CN108461436B - Automatic material combing system before axial diode die pressing and working method thereof - Google Patents
Automatic material combing system before axial diode die pressing and working method thereof Download PDFInfo
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- CN108461436B CN108461436B CN201810177661.XA CN201810177661A CN108461436B CN 108461436 B CN108461436 B CN 108461436B CN 201810177661 A CN201810177661 A CN 201810177661A CN 108461436 B CN108461436 B CN 108461436B
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- material carrying
- graphite boat
- diode
- carrying
- carrying frame
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- 239000000463 material Substances 0.000 title claims abstract description 154
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000007723 die pressing method Methods 0.000 title abstract description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 66
- 239000010439 graphite Substances 0.000 claims abstract description 66
- 238000013459 approach Methods 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 238000009960 carding Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 7
- 230000000717 retained effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Preliminary Treatment Of Fibers (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The invention relates to an automatic material combing system before axial diode die pressing and a working method thereof, wherein the automatic material combing system comprises: the feeding mechanism and the carrying mechanism; the feeding mechanism is suitable for bearing the graphite boat and pushing out the diode part to be combed in the graphite boat so as to be suitable for the carrying mechanism to lift up the carried diode and place the carried diode on the carrying frame. According to the automatic material combing system, the automatic combing of products from the graphite boat to the material carrying rack before die pressing is realized through the accurate positioning and the mutual conversion of the positions of the graphite boat, the material carrying strips and the material carrying rack.
Description
Technical Field
The invention relates to an automatic material combing system before axial diode die pressing and a working method thereof.
Background
Diodes are widely used in various fields as basic components of electronic products. The packaging process of the diode comprises the following steps: arranging leads, mounting, welding and die pressing. However, the axial diode needs to be converted from a welding boat to a material carrying rack before die pressing, and the efficiency is low at present by means of manual conversion.
Based on the above problems, there is a need to design an automatic combing system before axial diode molding and a working method thereof.
Disclosure of Invention
The invention aims to provide an automatic material combing system before axial diode die pressing and a working method thereof.
In order to solve the technical problems, the invention provides an automatic combing system, which comprises:
the feeding mechanism and the carrying mechanism; wherein the method comprises the steps of
The feeding mechanism is suitable for bearing the graphite boat and pushing out the diode part to be combed in the graphite boat so as to be suitable for the carrying mechanism to lift up and carry the diode, and the carried diode is placed on the carrying frame.
Further, the feeding mechanism includes: a graphite boat placement area; a cylinder suitable for pushing out the diode part in the graphite boat is arranged at the rear side of the graphite boat placing area; the pushing part of the diode is lifted up and received by the material carrying mechanism.
Further, take material mechanism includes: a material carrying rack placing table, wherein a material carrying strip is arranged below the material carrying rack placing table; wherein the material carrying frame is provided with at least one material carrying frame groove; the material carrying mechanism is suitable for driving the material carrying frame to move towards the graphite boat direction to approach, when the material carrying frame groove is positioned at the material receiving position, the material carrying strip is ejected out of the material carrying frame groove to receive a row of diodes positioned at the lowest part in the graphite boat, and then the material carrying mechanism drives the graphite boat to move backwards so as to lead the diodes to stay above the material carrying strip, and the material carrying strip descends to place the received diodes in the material carrying frame groove.
Further, take material mechanism still includes: and the material carrying servo mechanism is suitable for pushing the material carrying frame to move towards the opposite direction of the graphite boat after the primary diode connection is completed, so that the next material carrying frame groove is positioned at the material receiving position.
Further, the feeding mechanism further includes: a feeding servo mechanism suitable for pushing the graphite boat to advance; the material carrying servo mechanism, the feeding servo mechanism, the material carrying strip ejection mechanism and the air cylinder are controlled by the control module.
In still another aspect, the present invention further provides a working method of an automatic carding system, including: the graphite boat is loaded by the feeding mechanism, the diode part to be combed in the graphite boat is pushed out, so that the feeding mechanism is suitable for jacking the carrying diode, and the carrying diode is placed on the carrying rack.
Further, the feeding mechanism includes: a graphite boat placement area; a cylinder suitable for pushing out the diode part in the graphite boat is arranged at the rear side of the graphite boat placing area; the pushing part of the diode is lifted up and received by the material carrying mechanism.
Further, take material mechanism includes: a material carrying rack placing table, wherein a material carrying strip is arranged below the material carrying rack placing table; wherein the material carrying frame is provided with at least one material carrying frame groove; the material carrying mechanism is suitable for driving the material carrying frame to move towards the graphite boat direction to approach, when the material carrying frame groove is positioned at the material receiving position, the material carrying strip is ejected out of the material carrying frame groove to receive a row of diodes positioned at the lowest part in the graphite boat, and then the material carrying mechanism drives the graphite boat to move backwards so as to lead the diodes to stay above the material carrying strip, and the material carrying strip descends to place the received diodes in the material carrying frame groove.
Further, take material mechanism still includes: and the material carrying servo mechanism is suitable for pushing the material carrying frame to move towards the opposite direction of the graphite boat after the primary diode connection is completed, so that the next material carrying frame groove is positioned at the material receiving position.
Further, the feeding mechanism further includes: a feeding servo mechanism suitable for pushing the graphite boat to advance;
the material carrying servo mechanism, the feeding servo mechanism, the material carrying strip ejection mechanism and the air cylinder are controlled by the control module.
The automatic material combing system has the beneficial effects that the automatic material combing from the graphite boat to the material carrying rack before die pressing is realized through the accurate positioning and the mutual conversion of the positions of the graphite boat, the material carrying strip and the material carrying rack.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic view of an automatic combing system of the present invention without a graphite boat and a carrier;
FIG. 2 is a schematic diagram of an automated combing system of the present invention with graphite boats and a carriage;
FIG. 3 is a schematic diagram of a carding process of the automatic carding system of the invention;
FIG. 4 is a schematic diagram II of the carding working process of the automatic carding system of the invention;
FIG. 5 is a schematic diagram III of the carding working process of the automatic carding system of the invention;
FIG. 6 is a schematic diagram of a carding operation process of the automatic carding system of the invention;
FIG. 7 is a schematic diagram fifth of the carding operation of the automatic carding system of the invention;
FIG. 8 is a schematic diagram of a carding process of the automatic carding system of the invention;
in the figure:
the feeding mechanism 1, the graphite boat 101, the feeding servo mechanism 102 and the air cylinder 103;
a material carrying mechanism 2, a material carrying frame 201, a material carrying strip 202, a material carrying frame groove 203, a material carrying servo mechanism 204 and a material carrying frame placing table 205.
Detailed Description
The invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the invention and therefore show only the structures which are relevant to the invention.
Example 1
FIGS. 1 and 2 each show a schematic structural view of an automatic combing system;
the automatic carding system comprises: a feeding mechanism 1 and a carrying mechanism 2; the feeding mechanism 1 is suitable for carrying the graphite boat 101 and pushing out the diode part to be combed in the graphite boat 101, so as to be suitable for the carrying mechanism 2 to lift up the carried diode and place the carried diode on the carrying rack 201. The feeding mechanism 1 includes: a graphite boat 101 placement area; a cylinder 103 suitable for pushing out the diode part in the graphite boat 101 is arranged at the rear side of the placement area of the graphite boat 101; the diode pushing part is lifted up and received by the material carrying mechanism 2. The carrying mechanism 2 comprises: a material carrying rack 201 is arranged on the placing table, and a material carrying strip 202 is arranged below the material carrying rack 201.
The material carrying frame 201 placing table adopts a hollow structure, and a plurality of material carrying frame grooves 203 are arranged on the material carrying frame 201 so that the material carrying strips 202 can conveniently lift and extend from the lower part of the material carrying frame 201 placing table through one material carrying frame groove 203.
The feeding mechanism 1 and the carrying mechanism 2 are adapted to move toward each other, specifically, see arrows F1 and F2 in fig. 2, so that they approach each other, specifically, the positional relationship is shown in fig. 3.
As shown in fig. 3, the material carrying mechanism 2 is adapted to drive the material carrying frame 201 to move towards the graphite boat for approaching, when the empty material carrying frame 203 located at the outermost side of the material carrying frame 201 is at the material receiving position, the material carrying bar 202 is ejected from the material carrying frame 203 to receive the lowest row of diodes located in the graphite boat 101 (as shown in fig. 4), and then the feeding mechanism 1 drives the graphite boat 101 to move backward (as shown in fig. 5) so that the diodes are retained above the material carrying bar 202, and the material carrying bar 202 descends to place the received diodes in the material carrying frame 203 (as shown in fig. 6).
For easy receiving, a clamping groove suitable for clamping the diode is arranged above the material carrying strip 202.
As shown in fig. 7, the carrying mechanism 2 further includes: the material carrying servo mechanism 204, the material carrying servo mechanism 204 is adapted to push the material carrying frame 201 to move in the opposite direction of the graphite boat (as shown by arrow F4) after completing the primary diode receiving, so that the next material carrying frame slot 203 is located at the material receiving position; meanwhile, the feeding mechanism 1 drives the graphite boat 101 to move forward (as shown by arrow F3), that is, the feeding mechanism 1 and the carrying mechanism 2 are suitable for driving the graphite boat 101 and the carrying rack 201 to move towards each other to approach each other, so that the diode is located above the next carrying frame 203, and at this time, the carrying frame 203 is located at the material receiving position, and the material combing process shown in fig. 3 to 6 is repeated, and the carrying frame 203 realizes material receiving.
The above process is repeated, and finally, the transfer of each diode in the graphite boat 101 onto the carrier 201 is completed, as shown in fig. 8.
In the present embodiment, the feeding mechanism 1 further includes: a feed servo 102 adapted to push the graphite boat 101 to travel; the material carrying servo mechanism 204, the feeding servo mechanism 102, the ejection mechanism of the material carrying strip 202 and the air cylinder 103 are controlled by a control module. The control module may be, but is not limited to, a PLC module.
Example 2
On the basis of embodiment 1, this embodiment also provides a working method of the automatic carding system, including:
the graphite boat 101 is carried by the feeding mechanism 1, and the diode part to be combed in the graphite boat 101 is pushed out so as to be suitable for the carrying mechanism 2 to lift up the carried diode, and the carried diode is placed on the carrying frame 201.
The feeding mechanism 1 includes: a graphite boat 101 placement area; a cylinder 103 suitable for pushing out the diode part in the graphite boat 101 is arranged at the rear side of the placement area of the graphite boat 101; the diode pushing part is lifted up and received by the material carrying mechanism 2.
The carrying mechanism 2 comprises: a material carrying rack 201 placing table, and a material carrying strip 202 is arranged below the material carrying rack 201 placing table; wherein the material carrying frame 201 is provided with at least one material carrying frame groove 203; the material carrying mechanism 2 is adapted to drive the material carrying frame 201 to move towards the graphite boat for approaching, when the material carrying frame 203 is at the material receiving position, the material carrying bar 202 is ejected from the material carrying frame 203 to receive the lowest row of diodes in the graphite boat 101, and then the material carrying mechanism 1 drives the graphite boat 101 to move backwards so that the diodes are retained above the material carrying bar 202, and the material carrying bar 202 descends to place the received diodes in the material carrying frame 203.
The carrying mechanism 2 further comprises: the material carrying servo mechanism 204, the material carrying servo mechanism 204 is adapted to push the material carrying frame 201 to move towards the graphite boat for approaching after completing the primary diode carrying, so that the next material carrying frame 203 is located at the material receiving position.
The feeding mechanism 1 further includes: a feed servo 102 adapted to push the graphite boat 101 to travel; the material carrying servo mechanism 204, the feeding servo mechanism 102, the ejection mechanism of the material carrying strip 202 and the air cylinder 103 are controlled by a control module.
In this embodiment, the structure and the operation of the feeding mechanism 1 and the carrying mechanism 2 are described in detail in embodiment 1, and are not described here again.
According to the automatic material combing system, through accurate positioning and mutual conversion of the positions of the graphite boat 101, the material carrying strips 202 and the material carrying frame 201, automatic material combing of products from the graphite boat 101 to the material carrying frame 201 before die pressing is realized, and the production efficiency is improved.
With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (5)
1. An automated combing system, comprising:
the feeding mechanism and the carrying mechanism; wherein the method comprises the steps of
The feeding mechanism is suitable for bearing the graphite boat and pushing out the diode part to be combed in the graphite boat so as to be suitable for the carrying mechanism to lift up the carried diode and place the carried diode on the carrying frame;
the material carrying mechanism comprises: a material carrying rack placing table, wherein a material carrying strip is arranged below the material carrying rack placing table; wherein the method comprises the steps of
At least one material carrying frame groove is arranged on the material carrying frame;
the material carrying mechanism is suitable for driving the material carrying frame to move towards the graphite boat direction to approach, when the material carrying frame groove is positioned at the material receiving position, the material carrying strip is ejected out of the material carrying frame groove to receive a row of diodes positioned at the lowest part in the graphite boat, and then the material carrying mechanism drives the graphite boat to move backwards so as to lead the diodes to stay above the material carrying strip, and the material carrying strip descends to place the received diodes in the material carrying frame groove.
2. The automated combing system of claim 1, wherein the combing machine comprises a plurality of combing machines,
the material carrying mechanism further comprises: a material carrying servo mechanism,
the material carrying servo mechanism is suitable for pushing the material carrying frame to move towards the opposite direction of the graphite boat after the primary diode is carried, so that the next material carrying frame groove is located at the material receiving position.
3. An automated combing system as claimed in claim 2, wherein,
the feeding mechanism further comprises: a feeding servo mechanism suitable for pushing the graphite boat to advance;
the material carrying servo mechanism, the feeding servo mechanism, the material carrying strip ejection mechanism and the air cylinder are controlled by the control module.
4. A method of operating an automated combing system as claimed in any one of claims 1 to 3, comprising:
the graphite boat is loaded by the feeding mechanism, the diode part to be combed in the graphite boat is pushed out, so that the feeding mechanism is suitable for jacking the carrying diode, and the carrying diode is placed on the carrying rack.
5. The method of claim 4, wherein,
the feeding mechanism comprises: a graphite boat placement area;
a cylinder suitable for pushing out the diode part in the graphite boat is arranged at the rear side of the graphite boat placing area;
the pushing part of the diode is lifted up and received by the material carrying mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810177661.XA CN108461436B (en) | 2018-03-05 | 2018-03-05 | Automatic material combing system before axial diode die pressing and working method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810177661.XA CN108461436B (en) | 2018-03-05 | 2018-03-05 | Automatic material combing system before axial diode die pressing and working method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108461436A CN108461436A (en) | 2018-08-28 |
| CN108461436B true CN108461436B (en) | 2024-01-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810177661.XA Active CN108461436B (en) | 2018-03-05 | 2018-03-05 | Automatic material combing system before axial diode die pressing and working method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN108461436B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362342A (en) * | 1986-09-03 | 1988-03-18 | Hitachi Electronics Eng Co Ltd | Parts handling apparatus |
| US5658123A (en) * | 1995-09-15 | 1997-08-19 | Advanced Micro Devices, Inc. | Container-less transfer of semiconductor wafers through a barrier between fabrication areas |
| CN204391050U (en) * | 2014-12-30 | 2015-06-10 | 南通富士通微电子股份有限公司 | Automatic material charging system of semiconductor packaging equipment |
| CN206665608U (en) * | 2017-05-04 | 2017-11-24 | 曾昭龙 | A kind of slide rail pearl bar automatic strip discharge device |
| CN207993838U (en) * | 2018-03-05 | 2018-10-19 | 常州银河电器有限公司 | Auto-comb material system before axial diode molding |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5144661B2 (en) * | 2007-08-02 | 2013-02-13 | 平田機工株式会社 | Parts transfer apparatus and method |
-
2018
- 2018-03-05 CN CN201810177661.XA patent/CN108461436B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362342A (en) * | 1986-09-03 | 1988-03-18 | Hitachi Electronics Eng Co Ltd | Parts handling apparatus |
| US5658123A (en) * | 1995-09-15 | 1997-08-19 | Advanced Micro Devices, Inc. | Container-less transfer of semiconductor wafers through a barrier between fabrication areas |
| CN204391050U (en) * | 2014-12-30 | 2015-06-10 | 南通富士通微电子股份有限公司 | Automatic material charging system of semiconductor packaging equipment |
| CN206665608U (en) * | 2017-05-04 | 2017-11-24 | 曾昭龙 | A kind of slide rail pearl bar automatic strip discharge device |
| CN207993838U (en) * | 2018-03-05 | 2018-10-19 | 常州银河电器有限公司 | Auto-comb material system before axial diode molding |
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| Publication number | Publication date |
|---|---|
| CN108461436A (en) | 2018-08-28 |
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