CN109862716A - A kind of display base plate and preparation method thereof, display panel and display device - Google Patents
A kind of display base plate and preparation method thereof, display panel and display device Download PDFInfo
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- CN109862716A CN109862716A CN201910082025.3A CN201910082025A CN109862716A CN 109862716 A CN109862716 A CN 109862716A CN 201910082025 A CN201910082025 A CN 201910082025A CN 109862716 A CN109862716 A CN 109862716A
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Abstract
The present invention provides a kind of display base plate and preparation method thereof, display panel and display device, and wherein method includes: that at least one pad component is formed on substrate, and each pad component includes the positive terminal pad and negative terminal pad of mutually insulated；The pole P interconnected leg and the pole N leg are formed in each positive terminal pad and/or each negative terminal pad；The print solder paste in positive terminal pad and negative terminal pad；By the pole the P leg and the pole N leg access closed circuit preset period of time at least one positive terminal pad and/or negative terminal pad, assemble so that tin cream is acted on by Loulun magnetism towards positive terminal pad and/or negative terminal pad, so that the tin cream separation between the positive terminal pad and negative terminal pad in each pad component.In this way, the tin cream in positive terminal pad or negative terminal pad is acted on by Loulun magnetism and moved, the tin cream between positive terminal pad and negative terminal pad is also just separated, and effectively avoids the tin cream short problems between positive terminal pad and negative terminal pad, improves yield rate.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of display base plate and preparation method thereof, display panel and show
Showing device.
Background technique
With the development of display technology, display base plate is lightening, high colour gamut increasingly constitutes trend, and this requires display units
Size gradually reduce.Display unit is fixed on the pad of substrate by tin cream, and the size of display unit reduces, pad spacing
It will reduce, tin cream is easy to happen in brush tin cream on pad and is deviated relative to pad locations, tin between positive and negative anodes pad is caused
The problem of cream is shorted, influences the normal use of display base plate.
As it can be seen that existing display base plate, which there is technical issues that pad spacing is smaller, causes tin cream.
Summary of the invention
The embodiment of the present invention provides a kind of circuit substrate and preparation method thereof, display base plate and display device, existing to solve
With the presence of display base plate pad spacing smaller the technical issues of causing tin cream to be shorted.
In order to achieve the above object, concrete scheme provided in an embodiment of the present invention is as follows:
In a first aspect, the embodiment of the invention provides a kind of production methods of circuit substrate, which comprises
Form at least one pad component on substrate, each pad component include mutually insulated positive terminal pad and
Negative terminal pad；
The pole P interconnected leg and the weldering of the pole N are formed in each positive terminal pad and/or each negative terminal pad
Foot；
The print solder paste in the positive terminal pad and the negative terminal pad；
By at least one described positive terminal pad and/or the negative terminal pad the pole P leg and the pole N leg access be closed back
Road preset period of time is assembled so that the tin cream is acted on by Loulun magnetism towards the positive terminal pad and/or the negative terminal pad, is made
Obtain the tin cream separation between the positive terminal pad and the negative terminal pad in each pad component.
Optionally, described to form the pole P interconnected in each positive terminal pad and/or each negative terminal pad
The step of leg and the pole N leg, comprising:
The pole P interconnected leg and the weldering of the pole N are respectively provided in each positive terminal pad and each negative terminal pad
Foot.
Optionally, the pole P leg and the pole the N weldering by least one described positive terminal pad and/or the negative terminal pad
Foot accesses closed circuit preset period of time, so that the tin cream is acted on by Loulun magnetism towards the positive terminal pad and/or described negative
Pole pad is assembled, so that the tin cream separation between the positive terminal pad and the negative terminal pad in each pad component
Step, comprising:
It will be disconnected after the pole the P leg of the positive terminal pad and the pole N leg access closed circuit preset period of time, with
Assemble the tin cream of the positive terminal pad towards the positive terminal pad by Loulun magnetism effect；
The pole the P leg of the negative terminal pad and the pole N leg are accessed into closed circuit, so that the negative terminal pad
Tin cream by Loulun magnetism act on towards the negative terminal pad assemble so that between the positive terminal pad and the negative terminal pad
Tin cream separation.
Optionally, the pole P leg and the pole the N weldering by least one described positive terminal pad and/or the negative terminal pad
Foot accesses closed circuit preset period of time, so that the tin cream is acted on by Loulun magnetism towards the positive terminal pad and/or described negative
Pole pad is assembled, so that the tin cream separation between the positive terminal pad and the negative terminal pad in each pad component
Step, comprising:
It will be disconnected after the pole the P leg of the negative terminal pad and the pole N leg access closed circuit preset period of time, with
Assemble the tin cream of the negative terminal pad towards the negative terminal pad by Loulun magnetism effect；
The pole the P leg of the positive terminal pad and the pole N leg are accessed into closed circuit, so that the positive terminal pad
Tin cream by Loulun magnetism act on towards the positive terminal pad assemble so that between the positive terminal pad and the negative terminal pad
Tin cream separation.
Optionally, it is described the print solder paste in the positive terminal pad and the negative terminal pad the step of before, the method
Further include:
It is formed with connector on the substrate；
The pole the N leg of all positive terminal pads is connected in series to the first pin of the connector, it will be all described negative
The pole the P leg of pole pad is connected in series to the second pin of the connector；
The pole P leg and the pole N the leg access by least one described positive terminal pad and/or the negative terminal pad is closed
Circuit preset period of time is closed, is gathered so that the tin cream is acted on by Loulun magnetism towards the positive terminal pad and/or the negative terminal pad
Collect, so that the step of tin cream between the positive terminal pad and the negative terminal pad in each pad component separates, packet
It includes:
It will break after the pole P leg and first pin access closed circuit preset period of time of all positive terminal pads
It opens, so that all the tin cream of the positive terminal pad is acted on by Loulun magnetism towards positive terminal pad aggregation；
The all pole N legs of the negative terminal pad and the second pin are accessed into closed circuit, so that whole institutes
The tin cream for stating negative terminal pad is assembled by Loulun magnetism effect towards the negative terminal pad, so that each pad component is described
Tin cream separation between positive terminal pad and the negative terminal pad.
It is optionally, described the print solder paste in the positive terminal pad and the negative terminal pad the step of, comprising:
Tin cream is crimped on the pole P leg and the pole N leg by conducting pressing smelting tool.
Optionally, contain magnetic powder in the tin cream.
Second aspect, the embodiment of the invention provides a kind of circuit substrates, using as described in any one of first aspect
The production method of circuit substrate is made；The circuit substrate includes:
At least one the pad component being set on substrate, each pad component include the positive terminal pad of mutually insulated
And negative terminal pad, the pole P interconnected leg and N are respectively provided in each positive terminal pad and/or each negative terminal pad
Pole leg；
Tin cream is printed in the positive terminal pad and the negative terminal pad, the anode weldering in each pad component
Tin cream separation between disk and the negative terminal pad.
Optionally, the pole P interconnected leg is provided in each positive terminal pad and each negative terminal pad
With the pole N leg；
Connector is additionally provided on the substrate；
All the pole the N leg of the positive terminal pad is connected in series to the first pin of the connector, and/or, described in whole
The pole the P leg of negative terminal pad is connected in series to the second pin of the connector.
The third aspect, the embodiment of the invention also provides a kind of display base plates, including at least one display unit, Yi Jiru
Circuit substrate described in any one of second aspect；
At least one described display unit is fixed on substrate by least one described pad component, wherein described aobvious
Show that unit and the pad component correspond.
Fourth aspect, the embodiment of the invention provides a kind of display devices, including the display base plate as described in the third aspect.
At least one pad component is formed in the embodiment of the present invention, on circuit substrate, in the anode weldering of each pad component
The pole P interconnected leg and the pole N leg are formed on disk and/or negative terminal pad, and are printed in positive terminal pad and negative terminal pad
Tin cream, then the same closed circuit of the pole the P leg and the pole N leg of at least one positive terminal pad and/or negative terminal pad access is pre-
If the period.In this way, being connected between the pole the P leg and the pole N pad of access closed circuit, in the positive terminal pad or negative terminal pad
Tin cream just will receive Loulun magnetism effect, assemble to the positive terminal pad or negative terminal pad, be located at positive terminal pad and negative terminal pad
Between tin cream also just separate, effectively avoid the tin cream short problems between positive terminal pad and negative terminal pad, improve finished product
Rate.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, needed in being described below to the embodiment of the present invention
Attached drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention,
For those of ordinary skill in the art, without any creative labor, it can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of flow diagram of the production method of circuit substrate provided in an embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram of circuit substrate provided in an embodiment of the present invention；
Fig. 3 is another structural schematic diagram of circuit substrate provided in an embodiment of the present invention；
Fig. 4 is schematic diagram of the tin cream particle provided in an embodiment of the present invention by Loulun magnetism；
Fig. 5 is the distribution schematic diagram of tin cream and magnetic powder before energization on circuit substrate provided in an embodiment of the present invention；
Fig. 6 is the distribution schematic diagram of tin cream and magnetic powder after powered up on circuit substrate provided in an embodiment of the present invention；
Fig. 7 is the connection schematic diagram of circuit substrate provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
It is a kind of flow diagram of the production method of circuit substrate provided in an embodiment of the present invention referring to Fig. 1.Such as Fig. 1
Shown, the production method of provided circuit substrate mainly comprises the steps that
Step 101 forms at least one pad component on substrate, each pad component include mutually insulated just
Pole pad and negative terminal pad；
Step 102 forms the pole P weldering interconnected in each positive terminal pad and/or each negative terminal pad
Foot and the pole N leg；
Step 103, the print solder paste in the positive terminal pad and the negative terminal pad；
The production method of circuit substrate provided in this embodiment is mainly used for forming at least one pad group on substrate
Then display unit is fixed on circuit substrate by pad component, as in display device by part again for use as circuit substrate
Display base plate.Made circuit substrate can be applied to the display devices such as Mini LED, Micro LED.
When it is implemented, as shown in Figures 2 and 3, at least one pad component 210 is formed on substrate 200 first, each
Pad component 210 includes a positive terminal pad 211 and negative terminal pad 212, and pad component 210 and negative terminal pad 212 are mutual
Insulation and separation.Used substrate 200 can be glass substrate (Glass subsrate) or other rigid planar plates
Material.The size and relative distance of positive terminal pad 211 and negative terminal pad 212 in each pad component 210, can correspond to be consolidated
The distance between fixed two pads of display unit 300.The quantity and arrangement for the pad component 210 being arranged on substrate 200, can
To be determined by the quantity and arrangement of the display unit 300 to be fixed, it is not construed as limiting.
In being formed by each pad component 210, the pole a P leg 213 is formed in positive terminal pad 211, in cathode
The pole a N leg 214 is formed on pad 212, can be connected by single line between the pole the P leg 213 and the pole N leg 214.This
Outside, it is also necessary to the pole a N leg 214 connecting with the pole P leg is set in positive terminal pad 211, and/or, in negative terminal pad 212
One pole P leg 213 connecting with the pole N leg 214 of upper setting, then prints in positive terminal pad 211 and negative terminal pad 212
For realizing the conductive material of welding, such as tin cream 220.It is of course also possible to materials such as rosin, scaling powders.
Step 104, by least one described positive terminal pad and/or the negative terminal pad the pole P leg and the pole N leg connect
Enter closed circuit preset period of time, is welded so that the tin cream is acted on by Loulun magnetism towards the positive terminal pad and/or the cathode
Disk is assembled, so that the tin cream separation between the positive terminal pad and the negative terminal pad in each pad component.
According to above-mentioned steps print solder paste 220 in positive terminal pad 211 and negative terminal pad 212, due to 300 ruler of display unit
Very little smaller, the size of positive terminal pad 211 and negative terminal pad 212 on circuit substrate 200 is also relatively small, therefore, print solder paste
When 220, it be easy to cause tin cream 220 to deviate relative to pad locations, leads to the tin between positive terminal pad 211 and negative terminal pad 212
Cream 220 is shorted, and influences the normal use of circuit substrate 200.
The positive terminal pad 211 or the access closure of negative terminal pad 212 of the pole P leg 213 and the pole N leg 214 will be set simultaneously
Circuit preset period of time mentions at this point, forming circuit pathways between the pole P leg 213 and the pole N leg 214 for the conducting particles on pad
For electromagnetic field.As shown in Figure 4 and Figure 5, since 220 particle of tin cream itself is conducting particles, by Loulun magnetism in electromagnetic field
And move, i.e., the tin cream 220 outside pad is assembled by Loulun magnetism towards pad, and the effect after aggregation is as shown in Figure 6.
In the specific implementation, at least one positive terminal pad 211 on the substrate 200 only can be accessed into closed circuit, made
The tin cream 220 near positive terminal pad 211 is obtained to assemble towards positive terminal pad 211 to realize the tin cream 220 between negative terminal pad 212
Separation.Alternatively, closed circuit only can also be accessed at least one negative terminal pad 212 on the substrate 200, so that negative terminal pad
The tin cream 220 of 212 attachmentes is assembled towards negative terminal pad 212 to be separated with the tin cream 220 realized between positive terminal pad 211.It can be with
Whole positive and negative anodes pads are accessed into circuit, only can also will need to carry out the isolated pad of 212 tin cream 220 of positive and negative anodes pad and connect
Enter circuit.Optionally, magnetic powder 240 can also be contained in the tin cream 220.The more affine metal copper pad of magnetic powder 240, in tin cream
Magnetic powder 240 is added in 220, magnetic powder 240 can drive tin cream 220 to be easier to assemble towards pad.
Specifically, described in step 103, print solder paste 220 in the positive terminal pad and the negative terminal pad the step of,
May include:
Tin cream is crimped on the pole P leg and the pole N leg by conducting pressing smelting tool.
In positive terminal pad 211 or negative terminal pad 212 after print solder paste 220, the pole P is crimped on by conducting pressing smelting tool
On leg 213 and the pole N leg 214, it can be realized the pole P leg 213 and the pole N leg access closed circuit.Specifically, being used
Conducting pressing smelting tool may include the structures such as thimble, conducting wire, circuit can be realized when other are able to achieve pressing or when releasing
The structure of conducting is equally applicable to the present embodiment, is not construed as limiting.
The production method for the circuit substrate that the embodiments of the present invention provide forms at least one pad group on circuit substrate
Part, forms the pole P interconnected leg and the pole N leg in the positive terminal pad and/or negative terminal pad of each pad component, and
Print solder paste in positive terminal pad and negative terminal pad, then by the pole the P leg and N of at least one positive terminal pad and/or negative terminal pad
Pole leg accesses same closed circuit preset period of time.In this way, be connected between the pole the P leg and the pole N pad of access closed circuit, it should
It is poly- to the positive terminal pad or negative terminal pad that tin cream of the positive terminal pad perhaps in negative terminal pad just will receive Loulun magnetism effect
Collection, the tin cream between positive terminal pad and negative terminal pad are also just separated, are effectively avoided between positive terminal pad and negative terminal pad
Tin cream short problems, improve yield rate.Reduce pad and tin cream limitation, circuit substrate and the display unit connected
Size can further decrease, while can reduce the spacing on substrate between pad, reduce overall dimensions.In addition, circuit substrate
On pad component can correspond to fixed display unit, without encapsulation after gluing, reduce integral thickness.
On the basis of the above embodiments, described in step 102, in each positive terminal pad and/or each described negative
The step of pole P interconnected leg and the pole N leg are formed on the pad of pole may include:
The pole P interconnected leg and the weldering of the pole N are respectively provided in each positive terminal pad and each negative terminal pad
Foot.
In present embodiment, the weldering of the pole P is respectively provided in the positive terminal pad 211 and negative terminal pad 212 of each pad component 210
Foot 213 and the pole N leg 214 are closed back in this manner it is possible to which positive terminal pad 211 and negative terminal pad 212 are not accessed successively simultaneously
Road, as shown in fig. 6, positive terminal pad 211 and neighbouring 220 particle of tin cream are assembled to positive terminal pad 211, near negative terminal pad 212
220 particle of tin cream assemble to negative terminal pad 212, the tin cream 220 accelerated between positive terminal pad 211 and negative terminal pad 212 divides
From speed, 220 separation degree of tin cream is improved.
In the case where positive and negative anodes pad can access closed circuit, the embodiment for accessing circuit may include following two
Kind:
In one embodiment, described in step 104, at least one described positive terminal pad and/or the cathode are welded
The pole P leg and the pole N leg on disk access closed circuit preset period of time, so that the tin cream is by Loulun magnetism effect described in
Positive terminal pad and/or negative terminal pad aggregation, so that the positive terminal pad and the cathode in each pad component
Between pad tin cream separation the step of, may include:
It will be disconnected after the pole the P leg of the positive terminal pad and the pole N leg access closed circuit preset period of time, with
Assemble the tin cream of the positive terminal pad towards the positive terminal pad by Loulun magnetism effect；
The pole the P leg of the negative terminal pad and the pole N leg are accessed into closed circuit, so that the negative terminal pad
Tin cream by Loulun magnetism act on towards the negative terminal pad assemble so that between the positive terminal pad and the negative terminal pad
Tin cream separation.
In another embodiment, described in step 104, by least one described positive terminal pad and/or the cathode
The pole P leg and the pole N leg on pad access closed circuit preset period of time, so that the tin cream is acted on by Loulun magnetism towards institute
Positive terminal pad and/or negative terminal pad aggregation are stated, so that the positive terminal pad in each pad component and described negative
Between the pad of pole tin cream separation the step of, may include:
It will be disconnected after the pole the P leg of the negative terminal pad and the pole N leg access closed circuit preset period of time, with
Assemble the tin cream of the negative terminal pad towards the negative terminal pad by Loulun magnetism effect；
The pole the P leg of the positive terminal pad and the pole N leg are accessed into closed circuit, so that the positive terminal pad
Tin cream by Loulun magnetism act on towards the positive terminal pad assemble so that between the positive terminal pad and the negative terminal pad
Tin cream separation.
Positive terminal pad and negative terminal pad are not accessed closed circuit successively by above two embodiment simultaneously, to realize just
Tin cream between pole pad and negative terminal pad is assembled to both ends respectively, has fast implemented the tin between positive terminal pad and negative terminal pad
Cream separation.
In another embodiment specific implementation mode, it described in step 103, is printed in the positive terminal pad and the negative terminal pad
Before the step of brush tin cream, the method can also include:
It is formed with connector on the substrate；
The pole the N leg of all positive terminal pads is connected in series to the first pin of the connector, it will be all described negative
The pole the P leg of pole pad is connected in series to the second pin of the connector；
Described in step 104, by least one described positive terminal pad and/or the negative terminal pad the pole P leg and the pole N
Leg accesses closed circuit preset period of time, so that the tin cream is acted on by Loulun magnetism towards the positive terminal pad and/or described
Negative terminal pad is assembled, so that the tin cream separation between the positive terminal pad and the negative terminal pad in each pad component
The step of, comprising:
It will break after the pole P leg and first pin access closed circuit preset period of time of all positive terminal pads
It opens, so that all the tin cream of the positive terminal pad is acted on by Loulun magnetism towards positive terminal pad aggregation；
The all pole N legs of the negative terminal pad and the second pin are accessed into closed circuit, so that whole institutes
The tin cream for stating negative terminal pad is assembled by Loulun magnetism effect towards the negative terminal pad, so that each pad component is described
Tin cream separation between positive terminal pad and the negative terminal pad.
In present embodiment, as shown in fig. 7, adding connector 230 on substrate, connector 230 includes the first pin 231
With second pin 232.As shown in fig. 7, the pole the N leg 214 of whole positive terminal pads 211 is connected in series to the first pin 231, it will be complete
The pole the P leg 213 of portion's negative terminal pad 212 is connected in series to second pin 232.
It will be disconnected after the pole the P leg 213 of whole positive terminal pads 211 and the first pin 231 access closed circuit preset period of time,
So that positive terminal pad 211 and neighbouring tin cream 220 are assembled to positive terminal pad 211, then by the pole the N leg of whole negative terminal pads 212
214 and second pin 232 access closed circuit so that negative terminal pad 212 and neighbouring tin cream 220 are assembled to negative terminal pad 212,
The tin cream 220 that can be realized between positive terminal pad 211 and negative terminal pad 212 separates.
Specifically, the pole the P leg 213 of each positive terminal pad 211 on substrate 200 can be corresponded on connector 230
The pole a P pin, can also the pole the P leg 213 in multiple positive terminal pads 211 be correspondingly connected with the same pole P on device 230 and draw
Foot, the pole the N leg 214 in whole positive terminal pads 211 then correspond to the first pin 231 on connector 230, are drawn with reducing route
Foot layout.It should be noted that the first pin 231 is the dummy pin on connector 230, it is not turned in normal use, but
When corresponding board conducting pressing smelting tool, the first pin 231 can be connected with the pole the P leg 213 in positive terminal pad 211.
Similarly, the pole the N leg in each negative terminal pad 212 on substrate 200 can be corresponded on connector 230
One pole N pin, can also the pole the N leg 214 in multiple negative terminal pads 212 be correspondingly connected with the same pole the N pin on device 230,
The pole P leg 213 in whole negative terminal pads 212 then corresponds to the second pin 232 on connector 230, to reduce route pin
Layout.It should be noted that second pin 232 is the dummy pin on connector 230, it is not turned in normal use, but right
When answering board conducting pressing smelting tool, second pin 232 can be connected with the pole the N leg 214 in negative terminal pad 212.
In present embodiment, the pole the P leg 213 of whole positive terminal pads 211 is shared into the pole N, whole negative terminal pads 212
The pole N leg 214 share the pole P, simplify connection process.Circuit substrate 200 when in use, usually by positive leg
The pole P leg 213 and cathode leg the pole N leg 214 access circuit be therefore connected in series to the first pin 231 and second pin
The normal connection that 232 leg does not influence circuit substrate 200 uses.
Referring to fig. 2, the embodiment of the invention provides a kind of circuit substrates, and the circuit substrate is using as shown in Figure 1 above
The production method of circuit substrate that provides of embodiment be made.As shown in Figures 2 and 3, the circuit substrate includes:
At least one the pad component 210 being set on substrate, each pad component 210 include mutually insulated just
Pole pad 211 and negative terminal pad 212 are respectively provided with phase in each positive terminal pad 211 and/or each negative terminal pad 212
The pole the P leg 213 and the pole N leg 214 to connect；
Tin cream 220 is printed in the positive terminal pad 211 and the negative terminal pad 212, in each pad component 210
The positive terminal pad 211 and the negative terminal pad 212 between tin cream 220 separate.
In the present embodiment, the pole N leg 214 is added in the pole the P leg 213 of positive terminal pad 211, or in negative terminal pad 212
The pole N leg 214 add the pole P leg 213, by the pole the P leg 213 and the pole N leg of positive terminal pad 211 or negative terminal pad 212
214 access closed circuit, to realize that the tin cream 220 between positive terminal pad 211 and negative terminal pad 212 separates.
Optionally, as shown in fig. 7, being provided with phase in each positive terminal pad 211 and each negative terminal pad 212
The pole the P leg 213 and the pole N leg 214 to connect；
Connector 230 is additionally provided on the substrate；
All the pole the N leg 214 of the positive terminal pads 211 is connected in series to the first pin 231 of the connector 230, and/
Or, all the pole the P leg 213 of the negative terminal pad 212 is connected in series to the second pin 232 of the connector 230.
The circuit substrate that the embodiments of the present invention provide, including at least one pad component, in each pad component
The pole P interconnected leg and the pole N leg are formed in positive terminal pad and/or negative terminal pad, and in positive terminal pad and negative terminal pad
Upper print solder paste, then the pole the P leg and the pole N leg of at least one positive terminal pad and/or negative terminal pad are accessed into same closure
Circuit preset period of time.In this way, being connected between the pole the P leg and the pole N pad of access closed circuit, the positive terminal pad or cathode weldering
Tin cream on disk just will receive Loulun magnetism effect, assemble to the positive terminal pad or negative terminal pad, is located at positive terminal pad and bears
Tin cream between the pad of pole also just separates, and effectively avoids the tin cream short problems between positive terminal pad and negative terminal pad, improves
Yield rate.The specific implementation process of circuit substrate provided in an embodiment of the present invention may refer to electricity provided by the above embodiment
The specific implementation process of the production method of base board, this is no longer going to repeat them.
In addition, the embodiment of the invention also provides a kind of display base plates, including at least one display unit and circuit substrate,
The circuit substrate that the circuit substrate is above-mentioned Fig. 2 and embodiment shown in Fig. 3 provides.Wherein,
At least one described display unit 300 is fixed on substrate 200 by least one described pad component 210,
In, the display unit 300 is corresponded with the pad component 210.
Optionally, it is also provided in the region between the adjacent display unit 300 on the substrate 200
Reflecting layer 400, for realizing the reflection of luminescence unit scattering light, to improve the luminous efficiency of display base plate.
In addition, the embodiment of the invention provides a kind of display devices, including such as display base plate provided by the above embodiment.
The embodiments of the present invention provide display base plate and display device, included by circuit substrate on formed at least
One pad component forms the pole P interconnected leg and N in the positive terminal pad and/or negative terminal pad of each pad component
Pole leg, and the print solder paste in positive terminal pad and negative terminal pad, then by least one positive terminal pad and/or negative terminal pad
The pole P leg and the pole N leg access same closed circuit preset period of time.In this way, the pole the P leg and the pole N pad of access closed circuit
Between be connected, tin cream of the positive terminal pad perhaps in negative terminal pad just will receive Loulun magnetism effect to the positive terminal pad or
Negative terminal pad aggregation, the tin cream between positive terminal pad and negative terminal pad also just separate, and effectively avoid positive terminal pad and bear
Tin cream short problems between the pad of pole, improve yield rate.
The specific implementation process of display base plate provided in an embodiment of the present invention and display device may refer to above-described embodiment
The specific implementation process of the circuit substrate of offer and preparation method thereof, this is no longer going to repeat them.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (11)
1. a kind of production method of circuit substrate, which is characterized in that the described method includes:
At least one pad component is formed on substrate, each pad component includes the positive terminal pad and cathode of mutually insulated
Pad；
The pole P interconnected leg and the pole N leg are formed in each positive terminal pad and/or each negative terminal pad；
The print solder paste in the positive terminal pad and the negative terminal pad；
By at least one described positive terminal pad and/or the negative terminal pad the pole P leg and the pole N leg access closed circuit it is pre-
If the period, assemble so that the tin cream is acted on by Loulun magnetism towards the positive terminal pad and/or the negative terminal pad, so that often
Tin cream separation between the positive terminal pad and the negative terminal pad in a pad component.
2. the method according to claim 1, wherein described in each positive terminal pad and/or each described
The step of pole P interconnected leg and the pole N leg are formed in negative terminal pad, comprising:
The pole P interconnected leg and the pole N leg are respectively provided in each positive terminal pad and each negative terminal pad.
3. according to the method described in claim 2, it is characterized in that, described by least one described positive terminal pad and/or described
The pole P leg and the pole N leg in negative terminal pad access closed circuit preset period of time, so that the tin cream is acted on court by Loulun magnetism
Assemble to the positive terminal pad and/or the negative terminal pad, so that the positive terminal pad and institute in each pad component
The step of stating the tin cream separation between negative terminal pad, comprising:
It will be disconnected after the pole the P leg of the positive terminal pad and the pole N leg access closed circuit preset period of time, so that institute
The tin cream for stating positive terminal pad is assembled by Loulun magnetism effect towards the positive terminal pad；
The pole the P leg of the negative terminal pad and the pole N leg are accessed into closed circuit, so that the tin of the negative terminal pad
Cream, which is acted on by Loulun magnetism towards the negative terminal pad, to be assembled, so that the tin cream between the positive terminal pad and the negative terminal pad
Separation.
4. according to the method described in claim 2, it is characterized in that, described by least one described positive terminal pad and/or described
The pole P leg and the pole N leg in negative terminal pad access closed circuit preset period of time, so that the tin cream is acted on court by Loulun magnetism
Assemble to the positive terminal pad and/or the negative terminal pad, so that the positive terminal pad and institute in each pad component
The step of stating the tin cream separation between negative terminal pad, comprising:
It will be disconnected after the pole the P leg of the negative terminal pad and the pole N leg access closed circuit preset period of time, so that institute
The tin cream for stating negative terminal pad is assembled by Loulun magnetism effect towards the negative terminal pad；
The pole the P leg of the positive terminal pad and the pole N leg are accessed into closed circuit, so that the tin of the positive terminal pad
Cream, which is acted on by Loulun magnetism towards the positive terminal pad, to be assembled, so that the tin cream between the positive terminal pad and the negative terminal pad
Separation.
5. according to the method described in claim 2, it is characterized in that, described print in the positive terminal pad and the negative terminal pad
Before the step of brush tin cream, the method also includes:
It is formed with connector on the substrate；
The pole the N leg of all positive terminal pads is connected in series to the first pin of the connector, it will all cathode welderings
The pole the P leg of disk is connected in series to the second pin of the connector；
The pole P leg and the pole N the leg access by least one described positive terminal pad and/or the negative terminal pad is closed back
Road preset period of time is assembled so that the tin cream is acted on by Loulun magnetism towards the positive terminal pad and/or the negative terminal pad, is made
The step of obtaining the tin cream separation between the positive terminal pad and the negative terminal pad in each pad component, comprising:
It will be disconnected after the pole P leg and first pin access closed circuit preset period of time of all positive terminal pads,
So that all the tin cream of the positive terminal pad is acted on by Loulun magnetism towards positive terminal pad aggregation；
The all pole N legs of the negative terminal pad and the second pin are accessed into closed circuit, so that all described negative
The tin cream of pole pad, which is acted on by Loulun magnetism towards the negative terminal pad, to be assembled, so that the anode of each pad component
Tin cream separation between pad and the negative terminal pad.
6. the method according to claim 1, wherein described print in the positive terminal pad and the negative terminal pad
The step of brush tin cream, comprising:
Tin cream is crimped on the pole P leg and the pole N leg by conducting pressing smelting tool.
7. method according to any one of claim 1 to 6, which is characterized in that contain magnetic powder in the tin cream.
8. a kind of circuit substrate, which is characterized in that using the production of the circuit substrate as described in any one of claims 1 to 7
Method is made；The circuit substrate includes:
At least one the pad component being set on substrate, each pad component include the positive terminal pad of mutually insulated and bear
The pole P interconnected leg and the weldering of the pole N are respectively provided in pole pad, each positive terminal pad and/or each negative terminal pad
Foot；
Tin cream is printed in the positive terminal pad and the negative terminal pad, the positive terminal pad in each pad component and
Tin cream separation between the negative terminal pad.
9. circuit substrate according to claim 8, which is characterized in that each positive terminal pad and each cathode weldering
The pole P interconnected leg and the pole N leg are provided on disk；
Connector is additionally provided on the substrate；
All the pole the N leg of the positive terminal pad is connected in series to the first pin of the connector, and/or, whole cathode
The pole the P leg of pad is connected in series to the second pin of the connector.
10. a kind of display base plate, which is characterized in that including at least one display unit, and as described in claim 8 or 9
Circuit substrate；
At least one described display unit is fixed on substrate by least one described pad component, wherein the display is single
It is first to be corresponded with the pad component.
11. a kind of display device, which is characterized in that including display base plate as claimed in claim 10.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910082025.3A CN109862716B (en) | 2019-01-28 | 2019-01-28 | Display substrate, manufacturing method thereof, display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910082025.3A CN109862716B (en) | 2019-01-28 | 2019-01-28 | Display substrate, manufacturing method thereof, display panel and display device |
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| CN109862716A true CN109862716A (en) | 2019-06-07 |
| CN109862716B CN109862716B (en) | 2020-12-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023159523A1 (en) * | 2022-02-25 | 2023-08-31 | 京东方科技集团股份有限公司 | Driving backplane and manufacturing method therefor, and display device |
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| CN108055770A (en) * | 2017-12-26 | 2018-05-18 | 江西合力泰科技有限公司 | A kind of backlight FPC plates and backlight semi-finished product |
| CN108323004A (en) * | 2018-02-02 | 2018-07-24 | 江门黑氪光电科技有限公司 | A kind of wiring board with symmetrical pad |
| JP2018114511A (en) * | 2017-01-16 | 2018-07-26 | トヨタ自動車株式会社 | Plastic working method for metal |
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| JP2018114511A (en) * | 2017-01-16 | 2018-07-26 | トヨタ自動車株式会社 | Plastic working method for metal |
| CN108055770A (en) * | 2017-12-26 | 2018-05-18 | 江西合力泰科技有限公司 | A kind of backlight FPC plates and backlight semi-finished product |
| CN108323004A (en) * | 2018-02-02 | 2018-07-24 | 江门黑氪光电科技有限公司 | A kind of wiring board with symmetrical pad |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023159523A1 (en) * | 2022-02-25 | 2023-08-31 | 京东方科技集团股份有限公司 | Driving backplane and manufacturing method therefor, and display device |
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| CN109862716B (en) | 2020-12-25 |
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