CN108417391B - Capacitor assembly - Google Patents

Capacitor assembly Download PDF

Info

Publication number
CN108417391B
CN108417391B CN201711191161.3A CN201711191161A CN108417391B CN 108417391 B CN108417391 B CN 108417391B CN 201711191161 A CN201711191161 A CN 201711191161A CN 108417391 B CN108417391 B CN 108417391B
Authority
CN
China
Prior art keywords
electrode
layer
connection
electrodes
connection electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201711191161.3A
Other languages
Chinese (zh)
Other versions
CN108417391A (en
Inventor
徐庸原
朱镇卿
李泽正
千晋雨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN108417391A publication Critical patent/CN108417391A/en
Application granted granted Critical
Publication of CN108417391B publication Critical patent/CN108417391B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

A capacitor assembly includes a body having a plurality of first internal electrodes and a plurality of second internal electrodes alternately stacked with a dielectric layer interposed therebetween. First and second connection electrodes extend in a thickness direction of the body and are connected to the first and second internal electrodes, respectively. First and second lower electrodes on a lower surface of the body and connected to the first and second connection electrodes, respectively.

Description

Capacitor assembly
This application claims the benefit of priority of korean patent application No. 10-2017-0018727, filed on 10.2.2017 by the korean intellectual property office, the disclosure of which is incorporated herein by reference in its entirety.
Technical Field
The present disclosure relates to a capacitor assembly.
Background
Multilayer ceramic capacitors (MLCCs) are chip capacitors mounted on printed circuit boards of a variety of electronic products such as Liquid Crystal Displays (LCDs), Plasma Display Panels (PDPs) or other displays, computers, smart phones, and other cellular phones. MLCCs are used for charging or discharging. MLCCs can be used as components of various electronic devices because of their relative small size, high capacitance, and ease of installation.
Recently, MLCCs having high capacitance and high reliability have been developed. In order to obtain a capacitor having a high capacitance, the dielectric constant of the material constituting the capacitor body may be increased, or the number of internal electrodes and dielectric layers may be increased by reducing the thicknesses of the internal electrodes and dielectric layers.
However, it is not easy to develop a composition of a material having a high dielectric constant, and there is a limit to reduce the thickness of the dielectric layer using the current method. As such, there is a limit to increasing the capacitance of a product by such a method. Therefore, it has been required to study a method of increasing the overlapping area of the internal electrodes having different polarities and a method of increasing the capacitance of the capacitor according to the miniaturization trend of the capacitor. Further, attempts have been made to reduce the mounting area and mounting height of the capacitor in accordance with an increase in the mounting density of the board.
As part of such research, capacitors having a structure in which internal electrodes are connected to each other through via (through-hole) have been developed. In such a capacitor, unlike a general capacitor, a current flows through a via hole connecting the inner electrodes to each other.
In such a structure, an equivalent series inductance (ESL) characteristic value and an Equivalent Series Resistance (ESR) characteristic value of the capacitor may vary according to the structure of the via hole.
The small distance between the through holes is advantageous in order to obtain low ESL characteristics. However, when the distance between the through holes is excessively small, defects such as short circuits due to contact between the through holes after plating is performed may occur.
Products having small sizes and thin film forms have been demanded, and capacitors having low ESL characteristic values depending on high frequency characteristics have been demanded. Therefore, research into capacitors satisfying these requirements has been required.
Disclosure of Invention
An aspect of the present disclosure may provide a capacitor assembly having improved equivalent series inductance (ESL) values and Equivalent Series Resistance (ESR) values.
According to an aspect of the present disclosure, a capacitor assembly may include a body including a plurality of first and second internal electrodes alternately stacked in a thickness direction with a dielectric layer interposed therebetween. The first and second connection electrodes may extend in the thickness direction and be connected to the first and second internal electrodes, respectively. First and second lower electrodes may be located on a lower surface of the body in the thickness direction and connected to the first and second connection electrodes, respectively. The first lower electrode may include a first electrode layer and a first plating layer, the second lower electrode may include a second electrode layer and a second plating layer, the first electrode layer and the second electrode layer are connected to the first connection electrode and the second connection electrode, respectively, and the first plating layer and the second plating layer cover a portion of the first electrode layer and a portion of the second electrode layer, respectively. The first electrode layer and the second electrode layer may each include a first region covered by the first plating layer and the second plating layer, respectively, and a second region connected to the first connection electrode and the second connection electrode, respectively, and extending from the first region. An insulating layer may be located between the first and second plating layers, and may cover the respective second regions of the first and second electrode layers and the first and second connection electrodes.
According to another aspect of the present disclosure, a capacitor assembly may include a body including a plurality of first and second internal electrodes alternately stacked in a thickness direction with a dielectric layer interposed therebetween. The first and second connection electrodes may extend in the thickness direction and be connected to the first and second internal electrodes, respectively. The first and second lower electrodes may be positioned on a lower surface of the body in a thickness direction and connected to the first and second connection electrodes, respectively. There may be one or more first connection electrodes and one or more second connection electrodes. In dividing the body into three parts along a length direction perpendicular to the thickness direction, all of the first and second connection electrodes may be located in a central portion of the body and separated from each other by a predetermined distance.
According to another aspect of the present disclosure, a capacitor assembly may include: a body including a plurality of first and second internal electrodes alternately stacked in a thickness direction with a dielectric layer interposed therebetween; a first connection electrode extending in the thickness direction, connected to the first internal electrode, and separated from the second internal electrode; a second connection electrode extending in the thickness direction, connected to the second internal electrode, and separated from the first internal electrode; a first electrode layer located on a lower surface of the body in the thickness direction, extending from a first end surface in a length direction perpendicular to the thickness direction toward a center of the body in the length direction, and contacting the first connection electrode; a second electrode layer located on the lower surface of the body in the thickness direction, extending from a second end surface opposite to the first end surface in the length direction toward a center of the body in the length direction, separated from the first electrode layer, and in contact with the second connection electrode; a lower insulating layer on the lower surface of the body and between the first electrode layer and the second electrode layer, extending over a portion of the first electrode layer, and extending over a portion of the second electrode layer, wherein the first connection electrode and the second connection electrode are located in a central portion of the body when the body is divided into three portions along the length direction.
Drawings
The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic perspective view illustrating a capacitor assembly according to an exemplary embodiment in the present disclosure;
FIG. 2 is a cross-sectional view showing the capacitor assembly taken along line I-I' of FIG. 1;
fig. 3 is a plan view showing the form of internal electrodes and connection electrodes in the capacitor assembly of fig. 1;
fig. 4 to 6 are diagrams showing an example in which the form of the lower electrode is modified from the exemplary embodiment of fig. 1; and
fig. 7 is a diagram showing an example in which the form of plating is modified from the exemplary embodiment of fig. 1.
Detailed Description
Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
Fig. 1 is a schematic perspective view illustrating a capacitor assembly according to an exemplary embodiment in the present disclosure. Fig. 2 is a sectional view showing the capacitor assembly taken along line I-I' of fig. 1. Fig. 3 is a plan view showing the form of internal electrodes and connection electrodes in the capacitor assembly of fig. 1.
Referring to fig. 1 to 3, a capacitor assembly 100 according to an exemplary embodiment of the present disclosure may include a body 101, the body 101 including a plurality of dielectric layers 110 and first and second internal electrodes 111 and 112 alternately arranged with each dielectric layer 110 interposed between the first and second internal electrodes 111 and 112. The first and second connection electrodes 121 and 122 may extend in a thickness direction of the body 101 and be connected to the first and second internal electrodes 111 and 112, respectively. The lower electrode 130 may be disposed on the lower surface of the body 101, and the lower electrode 130 may include first and second lower electrodes connected to the first and second connection electrodes 121 and 122, respectively.
In the present exemplary embodiment, the plurality of internal electrodes 111 and 112 will be referred to as a first internal electrode 111 and a second internal electrode 112. The connection electrode connected to the first inner electrode 111 of the connection electrodes 121 and 122 will be referred to as a first connection electrode 121. The connection electrode connected to the second inner electrode 112 among the connection electrodes 121 and 122 will be referred to as a second connection electrode 122.
The body 101 may be formed by stacking a plurality of dielectric layers, and the material of the dielectric layers may be ceramic or the like. For example, the body 101 may include barium titanate (BaTiO) by sintering3) A ceramic green sheet of a base ceramic powder or the like. Barium titanate (BaTiO)3) The base ceramic powder may include (Ba)1-xCax)TiO3、Ba(Ti1-yCay)O3、(Ba1-xCax)(Ti1-yZry)O3、Ba(Ti1-yZry)O3Etc., wherein calcium (Ca), zirconium (Zr), etc. are partially dissolved in BaTiO3In (1). However, barium titanate (BaTiO)3) The base ceramic powder is not limited thereto.
The first and second internal electrodes 111 and 112 may have different polarities, may be alternately stacked, and may be formed by a method of printing a conductive paste on a ceramic green sheet, or the like. The first and second internal electrodes 111 and 112 may be formed of a material such as nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof. The method of printing the conductive paste may be a screen printing method, a gravure printing method, etc., but is not limited thereto.
As shown in fig. 2, the first and second connection electrodes 121 and 122 may extend in a thickness direction (Z-axis direction in fig. 2) of the body 101, may be connected to the first and second internal electrodes 111 and 112, respectively, and may penetrate the body 101. Such via-hole type connection electrodes 121 and 122 may be provided in the form of first and second internal electrodes which are not connected to the connection electrodes 121 and 122 to penetrate therethrough. In other words, as shown in fig. 3, the second connection electrode 122 may have the following form: the second connection electrode 122 is not connected to the first internal electrode 111, but the second connection electrode 122 penetrates the first internal electrode 111, and the insulation space S is located between the second connection electrode 122 and the first internal electrode 111. Similarly, the first connection electrode 121 is not connected to the second internal electrode 112, but penetrates the second internal electrode 112.
The first and second connection electrodes 121 and 122 may be formed by forming holes in the body 101 and the first and second internal electrodes 111 and 112 and then filling conductive materials in the holes. Filling the hole with the conductive material may be achieved by a method of applying a conductive paste, a plating method, or the like. The holes of the body 101 may be formed in the ceramic green sheet by a laser method, a punching method, or the like, or may be obtained by drilling holes in the laminate after sintering.
In the capacitor assembly 100 according to an exemplary embodiment of the present disclosure, the first and second internal electrodes 111 and 112 may be connected to the lower electrode 130 through the first and second connection electrodes 121 and 122, respectively, and may be prevented from being short-circuited by the insulation space S, so that the overlapping area of the first and second internal electrodes 111 and 112 may be increased as much as possible.
Therefore, the capacitance of the capacitor can be increased without using the existing method of increasing the number of the internal electrodes and the dielectric layers by reducing the thicknesses of the dielectric layers and the internal electrodes. In addition, the same kind of internal electrodes may be electrically connected to each other through the first and second connection electrodes 121 and 122, so that the connectivity of the internal electrodes may be improved even for an ultra-thin product whose body has a thickness of 80 μm or less.
The lower electrode 130 may be disposed on the lower surface of the body 101, and may be connected to the first and second connection electrodes 121 and 122. The lower electrode 130 may be provided as a region where the capacitor assembly 100 is mounted on a board or the like, and the lower electrode 130 may have a multi-layered structure, if necessary.
The lower electrode 130 may include: electrode layers 131 and 132 connected to the first connection electrode 121 and the second connection electrode 122, respectively; and plating layers 133 disposed to cover portions of the electrode layers 131 and 132, respectively. According to an example of the present invention, a first one of the lower electrodes 130 may include an electrode layer 131 and a plating layer 133, and a second one of the lower electrodes 130 may include an electrode layer 132 and a plating layer 133.
The electrode layers 131 and 132 may include first regions 131a and 132a, respectively, on which the plating layer 133 is disposed. The electrode layers 131 and 132 may further include second regions 131b and 132b connected to the first connection electrode 121 and the second connection electrode 122, respectively, and extending from the first regions 131a and 132a, respectively.
The insulating layer 151 may be disposed between the plating layers 133 to cover the second regions 131b and 132b of the electrode layers 131 and 132 and the first and second connection electrodes 121 and 122.
In the structure of the general capacitor, the first connection electrode and the second connection electrode are respectively disposed at positions close to opposite end surfaces of the body 101 in a length direction thereof. Accordingly, the electrode layer may be disposed on the surface of the body to be connected to the first and second connection electrodes, and a plating layer covering the entire upper surface of the electrode layer may be formed.
In such a structure according to the related art, the distance between the first connection electrode and the second connection electrode is excessively large, and thus a low equivalent series inductance (ESL) value required in high frequency characteristics may not be obtained.
According to an exemplary embodiment in the present disclosure, as described below, the first and second connection electrodes 121 and 122 may be disposed in a central region of the body 101 such that the first and second connection electrodes 121 and 122 have a relatively small distance therebetween. The plating layer 133 may be provided not to cover the entire upper surfaces of the respective electrode layers 131 and 132. Conversely, the plating layer may be provided to cover a portion of the upper surface of the electrode layer 131 and a portion of the upper surface of the electrode layer 132, respectively.
That is, the electrode layer 131 may include a first region 131a on which the plating layer 133 is disposed and a second region 131b connected to the first connection electrode 121 and extending from the first region 131a, and the electrode layer 132 may include a first region 132a on which the plating layer 133 is disposed and a second region 132b connected to the second connection electrode 122 and extending from the first region 132 a.
The second regions 131b and 132b of the electrode layers 131 and 132 may be electrically connected to the first connection electrode 121 and the second connection electrode 122, respectively, and the plating layer 133 may not be disposed on the second regions 131b and 132 b.
Since the upper portion of the second region 131b and the upper portion of the second region 132b are not covered by the plating layer 133, defects such as electrical short circuits and moisture-resistant defects may occur. Accordingly, an insulating layer (i.e., an upper insulating layer) 151 covering an upper portion of the second region 131b and an upper portion of the second region 132b may be provided.
That is, in the capacitor assembly 100 according to an exemplary embodiment of the present disclosure, the lower electrode 130 may have a structure in which the electrode layers 131 and 132 additionally include the second regions 131b and 132b extending from the first regions 131a and 132a, respectively, in addition to the structure of the first regions 131a and 132a of the electrode layers 131 and 132 corresponding to the lower electrode of the capacitor according to the related art and the plating layer 133 disposed on the first regions 131a and 132a, so as to electrically connect the first and second connection electrodes 121 and 122 disposed to have a small distance therebetween to obtain low ESL characteristics and the lower electrode 130 to each other.
As described above, the first and second connection electrodes 121 and 122 are disposed to have a small distance therebetween, so that the ESL value of the capacitor assembly 100 according to an exemplary embodiment in the present disclosure may be reduced.
Although a small distance between the first connection electrode 121 and the second connection electrode 122 may be beneficial in order to obtain the low ESL characteristics, a small distance between the first connection electrode 121 and the second connection electrode 122 may cause defects such as short circuits due to contact between the first connection electrode 121 and the second connection electrode 122 after plating.
According to an exemplary embodiment in the present disclosure, an insulating layer 151 may be disposed between the plating layers 133 to cover the second regions 131b and 132b of the electrode layers 131 and 132 and the first and second connection electrodes 121 and 122, thereby preventing defects such as a short circuit due to contact between the first and second connection electrodes 121 and 122.
In detail, the insulating layer 151 may be disposed on a region on the lower surface of the body 101 on which the plating layer 133 is not disposed, that is, between the plating layers 133 on the lower surface of the body.
The insulating layer 151 may serve to insulate the first and second connection electrodes 121 and 122 exposed to the lower surface of the body 101 from each other and to prevent the second regions 131b and 132b of the electrode layers 131 and 132 from being exposed to the outside.
Accordingly, defects such as a short circuit due to contact between the first and second connection electrodes 121 and 122 may be prevented, and moisture-resistant defects may also be prevented.
The second regions 131b and 132b of the electrode layers 131 and 132, which are connected to the first connection electrode 121 and the second connection electrode 122, respectively, may be disposed to cover portions of the first connection electrode 121 and portions of the second connection electrode 122, respectively.
Since the first and second connection electrodes 121 and 122 only have to be electrically connected with the lower electrode 130, the second regions 131b and 132b of the electrode layers 131 and 132 need not cover the entirety of the first connection electrode 121 and the entirety of the second connection electrode 122, but may be disposed to cover portions of the first connection electrode 121 and the second connection electrode 122, respectively. Alternatively, the second regions 131b and 132b of the electrode layers 131 and 132 and the first and second connection electrodes 121 and 122 may be disposed to contact each other, respectively, by a printing method.
According to another exemplary embodiment in the present disclosure, the plating layer 133 may be provided to cover the entirety of the electrode layers 131 and 132.
Referring to fig. 7, the electrode layers 131 and 132 may additionally have second regions 131b and 132b extending from the first regions 131a and 132a, respectively, and the plating layer 133 may be disposed to cover the entirety of the electrode layers 131 and 132 (i.e., the first regions 131a and 132a and the second regions 131b and 132 b).
Referring to fig. 1 and 2, an insulating layer 151 may be disposed on an upper surface of the body 101.
According to an exemplary embodiment in the present disclosure, the first and second connection electrodes 121 and 122 are disposed with a small distance therebetween to obtain a low ESL characteristic, a defect such as a short circuit due to contact between the first and second connection electrodes 121 and 122 exposed to the upper surface of the body 101 may occur.
According to an exemplary embodiment in the present disclosure, an insulating layer 151 may be disposed on the upper surface of the body 101 to cover the first and second connection electrodes 121 and 122 exposed to the upper surface of the body 101, thereby preventing defects such as a short circuit due to contact between the first and second connection electrodes 121 and 122.
The insulating layer 151 may serve to insulate the first and second connection electrodes 121 and 122 exposed to the upper surface of the body 101 from each other.
Accordingly, defects such as a short circuit due to contact between the first and second connection electrodes 121 and 122 may be prevented, and moisture-resistant defects may also be prevented.
The capping layer 152 may be positioned between the upper surface of the body 101 and the insulating layer 151 disposed on the upper surface of the body 101. The cover layer may be a dielectric layer, and may be formed by adding a green sheet over the upper surface of the body 101. Here, the cover layer may also be referred to as a green sheet cover layer.
In the exemplary embodiment in the present disclosure, the distance between the first and second connection electrodes 121 and 122 may be as small as possible to obtain a low ESL value, but it is necessary to maintain an insulation state for preventing defects such as short circuit due to contact between the connection electrodes.
In order to prevent the above-described defects such as short circuits, the capping layer 152 may be included between the upper surface of the body 101 and the insulating layer 151 disposed on the upper surface of the body 101, whereby an insulating effect for preventing a short circuit due to contact between connection electrodes may be improved.
Referring to fig. 3, the number of each of the first and second connection electrodes 121 and 122 may be one or more. When the main body 101 is divided into three parts in the length direction, all the first and second connection electrodes 121 and 122 may be disposed in the central portion "c" of the main body 101 to be separated from each other by a predetermined distance.
That is, according to an exemplary embodiment of the present disclosure, in order to make the distance between the first and second connection electrodes 121 and 122 as small as possible, all of the first and second connection electrodes 121 and 122 may be disposed to be separated from each other by a predetermined distance and may be disposed within the central portion c of the body 101 when the body 101 is divided into three parts in the length direction.
Due to the structure as described above, the distance between the first connection electrode 121 and the second connection electrode 122 can be significantly reduced, and thus the equivalent series inductance (ESL) value and the Equivalent Series Resistance (ESR) value can be improved.
The distance "d 1" between the first connection electrode 121 and the second connection electrode 122 may be 5 μm or more.
The first connection electrode 121 and the second connection electrode 122 are disposed such that the distance d1 therebetween is 5 μm or more, whereby the ESL value and the ESR value can be improved and also the reliability can be ensured.
When the distance d1 between the first and second connection electrodes 121 and 122 is less than 5 μm, the distance between the first and second connection electrodes 121 and 122 may be excessively small, which may cause a short circuit due to contact between the first and second connection electrodes 121 and 122, resulting in reduced reliability.
When the distance d1 between the first connection electrode 121 and the second connection electrode 122 is excessively large, the improvement effect of the ESL value and the ESR value may be small.
Fig. 4 to 6 are diagrams illustrating an example in which the form of the lower electrode is modified from the exemplary embodiment of fig. 1.
Referring to fig. 4, the first regions 131a and 132a of the electrode layers 131 and 132 may be disposed on opposite ends of the body 101 in a length direction of the body 101.
The second regions 131b and 132b of the electrode layers 131 and 132 may extend from the first regions 131a and 132a, respectively, and may extend in the same shape as the first regions 131a and 132a disposed on opposite ends of the body 101 in the length direction thereof to be electrically connected to the first connection electrodes 121 and the second connection electrodes 122, respectively.
Accordingly, in the exemplary embodiment shown in fig. 4, the second regions 131b and 132b of the electrode layers 131 and 132 may each extend to opposite ends of the body 101 along the width direction of the body 101.
According to the present exemplary embodiment, the lower electrode 130 and the first and second connection electrodes 121 and 122 may be easily electrically connected to each other.
Referring to fig. 5, the second regions 131b and 132b of the electrode layers 131 and 132 may be connected to the first connection electrodes 121 and the second connection electrodes 122, respectively, when being disposed in the same number as the first connection electrodes 121 and the second connection electrodes 122.
That is, the widths of the portions of the second regions 131b and 132b connected to the corresponding first and second connection electrodes 121 and 122 may be the same or approximately the same as the widths of the first and second connection electrodes 121 and 122, respectively.
That is, unlike other exemplary embodiments, the second regions 131b and 132b of the electrode layers 131 and 132 may have only a minimum area for electrical connection with the first connection electrode 121 and the second connection electrode 122, respectively, and may not be additionally printed on the lower surface of the main body.
Therefore, according to the present exemplary embodiment, the area of the lower electrode 130 may not be significantly increased.
Referring to fig. 6, the second regions 131b and 132b of the electrode layers 131 and 132 may be disposed to be separated from opposite ends in the width direction of the body 101, and may be in a corresponding shape to connect the first connection electrodes 121 to each other or the second connection electrodes 122 to each other.
That is, unlike other exemplary embodiments, the second regions 131b and 132b of the electrode layers 131 and 132 may have only a minimum area for electrical connection with the first connection electrode 121 and the second connection electrode 122, respectively, and may have the following form: the second regions 131b and 132b may be additionally printed in the width direction of the body according to the distance between the first connection electrodes 121 and the distance between the second connection electrodes 122, respectively.
Therefore, according to the present exemplary embodiment, the second regions 131b and 132b of the electrode layers 131 and 132 and the plurality of first and second connection electrodes 121 and 122 may be easily electrically connected to each other, and the second regions 131b and 132b may be easily formed.
The capacitor assembly 100 according to another exemplary embodiment in the present disclosure may include a body 101, the body 101 including a plurality of first and second internal electrodes 111 and 112 alternately stacked, with a dielectric layer 110 interposed between the first and second internal electrodes 111 and 112. The first and second connection electrodes 121 and 122 may extend in a thickness direction of the body 101 and be connected to the first and second internal electrodes 111 and 112, respectively. The lower electrode 130 may be disposed on the lower surface of the body 101 and connected to the first and second connection electrodes 121 and 122. The number of each of the first and second connection electrodes 121 and 122 may be one or more, and when the body 101 is divided into three parts in the length direction, all of the first and second connection electrodes 121 and 122 may be disposed in the central portion c of the body 101 to be separated from each other by a predetermined distance.
The distance between the first connection electrode 121 and the second connection electrode 122 may be 5 μm or more.
An insulating layer 151 may be disposed on the upper surface of the body 101, and a cover layer 152 may be located between the upper surface of the body 101 and the insulating layer 151 disposed on the upper surface of the body 101.
The lower electrode 130 may include: electrode layers 131 and 132 connected to the first connection electrode 121 and the second connection electrode 122, respectively; and a plating layer 133 provided to cover a portion of the electrode layer 131 and a portion of the electrode layer 132. The electrode layer 131 may include a first region 131a on which the plating layer 133 is disposed and a second region 131b connected to the first connection electrode 121 and extending from the first region 131a, and the electrode layer 132 may include a first region 132a on which the plating layer 133 is disposed and a second region 132b connected to the second connection electrode 122 and extending from the first region 132 a. The insulating layer 151 may be disposed between the plating layers 133 to cover the second regions 131b and 132b of the electrode layers 131 and 132 and the first and second connection electrodes 121 and 122.
The second regions 131b and 132b of the electrode layers 131 and 132 may extend to opposite ends of the body 101 in the width direction of the body 101.
The second regions 131b and 132b of the electrode layers 131 and 132 may be connected to the first connection electrodes 121 and the second connection electrodes 122, respectively, when being disposed in the same number as the first connection electrodes 121 and the second connection electrodes 122.
The second regions 131b and 132b of the electrode layers 131 and 132 may be disposed to be separated from opposite ends of the body 101 in the width direction of the body 101, and may be respectively in a shape of connecting the first connection electrodes 121 to each other and a shape of connecting the second connection electrodes 122 to each other.
Repetitive description of the same contents as those of the capacitor assembly according to the exemplary embodiment in the present disclosure described above among the features of the capacitor assembly according to another exemplary embodiment in the present disclosure has been omitted.
As described above, according to exemplary embodiments in the present disclosure, the ESL value and the ESR value may be improved by changing the position and the number of the connection electrodes.
While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the invention defined by the claims.

Claims (21)

1. A capacitor assembly, comprising:
a body including a plurality of first and second internal electrodes alternately stacked in a thickness direction with a dielectric layer interposed therebetween;
first and second connection electrodes extending in the thickness direction and having side surfaces directly connected to the first and second internal electrodes, respectively; and
first and second lower electrodes on a lower surface of the body in the thickness direction and connected to the first and second connection electrodes, respectively,
wherein the first lower electrode includes a first electrode layer and a first plating layer, the second lower electrode includes a second electrode layer and a second plating layer, the first electrode layer and the second electrode layer are connected to the first connection electrode and the second connection electrode, respectively, the first plating layer and the second plating layer cover a portion of the first electrode layer and a portion of the second electrode layer, respectively,
the first electrode layer and the second electrode layer each include a first region covered by the first plating layer and the second plating layer, respectively, and a second region connected to the first connection electrode and the second connection electrode, respectively, and extending from the first region, and
an insulating layer is provided between the first plating layer and the second plating layer, and covers the respective second regions of the first electrode layer and the second electrode layer and the first connection electrode and the second connection electrode.
2. The capacitor assembly according to claim 1, wherein there are one or more first connection electrodes and one or more second connection electrodes, and when the body is divided into three parts along a length direction perpendicular to the thickness direction, all of the first connection electrodes and the second connection electrodes are located in a central portion of the body and are separated from each other by a predetermined distance.
3. The capacitor assembly according to claim 2, wherein a minimum distance between any of the first connection electrodes and any of the second connection electrodes is 5 μ ι η or greater than 5 μ ι η.
4. The capacitor assembly of claim 1, further comprising: an upper insulating layer disposed on an upper surface of the main body in the thickness direction.
5. The capacitor assembly of claim 4, further comprising a green sheet cover layer between the upper surface of the body and the upper insulating layer.
6. The capacitor assembly according to claim 1, wherein the second regions of the first and second electrode layers each extend to opposite ends of the body along a width direction perpendicular to the thickness direction.
7. The capacitor assembly according to claim 1, wherein the second regions of the first and second electrode layers are connected to the first and second connection electrodes, respectively, and each have a width equal to that of the first and second connection electrodes.
8. The capacitor assembly according to claim 1, wherein the second regions of the first and second electrode layers are separated from opposite ends of the body in a width direction perpendicular to the thickness direction, and are in shapes that connect the first connection electrodes to each other and the second connection electrodes to each other, respectively.
9. The capacitor assembly of claim 1, wherein the first and second plating layers cover an entirety of the first electrode layer and an entirety of the second electrode layer, respectively.
10. A capacitor assembly, comprising:
a body including a plurality of first and second internal electrodes each disposed at a different height and alternately stacked in a thickness direction with a dielectric layer interposed therebetween;
first and second connection electrodes extending in the thickness direction and having side surfaces directly connected to the first and second internal electrodes, respectively; and
first and second lower electrodes on a lower surface of the body in the thickness direction and connected to the first and second connection electrodes, respectively,
wherein one or more first connection electrodes and one or more second connection electrodes are present, and when the body is divided into three parts along a length direction perpendicular to the thickness direction, all of the first connection electrodes and the second connection electrodes are located in a central portion of the body and are separated from each other by a predetermined distance, and
wherein the first connection electrode is in direct contact with the first lower electrode, and the second connection electrode is in direct contact with the second lower electrode.
11. The capacitor assembly according to claim 10, wherein a minimum distance between any of the first connection electrodes and any of the second connection electrodes is 5 μ ι η or greater than 5 μ ι η.
12. The capacitor assembly of claim 10, further comprising: an upper insulating layer on an upper surface of the main body in the thickness direction.
13. The capacitor assembly of claim 12, further comprising a green sheet cover layer between the upper surface of the body and the upper insulating layer.
14. The capacitor assembly according to claim 10, wherein the first lower electrode comprises a first electrode layer and a first plating layer, the second lower electrode comprises a second electrode layer and a second plating layer, the first electrode layer and the second electrode layer are connected to the first connection electrode and the second connection electrode, respectively, the first plating layer and the second plating layer cover a portion of the first electrode layer and a portion of the second electrode layer, respectively,
the first electrode layer and the second electrode layer each include a first region covered by the first plating layer and the second plating layer, respectively, and a second region connected to the one or more first connection electrodes and the one or more second connection electrodes, respectively, and extending from the first region, and
an insulating layer is provided between the first plating layer and the second plating layer, and covers the respective second regions of the first electrode layer and the second electrode layer and the first connection electrode and the second connection electrode.
15. The capacitor assembly according to claim 14 wherein the second regions of the first and second electrode layers each extend to opposite ends of the body along a width direction perpendicular to the thickness direction.
16. The capacitor assembly according to claim 14, wherein the second regions of the first and second electrode layers are connected to the first and second connection electrodes, respectively, and each have a width equal to a width of the first and second connection electrodes.
17. The capacitor assembly according to claim 14, wherein the second regions of the first and second electrode layers are separated from opposite ends of the body in a width direction perpendicular to the thickness direction, and are in shapes that connect the first connection electrodes to each other and the second connection electrodes to each other, respectively.
18. A capacitor assembly, comprising:
a body including a plurality of first and second internal electrodes alternately stacked in a thickness direction with a dielectric layer interposed therebetween;
a first connection electrode extending in the thickness direction, having a side surface directly connected to the first internal electrode, and being separated from the second internal electrode;
a second connection electrode extending in the thickness direction, having a side surface directly connected to the second internal electrode, and being separated from the first internal electrode;
a first electrode layer located on a lower surface of the body in the thickness direction, extending from a first end surface in a length direction perpendicular to the thickness direction toward a center of the body in the length direction, and contacting the first connection electrode;
a second electrode layer located on the lower surface of the body in the thickness direction, extending from a second end surface opposite to the first end surface in the length direction toward the center of the body in the length direction, separated from the first electrode layer, and in contact with the second connection electrode;
a lower insulating layer on the lower surface of the body and between the first electrode layer and the second electrode layer, extending over a portion of the first electrode layer, and extending over a portion of the second electrode layer,
wherein the first and second connection electrodes are located in a central portion of the body when the body is divided into three portions along the length direction.
19. The capacitor assembly of claim 18, further comprising:
a first plating layer covering a part of the first electrode layer; and
and a second plating layer covering a portion of the second electrode layer.
20. The capacitor assembly of claim 18, further comprising:
an upper cover layer including a dielectric layer on an upper surface of the body opposite the lower surface in the thickness direction of the body; and
an upper insulating layer over the upper capping layer.
21. The capacitor assembly of claim 18,
the first electrode layer includes: a first region extending to the first end surface and to opposite side surfaces of the body in a width direction perpendicular to the thickness direction and perpendicular to the length direction; a second region extending from the first region, separated from the opposite side surfaces, and contacting the first connection electrode, and
the second electrode layer includes: a first region extending to the second end surface and to the opposing side surface; a second region extending from the first region, separated from the opposite side surfaces, and contacting the second connection electrode.
CN201711191161.3A 2017-02-10 2017-11-24 Capacitor assembly Active CN108417391B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170018727A KR101963283B1 (en) 2017-02-10 2017-02-10 Capacitor Component
KR10-2017-0018727 2017-02-10

Publications (2)

Publication Number Publication Date
CN108417391A CN108417391A (en) 2018-08-17
CN108417391B true CN108417391B (en) 2020-11-27

Family

ID=63105456

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711191161.3A Active CN108417391B (en) 2017-02-10 2017-11-24 Capacitor assembly

Country Status (4)

Country Link
US (1) US10468190B2 (en)
JP (1) JP6992946B2 (en)
KR (1) KR101963283B1 (en)
CN (1) CN108417391B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7056290B2 (en) * 2018-03-23 2022-04-19 Tdk株式会社 Thin film capacitors and methods for manufacturing thin film capacitors
KR102561932B1 (en) * 2018-08-29 2023-08-01 삼성전기주식회사 Capacitor component
KR102101932B1 (en) 2018-10-02 2020-04-20 삼성전기주식회사 Multi-layered ceramic electronic component
CN115527773A (en) * 2019-07-04 2022-12-27 三星电机株式会社 Multilayer ceramic capacitor
KR102620521B1 (en) 2019-07-05 2024-01-03 삼성전기주식회사 Multi-layered ceramic capacitor
KR102333095B1 (en) * 2019-08-19 2021-12-01 삼성전기주식회사 Multi-layered ceramic capacitor
JP2021048261A (en) * 2019-09-18 2021-03-25 株式会社村田製作所 Multilayer capacitor and multilayer capacitor group
KR20210085848A (en) * 2019-12-31 2021-07-08 삼성전기주식회사 Mutilayered electronic component
JP2023143549A (en) * 2022-03-26 2023-10-06 株式会社村田製作所 multilayer ceramic capacitor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0252498A (en) * 1988-08-17 1990-02-22 Murata Mfg Co Ltd Multilayer board with built-in capacitor
JP2003158037A (en) * 2001-11-20 2003-05-30 Ngk Spark Plug Co Ltd Method for manufacturing multilayer electronic component

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270282A (en) * 1997-03-21 1998-10-09 Taiyo Yuden Co Ltd Multilayer ceramic capacitor
KR20010036982A (en) 1999-10-13 2001-05-07 김춘호 Radio frequency condensor using for integrated ceramic module
JP2003318058A (en) * 2002-04-25 2003-11-07 Kyocera Corp Layered capacitor
US7136272B2 (en) * 2003-03-28 2006-11-14 Intel Corporation Low parasitic inductance capacitor with central terminals
CN100511509C (en) * 2004-02-26 2009-07-08 京瓷株式会社 Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same
KR100674823B1 (en) * 2004-12-07 2007-01-26 삼성전기주식회사 Wiring connection structure of multilayered chip capacitor array
KR100649579B1 (en) 2004-12-07 2006-11-28 삼성전기주식회사 Multilayered chip capacitor and capacitor array
JP4757587B2 (en) * 2005-09-21 2011-08-24 Ｔｄｋ株式会社 Multilayer capacitor and manufacturing method thereof
JP4841234B2 (en) 2005-11-24 2011-12-21 日本特殊陶業株式会社 Manufacturing method of wiring substrate with built-in via array capacitor
DE102006000935B4 (en) * 2006-01-05 2016-03-10 Epcos Ag Monolithic ceramic component and method of manufacture
KR100887140B1 (en) 2007-06-20 2009-03-04 삼성전기주식회사 Capacitor embeded multi-layer ceramic substrate
JP4930602B2 (en) 2007-12-14 2012-05-16 株式会社村田製作所 Method for manufacturing thin film multilayer capacitor
JP4957737B2 (en) * 2008-05-14 2012-06-20 株式会社村田製作所 Ceramic electronic component, method for manufacturing the same, and assembly component
JP5221228B2 (en) 2008-07-10 2013-06-26 日本特殊陶業株式会社 Component built-in wiring board and manufacturing method thereof
JP2010045209A (en) * 2008-08-13 2010-02-25 Tdk Corp Method of manufacturing laminated ceramic electronic component
JP5013132B2 (en) * 2009-03-25 2012-08-29 Ｔｄｋ株式会社 Multilayer capacitor and manufacturing method thereof
EP2449569B1 (en) 2009-07-01 2015-08-26 Kemet Electronics Corporation Multilayer capacitor with high capacitance and high voltage capability
JP5777302B2 (en) * 2010-07-21 2015-09-09 株式会社村田製作所 Method for manufacturing ceramic electronic component, ceramic electronic component and wiring board
JP5246215B2 (en) 2010-07-21 2013-07-24 株式会社村田製作所 Ceramic electronic components and wiring boards
KR101462746B1 (en) * 2013-01-02 2014-11-17 삼성전기주식회사 Multi-layered ceramic capacitor and mounting circuit having thereon multi-layered ceramic capacitor
KR101994713B1 (en) * 2013-04-22 2019-07-01 삼성전기주식회사 Multi-layered ceramic capacitor and board for mounting the same
KR101525667B1 (en) * 2013-07-22 2015-06-03 삼성전기주식회사 Embedded multilayer ceramic electronic part and print circuit board having embedded multilayer ceramic electronic part
KR101548813B1 (en) 2013-11-06 2015-08-31 삼성전기주식회사 Multi-layered ceramic capacitor
DE102014118749A1 (en) * 2014-12-16 2016-06-16 Epcos Ag Low distortion ceramic carrier plate and method of manufacture
CN107210129B (en) * 2015-01-30 2020-03-10 株式会社村田制作所 Method for manufacturing electronic component and electronic component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0252498A (en) * 1988-08-17 1990-02-22 Murata Mfg Co Ltd Multilayer board with built-in capacitor
JP2003158037A (en) * 2001-11-20 2003-05-30 Ngk Spark Plug Co Ltd Method for manufacturing multilayer electronic component

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Highly accelerated resistance degradation and thermally stimulated relaxation in BaTiO3-based multilayer ceramic capacitors with Y5V specification;XiaohuaZhang 等;《Journal of Alloys and Compounds》;20151212;第662卷;第308-314页 *
中压高容MLCC的设计及性能;卓金丽等;《电子工艺技术》;20160518(第03期);第157-159页 *
多层陶瓷电容器的技术现状及未来发展趋势;王俊波;《绝缘材料》;20080620(第03期);第30-36页 *

Also Published As

Publication number Publication date
US20180233287A1 (en) 2018-08-16
CN108417391A (en) 2018-08-17
JP6992946B2 (en) 2022-01-13
KR20180092678A (en) 2018-08-20
KR101963283B1 (en) 2019-03-28
JP2018129499A (en) 2018-08-16
US10468190B2 (en) 2019-11-05

Similar Documents

Publication Publication Date Title
CN108417391B (en) Capacitor assembly
US11058003B2 (en) Capacitor and board having the same
US10553364B2 (en) Multilayer capacitor including via electrodes and board having the same
US10076036B2 (en) Multilayer capacitor with via electrodes interconnecting internal electrodes and board having the same
US9258896B2 (en) Multilayer ceramic capacitor
KR102319596B1 (en) Multilayered capacitor and board having the same mounted thereon
US10186380B2 (en) Capacitor component
KR20190053692A (en) 3-termibal multi-layered capacitor
US11031186B2 (en) Capacitor component
KR101792362B1 (en) Multi-layered ceramic capacitor and board for mounting the same
US10763041B2 (en) Multilayer ceramic capacitor and method of manufacturing the same
US10431381B2 (en) Multilayer capacitor and board having the same
KR20180068911A (en) Capacitor and board having the same mounted thereon
CN109427484B (en) Capacitor assembly
KR20180058034A (en) Multi-layered capacitor

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant