CN108417684A - Mosquito-repelling lamp production process based on flip Chip On Board (COB) technology - Google Patents
Mosquito-repelling lamp production process based on flip Chip On Board (COB) technology Download PDFInfo
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- CN108417684A CN108417684A CN201810100840.3A CN201810100840A CN108417684A CN 108417684 A CN108417684 A CN 108417684A CN 201810100840 A CN201810100840 A CN 201810100840A CN 108417684 A CN108417684 A CN 108417684A
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- China
- Prior art keywords
- repelling lamp
- mosquito repelling
- welded
- powder
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005516 engineering process Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 24
- 239000003292 glue Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000005476 soldering Methods 0.000 claims abstract description 6
- 241000255925 Diptera Species 0.000 claims description 30
- 230000001846 repelling effect Effects 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 239000006071 cream Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 3
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 239000000077 insect repellent Substances 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 4
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 239000004568 cement Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 206010000234 Abortion spontaneous Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 208000015994 miscarriage Diseases 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 208000000995 spontaneous abortion Diseases 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Catching Or Destruction (AREA)
Abstract
The invention discloses a mosquito-repellent lamp production process based on an inverted COB technology, which comprises the following steps of die bonding, placing L ED inverted chips on a substrate in a dispensing mode to form an integrated board to be welded, placing the integrated board to be welded in reflow soldering equipment, adjusting the temperature and chain speed of each section of the reflow soldering equipment, performing reflow soldering on the integrated board to be welded to form a welded integrated board, dispensing powder according to required color temperature to form fluorescent glue, covering the fluorescent glue on L ED inverted chips of the welded integrated board by using an automatic dispenser, and thus a mosquito-repellent lamp packaging light source can be obtained.
Description
Technical field
The present invention relates to a kind of mosquito repelling lamp LED light source packaging technology technical fields, especially a kind of to be based on upside-down mounting COB technologies
Mosquito repelling lamp production technology.
Background technology
COB technologies, that is, chip on board encapsulation technology (Chip On Board), are to be encapsulated in plurality of LEDs integrated chip together
A kind of technology of illuminator is made on one substrate；COB integration packaging technologies are a kind of more novel LED packaged types, but
It is the extensive use with LED product in lighting area, the light source encapsulated using COB technologies will be increasingly becoming the master of encapsulation industry
Miscarriage product.
LED mosquito repelling lamps are a kind of novel mosquito repellent products, have many advantages, such as that safe and environment-friendly, health is harmless.The prior art
In mosquito repelling lamp LED light source encapsulate produce during, need to include the processes such as gold thread encapsulation, lead frame routing, above-mentioned
In operation process, welded wire or poor contact easily causes LED chip light source and does not work, flickers or the problems such as light decay is big.Therefore
It is necessary to design a kind of novel mosquito repelling lamp LED light source packaging technology, to overcome the above problem.
Invention content
For overcome the deficiencies in the prior art, the present invention provides a kind of, and the mosquito repelling lamp based on upside-down mounting COB technologies produces work
Skill can efficiently reduce the LED chip light source caused by welded wire or poor contact and not work, flicker or light decay is big etc. asks
The occurrence probability of topic improves the product quality and service life of LED mosquito repelling lamps.
The technical solution adopted by the present invention to solve the technical problems is：
A kind of mosquito repelling lamp production technology based on upside-down mounting COB technologies, includes the following steps：
Die bond step：LED flip chip, is then placed on the tin cream of spot printing by the spot printing tin cream on substrate, is made and waits for
Weld circuit board；
Welding step：Circuit board to be welded is placed in solder reflow device, the temperature of each section and chain of solder reflow device are adjusted
Then speed is made circuit board to be welded progress Reflow Soldering and has welded circuit board；
Point powder step：Colour temperature as needed carries out that fluorescent glue is made with powder operation, then uses automatic dispensing machine will be glimmering
Optical cement is covered in the LED flip chip for having welded circuit board, you can mosquito repelling lamp packaged light source is made.
As the further preferred of above-mentioned technical proposal, in powder step, control matches glue ratio with powder operation, makes system
The emission wavelength of the mosquito repelling lamp packaged light source obtained is 585~595 nanometers.
After powder step further include baking procedure as the further preferred of above-mentioned technical proposal：Mosquito repellent is detected first
Whether the emission wavelength of lamp packaged light source meets the requirements, and the satisfactory mosquito repelling lamp packaged light source of emission wavelength is laid in baking
On pallet, then baking pallet level is put into oven and is toasted.
As the further preferred of above-mentioned technical proposal, in powder step, the process with powder operation is as follows：Claim in proportion
Assorted fluorescent powder and silica gel are taken, the two is uniformly mixed, then can be made into fluorescent glue after deaeration is handled.
Compared with prior art, the beneficial effects of the invention are as follows：
A kind of mosquito repelling lamp production technology based on upside-down mounting COB technologies provided by the present invention, simplifies technological process, saves
Lead frame routing procedure only leaves LED chip collocation fluorescent powder and is used with packaging plastic；As the product of new packaging technology, upside-down mounting
The LED chip light source of no gold thread do not work caused by welded wire or poor contact completely, flickers or the problems such as light decay is big,
Considerably improve the product quality and service life of LED mosquito repelling lamps.
Compared to traditional packaging process, a kind of mosquito repelling lamp production technology based on upside-down mounting COB technologies provided by the present invention
Packaging density increase 16 times, encapsulation volume reduces 80%, Design of Luminaires space bigger, LED chip of the upside-down mounting without gold thread
With more stable performance, better thermal diffusivity, photochromic distribution evenly, smaller volume.
Specific implementation mode
The present invention is further described with reference to specific embodiment.
A kind of mosquito repelling lamp production technology based on upside-down mounting COB technologies that the present embodiment is provided, includes the following steps：
Die bond step：LED flip chip, is then placed on the tin cream of spot printing by the spot printing tin cream on substrate, is made and waits for
Weld circuit board.
The effect of substrate is mainly used for supporting and fixed LED flip chip, is dissipated to itself and LED flip chip
Heat carries out circuit trace arrangement.The effect of tin cream is mainly used for LED flip chip being fixed on substrate, to the LED in work
Flip-chip is radiated and is made conductive between LED flip chip and substrate.
Welding step：Circuit board to be welded is placed in solder reflow device, the temperature of each section and chain of solder reflow device are adjusted
Then speed is made circuit board to be welded progress Reflow Soldering and has welded circuit board.
Point powder step：Colour temperature as needed carries out that fluorescent glue is made with powder operation, then uses automatic dispensing machine will be glimmering
Optical cement is covered in the LED flip chip for having welded circuit board, you can mosquito repelling lamp packaged light source is made；Control matching with powder operation
Glue ratio, it is 585~595 nanometers to make the emission wavelength of mosquito repelling lamp packaged light source obtained.
Specifically, the process for matching powder operation is as follows：Assorted fluorescent powder and silica gel are weighed in proportion, and the two is uniformly mixed,
Then it can be made into fluorescent glue after deaeration is handled.
There are many open schemes in the prior art for the specific proportioning of assorted fluorescent powder and silica gel, specifically for example in
Scheme disclosed in 107331740 A of state patent document CN, 106252492 A of Chinese patent literature CN etc., therefore be not necessarily to herein
It repeats again.
Baking procedure：Whether the emission wavelength of detection mosquito repelling lamp packaged light source first meets the requirements, and emission wavelength is met
It is required that mosquito repelling lamp packaged light source be laid on baking pallet, then baking pallet level is put into oven and is toasted.
Appearance detection finally is carried out to the mosquito repelling lamp packaged light source through overbaking, then lights and is detected, for detection
Qualified mosquito repelling lamp packaged light source is packed, is put in storage.
Above to the present invention better embodiment specifically described, certainly, the present invention can also use with it is upper
State the different form of embodiment, those skilled in the art under the premise of without prejudice to spirit of that invention made by it is equivalent
Transformation or corresponding change, should all belong to the scope of protection of the present invention in.
Claims (4)
1. a kind of mosquito repelling lamp production technology based on upside-down mounting COB technologies, which is characterized in that include the following steps：
Die bond step：LED flip chip, is then placed on the tin cream of spot printing by the spot printing tin cream on substrate, is made to be welded
Circuit board；
Welding step：Circuit board to be welded is placed in solder reflow device, adjusts the temperature of each section and chain speed of solder reflow device, so
Circuit board to be welded progress Reflow Soldering is made afterwards and has welded circuit board；
Point powder step：Colour temperature as needed carries out that fluorescent glue is made with powder operation, then uses automatic dispensing machine by fluorescent glue
It is covered in the LED flip chip for having welded circuit board, you can mosquito repelling lamp packaged light source is made.
2. a kind of mosquito repelling lamp production technology based on upside-down mounting COB technologies according to claim 1, which is characterized in that in point
In powder step, control matches glue ratio with powder operation, and the emission wavelength of mosquito repelling lamp packaged light source obtained is made to be received for 585~595
Rice.
3. a kind of mosquito repelling lamp production technology based on upside-down mounting COB technologies according to claim 2, which is characterized in that in point
Further include baking procedure after powder step：Whether the emission wavelength of detection mosquito repelling lamp packaged light source first meets the requirements, by luminous wave
Long satisfactory mosquito repelling lamp packaged light source is laid on baking pallet, and then baking pallet level is put into oven and is carried out
Baking.
4. a kind of mosquito repelling lamp production technology based on upside-down mounting COB technologies according to claim 2, which is characterized in that in point
In powder step, the process with powder operation is as follows：Assorted fluorescent powder and silica gel are weighed in proportion, and the two is uniformly mixed, is then passed through
Fluorescent glue is can be made into after crossing deaeration processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810100840.3A CN108417684A (en) | 2018-02-01 | 2018-02-01 | Mosquito-repelling lamp production process based on flip Chip On Board (COB) technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810100840.3A CN108417684A (en) | 2018-02-01 | 2018-02-01 | Mosquito-repelling lamp production process based on flip Chip On Board (COB) technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108417684A true CN108417684A (en) | 2018-08-17 |
Family
ID=63127521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810100840.3A Pending CN108417684A (en) | 2018-02-01 | 2018-02-01 | Mosquito-repelling lamp production process based on flip Chip On Board (COB) technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108417684A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738324A (en) * | 2012-04-25 | 2012-10-17 | 江苏汉莱科技有限公司 | LED (light-emitting diode) COB (Chip on Board) packaging technology and applications thereof |
| CN105489734A (en) * | 2015-04-10 | 2016-04-13 | 郭垣成 | Chip on board (COB) production process free from wire binding |
| CN105655327A (en) * | 2016-03-16 | 2016-06-08 | 广东华辉煌光电科技有限公司 | Structure substrate of COB light source modules with flip LED chips |
| CN205402428U (en) * | 2016-03-28 | 2016-07-27 | 佛山市南海光雅灯饰电器有限公司 | Multi -functional acoustic control lamp with air -purifying function |
| CN206055256U (en) * | 2016-08-19 | 2017-03-29 | 江苏东林电子有限公司 | A kind of Multifunctional LED lamp |
| CN106784263A (en) * | 2017-01-17 | 2017-05-31 | 东莞市可享光电科技有限公司 | A kind of LED mosquito repelling lamps and preparation method thereof |
-
2018
- 2018-02-01 CN CN201810100840.3A patent/CN108417684A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738324A (en) * | 2012-04-25 | 2012-10-17 | 江苏汉莱科技有限公司 | LED (light-emitting diode) COB (Chip on Board) packaging technology and applications thereof |
| CN105489734A (en) * | 2015-04-10 | 2016-04-13 | 郭垣成 | Chip on board (COB) production process free from wire binding |
| CN105655327A (en) * | 2016-03-16 | 2016-06-08 | 广东华辉煌光电科技有限公司 | Structure substrate of COB light source modules with flip LED chips |
| CN205402428U (en) * | 2016-03-28 | 2016-07-27 | 佛山市南海光雅灯饰电器有限公司 | Multi -functional acoustic control lamp with air -purifying function |
| CN206055256U (en) * | 2016-08-19 | 2017-03-29 | 江苏东林电子有限公司 | A kind of Multifunctional LED lamp |
| CN106784263A (en) * | 2017-01-17 | 2017-05-31 | 东莞市可享光电科技有限公司 | A kind of LED mosquito repelling lamps and preparation method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180817 |
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| RJ01 | Rejection of invention patent application after publication |