KR100204613B1 - Fabrication method of printed circuit board - Google Patents

Abstract

To a method of manufacturing a printed circuit board in which a surface mount type component is directly mounted on a conductive paste (Past) to improve the degree of integration of the printed circuit board.

The present invention relates to a method of manufacturing a printed circuit board including formation of an insulating layer and a conductive paste on a wiring represented by a copper foil, comprising the steps of: forming terminals (terminals) in a specific region above the conductive paste; Mounting the component between the terminals and bonding the component to the terminal using infrared light.

Accordingly, according to the present invention, it is possible to manufacture a printed circuit board having a high degree of integration, improve productivity, actively cope with deadlines, and eliminate defects in printing.

Description

Manufacturing method of printed circuit board

FIG. 1 is a cross-sectional view showing a printing method for forming a terminal in a conventional method of manufacturing a printed circuit board.

FIG. 2 is a cross-sectional view showing an embodiment of a method of manufacturing a printed circuit board according to the present invention.

DESCRIPTION OF THE REFERENCE NUMERALS

10, 30: substrate 12, 32: pattern

14, 18, 34: insulating layer 16, 36: conductive paste

20: mask 38: terminal

40: Parts

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a printed circuit board (PCB), and more particularly, to a method of manufacturing a printed circuit board in which surface-mounted components are directly mounted on a conductive paste, ≪ / RTI >

Generally, a printed circuit board is obtained by laminating a copper plate on a substrate such as a paper-phenol resin or a glass-epoxy resin and by using a technique such as pattern printing and etching to form a copper foil for wiring It is finished with figure.

In recent electronic devices, miniaturization and high density of semiconductors such as LSI and VLSI (Very Large Scale Integrator) are getting more and more complicated due to thinning and shortening, and accordingly, it is required to manufacture printed circuit boards with high density and thin foil In addition, there is an increasing demand for a substrate capable of performing a jumper circuit, a conductive paste through hole, an electromagnetic wave shielding, and the like.

Therefore, in order to improve the degree of integration, a printed circuit board or the like made of multilayer is manufactured by using conductive paste or the like.

However, the conventional printed circuit board has a problem that there is a limit to increase the degree of integration because the mounting area of the component must be secured.

In a printed circuit board on which a conductive paste is uniformly layered for shielding electromagnetic waves, a printing process is performed to form terminals for connecting the components to the patterns of the components in order to mount the components. In the printing process, There was a problem such as flowing down and spreading.

That is, the thickness of the substrate 10 on which the conductive paste 16 performing the conventional electromagnetic wave shielding function is stacked is the same as the thickness of the first insulating layer (undercoater) 14, And the second insulating layer 16 is laminated on the upper portion of the conductive paste 16 to a thickness of about 20 mu m so that the entirety of the conductive paste 16 from the substrate 10 When printing is performed to form terminals on the pattern 12 using the mask 20 with a thickness of about 100 mu m or more, the thickness of the pattern 12 is about 35 mu m so that the mask 20 and the terminals are formed A space is formed between the patterns 12 so that the solder cream may spread or flow down.

Another problem with the prior art is that in the case of a printed circuit board in which a component is connected to a terminal by a conductive adhesive after forming a terminal with a conductive paste, the number of manufacturing operations is increased due to the execution of a separate adhesive printing process, There was this difficulty.

An object of the present invention is to provide a method of manufacturing a printed circuit board for improving the degree of integration by effectively securing a mounting space by directly connecting a part to an upper portion of a conductive paste.

It is another object of the present invention to provide a method of manufacturing a printed circuit board for eliminating defects in a printing process for forming terminals (terminals) and reducing the number of manufacturing steps to actively cope with improvement in productivity and delivery time have.

According to another aspect of the present invention, there is provided a method of manufacturing a printed circuit board having a pattern formed thereon, the method comprising: forming a printed circuit board including an insulation layer and a conductive paste on the wiring, A method of manufacturing a substrate, comprising the steps of: forming a terminal (terminal) in a specific region of the conductive paste; mounting the component between the terminals formed in different regions; and bonding the component to the terminal / RTI >

The terminals are preferably formed by a lead paste printing method using a metal mask.

It is also preferable that the component and the terminal are coupled using hot air.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a cross-sectional view showing an embodiment of a method of manufacturing a printed circuit board according to the present invention.

First, an insulating layer 34 is laminated on a part of the pattern 32 in which the copper foil is expressed as a wiring figure in a certain region of the substrate 30. [

A conductive paste 36 used for jumper or electromagnetic wave shielding or the like is laminated on the insulating layer 34. The upper part of the conductive paste 36 is connected to a terminal 38 are connected to each other.

The present invention performs a pattern printing and etching process based on a circuit design to form a copper foil laminated on a substrate 30 with a pattern 32 represented by a wiring pattern.

The conductive paste 36 is then inserted between the pattern 32 and the pattern 32 which need to be connected after the insulating layer 34 is lapped on the pattern 32 that does not need to be connected in order to connect the patterns 32 with the conductive paste 36. [ ) Are laminated and connected.

The conductive paste 936 laminated in the embodiment is for performing a jumper circuit function for connecting the specific pattern 32 and the pattern 32. In other words, There is also a printed circuit board on which a conductive paste for performing an electromagnetic shielding function which can be solved is laminated.

Subsequently, a terminal 38 is formed by using a metal mask on a specific area of the conductive paste 36, that is, a part connecting the component mounting pad in the circuit design.

Here, printing using a metal mask is generally referred to as "lead paste printing", and lead paste is excellent in bonding property.

When the component 40 is mounted on the thus formed terminal 38 and exposed to infrared rays, the terminal 38 and the component 40 formed with the lead paste are joined.

Here, the lead paste is liquefied and hardened as heat generated from the infrared rays and is combined with the component 40.

In the embodiment, the terminal 38 and the component 40 are combined using infrared rays, but they may be combined using hot air in another method.

Then, a printed circuit board on which components are directly mounted on the conductive paste as in the present invention can be formed.

Further, it is even more effective that the component of the present invention is mainly coupled with the surface-mounted components.

Therefore, since the printed circuit board of the present invention is directly coupled with the surface-mounted component on the conductive paste, it is not necessary to secure a separate mounting space, and the degree of integration can be improved.

That is, in the case of a single-sided printed circuit board, the surface-mounted components can be combined while forming the substrate in two or more layers. In the case of a double-sided printed circuit board, the surface- So that the mounting rate of the printed circuit board can be largely extended and the space in which the surface-mounted components are coupled can be efficiently utilized.

In addition, since the direct printing is performed on the conductive paste, it is possible to prevent defects such as flowing and spreading of the lead paste during printing.

In addition, since the adhesive printing process for separate bonding is not performed, the number of manufacturing processes is reduced and the productivity is improved. On the customized printed circuit board, the delivery time can be flexibly dealt with.

Therefore, according to the present invention, it is possible to manufacture a printed circuit board having an extremely high degree of integration, improve productivity, actively cope with deadlines, and eliminate defects in printing.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (3)

A method of manufacturing a printed circuit board including forming an insulating layer and a conductive paste on a wiring represented by a copper foil, the method comprising: forming a terminal in a specific region of the conductive paste; Mounting components between the terminals formed in different regions; And coupling the component to the terminal using infrared radiation; And forming a printed circuit board on the printed circuit board. The method of claim 1, wherein the terminal is formed by a lead paste printing method using a metal mask. The method of claim 1, wherein hot air is used to connect the component to the terminal.