CN108423998B - 玻璃粉体组合物、玻璃封接料及其制备方法和电池 - Google Patents
玻璃粉体组合物、玻璃封接料及其制备方法和电池 Download PDFInfo
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- CN108423998B CN108423998B CN201810550872.3A CN201810550872A CN108423998B CN 108423998 B CN108423998 B CN 108423998B CN 201810550872 A CN201810550872 A CN 201810550872A CN 108423998 B CN108423998 B CN 108423998B
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- 239000011521 glass Substances 0.000 title claims abstract description 196
- 239000003566 sealing material Substances 0.000 title claims abstract description 60
- 239000000843 powder Substances 0.000 title claims abstract description 53
- 239000000203 mixture Substances 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000000654 additive Substances 0.000 claims abstract description 19
- 230000000996 additive effect Effects 0.000 claims abstract description 19
- 150000001875 compounds Chemical class 0.000 claims abstract description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 7
- 239000011574 phosphorus Substances 0.000 claims abstract description 7
- -1 lanthanide metal oxide Chemical class 0.000 claims abstract description 5
- 229910052747 lanthanoid Inorganic materials 0.000 claims abstract description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 4
- 229910000314 transition metal oxide Inorganic materials 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims description 35
- 239000000155 melt Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- 239000007787 solid Substances 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 9
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical compound [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 claims description 9
- 238000000227 grinding Methods 0.000 claims description 7
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 229910052593 corundum Inorganic materials 0.000 claims description 4
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 3
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 2
- 229910021641 deionized water Inorganic materials 0.000 claims description 2
- 125000002467 phosphate group Chemical class [H]OP(=O)(O[H])O[*] 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 19
- 239000003792 electrolyte Substances 0.000 abstract description 7
- 238000012360 testing method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 5
- 238000005097 cold rolling Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Inorganic materials [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910001947 lithium oxide Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 229910003069 TeO2 Inorganic materials 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C12/00—Powdered glass; Bead compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/183—Sealing members
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Glass Compositions (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201810550872.3A CN108423998B (zh) | 2018-05-31 | 2018-05-31 | 玻璃粉体组合物、玻璃封接料及其制备方法和电池 |
Applications Claiming Priority (1)
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CN201810550872.3A CN108423998B (zh) | 2018-05-31 | 2018-05-31 | 玻璃粉体组合物、玻璃封接料及其制备方法和电池 |
Publications (2)
Publication Number | Publication Date |
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CN108423998A CN108423998A (zh) | 2018-08-21 |
CN108423998B true CN108423998B (zh) | 2021-10-08 |
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CN201810550872.3A Active CN108423998B (zh) | 2018-05-31 | 2018-05-31 | 玻璃粉体组合物、玻璃封接料及其制备方法和电池 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108996910A (zh) * | 2018-09-07 | 2018-12-14 | 苏州融睿电子科技有限公司 | 一种组合体、混合料、封接玻璃及其制作方法 |
CN110372215A (zh) * | 2019-08-07 | 2019-10-25 | 北京北旭电子材料有限公司 | 一种封接玻璃材料及其制备方法、连接组件 |
CN113461337A (zh) * | 2021-07-02 | 2021-10-01 | 苏州长风航空电子有限公司 | 一种热电偶用封装玻璃及其制备和封装方法 |
CN113716874B (zh) * | 2021-10-18 | 2022-09-23 | 北京北旭电子材料有限公司 | 玻璃材料、玻璃粉、玻璃粉的制备方法及其应用 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08301631A (ja) * | 1995-03-07 | 1996-11-19 | Asahi Glass Co Ltd | プラズマディスプレイパネル |
JPH11349347A (ja) * | 1998-06-08 | 1999-12-21 | Asahi Glass Co Ltd | 結晶性低融点ガラス組成物 |
JP2001106549A (ja) * | 1999-10-06 | 2001-04-17 | Ohara Inc | 低融点ガラスおよび封着用組成物 |
JP2001274272A (ja) * | 2000-03-23 | 2001-10-05 | Kyocera Corp | 光半導体素子収納用パッケージ |
JP2002160937A (ja) * | 2000-11-24 | 2002-06-04 | Ngk Insulators Ltd | 低温溶融性ガラス |
JP2002319646A (ja) * | 2001-04-20 | 2002-10-31 | Kyocera Corp | 電子部品収納用容器 |
CN105481253A (zh) * | 2015-12-09 | 2016-04-13 | 哈尔滨工业大学 | 一种复合型低温封接玻璃钎料焊膏的制备方法 |
-
2018
- 2018-05-31 CN CN201810550872.3A patent/CN108423998B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08301631A (ja) * | 1995-03-07 | 1996-11-19 | Asahi Glass Co Ltd | プラズマディスプレイパネル |
JPH11349347A (ja) * | 1998-06-08 | 1999-12-21 | Asahi Glass Co Ltd | 結晶性低融点ガラス組成物 |
JP2001106549A (ja) * | 1999-10-06 | 2001-04-17 | Ohara Inc | 低融点ガラスおよび封着用組成物 |
JP2001274272A (ja) * | 2000-03-23 | 2001-10-05 | Kyocera Corp | 光半導体素子収納用パッケージ |
JP2002160937A (ja) * | 2000-11-24 | 2002-06-04 | Ngk Insulators Ltd | 低温溶融性ガラス |
JP2002319646A (ja) * | 2001-04-20 | 2002-10-31 | Kyocera Corp | 電子部品収納用容器 |
CN105481253A (zh) * | 2015-12-09 | 2016-04-13 | 哈尔滨工业大学 | 一种复合型低温封接玻璃钎料焊膏的制备方法 |
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Publication number | Publication date |
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CN108423998A (zh) | 2018-08-21 |
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Effective date of registration: 20210406 Address after: 100015 No. 10, Jiuxianqiao Road, Beijing, Chaoyang District Applicant after: BEIJING ASASHI ELECTRONIC MATERIALS Co.,Ltd. Address before: 100015 No. 10, Jiuxianqiao Road, Beijing, Chaoyang District Applicant before: BEIJING ASASHI ELECTRONIC MATERIALS Co.,Ltd. Applicant before: BOE TECHNOLOGY GROUP Co.,Ltd. |
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Effective date of registration: 20220630 Address after: 433199 No. 2, East Road, Jianghan Salt Chemical Industrial Park, Qianjiang City, Hubei Province Patentee after: Beixu (Hubei) Electronic Material Co.,Ltd. Address before: 100015 No. 10, Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: BEIJING ASASHI ELECTRONIC MATERIALS Co.,Ltd. |