CN109862716A - A kind of display base plate and preparation method thereof, display panel and display device - Google Patents
A kind of display base plate and preparation method thereof, display panel and display device Download PDFInfo
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- CN109862716A CN109862716A CN201910082025.3A CN201910082025A CN109862716A CN 109862716 A CN109862716 A CN 109862716A CN 201910082025 A CN201910082025 A CN 201910082025A CN 109862716 A CN109862716 A CN 109862716A
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- 238000002360 preparation method Methods 0.000 title abstract 2
- 229910000679 solder Inorganic materials 0.000 claims abstract description 102
- 239000000758 substrate Substances 0.000 claims abstract description 85
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000006071 cream Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000000926 separation method Methods 0.000 claims abstract description 9
- 238000003466 welding Methods 0.000 claims description 286
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 12
- 239000006247 magnetic powder Substances 0.000 claims description 8
- 230000005389 magnetism Effects 0.000 abstract 2
- 230000000712 assembly Effects 0.000 description 9
- 238000000429 assembly Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of display base plate and preparation method thereof, display panel and display device, and wherein method includes: that at least one pad component is formed on substrate, and each pad component includes the positive terminal pad and negative terminal pad of mutually insulated；The pole P interconnected leg and the pole N leg are formed in each positive terminal pad and/or each negative terminal pad；The print solder paste in positive terminal pad and negative terminal pad；By the pole the P leg and the pole N leg access closed circuit preset period of time at least one positive terminal pad and/or negative terminal pad, assemble so that tin cream is acted on by Loulun magnetism towards positive terminal pad and/or negative terminal pad, so that the tin cream separation between the positive terminal pad and negative terminal pad in each pad component.In this way, the tin cream in positive terminal pad or negative terminal pad is acted on by Loulun magnetism and moved, the tin cream between positive terminal pad and negative terminal pad is also just separated, and effectively avoids the tin cream short problems between positive terminal pad and negative terminal pad, improves yield rate.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a manufacturing method of the display substrate, a display panel and a display device.
Background
With the development of display technology, the display substrate tends to be thinner and lighter, and the color gamut thereof is higher, which requires the size of the display unit to be gradually reduced. The display unit passes through the tin cream and fixes to the pad of base plate on, the size of display unit reduces, and the pad interval just reduces, takes place the tin cream for pad offset when brushing the tin cream on the pad easily, leads to the problem of tin cream short circuit between positive negative pole pad, influences the normal use of display substrate.
Therefore, the technical problem that solder paste short circuit is caused by small pad distance exists in the conventional display substrate.
Disclosure of Invention
The embodiment of the invention provides a circuit substrate, a manufacturing method thereof, a display substrate and a display device, and aims to solve the technical problem that solder paste is short-circuited due to the fact that the space between bonding pads is small in the existing display substrate.
In order to achieve the above purpose, the embodiments of the present invention provide the following specific schemes:
in a first aspect, an embodiment of the present invention provides a method for manufacturing a circuit substrate, where the method includes:
forming at least one pad assembly on a substrate, each pad assembly including a positive pad and a negative pad insulated from each other;
forming a P-pole welding foot and an N-pole welding foot which are connected with each other on each positive electrode welding pad and/or each negative electrode welding pad;
printing solder paste on the positive electrode bonding pad and the negative electrode bonding pad;
and connecting a P electrode welding foot and an N electrode welding foot on at least one positive electrode welding disk and/or the negative electrode welding disk into a closed loop for a preset time period, so that the solder paste is gathered towards the positive electrode welding disk and/or the negative electrode welding disk under the action of the Roots magnetic force, and the solder paste between the positive electrode welding disk and the negative electrode welding disk in each welding disk assembly is separated.
Optionally, the step of forming a P-pole fillet and an N-pole fillet connected to each other on each positive electrode pad and/or each negative electrode pad includes:
and each positive electrode bonding pad and each negative electrode bonding pad are provided with a P electrode welding foot and an N electrode welding foot which are connected with each other.
Optionally, the step of switching the P-pole leg and the N-pole leg on at least one of the positive pad and/or the negative pad into a closed loop for a preset period of time to make the solder paste gather toward the positive pad and/or the negative pad under the action of lorentn magnetic force, so that the solder paste between the positive pad and the negative pad in each of the pad assemblies is separated includes:
connecting the P electrode welding foot and the N electrode welding foot of the positive electrode welding disc into a closed loop for a preset time period, and then disconnecting the P electrode welding foot and the N electrode welding foot so as to enable tin paste of the positive electrode welding disc to gather towards the positive electrode welding disc under the action of Lorentn magnetic force;
and connecting the P electrode welding foot and the N electrode welding foot of the negative electrode welding disc into a closed loop, so that the tin cream of the negative electrode welding disc is gathered towards the negative electrode welding disc under the action of the Roots magnetic force, and the tin cream between the positive electrode welding disc and the negative electrode welding disc is separated.
Optionally, the step of switching the P-pole leg and the N-pole leg on at least one of the positive pad and/or the negative pad into a closed loop for a preset period of time to make the solder paste gather toward the positive pad and/or the negative pad under the action of lorentn magnetic force, so that the solder paste between the positive pad and the negative pad in each of the pad assemblies is separated includes:
connecting the P electrode welding foot and the N electrode welding foot of the negative electrode welding disc into a closed loop for a preset time period and then disconnecting the P electrode welding foot and the N electrode welding foot of the negative electrode welding disc so as to enable tin paste of the negative electrode welding disc to gather towards the negative electrode welding disc under the action of Loran magnetic force;
and connecting the P electrode welding foot and the N electrode welding foot of the positive electrode welding disc into a closed loop, so that the tin cream of the positive electrode welding disc is gathered towards the positive electrode welding disc under the action of Loran magnetic force, and the tin cream between the positive electrode welding disc and the negative electrode welding disc is separated.
Optionally, before the step of printing solder paste on the positive electrode pad and the negative electrode pad, the method further includes:
a connector is formed on the substrate;
connecting all the N-pole welding feet of the positive electrode welding disc in series to a first pin of the connector, and connecting all the P-pole welding feet of the negative electrode welding disc in series to a second pin of the connector;
the step of switching the P-electrode and N-electrode solder feet on at least one of the positive electrode pad and/or the negative electrode pad into a closed loop for a preset period of time to make the solder paste gather towards the positive electrode pad and/or the negative electrode pad under the action of lorentn magnetic force, so that the solder paste between the positive electrode pad and the negative electrode pad in each pad assembly is separated comprises:
connecting the P electrode welding feet and the first pins of all the anode welding pads into a closed loop for a preset time period, and then disconnecting the P electrode welding feet and the first pins so as to enable the solder paste of all the anode welding pads to gather towards the anode welding pads under the action of Lorentz magnetic force;
and connecting the N-pole welding foot and the second pin of all the negative electrode welding discs into a closed loop, so that the solder paste of all the negative electrode welding discs is gathered towards the negative electrode welding discs under the action of the Roots magnetic force, and the solder paste between the positive electrode welding discs and the negative electrode welding discs of each welding disc assembly is separated.
Optionally, the step of printing solder paste on the positive electrode pad and the negative electrode pad includes:
and pressing solder paste on the P electrode welding foot and the N electrode welding foot through the conduction pressing jig.
Optionally, the solder paste contains magnetic powder.
In a second aspect, an embodiment of the present invention provides a circuit substrate, which is manufactured by using the manufacturing method of the circuit substrate according to any one of the first aspects; the circuit substrate includes:
the welding disc assembly comprises a positive welding disc and a negative welding disc which are insulated from each other, and a P electrode welding foot and an N electrode welding foot which are connected with each other are arranged on each positive welding disc and/or each negative welding disc;
solder pastes are printed on the positive electrode bonding pad and the negative electrode bonding pad, and the solder pastes between the positive electrode bonding pad and the negative electrode bonding pad in each bonding pad assembly are separated.
Optionally, each positive electrode pad and each negative electrode pad are provided with a P-electrode solder leg and an N-electrode solder leg which are connected with each other;
the substrate is also provided with a connector;
and N electrode welding feet of all the positive electrode welding pads are connected to the first pins of the connector in series, and/or P electrode welding feet of all the negative electrode welding pads are connected to the second pins of the connector in series.
In a third aspect, an embodiment of the present invention further provides a display substrate, including at least one display unit, and the circuit substrate according to any one of the second aspects;
at least one display unit is fixed on the substrate through at least one welding disc component, wherein the display unit corresponds to the welding disc component one to one.
In a fourth aspect, embodiments of the present invention provide a display device, including the display substrate according to the third aspect.
In the embodiment of the invention, at least one welding disc assembly is formed on the circuit substrate, the P-pole welding foot and the N-pole welding foot which are connected with each other are formed on the positive electrode welding disc and/or the negative electrode welding disc of each welding disc assembly, the tin paste is printed on the positive electrode welding disc and the negative electrode welding disc, and then the P-pole welding foot and the N-pole welding foot of the at least one positive electrode welding disc and/or the negative electrode welding disc are connected into the same closed loop for a preset time period. Therefore, the P electrode welding foot and the N electrode welding pad which are connected into the closed loop are conducted, the tin cream on the positive electrode welding pad or the negative electrode welding pad can be gathered to the positive electrode welding pad or the negative electrode welding pad under the action of the Roots magnetic force, the tin cream between the positive electrode welding pad and the negative electrode welding pad is separated, the short circuit problem of the tin cream between the positive electrode welding pad and the negative electrode welding pad is effectively avoided, and the yield is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a circuit substrate according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a circuit substrate according to an embodiment of the invention;
fig. 3 is another schematic structural diagram of a circuit substrate according to an embodiment of the invention;
FIG. 4 is a schematic diagram of a magnetic force of the solder paste particles subjected to the lorentn in accordance with the embodiment of the present invention;
fig. 5 is a schematic diagram illustrating a distribution of solder paste and magnetic powder on a circuit substrate before being energized according to an embodiment of the present invention;
fig. 6 is a schematic diagram illustrating distribution of solder paste and magnetic powder on a circuit substrate after being electrified according to an embodiment of the present invention;
fig. 7 is a schematic connection diagram of a circuit substrate according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a flow chart of a method for manufacturing a circuit substrate according to an embodiment of the present invention is shown. As shown in fig. 1, the method for manufacturing a circuit substrate mainly includes the following steps:
step 101, forming at least one pad assembly on a substrate, wherein each pad assembly comprises a positive pad and a negative pad which are insulated from each other;
102, forming a P-pole welding foot and an N-pole welding foot which are connected with each other on each positive electrode bonding pad and/or each negative electrode bonding pad;
103, printing solder paste on the positive electrode bonding pad and the negative electrode bonding pad;
the manufacturing method of the circuit substrate provided by this embodiment is mainly used to form at least one pad assembly on the substrate to be used as the circuit substrate, and then fix the display unit on the circuit substrate through the pad assembly, that is, the display substrate in the display device. The manufactured circuit board can be applied to display devices such as Mini LED and Micro LED.
In specific implementation, as shown in fig. 2 and 3, at least one pad assembly 210 is first formed on the substrate 200, each pad assembly 210 includes a positive pad 211 and a negative pad 212, and the pad assembly 210 and the negative pad 212 are insulated and separated from each other. The substrate 200 used may be a Glass substrate (Glass substrate), or other hard planar sheet material. The size and relative distance of the positive electrode pad 211 and the negative electrode pad 212 in each pad assembly 210 may correspond to the distance between two pads of the display unit 300 to be fixed. The number and arrangement of the pad assemblies 210 disposed on the substrate 200 may be determined by the number and arrangement of the display units 300 to be fixed, but is not limited thereto.
In each of the formed pad assemblies 210, a P-electrode fillet 213 is formed on the positive electrode pad 211, and an N-electrode fillet 214 is formed on the negative electrode pad 212, and the P-electrode fillet 213 and the N-electrode fillet 214 may be connected by a single wire. In addition, it is necessary to provide an N-electrode fillet 214 connected to the P-electrode fillet on the positive electrode pad 211 and/or provide a P-electrode fillet 213 connected to the N-electrode fillet 214 on the negative electrode pad 212, and then print a conductive material for performing soldering, such as solder paste 220, on both the positive electrode pad 211 and the negative electrode pad 212. Of course, materials such as rosin, flux, etc. may be used.
And 104, switching a P electrode welding foot and an N electrode welding foot on at least one positive electrode bonding pad and/or one negative electrode bonding pad into a closed loop for a preset time period to enable the solder paste to be gathered towards the positive electrode bonding pad and/or the negative electrode bonding pad under the action of Roots magnetic force, and enabling the solder paste between the positive electrode bonding pad and the negative electrode bonding pad in each bonding pad assembly to be separated.
According to the above steps, the solder paste 220 is printed on the positive electrode pad 211 and the negative electrode pad 212, since the size of the display unit 300 is small, and the size of the positive electrode pad 211 and the negative electrode pad 212 on the circuit substrate 200 is also relatively small, when the solder paste 220 is printed, the position of the solder paste 220 relative to the pads is easily deviated, so that the solder paste 220 between the positive electrode pad 211 and the negative electrode pad 212 is shorted, and the normal use of the circuit substrate 200 is affected.
The positive electrode bonding pad 211 or the negative electrode bonding pad 212 which is simultaneously provided with the P electrode welding foot 213 and the N electrode welding foot 214 is connected to a closed loop for a preset time period, at the moment, a circuit path is formed between the P electrode welding foot 213 and the N electrode welding foot 214, and an electromagnetic field is provided for conductive particles on the bonding pad. As shown in fig. 4 and 5, since the solder paste 220 particles are conductive particles, they move under the lorentn magnetic force in the electromagnetic field, i.e., the solder paste 220 outside the bonding pad gathers toward the bonding pad under the lorentn magnetic force, and the effect after gathering is shown in fig. 6.
In particular implementations, at least one positive pad 211 on the substrate 200 may only be switched into a closed loop such that solder paste 220 near the positive pad 211 is gathered toward the positive pad 211 to achieve separation of the solder paste 220 from the negative pad 212. Alternatively, only at least one negative pad 212 on the substrate 200 may be switched into a closed loop such that the solder paste 220 near the negative pad 212 is gathered toward the negative pad 212 to achieve separation of the solder paste 220 from the positive pad 211. All the positive and negative pads may be connected to the circuit, or only the pads requiring the separation of the positive and negative pads 212 and the solder paste 220 may be connected to the circuit. Optionally, the solder paste 220 may further contain a magnetic powder 240. The magnetic powder 240 is more compatible with the metal copper bonding pad, and the magnetic powder 240 is added into the solder paste 220, so that the magnetic powder 240 can drive the solder paste 220 to gather towards the bonding pad more easily.
Specifically, the step of printing solder paste 220 on the positive electrode pad and the negative electrode pad in step 103 may include:
and pressing solder paste on the P electrode welding foot and the N electrode welding foot through the conduction pressing jig.
After the solder paste 220 is printed on the positive electrode bonding pad 211 or the negative electrode bonding pad 212, the P-electrode bonding leg 213 and the N-electrode bonding leg 214 are connected to a closed loop by pressing the conductive pressing jig. Specifically, the used conduction pressing jig may include structures such as an ejector pin and a lead, and other structures that can realize circuit conduction when pressing or releasing are also applicable to this embodiment, without limitation.
In the method for manufacturing a circuit substrate according to the embodiment of the present invention, at least one pad assembly is formed on the circuit substrate, a P-electrode pad and an N-electrode pad connected to each other are formed on a positive pad and/or a negative pad of each pad assembly, solder paste is printed on the positive pad and the negative pad, and then the P-electrode pad and the N-electrode pad of the at least one positive pad and/or the negative pad are connected to the same closed loop for a preset period of time. Therefore, the P electrode welding foot and the N electrode welding pad which are connected into the closed loop are conducted, the tin cream on the positive electrode welding pad or the negative electrode welding pad can be gathered to the positive electrode welding pad or the negative electrode welding pad under the action of the Roots magnetic force, the tin cream between the positive electrode welding pad and the negative electrode welding pad is separated, the short circuit problem of the tin cream between the positive electrode welding pad and the negative electrode welding pad is effectively avoided, and the yield is improved. The limitation of the bonding pads and the solder paste is reduced, the size of the circuit substrate and the connected display unit can be further reduced, and meanwhile, the distance between the bonding pads on the substrate can be reduced, and the whole size is reduced. In addition, the welding disc component on the circuit substrate can correspondingly fix the display unit, encapsulation is not needed after gluing, and the whole thickness is reduced.
On the basis of the foregoing embodiment, the step 102 of forming the P-pole fillet and the N-pole fillet connected to each other on each positive electrode pad and/or each negative electrode pad may include:
and each positive electrode bonding pad and each negative electrode bonding pad are provided with a P electrode welding foot and an N electrode welding foot which are connected with each other.
In this embodiment, the positive electrode pad 211 and the negative electrode pad 212 of each pad assembly 210 are provided with the P electrode leg 213 and the N electrode leg 214, so that the positive electrode pad 211 and the negative electrode pad 212 can be sequentially and simultaneously connected to a closed loop, as shown in fig. 6, the positive electrode pad 211 and the solder paste 220 particles nearby are gathered to the positive electrode pad 211, and the solder paste 220 particles nearby the negative electrode pad 212 are gathered to the negative electrode pad 212, thereby increasing the speed of separating the solder paste 220 between the positive electrode pad 211 and the negative electrode pad 212 and improving the separation degree of the solder paste 220.
In the case where both the positive and negative pads are accessible to the closed loop, embodiments of the access circuit may include the following two:
in one embodiment, the step 104 of closing the P-electrode and N-electrode solder feet on at least one of the positive electrode pad and/or the negative electrode pad into a closed loop for a predetermined period of time to concentrate the solder paste toward the positive electrode pad and/or the negative electrode pad under the action of lorentz magnetic force so that the solder paste between the positive electrode pad and the negative electrode pad in each of the pad assemblies is separated may include:
connecting the P electrode welding foot and the N electrode welding foot of the positive electrode welding disc into a closed loop for a preset time period, and then disconnecting the P electrode welding foot and the N electrode welding foot so as to enable tin paste of the positive electrode welding disc to gather towards the positive electrode welding disc under the action of Lorentn magnetic force;
and connecting the P electrode welding foot and the N electrode welding foot of the negative electrode welding disc into a closed loop, so that the tin cream of the negative electrode welding disc is gathered towards the negative electrode welding disc under the action of the Roots magnetic force, and the tin cream between the positive electrode welding disc and the negative electrode welding disc is separated.
In another embodiment, the step 104 of turning on the P-electrode and N-electrode pads on at least one of the positive electrode pad and/or the negative electrode pad in a closed loop for a preset period of time to gather the solder paste toward the positive electrode pad and/or the negative electrode pad under the action of lorentn magnetic force so that the solder paste between the positive electrode pad and the negative electrode pad in each of the pad assemblies is separated may include:
connecting the P electrode welding foot and the N electrode welding foot of the negative electrode welding disc into a closed loop for a preset time period and then disconnecting the P electrode welding foot and the N electrode welding foot of the negative electrode welding disc so as to enable tin paste of the negative electrode welding disc to gather towards the negative electrode welding disc under the action of Loran magnetic force;
and connecting the P electrode welding foot and the N electrode welding foot of the positive electrode welding disc into a closed loop, so that the tin cream of the positive electrode welding disc is gathered towards the positive electrode welding disc under the action of Loran magnetic force, and the tin cream between the positive electrode welding disc and the negative electrode welding disc is separated.
According to the two embodiments, the positive bonding pad and the negative bonding pad are sequentially and non-simultaneously connected into the closed loop, so that the solder paste between the positive bonding pad and the negative bonding pad is respectively gathered towards two ends, and the solder paste separation between the positive bonding pad and the negative bonding pad is rapidly realized.
In another specific embodiment, before the step of printing solder paste on the positive electrode pad and the negative electrode pad in step 103, the method may further include:
a connector is formed on the substrate;
connecting all the N-pole welding feet of the positive electrode welding disc in series to a first pin of the connector, and connecting all the P-pole welding feet of the negative electrode welding disc in series to a second pin of the connector;
step 104, switching a P-electrode leg and an N-electrode leg on at least one of the positive electrode pad and the negative electrode pad into a closed loop for a preset period of time to gather the solder paste toward the positive electrode pad and/or the negative electrode pad under the action of lorentn magnetic force, so that the solder paste between the positive electrode pad and the negative electrode pad in each of the pad assemblies is separated, including:
connecting the P electrode welding feet and the first pins of all the anode welding pads into a closed loop for a preset time period, and then disconnecting the P electrode welding feet and the first pins so as to enable the solder paste of all the anode welding pads to gather towards the anode welding pads under the action of Lorentz magnetic force;
and connecting the N-pole welding foot and the second pin of all the negative electrode welding discs into a closed loop, so that the solder paste of all the negative electrode welding discs is gathered towards the negative electrode welding discs under the action of the Roots magnetic force, and the solder paste between the positive electrode welding discs and the negative electrode welding discs of each welding disc assembly is separated.
In the present embodiment, as shown in fig. 7, a connector 230 is additionally provided on the substrate, and the connector 230 includes a first lead 231 and a second lead 232. As shown in fig. 7, the N-pole fillets 214 of all the positive electrode pads 211 are connected in series to the first lead 231, and the P-pole fillets 213 of all the negative electrode pads 212 are connected in series to the second lead 232.
The P-pole fillets 213 and the first pins 231 of all the anode bonding pads 211 are switched on the closed loop for a preset period of time and then are switched off, so that the anode bonding pads 211 and the solder paste 220 nearby are gathered towards the anode bonding pads 211, and then the N-pole fillets 214 and the second pins 232 of all the cathode bonding pads 212 are switched on the closed loop, so that the cathode bonding pads 212 and the solder paste 220 nearby are gathered towards the cathode bonding pads 212, and the solder paste 220 separation between the anode bonding pads 211 and the cathode bonding pads 212 can be realized.
Specifically, the P-electrode leg 213 of each positive electrode pad 211 on the substrate 200 may correspond to one P-electrode pin on the connector 230, or the P-electrode legs 213 of a plurality of positive electrode pads 211 may correspond to the same P-electrode pin on the connector 230, and the N-electrode legs 214 of all positive electrode pads 211 correspond to the first pins 231 on the connector 230, so as to reduce the layout of circuit pins. It should be noted that the first pin 231 is a dummy pin on the connector 230, and is not conducted during normal use, but when the corresponding machine conducts the pressing tool, the first pin 231 can be conducted with the P-electrode pad 213 on the positive electrode pad 211.
Similarly, the N-pole solder foot on each negative electrode pad 212 on the substrate 200 may correspond to one N-pole pin on the connector 230, or the N-pole solder feet 214 on a plurality of negative electrode pads 212 may correspond to the same N-pole pin on the connector 230, and the P-pole solder feet 213 on all negative electrode pads 212 may correspond to the second pins 232 on the connector 230, so as to reduce the layout of the circuit pins. It should be noted that the second pin 232 is a dummy pin on the connector 230, and is not conducted during normal use, but when the corresponding machine conducts the pressing tool, the second pin 232 can be conducted with the N-electrode solder 214 on the negative electrode pad 212.
In this embodiment, the P-electrode fillets 213 of all the positive electrode pads 211 share one N-electrode, and the N-electrode fillets 214 of all the negative electrode pads 212 share one P-electrode, so that the circuit connection process is simplified. When the circuit substrate 200 is used, the P-electrode solder leg 213 of the positive electrode solder leg and the N-electrode solder leg 214 of the negative electrode solder leg are usually connected to the circuit, so that the solder legs connected in series to the first pin 231 and the second pin 232 do not affect the normal connection and use of the circuit substrate 200.
Referring to fig. 2, an embodiment of the present invention provides a circuit substrate, which is manufactured by using the manufacturing method of the circuit substrate according to the embodiment shown in fig. 1. As shown in fig. 2 and 3, the circuit substrate includes:
at least one bonding pad assembly 210 arranged on the substrate, wherein each bonding pad assembly 210 comprises a positive bonding pad 211 and a negative bonding pad 212 which are insulated from each other, and a P-pole welding foot 213 and an N-pole welding foot 214 which are connected with each other are arranged on each positive bonding pad 211 and/or each negative bonding pad 212;
solder paste 220 is printed on the positive electrode bonding pad 211 and the negative electrode bonding pad 212, and the solder paste 220 between the positive electrode bonding pad 211 and the negative electrode bonding pad 212 in each bonding pad assembly 210 is separated.
In this embodiment, an N-electrode leg 214 is added to the P-electrode leg 213 of the positive electrode pad 211, or a P-electrode leg 213 is added to the N-electrode leg 214 of the negative electrode pad 212, and the P-electrode leg 213 and the N-electrode leg 214 of the positive electrode pad 211 or the negative electrode pad 212 are both connected to a closed loop, so as to separate the solder paste 220 between the positive electrode pad 211 and the negative electrode pad 212.
Optionally, as shown in fig. 7, each positive electrode pad 211 and each negative electrode pad 212 are provided with a P-electrode fillet 213 and an N-electrode fillet 214 that are connected to each other;
a connector 230 is also provided on the substrate;
the N-electrode pads 214 of all the positive electrode pads 211 are connected in series to the first pins 231 of the connector 230, and/or the P-electrode pads 213 of all the negative electrode pads 212 are connected in series to the second pins 232 of the connector 230.
The circuit substrate provided by the embodiment of the invention comprises at least one welding disc assembly, wherein the positive electrode welding pad and/or the negative electrode welding pad of each welding disc assembly are provided with the P electrode welding foot and the N electrode welding foot which are connected with each other, the positive electrode welding pad and the negative electrode welding pad are printed with the tin paste, and the P electrode welding foot and the N electrode welding foot of the at least one positive electrode welding pad and/or the negative electrode welding pad are connected into the same closed loop for a preset time period. Therefore, the P electrode welding foot and the N electrode welding pad which are connected into the closed loop are conducted, the tin cream on the positive electrode welding pad or the negative electrode welding pad can be gathered to the positive electrode welding pad or the negative electrode welding pad under the action of the Roots magnetic force, the tin cream between the positive electrode welding pad and the negative electrode welding pad is separated, the short circuit problem of the tin cream between the positive electrode welding pad and the negative electrode welding pad is effectively avoided, and the yield is improved. For a specific implementation process of the circuit substrate provided in the embodiment of the present invention, reference may be made to the specific implementation process of the method for manufacturing the circuit substrate provided in the above embodiment, and details are not repeated here.
In addition, an embodiment of the present invention further provides a display substrate, which includes at least one display unit and a circuit substrate, where the circuit substrate is provided in the embodiments shown in fig. 2 and fig. 3. Wherein,
at least one of the display units 300 is fixed to the substrate 200 by at least one of the pad assemblies 210, wherein the display units 300 correspond to the pad assemblies 210 one to one.
Optionally, a reflective layer 400 may be further disposed on the substrate 200 in a region between adjacent display units 300, so as to reflect light scattered by the light emitting units, so as to improve the light emitting efficiency of the display substrate.
In addition, an embodiment of the present invention provides a display device, including the display substrate provided in the above embodiment.
The display substrate and the display device provided by the embodiment of the invention have the advantages that at least one welding disc assembly is formed on the circuit substrate, the P-pole welding foot and the N-pole welding foot which are connected with each other are formed on the positive electrode welding disc and/or the negative electrode welding disc of each welding disc assembly, the solder paste is printed on the positive electrode welding disc and the negative electrode welding disc, and then the P-pole welding foot and the N-pole welding foot of the at least one positive electrode welding disc and/or the negative electrode welding disc are connected into the same closed loop for a preset time period. Therefore, the P electrode welding foot and the N electrode welding pad which are connected into the closed loop are conducted, the tin cream on the positive electrode welding pad or the negative electrode welding pad can be gathered to the positive electrode welding pad or the negative electrode welding pad under the action of the Roots magnetic force, the tin cream between the positive electrode welding pad and the negative electrode welding pad is separated, the short circuit problem of the tin cream between the positive electrode welding pad and the negative electrode welding pad is effectively avoided, and the yield is improved.
The specific implementation processes of the display substrate and the display device provided by the embodiment of the invention can be referred to the specific implementation processes of the circuit substrate and the manufacturing method thereof provided by the above embodiment, and are not described in detail herein.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (11)
1. A method of fabricating a circuit substrate, the method comprising:
forming at least one pad assembly on a substrate, each pad assembly including a positive pad and a negative pad insulated from each other;
forming a P-pole welding foot and an N-pole welding foot which are connected with each other on each positive electrode welding pad and/or each negative electrode welding pad;
printing solder paste on the positive electrode bonding pad and the negative electrode bonding pad;
and connecting a P electrode welding foot and an N electrode welding foot on at least one positive electrode welding disk and/or the negative electrode welding disk into a closed loop for a preset time period, so that the solder paste is gathered towards the positive electrode welding disk and/or the negative electrode welding disk under the action of the Roots magnetic force, and the solder paste between the positive electrode welding disk and the negative electrode welding disk in each welding disk assembly is separated.
2. The method of claim 1, wherein said step of forming interconnected P-electrode and N-electrode fillets on each of said positive electrode pads and/or each of said negative electrode pads comprises:
and each positive electrode bonding pad and each negative electrode bonding pad are provided with a P electrode welding foot and an N electrode welding foot which are connected with each other.
3. The method of claim 2, wherein said step of placing a P-pole and an N-pole leg on at least one of said positive and/or negative pads in a closed loop for a predetermined period of time to cause said solder paste to be focused by lorentz force toward said positive and/or negative pads such that solder paste separation between said positive and negative pads in each said pad assembly comprises:
connecting the P electrode welding foot and the N electrode welding foot of the positive electrode welding disc into a closed loop for a preset time period, and then disconnecting the P electrode welding foot and the N electrode welding foot so as to enable tin paste of the positive electrode welding disc to gather towards the positive electrode welding disc under the action of Lorentn magnetic force;
and connecting the P electrode welding foot and the N electrode welding foot of the negative electrode welding disc into a closed loop, so that the tin cream of the negative electrode welding disc is gathered towards the negative electrode welding disc under the action of the Roots magnetic force, and the tin cream between the positive electrode welding disc and the negative electrode welding disc is separated.
4. The method of claim 2, wherein said step of placing a P-pole and an N-pole leg on at least one of said positive and/or negative pads in a closed loop for a predetermined period of time to cause said solder paste to be focused by lorentz force toward said positive and/or negative pads such that solder paste separation between said positive and negative pads in each said pad assembly comprises:
connecting the P electrode welding foot and the N electrode welding foot of the negative electrode welding disc into a closed loop for a preset time period and then disconnecting the P electrode welding foot and the N electrode welding foot of the negative electrode welding disc so as to enable tin paste of the negative electrode welding disc to gather towards the negative electrode welding disc under the action of Loran magnetic force;
and connecting the P electrode welding foot and the N electrode welding foot of the positive electrode welding disc into a closed loop, so that the tin cream of the positive electrode welding disc is gathered towards the positive electrode welding disc under the action of Loran magnetic force, and the tin cream between the positive electrode welding disc and the negative electrode welding disc is separated.
5. The method of claim 2, wherein prior to the step of printing solder paste on the positive and negative pads, the method further comprises:
a connector is formed on the substrate;
connecting all the N-pole welding feet of the positive electrode welding disc in series to a first pin of the connector, and connecting all the P-pole welding feet of the negative electrode welding disc in series to a second pin of the connector;
the step of switching the P-electrode and N-electrode solder feet on at least one of the positive electrode pad and/or the negative electrode pad into a closed loop for a preset period of time to make the solder paste gather towards the positive electrode pad and/or the negative electrode pad under the action of lorentn magnetic force, so that the solder paste between the positive electrode pad and the negative electrode pad in each pad assembly is separated comprises:
connecting the P electrode welding feet and the first pins of all the anode welding pads into a closed loop for a preset time period, and then disconnecting the P electrode welding feet and the first pins so as to enable the solder paste of all the anode welding pads to gather towards the anode welding pads under the action of Lorentz magnetic force;
and connecting the N-pole welding foot and the second pin of all the negative electrode welding discs into a closed loop, so that the solder paste of all the negative electrode welding discs is gathered towards the negative electrode welding discs under the action of the Roots magnetic force, and the solder paste between the positive electrode welding discs and the negative electrode welding discs of each welding disc assembly is separated.
6. The method of claim 1, wherein the step of printing solder paste on the positive and negative pads comprises:
and pressing solder paste on the P electrode welding foot and the N electrode welding foot through the conduction pressing jig.
7. The method of any of claims 1-6, wherein magnetic powder is contained within the solder paste.
8. A circuit board manufactured by the method for manufacturing a circuit board according to any one of claims 1 to 7; the circuit substrate includes:
the welding disc assembly comprises a positive welding disc and a negative welding disc which are insulated from each other, and a P electrode welding foot and an N electrode welding foot which are connected with each other are arranged on each positive welding disc and/or each negative welding disc;
solder pastes are printed on the positive electrode bonding pad and the negative electrode bonding pad, and the solder pastes between the positive electrode bonding pad and the negative electrode bonding pad in each bonding pad assembly are separated.
9. The circuit substrate according to claim 8, wherein each of the positive electrode pads and each of the negative electrode pads are provided with a P-electrode leg and an N-electrode leg connected to each other;
the substrate is also provided with a connector;
and N electrode welding feet of all the positive electrode welding pads are connected to the first pins of the connector in series, and/or P electrode welding feet of all the negative electrode welding pads are connected to the second pins of the connector in series.
10. A display substrate comprising at least one display cell, and the circuit substrate according to claim 8 or 9;
at least one display unit is fixed on the substrate through at least one welding disc component, wherein the display unit corresponds to the welding disc component one to one.
11. A display device comprising the display substrate according to claim 10.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114783911A (en) * | 2022-04-02 | 2022-07-22 | 深圳市华星光电半导体显示技术有限公司 | Transfer device of LED chip, chip assembly process and display screen |
| WO2023159523A1 (en) * | 2022-02-25 | 2023-08-31 | 京东方科技集团股份有限公司 | Driving backplane and manufacturing method therefor, and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108055770A (en) * | 2017-12-26 | 2018-05-18 | 江西合力泰科技有限公司 | A kind of backlight FPC plates and backlight semi-finished product |
| CN108323004A (en) * | 2018-02-02 | 2018-07-24 | 江门黑氪光电科技有限公司 | A kind of wiring board with symmetrical pad |
| JP2018114511A (en) * | 2017-01-16 | 2018-07-26 | トヨタ自動車株式会社 | Plastic working method for metal |
-
2019
- 2019-01-28 CN CN201910082025.3A patent/CN109862716B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018114511A (en) * | 2017-01-16 | 2018-07-26 | トヨタ自動車株式会社 | Plastic working method for metal |
| CN108055770A (en) * | 2017-12-26 | 2018-05-18 | 江西合力泰科技有限公司 | A kind of backlight FPC plates and backlight semi-finished product |
| CN108323004A (en) * | 2018-02-02 | 2018-07-24 | 江门黑氪光电科技有限公司 | A kind of wiring board with symmetrical pad |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023159523A1 (en) * | 2022-02-25 | 2023-08-31 | 京东方科技集团股份有限公司 | Driving backplane and manufacturing method therefor, and display device |
| CN114783911A (en) * | 2022-04-02 | 2022-07-22 | 深圳市华星光电半导体显示技术有限公司 | Transfer device of LED chip, chip assembly process and display screen |
| CN114783911B (en) * | 2022-04-02 | 2024-07-23 | 深圳市华星光电半导体显示技术有限公司 | Transfer device of LED chip, assembly process of chip and preparation method of display screen |
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|---|---|
| CN109862716B (en) | 2020-12-25 |
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