin adhesive liquid is applied to PET films using precision coating machine carry out seven section oven drieds,
To obtain the final product.
2. the preparation method of metal substrate filling perforation film according to claim 1, which is characterized in that step S1 includes phenol
39-45 parts of formaldehyde epoxy resin, 3.7-4.9 parts of polyfunctional epoxy resin, 0.072-0.093 parts of toughener, linear phenol-aldehyde resin
7.8-8.9 parts, 0.55-0.59 parts of accelerating agent, 32-42 parts of heat filling, 0.027-0.035 parts of auxiliary agent, curing agent 0.12-0.25
Part.
3. the preparation method of metal substrate filling perforation film according to claim 1, which is characterized in that film in step S2
Thickness is 35-50 microns.
4. the preparation method of metal substrate filling perforation film according to claim 1, which is characterized in that in step S3 on film
The thickness of the resin adhesive liquid of surface and lower surface coating is 50-200 microns.
5. the preparation method of metal substrate filling perforation film according to claim 1, which is characterized in that seven sections are roasting in step S3
It is 70-80 DEG C, 70-80 DEG C, 100-110 DEG C, 120-130 DEG C, 140-150 DEG C, 160 DEG C and 160 DEG C that the temperature of case, which is set gradually,.
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| CN201810286464.1A CN108503873A (en) | 2018-03-30 | 2018-03-30 | A kind of preparation method of metal substrate filling perforation film |
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| CN201810286464.1A CN108503873A (en) | 2018-03-30 | 2018-03-30 | A kind of preparation method of metal substrate filling perforation film |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111849003A (en) * | 2020-08-06 | 2020-10-30 | 广东创辉鑫材科技股份有限公司 | Preparation method of rubber sheet for filling holes in slotted holes of metal substrate |
| CN111909600A (en) * | 2020-08-06 | 2020-11-10 | 广东创辉鑫材科技股份有限公司 | Manufacturing method of high-thermal-conductivity resin for metal substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107791627A (en) * | 2017-10-27 | 2018-03-13 | 景旺电子科技(龙川)有限公司 | A kind of metal-based copper-clad plate preparation method of resinous composition |
| CN107825821A (en) * | 2017-12-05 | 2018-03-23 | 广东创辉鑫材科技有限公司东莞分公司 | A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity |
-
2018
- 2018-03-30 CN CN201810286464.1A patent/CN108503873A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107791627A (en) * | 2017-10-27 | 2018-03-13 | 景旺电子科技(龙川)有限公司 | A kind of metal-based copper-clad plate preparation method of resinous composition |
| CN107825821A (en) * | 2017-12-05 | 2018-03-23 | 广东创辉鑫材科技有限公司东莞分公司 | A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111849003A (en) * | 2020-08-06 | 2020-10-30 | 广东创辉鑫材科技股份有限公司 | Preparation method of rubber sheet for filling holes in slotted holes of metal substrate |
| CN111909600A (en) * | 2020-08-06 | 2020-11-10 | 广东创辉鑫材科技股份有限公司 | Manufacturing method of high-thermal-conductivity resin for metal substrate |
| CN111849003B (en) * | 2020-08-06 | 2021-01-19 | 广东创辉鑫材科技股份有限公司 | Preparation method of rubber sheet for filling holes in slotted holes of metal substrate |
| CN111909600B (en) * | 2020-08-06 | 2021-11-12 | 广东创辉鑫材科技股份有限公司 | Manufacturing method of high-thermal-conductivity resin for metal substrate |
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Application publication date: 20180907 |
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