CN107825821A - A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity - Google Patents
A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity Download PDFInfo
- Publication number
- CN107825821A CN107825821A CN201711268628.XA CN201711268628A CN107825821A CN 107825821 A CN107825821 A CN 107825821A CN 201711268628 A CN201711268628 A CN 201711268628A CN 107825821 A CN107825821 A CN 107825821A
- Authority
- CN
- China
- Prior art keywords
- metal
- clad plate
- based copper
- parts
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/552—Fatigue strength
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses a kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity, comprise the following steps：The preparation of resin adhesive liquid and the preparation of metal-based copper-clad plate, the beneficial effects of the invention are as follows：Cross novolac epoxy resin, polyfunctional epoxy resin, toughener, the compounding of high heat conduction filler, add appropriate curing agent, accelerator, solvent and other auxiliary agents, it successfully have developed a kind of metal-based copper-clad plate of high-Tg high-thermal conductivity, with good proof voltage energy, machining property, heat resistance and heat resistant performance, high radiating, the requirement of pb-free solder can be met.
Description
Technical field
The present invention is specifically a kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity.
Background technology
With electronic product to light, thin, small, high density, multifunction, microelectronics integrated technology direction high speed send out
Exhibition so that electronic component, logic circuit volume exponentially reduce, and working frequency sharply increases, and power consumption constantly increases, and leads
Component working environment is caused to decline to high temperature direction change, whole aircraft reliability, the lost of life.Develop the metal with high-termal conductivity
Base copper-clad plate, undoubtedly solve the most effective means of radiating and Structure Designing Problem.
In addition, with the needs of environmental protection, pb-free solder technique is just progressively substituting traditional lead jointing technique, welding temperature
More than 20 DEG C are improved, this heat resistance and reliability to metal substrate have proposed to require higher.
The content of the invention
It is above-mentioned to solve it is an object of the invention to provide a kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity
The problem of being proposed in background technology.
To achieve the above object, the present invention provides following technical scheme：
A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity, comprises the following steps：
S1, the preparation of resin adhesive liquid
Take a certain proportion of novolac epoxy resin, polyfunctional epoxy resin, toughener, linear phenol-aldehyde resin, accelerator, point
Dissipate and grind and cure mixing 0.5-1 hours, add organic solvent, curing agent and auxiliary agent and add heat filling afterwards, add and lead
Placed after the completion of hot filler and mixing in scattered 8 hours 12 hours it is standby；
S2, the preparation of metal-based copper-clad plate
Above-mentioned products obtained therefrom is applied on copper foil mat surface using precision coating machine, and the segmentation for carrying out seven section baking boxs is dried
Gum copper foil is obtained after roasting,
The glue surface of gum copper foil is bonded with Metal Substrate again, is placed in vacuum hotpressing machine and is vacuumized, heated and pressurizeed,
Metal-based copper-clad plate is made.
As the further scheme of the present invention：Novolac epoxy resin, polyfunctional epoxy resin, toughener, line in step S1
Type phenolic resin, accelerator, the portion rate of heat filling and auxiliary agent are：Novolac epoxy resin 19-25 parts, polyfunctional epoxy resin
3.7-4.9 parts, toughener 0.072-0.093 parts, linear phenol-aldehyde resin 7.8-8.9 parts, accelerator 0.55-0.59 parts, heat conduction are filled out
Expect 55-62 parts, auxiliary agent 0.027-0.035 parts.
As further scheme of the invention：The thickness of copper foil described in step S2 is 17-140 microns, gum copper foil
Glue thickness be 50-200 microns.
As further scheme of the invention：It is described seven section baking box temperature set gradually for 70-80 DEG C, 70-80 DEG C,
100-110 DEG C, 120-130 DEG C, 140-150 DEG C, 160 DEG C and 160 DEG C.
Compared with prior art, the beneficial effects of the invention are as follows：Cross novolac epoxy resin, polyfunctional epoxy resin, toughness reinforcing
Agent, the compounding of high heat conduction filler, appropriate curing agent, accelerator, solvent and other auxiliary agents are added, successfully have developed a kind of high Tg
The metal-based copper-clad plate of high heat conduction, there is good proof voltage energy, machining property, heat resistance and high temperature degradation resistance
Can, high radiating, the requirement of pb-free solder can be met.
Embodiment
The technical scheme of this patent is described in more detail with reference to embodiment.
Embodiment 1
A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity, comprises the following steps；
S1, the preparation of resin adhesive liquid
19 parts of novolac epoxy resin, 3.7 parts of polyfunctional epoxy resin, 0.072 part of toughener, line style phenol are weighed by weight
0.027 part of 7.8 parts of urea formaldehyde, 0.55 part of accelerator, 55 parts of heat filling and auxiliary agent, it is scattered to grind and cure 0.5 hour, obtain
Resin adhesive liquid；
Add organic solvent, curing agent and auxiliary agent and add heat filling afterwards, add heat filling and scattered 8 hours mixed
Placed after the completion of conjunction 12 hours it is standby；
S2, the preparation of metal-based copper-clad plate
Above-mentioned products obtained therefrom is applied on 17 microns thick of copper foil mat surface using precision coating machine, glue thickness is 50 micro-
Rice, and gum copper foil is obtained after carrying out the segmentations baking of seven section baking boxs, the temperature of seven section baking boxs set gradually for 70 DEG C, 70 DEG C,
100 DEG C, 120 DEG C, 140 DEG C, 160 DEG C and 160 DEG C；
The glue surface of gum copper foil is bonded with Metal Substrate again, is placed in vacuum hotpressing machine and vacuumizes, heats and pressurize, be made
Metal-based copper-clad plate.
Embodiment 2
A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity, comprises the following steps；
S1, the preparation of resin adhesive liquid
22 parts of novolac epoxy resin, 4.3 parts of polyfunctional epoxy resin, 0.082 part of toughener, line style phenol are weighed by weight
8.3 parts of urea formaldehyde, 0.57 part of accelerator, 58 parts of heat filling, 0.031 part of auxiliary agent, it is scattered to grind and cure 1 hour, set
Fat glue；
Organic solvent, curing agent and auxiliary agent are added into above-mentioned gained and adds heat filling afterwards, adds heat filling
And placed after the completion of mixing in scattered 8 hours 12 hours it is standby；
S2, the preparation of metal-based copper-clad plate
Above-mentioned products obtained therefrom is applied on 78 microns thick of copper foil mat surface using precision coating machine, glue thickness is 125 micro-
Rice, and gum copper foil is obtained after carrying out the segmentations baking of seven section baking boxs, the temperature of seven section baking boxs set gradually for 70 DEG C, 70 DEG C,
100 DEG C, 120 DEG C, 140 DEG C, 160 DEG C and 160 DEG C；
The glue surface of gum copper foil is bonded with Metal Substrate again, is placed in vacuum hotpressing machine and vacuumizes, heats and pressurize, be made
Metal-based copper-clad plate.
Embodiment 3
A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity, comprises the following steps；
S1, the preparation of resin adhesive liquid
25 parts of novolac epoxy resin, 4.9 parts of polyfunctional epoxy resin, 0.093 part of toughener, line style phenol are weighed by weight
8.9 parts of urea formaldehyde, 0.59 part of accelerator, 62 parts of heat filling, 0.035 part of auxiliary agent, it is scattered to grind and cure 0.75 hour, obtain
Resin adhesive liquid；
Organic solvent, curing agent and auxiliary agent are added into above-mentioned gained and adds heat filling afterwards, adds heat filling
And placed after the completion of mixing in scattered 8 hours 12 hours it is standby；
S2, the preparation of metal-based copper-clad plate
Above-mentioned products obtained therefrom is applied on 17 microns thick of copper foil mat surface using precision coating machine, glue thickness is 200 micro-
Rice, and gum copper foil is obtained after carrying out the segmentations baking of seven section baking boxs, the temperature of seven section baking boxs set gradually for 70 DEG C, 70 DEG C,
100 DEG C, 120 DEG C, 140 DEG C, 160 DEG C and 160 DEG C；
The glue surface of gum copper foil is bonded with Metal Substrate again, is placed in vacuum hotpressing machine and vacuumizes, heats and pressurize, be made
Metal-based copper-clad plate.
Metal-based copper-clad plate prepare after the completion of, it is necessary to carry out glass transition temperature, the plate bursting time, thermal stress, thermal resistance and
The test of thermal conductivity factor, high temperature ageing, proof voltage, machining property and peel strength.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than described above limits, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (4)
1. a kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity, it is characterised in that comprise the following steps：
S1, the preparation of resin adhesive liquid
Take a certain proportion of novolac epoxy resin, polyfunctional epoxy resin, toughener, linear phenol-aldehyde resin, accelerator, scattered grind
Grind and cure mixing 0.5-1 hours, heat filling is added after adding organic solvent, curing agent and auxiliary agent to above-mentioned gained,
Add place after the completion of heat filling and mixing in scattered 8 hours 12 hours it is standby；
S2, the preparation of metal-based copper-clad plate
Above-mentioned products obtained therefrom is applied on copper foil mat surface using precision coating machine, and after the segmentations baking of the section baking boxs of progress seven
Gum copper foil is obtained,
The glue surface of gum copper foil is bonded with Metal Substrate again, is placed in vacuum hotpressing machine and is vacuumized, heated and pressurizeed, be made
Metal-based copper-clad plate.
A kind of 2. processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity according to claim 1, it is characterised in that step
Novolac epoxy resin in rapid S1, polyfunctional epoxy resin, toughener, linear phenol-aldehyde resin, accelerator, heat filling and auxiliary agent
Portion rate is：Novolac epoxy resin 19-25 parts, polyfunctional epoxy resin 3.7-4.9 parts, toughener 0.072-0.093 parts, line style
Phenolic resin 7.8-8.9 parts, accelerator 0.55-0.59 parts, heat filling 55-62 parts, auxiliary agent 0.027-0.035 parts.
A kind of 3. processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity according to claim 1, it is characterised in that step
The thickness of copper foil is 17-140 microns described in rapid S2, and the glue thickness of gum copper foil is 50-200 microns.
A kind of 4. processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity according to claim 1, it is characterised in that institute
The temperature for stating seven section baking boxs is set gradually as 70-80 DEG C, 70-80 DEG C, 100-110 DEG C, 120-130 DEG C, 140-150 DEG C, 160 DEG C
With 160 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711268628.XA CN107825821A (en) | 2017-12-05 | 2017-12-05 | A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711268628.XA CN107825821A (en) | 2017-12-05 | 2017-12-05 | A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107825821A true CN107825821A (en) | 2018-03-23 |
Family
ID=61641520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711268628.XA Pending CN107825821A (en) | 2017-12-05 | 2017-12-05 | A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107825821A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108503873A (en) * | 2018-03-30 | 2018-09-07 | 广东创辉鑫材科技有限公司东莞分公司 | A kind of preparation method of metal substrate filling perforation film |
| CN108724851A (en) * | 2018-05-04 | 2018-11-02 | 苏州捷德瑞精密机械有限公司 | A kind of high-toughness copper clad laminate material and preparation method thereof |
| CN109041429A (en) * | 2018-08-14 | 2018-12-18 | 广东创辉鑫材科技有限公司东莞分公司 | A kind of manufacturing method of metal substrate filling perforation film |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103304961A (en) * | 2013-06-14 | 2013-09-18 | 泰山医学院 | High thermal conductive semi-cured film of composite copper clad plate and preparation method of high thermal conductive semi-cured film |
| CN103694644A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof |
-
2017
- 2017-12-05 CN CN201711268628.XA patent/CN107825821A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103304961A (en) * | 2013-06-14 | 2013-09-18 | 泰山医学院 | High thermal conductive semi-cured film of composite copper clad plate and preparation method of high thermal conductive semi-cured film |
| CN103694644A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 赵渠森等: "《先进复合材料手册》", 31 May 2003, 机械工业出版社 * |
| 辜信实: "《印制电路用覆铜箔层压板》", 28 February 2002, 化学工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108503873A (en) * | 2018-03-30 | 2018-09-07 | 广东创辉鑫材科技有限公司东莞分公司 | A kind of preparation method of metal substrate filling perforation film |
| CN108724851A (en) * | 2018-05-04 | 2018-11-02 | 苏州捷德瑞精密机械有限公司 | A kind of high-toughness copper clad laminate material and preparation method thereof |
| CN109041429A (en) * | 2018-08-14 | 2018-12-18 | 广东创辉鑫材科技有限公司东莞分公司 | A kind of manufacturing method of metal substrate filling perforation film |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101983425B (en) | Multilayer circuit board, insulating sheet, and semiconductor package using multilayer circuit board | |
| JP6800129B2 (en) | Manufacturing method of semiconductor package using film-like adhesive and film-like adhesive | |
| CN107825821A (en) | A kind of processing method of the metal-based copper-clad plate of high-Tg high-thermal conductivity | |
| KR101856914B1 (en) | Film adhesive, semiconductor package using film adhesive and method for manufacturing same | |
| KR101766552B1 (en) | Laminate for circuit boards, metal-based circuit board, and power module | |
| KR20120106623A (en) | Highly heat conductive film-shaped adhesive composition, highly heat conductive film-shaped adhesive and method for producing semiconductor package by using the highly heat conductive film-shaped adhesive | |
| JP2011219674A (en) | Thermosetting resin composition for circuit board | |
| TWI514942B (en) | A manufacturing method of a mounting apparatus and an electronic module | |
| JP2014229771A (en) | Method for manufacturing electronic component device, laminated sheet, and electronic component device | |
| JP2006117919A (en) | Three-dimensional sheet-like adherend for sealing semiconductor | |
| US8647518B2 (en) | Resin coated copper foil, method for manufacturing same and multi-layer circuit board | |
| JP6831731B2 (en) | Conductive paint and manufacturing method of shield package using it | |
| CN113462128B (en) | Resin composition, functional membrane and application thereof | |
| JP5424984B2 (en) | Manufacturing method of semiconductor module | |
| CN106663664A (en) | Heat-conductive sheet and semiconductor device | |
| JP4493929B2 (en) | Adhesive film for coating electronic components | |
| JP2016219638A (en) | Encapsulation resin sheet for electronic component built-in substrate and manufacturing method for electronic component built-in substrate | |
| JP2016096308A (en) | Semiconductor device manufacturing method | |
| JP7031203B2 (en) | Adhesive sheet for heat dissipation, laminate for heat dissipation adhesive member, and composite member | |
| KR100899720B1 (en) | Adhesive filim for die attachment and resin composition for the same | |
| JPH03105932A (en) | Sheet-shaped adhesive and semiconductor device using same adhesive | |
| CN108503873A (en) | A kind of preparation method of metal substrate filling perforation film | |
| JP5768023B2 (en) | Thermosetting resin sheet for encapsulating electronic parts, resin-encapsulated semiconductor device, and method for producing resin-encapsulated semiconductor device | |
| CN101781544A (en) | Adhesive composition and application thereof | |
| KR100924728B1 (en) | Adhesive filim for die attachment and resin composition for the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180323 |
|
| RJ01 | Rejection of invention patent application after publication |