CN108323004A - A kind of wiring board with symmetrical pad - Google Patents
A kind of wiring board with symmetrical pad Download PDFInfo
- Publication number
- CN108323004A CN108323004A CN201810106414.0A CN201810106414A CN108323004A CN 108323004 A CN108323004 A CN 108323004A CN 201810106414 A CN201810106414 A CN 201810106414A CN 108323004 A CN108323004 A CN 108323004A
- Authority
- CN
- China
- Prior art keywords
- pad
- terminal pad
- led light
- negative terminal
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to LED circuit board technical fields, refer in particular to a kind of wiring board with symmetrical pad, including circuit board, circuit board includes insulating layer, the circuit layer on insulating layer and the solder mask being covered on circuit layer, welding LED light is needed to offer LED lamp bead pad on solder mask, LED lamp bead pad includes symmetrically arranged positive terminal pad and negative terminal pad, positive terminal pad is identical as negative terminal pad shape size, and positive terminal pad is less than or equal to the LED light outer profile of required welding with negative terminal pad outer profile.The outer profile of positive terminal pad and negative terminal pad is less than or equal to the LED light outer profile of required welding, and positive terminal pad is identical as the lamp base shape size of the LED light of required welding as the shape size of negative terminal pad, in this way during heating the thawing of tin cream scaling powder, it effectively prevent LED light floating displacement, to keep the distance in LED light strip between each LED light equal, it shines uniform, and the production rate of rosin joint can be reduced.
Description
Technical field
The present invention relates to LED circuit board technical fields, refer in particular to a kind of wiring board with symmetrical pad.
Background technology
LED light strip is made of circuit board and crust, is wherein welded with LED light on circuit board.The lower layer of circuit board is insulation
Layer, middle level are circuit layer, and circuit layer is equipped with positive and negative power supply circuit and LED lamp bead series circuit, resistance is covered on circuit layer
Layer, wherein solder mask need weld LED light position offer positive and negative anodes pad.LED light is welded to the work on circuit board
Skill is：First tin cream is instilled in pad, then the positive and negative anodes lamp base alignment positive and negative anodes pad of LED light is fixed, it is heated, in tin cream
Help weldering melt volatilization, tin cream precipitation the positive and negative anodes lamp base of LED light is fixed and lamp base is made to be electrically connected with circuit.
Since the positive and negative anodes lamp base of LED light is small one and large one structure, so traditional positive and negative anodes pad is also configured as one greatly
One small structure, while for ease of the contraposition of LED light, the outer profile of positive terminal pad and negative terminal pad is more than LED light outer profile, in this way
During heating the thawing of tin cream scaling powder, LED light can float on tin cream, and LED light is caused to shift, when tin cream cools down,
Since the tin cream of positive terminal pad and negative terminal pad is of different sizes, the positive lamp base of LED light is different from the shrinkage stress of cathode lamp base,
Cause LED light to be pullled again to shift again, this may result in the distance in LED light strip between each LED light in this way and differ, to shine not
Uniformly, lamp base but will be caused to be detached from pad when serious, lead to rosin joint, dead lamp.
Invention content
In view of the above problems, the present invention provides a kind of wiring boards with symmetrical pad, by being equipped on solder mask
Symmetrical positive terminal pad and negative terminal pad, the outer profile distance and the LED lamp bead of required welding of positive terminal pad and negative terminal pad are long
Degree matching setting, and positive terminal pad matches setting with the size of negative terminal pad with the lamp base of the LED lamp bead of required welding, exists in this way
During heating the thawing of tin cream scaling powder, it is effectively prevent LED lamp bead floating displacement, to make in LED light strip between each LED lamp bead
Distance it is equal, shine uniform, and the production rate of rosin joint can be reduced, in addition, inner groovy is arranged on pad, due to dripping tin cream amount
It is the area design according to pad, the tin cream of a small amount of excess is pulled the inner groovy of pad under the action of surface tension of liquid
Position, will not dissociate away, will not form liquid pearl in the other places of circuit board surface, product qualification rate is high.
To achieve the goals above, the technical solution adopted by the present invention is as follows：
A kind of wiring board with symmetrical pad, including circuit board, circuit board include insulating layer, the circuit layer on insulating layer
And it is covered in the solder mask on circuit layer, need the position for welding LED light to offer LED lamp bead pad, LED light on solder mask
Bead weld disk includes symmetrically arranged positive terminal pad and negative terminal pad, and positive terminal pad is identical as negative terminal pad shape size, anode weldering
Disk is less than or equal to the LED light outer profile of required welding with negative terminal pad outer profile.
Furthermore, the lamp base of the LED light includes the different positive lamp base of shape size and cathode lamp base, LED light
The positive and negative anodes pad of bead weld disk is identical as the small lamp base shape size of LED light.
Furthermore, it is respectively equipped with concave inward structure in the positive terminal pad and negative terminal pad.
Furthermore, the concave inward structure includes the inner groovy of the outer fix set on positive terminal pad and negative terminal pad.
Furthermore, the circuit layer is equipped with power circuit and LED light series circuit, and power circuit is set to circuit layer
Two side positions, LED light series circuit are set to circuit layer centre position, and positive terminal pad is respectively arranged on adjacent two with negative terminal pad
On LED lamp series circuits.
Advantageous effect of the present invention：
The present invention uses such structure setting, by being equipped with symmetrical positive terminal pad and negative terminal pad, anode on solder mask
Pad and the outer profile of negative terminal pad are less than or equal to the LED light outer profile of required welding, and positive terminal pad and negative terminal pad
Shape size is identical as the lamp base shape size of the LED light of required welding, in this way during heating the thawing of tin cream scaling powder,
It effectively prevent LED light floating displacement, to keep the distance in LED light strip between each LED light equal, shine uniform, and void can be reduced
The production rate of weldering.
Description of the drawings
Fig. 1 is board structure of circuit figure of the present invention；
Fig. 2 is LED lamp structure figure of the present invention；
Fig. 3 is traditional LED lamp bead weld dish structure figure.
2.LED lamps；21. positive lamp base；22. cathode lamp base；5. circuit layer；11. solder mask；12. power circuit；13.LED
Lamp series circuit；14.LED lamp bead pads；140. negative terminal pad；141. positive terminal pad；142. inner groovy；15. traditional LED lamp pearl
Pad；L1. outer profile distance；L2.LED lamp bead length.
Specific implementation mode
Technical scheme of the present invention is illustrated with embodiment below in conjunction with the accompanying drawings.
As depicted in figs. 1 and 2, a kind of wiring board with symmetrical pad of the present invention, including circuit board, the electricity
Road plate 1 includes insulating layer, the circuit layer 5 on insulating layer and the solder mask 11 being covered on circuit layer 5, solder mask 11
On need the position for welding LED light 2 to offer LED lamp bead pad 14, LED lamp bead pad 14 includes symmetrically arranged positive terminal pad
141 with negative terminal pad 140, positive terminal pad 141 is identical as 140 shape size of negative terminal pad, positive terminal pad 141 and negative terminal pad
140 outer profile L1 are less than or equal to the LED light outer profile L2 of required welding.Using such structure setting, by solder mask
11 are equipped with symmetrical positive terminal pad 141 and negative terminal pad 140, and positive terminal pad 141 and the outer profile L1 of negative terminal pad 140 are less than
Or the LED light outer profile L2 equal to required welding effectively prevent LED light 2 in this way during heating the thawing of tin cream scaling powder
Floating displacement, positioning is more acurrate, to keep the distance between each LED light 2 in LED light strip equal, shines evenly, and can reduce
The production rate of rosin joint.Again since positive and negative anodes pad is identical, the tin glue dripped is also identical, after tin gelling is solid, the cooling meat of the two
Pulling force is identical, and LED light 2 is effectively prevent to shift.
More specifically, the lamp base of the LED light 2 includes the different positive lamp base 21 of shape size and cathode lamp base 22,
The positive and negative anodes pad of LED lamp bead pad 14 is identical as the small lamp base shape size of LED light 2.Using such structure setting, welding
When effectively prevent LED light 2 shift.
More specifically, it is respectively equipped with concave inward structure in the positive terminal pad 141 and negative terminal pad 140.Concave inward structure packet
Include the inner groovy 142 set on positive terminal pad 141 and the outer fix of negative terminal pad 140.Using such structure setting, inner groovy
142 will not be blocked by the lamp base of LED lamp bead 2, both make the tin cream for having a small amount of excess quilt under the action of surface tension of liquid in this way
The inner groovy 142 for retracting LED lamp bead pad 14, will not dissociate away, will not form liquid pearl elsewhere in circuit board surface,
It is low to drip tin cream technology controlling and process required precision, product yield is high.
More specifically, the circuit layer 5 is equipped with power circuit 12 and LED light series circuit 13, and power circuit 12 is set
In 5 liang of side positions of circuit layer, LED light series circuit 13 is set to 5 centre position of circuit layer, positive terminal pad 141 and negative terminal pad 140
It is respectively arranged on adjacent two LED light series circuits 13.Using such structure setting, pass through the anode of LED lamp bead pad 14
Pad 141 realizes connecting for LED light strip wiring board circuit with welding LED light 2 in negative terminal pad 140.
As shown in figure 3, the positive terminal pad of traditional LED lamp bead weld disk 15 and the outer profile distance L1 of negative terminal pad are more than required
The LED lamp bead length L2 of welding will result in not aligning for LED lamp bead in welding in this way, melt in heating tin cream scaling powder
During, LED lamp bead can float on tin cream, and LED lamp bead is caused to shift, and this may result in each LED in LED light strip in this way
Distance between lamp bead differs, and to non-uniform light, lamp base but will be caused to be detached from pad when serious, leads to rosin joint, dead lamp, this
Outside, traditional LED lamp bead weld disk 15 is to prevent rosin joint, can design a little excess when dripping tin cream on pad, but excess needs to control
In accurate range, otherwise excess is once excessive, when welding LED, extra tin cream be possible to dissociate to circuit board surface its
He forms solder joint in place, leads to short circuit.
The embodiment of the present invention is described above in association with attached drawing, but the invention is not limited in above-mentioned specific realities
Mode is applied, the above mentioned embodiment is only schematical, rather than restrictive, and those skilled in the art exist
Under the enlightenment of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, many shapes can be also made
Formula, within these are all belonged to the scope of protection of the present invention.
Claims (5)
1. a kind of wiring board with symmetrical pad, it is characterised in that：Including circuit board, the circuit board (1) include insulating layer,
Circuit layer (5) on insulating layer and the solder mask (11) being covered on circuit layer (5) need on the solder mask (11)
The position of welding LED light (2) offers LED lamp bead pad (14), and the LED lamp bead pad (14) includes symmetrically arranged anode
Pad (141) and negative terminal pad (140), the positive terminal pad (141) is identical as negative terminal pad (140) shape size, it is described just
Pole pad (141) is less than or equal to the LED light outer profile (L2) of required welding with negative terminal pad (140) outer profile (L1).
2. a kind of wiring board with symmetrical pad according to claim 1 and LED lamp bead structure, it is characterised in that：Institute
The lamp base for stating LED light (2) includes the different positive lamp base (21) of shape size and cathode lamp base (22), the LED lamp bead pad
(14) positive and negative anodes pad is identical as the small lamp base shape size of LED light (2).
3. a kind of wiring board with symmetrical pad according to claim 1 and LED lamp bead structure, it is characterised in that：Institute
It states and is respectively equipped with concave inward structure in positive terminal pad (141) and negative terminal pad (140).
4. a kind of wiring board with symmetrical pad according to claim 3 and LED lamp bead structure, it is characterised in that：Institute
It includes the inner groovy (142) for being set to positive terminal pad (141) and the outer fix of negative terminal pad (140) to state concave inward structure.
5. a kind of wiring board with symmetrical pad according to claim 1 and LED lamp bead structure, it is characterised in that：Institute
Circuit layer (5) is stated equipped with power circuit (12) and LED light series circuit (13), the power circuit (12) is set to circuit layer
(5) two side positions, the LED light series circuit (13) are set to circuit layer (5) centre position, the positive terminal pad (141) with it is negative
Pole pad (140) is respectively arranged on adjacent two LED light series circuits (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810106414.0A CN108323004A (en) | 2018-02-02 | 2018-02-02 | A kind of wiring board with symmetrical pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810106414.0A CN108323004A (en) | 2018-02-02 | 2018-02-02 | A kind of wiring board with symmetrical pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108323004A true CN108323004A (en) | 2018-07-24 |
Family
ID=62901756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810106414.0A Pending CN108323004A (en) | 2018-02-02 | 2018-02-02 | A kind of wiring board with symmetrical pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108323004A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862716A (en) * | 2019-01-28 | 2019-06-07 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display panel and display device |
| CN110312362A (en) * | 2019-06-17 | 2019-10-08 | 东莞市震泰电子科技有限公司 | A kind of banding pattern LED circuit board and processing method and LED light strip |
| CN114513895A (en) * | 2022-03-08 | 2022-05-17 | 江门市东达丰照明科技有限公司 | High-density arranged flexible circuit board, lamp strip thereof and die cutting tool |
Citations (7)
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|---|---|---|---|---|
| JPH104214A (en) * | 1996-06-17 | 1998-01-06 | Stanley Electric Co Ltd | Surface mounting type led element |
| JPH10190063A (en) * | 1996-12-25 | 1998-07-21 | Sharp Corp | Semiconductor light emitting element and semiconductor light emitting device |
| US20110210349A1 (en) * | 2008-08-26 | 2011-09-01 | Dingguo Pan | Led multi-chip bonding die and light strip using the same |
| CN202812882U (en) * | 2012-08-07 | 2013-03-20 | 姚志峰 | LED (light-emitting diode) energy-saving fluorescent lamp |
| CN205196090U (en) * | 2015-11-25 | 2016-04-27 | 江西凯强实业有限公司 | Backlight flexible wiring board pad |
| CN105782789A (en) * | 2016-04-29 | 2016-07-20 | 郭垣成 | FPC/COB light band and manufacturing method thereof |
| CN208353711U (en) * | 2018-02-02 | 2019-01-08 | 江门黑氪光电科技有限公司 | A kind of wiring board with symmetrical pad |
-
2018
- 2018-02-02 CN CN201810106414.0A patent/CN108323004A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH104214A (en) * | 1996-06-17 | 1998-01-06 | Stanley Electric Co Ltd | Surface mounting type led element |
| JPH10190063A (en) * | 1996-12-25 | 1998-07-21 | Sharp Corp | Semiconductor light emitting element and semiconductor light emitting device |
| US20110210349A1 (en) * | 2008-08-26 | 2011-09-01 | Dingguo Pan | Led multi-chip bonding die and light strip using the same |
| CN202812882U (en) * | 2012-08-07 | 2013-03-20 | 姚志峰 | LED (light-emitting diode) energy-saving fluorescent lamp |
| CN205196090U (en) * | 2015-11-25 | 2016-04-27 | 江西凯强实业有限公司 | Backlight flexible wiring board pad |
| CN105782789A (en) * | 2016-04-29 | 2016-07-20 | 郭垣成 | FPC/COB light band and manufacturing method thereof |
| CN208353711U (en) * | 2018-02-02 | 2019-01-08 | 江门黑氪光电科技有限公司 | A kind of wiring board with symmetrical pad |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862716A (en) * | 2019-01-28 | 2019-06-07 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display panel and display device |
| CN110312362A (en) * | 2019-06-17 | 2019-10-08 | 东莞市震泰电子科技有限公司 | A kind of banding pattern LED circuit board and processing method and LED light strip |
| CN114513895A (en) * | 2022-03-08 | 2022-05-17 | 江门市东达丰照明科技有限公司 | High-density arranged flexible circuit board, lamp strip thereof and die cutting tool |
| CN114513895B (en) * | 2022-03-08 | 2023-09-22 | 江门市东达丰照明科技有限公司 | High-density-arrangement flexible circuit board, lamp strip thereof and die cutting tool |
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