CN108495448A - A kind of flexible printed circuit board and preparation method thereof - Google Patents
A kind of flexible printed circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN108495448A CN108495448A CN201810499284.1A CN201810499284A CN108495448A CN 108495448 A CN108495448 A CN 108495448A CN 201810499284 A CN201810499284 A CN 201810499284A CN 108495448 A CN108495448 A CN 108495448A
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- China
- Prior art keywords
- substrate plate
- soft substrate
- circuit board
- printed circuit
- flexible printed
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Abstract
The invention discloses a kind of flexible printed circuit boards, including soft substrate plate and center toughness item, the soft substrate plate is equipped with thermoplastic resin insulating layer on two surfaces, the signal line group being mutually parallel is equipped between soft substrate plate and thermoplastic resin insulating layer, the signal line group is fixed by thermoplastic resin, further includes；A kind of production method is additionally provided, is included the following steps：On soft substrate plate several vias are formed according to five-pointed star distribution drilling, by the pattern exposure on original image on photosensitive bottom plate, develop, and single side plate surface is etched, multiport connecting pin is respectively set at both ends, bent circuit board at a temperature of thermoplastic in setting signal line group, and fast cooling is shaped, and joint face is suppressed；Spatial stability is very good, convenient for forming three-dimensional Multi-layer circuit board structure, directly carries out fold, rotation and sizing, and the production that identical template realizes mass can be employed many times, and simplifies technique, improves production efficiency.
Description
Technical field
The present invention relates to circuit board technology field, specially a kind of flexible printed circuit board and preparation method thereof.
Background technology
Flexible printed circuit board has the characteristics that thin thickness, light weight, circuit be intensive, bent, deflection, extensive
Applying electronic device field.Flexible printed circuit board has been widely used in provides cloth for the movable part of electronic device
Line.In addition, with the reduction of sizes of electronic devices and the improvement of electronic apparatus functions, it is used for by by several flexibilities
The flexible printed circuit board that printed circuit board connects.Flexible printed circuit board even can in some concrete applications
At least two flexible printed circuit boards are welded as an integrated flexible printed circuit board.
Obviously the thickness of integrated flexible print circuit welding position is more than the thickness of integrated flexible printed circuit board other positions
Degree.In this way, the scolding tin protrusion for welding is obviously provided projectingly relative to the surface of integrated flexible printed circuit board, easy to produce
Integrated flexible printed circuit board fractures in welding position, leads to the failure of integrated flexible printed circuit board.
In summary technical solution and reality there are the problem of, and combine the technical solution being widely used at present, also
Existing major defect is mainly reflected in the following aspects：Thermal conductivity and poor radiation, the transformation of space structure and specific
Size is difficult to control, and is directly resulted in its reliability and is also difficult to be promoted；Further, because spatial stability is very poor, wiring is close
It spends low, is also not easy to that multi-layer board is made, and in the prior art, multi-layer flexible circuit board uses mechanical punching and machine in making
When the mode of tool cutting, the slag particle of various grain sizes is easy tod produce, the performance of circuit board is influenced.
Invention content
In order to overcome the shortcomings of prior art, a kind of flexible printed circuit board of present invention offer and preparation method thereof,
It can effectively solve the problem that the problem of background technology proposes.
The technical solution adopted by the present invention to solve the technical problems is：
A kind of flexible printed circuit board, including soft substrate plate, the soft substrate plate are equipped with thermoplastic resin on two surfaces
Fat insulating layer is equipped with the signal line group being mutually parallel, the signal line group between soft substrate plate and thermoplastic resin insulating layer
Fixed by thermoplastic resin；
Further include center toughness item, the center toughness item is fixedly mounted on soft substrate plate central axis, the center
The length of toughness item is more than the long axis length of soft substrate plate, and passes through wave strip and soft substrate plate at the both ends of center toughness item
Fixed bonding connection, hard fold sheath, the soft base are uniformly coated in the junction of the soft substrate plate and wave strip
It is equipped with several punching press embedded holes on plate and center toughness item.
As a kind of preferred technical solution of the present invention, thermoplastic resin insulating layer outer surface is bonded by hot melt adhesive
There are EMI electromagnetic shielding films, and passes through soldering airtight connection positioned at the connecting sewing of both sides EMI electromagnetic shielding films.
As a kind of preferred technical solution of the present invention, it is installed with and signal line group electricity at the both ends of signal line group
Property connection multiport connecting pin, the multiport connecting pin is embedded in soft substrate plate end, and the signal wire in T fonts
Signal wire in group, which is corresponded with several separate ports of multiport connecting pin, to be electrically connected.
As a kind of preferred technical solution of the present invention, it is respectively and fixedly provided with cross on the front and back in the soft substrate plate
The slim holder of type hard, point is embroidered with several ellipses respectively on the upper slim holder of cross hard in the back side and front
Shape is recessed and the protrusion of several ellipses, and the shape for lugs and size of the oval depressions and ellipse correspond, and
Several coarse points are welded on the oval depressions inner surface.
In addition, the present invention also provides a kind of production method of flexible printed circuit board, include the following steps：
The processing of step 100, soft substrate plate, production obtain soft substrate plate, and according to five-pointed star point on soft substrate plate
Cloth drills to form several vias；
Step 200, etching development and wiring, by the pattern exposure on original image on photosensitive bottom plate, develop,
And single side plate surface is etched, setting signal line group；
Multiport connecting pin is respectively set at both ends in step 300, port closed and molding, and with signal line group pair
It should connect, bent circuit board at a temperature of thermoplastic, and fast cooling is shaped；
Step 400, compacting joint face, suppress connection structure, and be fixed on the slim holder of cross hard
On soft substrate plate.
As a kind of preferred technical solution of the present invention, in step 100, drilling the specific steps are：
Step 101 demarcates five-pointed star distribution pattern on soft substrate plate, and avoids track road sign on soft substrate plate
Fixed drilling position, the soft substrate plate for having demarcated drilling position is projected, retaining projection egative film is spare；
Step 102 drills according to the drilling position of calibration, is rinsed after drilling by absolute ethyl alcohol, and by nothing
Water-ethanol is dried；
Step 103, filling tackifying resin closes via in via, and is polished on two surfaces of via, makes
Hole end surface was obtained to flush with soft substrate plate surface；
Step 104 is fixed with hard fold sheath at soft substrate plate both ends, center toughness item is fixed by wave strip embedding
Enter in hard fold sheath, and it is embedding on soft substrate plate and center toughness item several punching presses to be arranged by decompressor
Enter hole.
As a kind of preferred technical solution of the present invention, in step 200, by the pattern exposure on original image photosensitive
On bottom plate the specific steps are：
Step 201 cleans to substrate, including the greasy dirt of substrate surface, oxidation film and its sweat stain, logical after removal of impurities
Absolute ethyl alcohol is crossed to rinse and dry；
Step 202 prepares standard picture and text silk printing screen version, fixes standard picture and text silk printing screen version after spraying photoresists 4-5 times
It is bonded on substrate, is directly exposed development；
Step 203 carries out artificial glue to product edge position and spray less than the place of glue, until the metal portion of product
Position is baked to spare without exposing phenomenon.
As a kind of preferred technical solution of the present invention the specific of standard picture and text silk printing screen version is prepared in step 202
Step is：Picture and text are come out by flat image design software fair drawing first, and by picture and text duplicate copy to printing plate output device
On, by picture and text output on plastic film.
As a kind of preferred technical solution of the present invention, in step 300, port closed mainly comprises the following steps：First, will
Multiport connecting pin is bonded on soft substrate plate, and by its T fonts edge and soft substrate plate to chimeric；Secondly, by multiport
Connecting pin corresponds and is electrically connected with signal line group, and multiport is connected end seal by thermoplastic resin insulating layer later
It closes.
As a kind of preferred technical solution of the present invention, in step 300, sizing mainly comprises the following steps：To having already passed through
The substrate progress low temperature of port closed is warm slowly, and average heating rate is 2-4 DEG C/min, and it is 50-60 DEG C to be heated to temperature, is protected
It is temperature-resistant to hold this, and its temperature fluctuation is no more than 5 DEG C of above-mentioned temperature range, is slowly bent to substrate at such a temperature
And rotation, so that it is slowly molded, the Mean Speed of bending and rotation is 1-2cm/min, keeps above-mentioned position after formation
The Mean Speed of fast cooling after 5-8min, cooling is 10-12 DEG C/min.
Compared with prior art, the beneficial effects of the invention are as follows：
The present invention meets the demand of single-layer-flex circuit first by the soft substrate plate by the way that single layer is arranged, and
While protection circuit plates structure, additionally it is possible to realize the demand on spatial, spatial stability is very good, convenient for being formed
Three-dimensional Multi-layer circuit board structure, since spatiality is good, heat conduction and heat dissipation performance are greatly improved, and further
Ground directly carries out fold, rotation and sizing by circuit board preparation process, ensure that flexible PCB it is disposable at
Type ensure that the thickness and intensity at bending part edge, is not susceptible to be broken in bending, in production technology, can repeatedly adopt
The production of mass is realized with identical template, simplifies technique, improves production efficiency.
Description of the drawings
Fig. 1 is the overall structure diagram of the present invention；
Fig. 2 is overlooking structure diagram of the present invention；
Fig. 3 is the cross slim supporting structure schematic diagram of hard of the present invention；
Fig. 4 is soft substrate plate structural schematic diagram of the present invention；
Fig. 5 is soft substrate plate cross-sectional view of the present invention；
Fig. 6 is the flow diagram of the present invention；
Figure label：1- soft substrate plates；2- thermoplastic resin insulating layers；3- signal line groups；The centers 4- toughness item；5- waves
Item；6- hard fold sheath 7- punching press embedded holes；8-EMI electromagnetic shielding films；9- multiports connecting pin；The cross hard of 10- is thin
Type holder；11- oval depressions；The protrusion of 12- ellipses；The coarse points of 13-；
101- hard fold sheaths；102- rotates band；103-U type film windings side；104- base sheets；105- copper foil bases
Plate；106- stiffening plates；107- cover films protect film；108- vias.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figures 1 to 5, described soft the present invention provides a kind of flexible printed circuit board, including soft substrate plate 1
Substrate is equipped with thermoplastic resin insulating layer 2 on 1 two surfaces, is equipped between soft substrate plate 1 and thermoplastic resin insulating layer 2
The signal line group 3 being mutually parallel, the signal line group 3 are fixed by thermoplastic resin.
Among the above, it should be further noted that soft substrate plate 1 is the basis of circuit board in present embodiment, lead
If being a kind of printed circuit board good with height reliability, pliability made of base material polyimides or polyester film,
And thermoplastic resin insulating layer 2 therein is then capable of providing best insulating effect, protects internal electricity structure.
Specifically, in the present embodiment, line can also be sprayed as desired in 2 outer surface of thermoplastic resin insulating layer
Road plate marine glue, so that circuit board has hydrophobic moisture-proof, radioresistance and anti-aging advantage.
As preferred embodiment, 2 outer surface of thermoplastic resin insulating layer has EMI electromagnetism by melt viscosity
Screened film 8, and positioned at the connecting sewing of both sides EMI electromagnetic shielding films 8 by soldering airtight connection, among the above, although can be by
Wiring board marine glue, which need to be sprayed, can have the function of waterproof, but wiring board is very sensitive for extraneous electromagnetic radiation
, therefore, it is necessary to the shielding of electromagnetic signal is carried out, and the EMI electromagnetic shielding films 8 in present embodiment neither interfere other set
It is standby, while also not influenced by miscellaneous equipment, in a smaller range, it can accomplish the independence of electromagnetic signal, that is,
Even when same circuit board on, electromagnetic signal will not be there is a situation where interfering with each other, the effect of shielded signal
Most preferably.
Wherein, the multiport connecting pin 9 being electrically connected with signal line group 3 is installed at the both ends of signal line group 3,
The multiport connecting pin 9 is embedded in 1 end of soft substrate plate in T fonts, and the signal wire in the signal line group 3 with it is more
Several separate ports of port connecting pin 9, which correspond, to be electrically connected.
Involved signal line group 3 specially can be fine signal wire among the above, can also be directly to pass through etching
Mode by circuit board foil section remove, to make characteristic impedance matching in order to high-speed transfer, be exactly in a word so that
The agent structure of circuit board is distinguished with signal transmission structure, the scheme of other signal transmissions for meeting the technical program
It is also possible.
Further include center toughness item 4, the center toughness item 4 is fixedly mounted on 1 central axis of soft substrate plate, in described
The length of heart toughness item 4 be more than soft substrate plate 1 long axis length, and the both ends of center toughness item 4 by wave strip 5 with it is soft
Matter substrate 1 fixes bonding connection, and hard fold sheath 6 is uniformly coated in the junction of the soft substrate plate 1 and wave strip 5,
It is equipped with several punching press embedded holes 7 on the soft substrate plate 1 and center toughness item 4.
An innovative point of the above-mentioned part as the application, which is characterized in that first, 4 one side of center toughness item of setting
Face can improve the mechanical tenacity of whole circuit board so that whole circuit board has preferable toughness, disclosure satisfy that in the application
In flexible PCB demand.Due in the present embodiment, not only require nothing more than be single sided board circuit board, be also required of
Dual platen or even be multiple panel structure, therefore, in the demand of toughness, than general flexible printed circuit board flexibility requirements
It is much bigger.Another aspect, due to the structures such as the transmission that in this application, has also related to signal, therefore, peripheral device structure
General flexible printed board will be more than, and increased peripheral device structure relies solely on the structural strength hardly possible in flexible printing plate itself
To meet it in mechanical strength the needs of, therefore, if not enough support strengths, it will due to the intensity of structure itself
The shape in demand and moulding not enough is not achieved, can not meet the demand of flexible PCB substantially.Also it is exactly to match
Installation center toughness item 4 is closed, in the hard fold sheath 6 that 1 end set of soft substrate plate is mating, further improves circuit board
The mechanical protection ability at edge, avoids the breakage of board edge.
In addition, the soft substrate plate 1 is equipped with several irregular fold belts 101, and positioned at the hard fold at both ends
Sheath 101 is rotated on soft substrate plate 1 along two opposite directions around the long axis of spindle of soft substrate plate 1 and forms rotation band 102,
The back side and positive both sides of the rotation band 102 are equipped with U-shaped film winding side 103, among the above, the effect of fold belt 101
It is to improve the length of practical soft substrate plate 1, and its lateral shear can then be improved by forming rotation band 102 by turning effort
Power so that whole circuit board can meet the needs of flexible PCB on horizontal and vertical upper and shear direction,
When ensure that circuit board has sufficiently ductile and anti-shearing force, so that it may specifically to be produced as desired.
In the present embodiment, the soft substrate plate 1 includes the base sheet 104 of polyimides or polyester film material,
It is for the reason of basic material with polyimides or polyester film：With height reliability, excellent pliability, printing electricity
Road plate has the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.Fixation is bonded in above-mentioned base sheet 104
Copper clad laminate 105,105 back side of the copper clad laminate and front are respectively equipped with stiffening plate 106 and cover film protection film 107,
In, for the stiffening plate 106 in hollow rectangular box-like, its role is to the mechanical strengths of reinforcement bottom plate, and surface actual load is facilitated to make
Industry, common thickness have 3mil to 9mil, and are equipped with several into Five-pointed star on copper clad laminate 105 and base sheet 104
The via 107 of distribution, the via 107 of setting is the multiple layer combination for the ease of circuit board, after provided with via 107,
When the combination of circuit board, directly internal circuit and signal line can be connected by via 107, avoided in combination also
Circuit structure equipped with peripheral hardware.
Specifically, in the present embodiment, cross hard is respectively and fixedly provided on the front and back in the soft substrate plate 1
Slim holder 10, point is embroidered with several ellipses respectively on the slim holder of the cross hard upper described positioned at the back side and front 10
12 shapes and sizes of protrusion one of the protrusion 12 of recess 11 and several ellipses, the oval depressions 11 and ellipse are a pair of
It answers, and is welded with several coarse points 13 on 11 inner surface of the oval depressions.
In the slim holder of above-mentioned cross hard 10, its main function is to combine the circuit board of multilayer, still
After provided with above structure, the mechanical strength of integrated circuit plate can also be improved by the slim holder 10 of cross hard,
Internal electrical components can be protected by being located at the slim holder of external cross hard 10, and be located at it is internal for connection ten
On the one hand the slim holder of font hard 10 provides the chimeric position of connection, another aspect is then to be to protect internally positioned electricity
Learn component.
In addition, in the present invention, as shown in fig. 6, a kind of production method of flexible printed circuit board is additionally provided, including such as
Lower step：
The processing of step 100, soft substrate plate, production obtain soft substrate plate, and according to five-pointed star point on soft substrate plate
Cloth drills to form several vias.
In above-mentioned production stage, the soft substrate plate directly using production is referred to, and the basic composition of the soft substrate plate exists
There is detailed elaboration among the above, i.e.,：The soft substrate plate 1 includes the base sheet of polyimides or polyester film material
104, and fixed in above-mentioned base sheet 104 and be bonded with copper clad laminate 105,105 back side of the copper clad laminate and front point
Not She You stiffening plate 106 and cover film protect film 107, wherein the stiffening plate 106 is in hollow rectangular box-like, and in copper
Foil substrate 105 and base sheet 104 are equipped with several vias 107 being distributed at Five-pointed star.Using above-mentioned soft substrate plate 1
The advantage is that it is convenient for subsequent operation with the clearly demarcated hierarchical structure of medium first, in addition, in the present embodiment,
Convenient for via 107 is arranged, and the purpose that via 107 is arranged is further to be convenient for forming multilayered structure.
Before carrying out step 100, further includes multilayer positioning, calibration is set on the equivalent position point of multilayer soft substrate plate
Point, and multilayer positioning is carried out according to calibration point before drilling, it is locked after the positioning.
So-called equivalent position point in the present embodiment, refers specifically to, opposite on the circuit board of different layers position
In the other circuit boards of circuit board, electrical functions are identical, and identical in electrical functions it is also desirable to ensure its position
The matching set.Understand to be exactly that on adjacent two pieces of circuit boards, the identical position of electrical functions has very much, and in electricity in other words
Function must also match specific position key point while identical, and such point is on a batch of circuit board
It is relatively unique.
In step 100, drilling the specific steps are：
Step 101 demarcates five-pointed star distribution pattern on soft substrate plate, and avoids track road sign on soft substrate plate
Fixed drilling position, the soft substrate plate for having demarcated drilling position is projected, and retaining projection egative film is spare, and the autochrome retained
Can repeatedly utilize, again using when need not be demarcated again, and can directly pass through projection and carry out mass
Production can also improve the harmony and uniformity of same batch production while simplifying process；
Step 102 drills according to the drilling position of calibration, is rinsed after drilling by absolute ethyl alcohol, and by nothing
Water-ethanol is dried, the part free matter for rinsing its clast and being adsorbed on substrate, reduces the remaining of impurity, is reduced to rear
The influence of continuous production, and the use of absolute ethyl alcohol can be repeated several times；
Step 103, filling tackifying resin closes via in via, and is polished on two surfaces of via, makes
It obtained hole end surface to flush with soft substrate plate surface, why close via, its role is to make circuit board be in same
On potential surface, has preferable electromagnetic shielding capability in entire plane；
Step 104 is fixed with hard fold sheath at soft substrate plate both ends, center toughness item is fixed by wave strip embedding
Enter in hard fold sheath, and it is embedding on soft substrate plate and center toughness item several punching presses to be arranged by decompressor
Enter hole, the punching press embedded hole of setting preferably plays punching press fixed function, fixes soft substrate plate and center toughness item to form one
Body structure.
In above-mentioned steps, the distribution pattern of five-pointed star type why is selected, can be prolonged because five-pointed star type radioactivity is good
Malleability is good, and also has traceability while ensureing ductility, convenient for carrying out punching positioning on different circuit boards.
Step 200, etching development and wiring, by the pattern exposure on original image on photosensitive bottom plate, develop,
And single side plate surface is etched, setting signal line group.
In step 200, by the pattern exposure on original image on photosensitive bottom plate the specific steps are：
Step 201 cleans to substrate, including the greasy dirt of substrate surface, oxidation film and its sweat stain, logical after removal of impurities
Absolute ethyl alcohol is crossed to rinse and dry；
Step 202 prepares standard picture and text silk printing screen version, fixes standard picture and text silk printing screen version after spraying photoresists 4-5 times
It is bonded on substrate, is directly exposed development；
Step 203 carries out artificial glue to product edge position and spray less than the place of glue, until the metal portion of product
Position is baked to spare without exposing phenomenon.
In above-mentioned steps, it should be noted that prepare standard picture and text silk printing screen version the specific steps are：First by picture and text
It is come out by flat image design software fair drawing, and by picture and text duplicate copy to printing plate output device, picture and text output is being moulded
Expect on film.
Multiport connecting pin is respectively set at both ends in step 300, port closed and molding, and with signal line group pair
It should connect, bent circuit board at a temperature of thermoplastic, and fast cooling is shaped.
Port closed mainly comprises the following steps：First, multiport connecting pin is bonded on soft substrate plate, and by its T word
Type edge and soft substrate plate are to chimeric；Secondly, multiport connecting pin is corresponded and is electrically connected with signal line group, Zhi Houtong
Thermoplastic resin insulating layer is crossed to close multiport connecting pin.
Wherein, sizing mainly comprises the following steps：It is hot slowly to the substrate progress low temperature for having already passed through port closed, average heating speed
Rate is 2-4 DEG C/min, and it is 50-60 DEG C to be heated to temperature, keeps this temperature-resistant, and its temperature fluctuation is no more than above-mentioned temperature
5 DEG C of degree range to substrate slowly bend and rotate, it are made slowly to be molded at such a temperature, bend and rotate flat
Equal rate is 1-2cm/min, keeps fast cooling after above-mentioned position 5-8min after formation, the Mean Speed of cooling is 10-
12℃/min。
Further include following step before carrying out step 400：The three-dimensional docking of multilayer drilling, in multilayer board
Setting connection pin on the upper position corresponding to via, and be electrically connected by enameled wire with pin is connect in corresponding via,
The signal line group of different layers position is connected also by via.
Step 400, compacting joint face, suppress connection structure, and be fixed on the slim holder of cross hard
On soft substrate plate.
Based on above-mentioned, in this application, it is also necessary to further explanation, the binder resin etc. stated in the above
Adhesive is and to be included the fine grain anisotropic conductive adhesion of conductive extract based on tackifying resin and formed.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Profit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
Claims (10)
1. a kind of flexible printed circuit board, including soft substrate plate (1), the soft substrate plate is equipped with thermoplastic on (1) two surface
Property resin insulating barrier (2), it is characterised in that：It is equipped with and is mutually parallel between soft substrate plate (1) and thermoplastic resin insulating layer (2)
Signal line group (3), the signal line group (3) fixed by thermoplastic resin；
Further include center toughness item (4), the center toughness item (4) is fixedly mounted on soft substrate plate (1) central axis, described
The length of center toughness item (4) is more than the long axis length of soft substrate plate (1), and passes through wave at the both ends of center toughness item (4)
Unrestrained item (5) and the fixed bonding connection of soft substrate plate (1), uniformly coat in the soft substrate plate (1) and the junction of wave strip (5)
There is hard fold sheath (6), several punching press embedded holes (7) are equipped on the soft substrate plate (1) and center toughness item (4).
2. a kind of flexible printed circuit board according to claim 1, which is characterized in that the thermoplastic resin insulating layer
(2) outer surface has EMI electromagnetic shielding films (8) by melt viscosity, and positioned at the connecting sewing of both sides EMI electromagnetic shielding films (8)
Pass through soldering airtight connection.
3. a kind of flexible printed circuit board according to claim 1, which is characterized in that equal at the both ends of signal line group (3)
It is installed with the multiport connecting pin (9) being electrically connected with signal line group (3), the multiport connecting pin (9) is in T fonts
Be embedded in soft substrate plate (1) end, and the signal wire in the signal line group (3) with multiport connecting pin (9) several
Separate port, which corresponds, to be electrically connected.
4. a kind of flexible printed circuit board according to claim 1, which is characterized in that the soft substrate plate (1) just
It is respectively and fixedly provided with the slim holder of cross hard (10) on face and the back side, it is slim to be located at the upper cross hard in the back side and front
Point is embroidered with the protrusion (12) of several oval depressions (11) and several ellipses respectively on holder (10), and the ellipse is recessed
Protrusion (12) shapes and sizes for falling into (11) and ellipse correspond, and are welded on the oval depressions (11) inner surface
There are several coarse points (13).
5. a kind of production method of flexible printed circuit board, which is characterized in that include the following steps：
The processing of step 100, soft substrate plate, production obtains soft substrate plate, and is distributed and bores according to five-pointed star on soft substrate plate
Hole forms several vias；
Step 200, etching development and wiring, by the pattern exposure on original image on photosensitive bottom plate, develop, and right
Single side plate surface is etched, setting signal line group；
Multiport connecting pin, and company corresponding with signal line group is respectively set at both ends in step 300, port closed and molding
It connects, bent circuit board at a temperature of thermoplastic, and fast cooling is shaped；
Step 400, compacting joint face, suppress connection structure, and be fixed in soft on the slim holder of cross hard
On substrate.
6. a kind of production method of flexible printed circuit board according to claim 5, which is characterized in that in step 100,
Drilling the specific steps are：
Step 101 demarcates five-pointed star distribution pattern on soft substrate plate, and avoids printed wire calibration on soft substrate plate and bore
Kong Wei projects the soft substrate plate for having demarcated drilling position, and retaining projection egative film is spare；
Step 102 drills according to the drilling position of calibration, is rinsed after drilling by absolute ethyl alcohol, and by anhydrous second
Alcohol is dried；
Step 103, filling tackifying resin closes via in via, and is polished on two surfaces of via so that mistake
Hole end surface is flushed with soft substrate plate surface；
Step 104 is fixed with hard fold sheath at soft substrate plate both ends, by center toughness item by wave strip it is fixedly embedded
In hard fold sheath, and several punching presses insertion is arranged by decompressor on soft substrate plate and center toughness item
Hole.
7. a kind of production method of flexible printed circuit board according to claim 5, which is characterized in that in step 200,
By the pattern exposure on original image on photosensitive bottom plate the specific steps are：
Step 201 cleans to substrate, including the greasy dirt of substrate surface, oxidation film and its sweat stain, passes through nothing after removal of impurities
Water-ethanol is rinsed and is dried；
Step 202 prepares standard picture and text silk printing screen version, and standard picture and text silk printing screen version is fixed bonding after spraying photoresists 4-5 time
On substrate, it is directly exposed development；
Step 203 carries out artificial glue to product edge position and spray less than the place of glue, until the metal position of product without
Exposing phenomenon, and be baked to spare.
8. a kind of production method of flexible printed circuit board according to claim 7, which is characterized in that in step 202
In, prepare standard picture and text silk printing screen version the specific steps are：Picture and text are come out by flat image design software fair drawing first, and
By in picture and text duplicate copy to printing plate output device, picture and text are exported on plastic film.
9. a kind of production method of flexible printed circuit board according to claim 5, which is characterized in that in step 300,
Port closed mainly comprises the following steps：First, multiport connecting pin is bonded on soft substrate plate, and by its T fonts edge with
Soft substrate plate is to chimeric；Secondly, multiport connecting pin is corresponded and is electrically connected with signal line group, passes through thermoplasticity later
Resin insulating barrier closes multiport connecting pin.
10. a kind of production method of flexible printed circuit board according to claim 5, which is characterized in that in step 300
In, sizing mainly comprises the following steps：To have already passed through port closed substrate carry out low temperature it is hot slowly, average heating rate be 2-4 DEG C/
Min, and it is 50-60 DEG C to be heated to temperature, keeps this temperature-resistant, and its temperature fluctuation is no more than the 5 of above-mentioned temperature range
DEG C, at such a temperature substrate slowly bend and rotate, it is made slowly to be molded, the Mean Speed of bending and rotation is 1-
2cm/min keeps fast cooling after above-mentioned position 5-8min after formation, and the Mean Speed of cooling is 10-12 DEG C/min.
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| CN201810499284.1A CN108495448B (en) | 2018-05-23 | 2018-05-23 | A kind of flexible printed circuit board |
| CN201811636703.8A CN109688708B (en) | 2018-05-23 | 2018-05-23 | Manufacturing method of flexible printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116968362A (en) * | 2023-09-22 | 2023-10-31 | 玩出梦想(上海)科技有限公司 | Preparation method of front cover of head-mounted display device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN109688708A (en) | 2019-04-26 |
| CN109688708B (en) | 2020-02-07 |
| CN108495448B (en) | 2019-05-10 |
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