CN209963088U - COB light source based on CSP LED chip - Google Patents
COB light source based on CSP LED chip Download PDFInfo
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- CN209963088U CN209963088U CN201822039578.4U CN201822039578U CN209963088U CN 209963088 U CN209963088 U CN 209963088U CN 201822039578 U CN201822039578 U CN 201822039578U CN 209963088 U CN209963088 U CN 209963088U
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- csp led
- led chip
- light source
- pad pair
- area
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- 239000000758 substrate Substances 0.000 claims abstract description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 21
- 238000002955 isolation Methods 0.000 claims abstract description 12
- 238000005476 soldering Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 11
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 238000004026 adhesive bonding Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000012459 cleaning agent Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
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Abstract
The utility model discloses a COB light source based on CSP LED chip, include: the surface of the aluminum substrate is coated with white oil, the surface of the aluminum substrate is provided with two pad pair areas, the first part area is in the center of the substrate, the second part area is at the edge of the substrate, an electric isolation groove is arranged in the middle of each pad pair, the area of each pad pair is larger than the single area of the CSP LED chip, and the width of the electric isolation groove area is not larger than the electrode spacing of the CSP LED chip; the CSP LED chips need to be tested and sorted, the CSP LED chips are arranged on the flip aluminum substrate, and the CSP LED chips arranged on the substrate are all the same bin; the utility model discloses a CSP LED chip has reduced bonding wire, box dam and some processes of gluing, simplifies the encapsulation process, and CSP LED chip has improved the light colour uniformity of light source through selecting separately the back to improve space colour temperature homogeneity.
Description
Technical Field
The utility model belongs to the technical field of the LED encapsulation, specifically a COB light source based on CSP LED chip.
Background
The size of the chip is also required to be developed in the direction of higher density, faster speed, smaller size, lower cost, etc. in the current electronic products. COB light source is with the integrated area source technique of high light efficiency of a plurality of LED chip snap-on single base plate, and the support concept has been eliminated to this technique, and the positive dress chip light emitting area can appear the electrode in addition and block the problem of chip light-emitting in same one side, and the light extraction rate is low, and the positive dress chip thermal diffusivity is not high simultaneously. The electrodes of the forward mounting structure are arranged on the same side of the LED, so that the current crowding phenomenon is easy to occur, and the thermal resistance is high. The forward mounting structure has a plurality of defects, and the reverse mounting structure has more advantages and is suitable for visible light communication. However, at present, the number of flip chip structures for directly fixing a plurality of LED chips on a single substrate is relatively small, and a preparation process is not reported.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a COB light source based on CSP LED chip. Through the characteristics of the CSP LED chip, the packaging process is simplified, the gold-wire-free packaging is realized, and the stability of a COB (chip on board) light source is improved.
To achieve the above object, the present invention provides a solution as follows.
A COB light source based on CSP LED chips comprises an aluminum substrate and a plurality of CSP LED chips; the surface of the aluminum substrate is provided with two parts of pad pair areas, wherein the first part of pad pair area is positioned in the center of the aluminum substrate, the second part of pad pair area is positioned at the edge of the aluminum substrate, and the first part of pad pair area and the second part of pad pair area are both provided with a plurality of pad pairs; each CSP LED chip electrode is connected with each bonding pad pair to form electric connection; the first part of pad pair area and the second part of pad pair area are provided with a plurality of lines, and each line is provided with a plurality of pad pairs connected in series; the head part and the tail part of each line are respectively connected in parallel in the second part of pad pair area; the surface of the aluminum substrate is provided with a layer of reflecting layer, and an electric isolation groove is arranged between two bonding pads of each bonding pad pair.
Preferably, the substrate may be circular or square.
Preferably, the area of each pad pair is larger than the single area of the CSP LED chip.
Preferably, the total area of each pad pair and each electrically isolated well is greater than the individual area of the CSP LED chip.
Preferably, the surface of the welding area of the welding pad is plated with a layer of gold or sprayed with a layer of tin film.
Preferably, the pad pair electrical isolation groove is a groove, and the depth of the groove is 0.1mm-0.2 mm.
Preferably, the CSP LED chip electrode spacing is not less than the width of the pad-to-electrical isolation groove.
Preferably, the CSP LED chip has 5 light emitting surfaces.
Preferably, the CSP LED chip comprises a flip blue LED chip and a fluorescent glue layer wrapping the flip blue LED chip.
Preferably, the CSP LED chip needs to be sorted before soldering.
Preferably, the two electrodes of the CSP LED chip are respectively welded with the two pads of the pad pair through solder paste.
Preferably, the surface reflecting layer of the aluminum substrate is white oil paint.
Preferably, the electrode spacing of the single CSP LED chip is not less than the width of the pad pair electrical isolation groove, so that the welding stability can be improved, and the electrical isolation groove in the middle of the pad pair is a groove, so that the short circuit of the CSP LED chip can be avoided; the CSP LED chips are tested and sorted before welding, so that the light-color consistency of the COB light source is improved.
According to the preparation method of the COB light source based on the CSP LED chip, the size of a substrate bonding pad pair is selected according to the size of the CSP LED chip, the CSP LED chip is connected with the substrate bonding pad pair through solder paste to form electric connection, the bonding pad pair forms electric connection through a copper circuit layer, the CSP LED chip is tested and sorted before welding, and chips of the same bin (grading) are selected for packaging.
The method specifically comprises the following steps:
s1, selecting a substrate;
s2, scrubbing the welding side surface of the substrate by using a cleaning agent;
s3, placing the CSP LED chip into a testing machine for testing;
s4, sorting the CSP LED chips by combining the test data;
s5, reversing the film of the sorted CSP LED chips to enable the electrodes to face downwards;
s6, coating solder paste on the bonding pad pair on the substrate;
s7, placing the CSP LED chip on a corresponding pad pair of the substrate;
and S8, placing the substrate with the CSP LED chip into reflow soldering to complete soldering.
Compare with traditional COB encapsulation light source, the utility model discloses a many ways series connection route are parallelly connected, saved the bonding wire, the box dam, the point is glued, the process flow who toasts, production efficiency has been improved, the light source uniformity is better, heat dispersion is better, use CSP LED chip can also reduce the technology that box dam and point were glued moreover, the process has been reduced, the chip passes through tin cream and base plate formation electrical connection, the bonding wire process has been reduced, the encapsulation flow has been simplified, the "dead lamp" problem that the long-time work bonding wire broken string of just adorning COB caused has been avoided simultaneously.
Drawings
FIG. 1 is a schematic diagram of a COB light source of a CSP LED chip according to an embodiment;
fig. 2 is a side view of a CSP LED and pad pair in an embodiment.
Detailed Description
For further understanding, the present invention is further explained below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto, and based on the embodiments of the present invention, all other embodiments obtained by the person skilled in the art without creative work are all within the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention, a COB light source based on CSP LED chips, including an aluminum substrate 7 and a plurality of CSP LED chips 6; the surface of the aluminum substrate 7 is provided with two parts of pad pair areas, wherein the first part of pad pair area is positioned in the center of the aluminum substrate 7, the second part of pad pair area is positioned at the edge of the aluminum substrate 7, and the first part of pad pair area and the second part of pad pair area are both provided with a plurality of pad pairs 2; each CSP LED chip 6 electrode is connected with each bonding pad pair 2 to form electric connection; the pad pairs in the first partial pad pair region and the second partial pad pair region form a plurality of parallel electrical connection structures, in this embodiment, each pad pair region has two pad pair routes, and each route has 7 pad pairs connected in series. The head of each route is connected in parallel at one side of the second part of the pad pair area, and the tail of each route is connected in parallel at the other side of the second part of the pad pair area. The surface of the aluminum substrate 7 is provided with a layer of reflecting layer 1, and an electric isolation groove 4 is arranged between two bonding pads of each bonding pad pair 2.
As shown in fig. 2, the CSP LED chip 6 includes a flip blue LED chip 3 and a phosphor layer 5 wrapping the flip blue LED chip 3. The size of the pad pair 2 of the substrate 7 is selected according to the size of the CSP LED chip 6, the CSP LED chip 6 is connected with the pad pair 2 of the substrate 7 through solder paste to form electric connection, the pad pair 2 forms electric connection through a copper circuit layer, the CSP LED chip 6 is tested and sorted before welding, and the chip of the same bin is selected for packaging.
The preparation method of the COB light source based on the CSP LED chip 6 specifically comprises the following steps:
s1, selecting a substrate 7 as a square aluminum substrate as shown in figure 1. Except for the weldable region, the other regions of the surface are coated with white oil to form a reflecting layer 1, the surface of the substrate 7 is provided with a plurality of pad pairs 2 and copper circuit layers, the area of a single pad pair 2 and the area of the middle electric isolation groove 4 are larger than that of a single CSP LED chip 6, and the depth of the electric isolation groove 4 of the pad pair 2 is 0.1 mm;
s2, scrubbing the welding side surface of the substrate 7 by using a cleaning agent;
s3, testing, wherein the CSP LED chip 6 is used for testing light color parameters;
s4, sorting, namely sorting according to the color temperature, and selecting the CSP LED chips 6 with the color temperature of 6500K-6700K;
s5, inverting the film, namely inverting the sorted CSP LED chips 6 onto a blue film with the electrodes facing downwards;
s6, dotting solder paste on the bonding pad pair 2 of the substrate 7;
s7, die bonding, wherein the sorted CSP LED chips 6 are placed on the corresponding bonding pad pairs 2 of the substrate 7;
and S8, performing over-reflow soldering, wherein the substrate 7 after the crystal is solidified performs over-reflow soldering to complete the soldering of the CSP LED chip 6 and the substrate 7.
The many ways of series connection route of this embodiment are parallelly connected, have saved the bonding wire, the box dam, the point is glued, the process flow who toasts, improved production efficiency, the light source uniformity is better, heat dispersion is better, use CSP LED chip can also reduce the technology of box dam and point gluing moreover, reduced the process, the chip passes through tin cream and forms electrical connection with the base plate, has reduced the bonding wire process, the encapsulation flow has been simplified, the long-time work bonding wire broken string of just installing COB caused "dead lamp" problem has been avoided simultaneously.
Claims (9)
1. A COB light source based on CSP LED chips is characterized by comprising an aluminum substrate and a plurality of CSP LED chips; the surface of the aluminum substrate is provided with two parts of pad pair areas, wherein the first part of pad pair area is positioned in the center of the aluminum substrate, the second part of pad pair area is positioned at the edge of the aluminum substrate, and the first part of pad pair area and the second part of pad pair area are both provided with a plurality of pad pairs; each CSP LED chip electrode is connected with each bonding pad pair to form electric connection; the first part of pad pair area and the second part of pad pair area are respectively provided with a plurality of lines, and each line is provided with a plurality of pad pairs connected in series; the head and the tail of each line are respectively connected in parallel in the second part of pad pair area; the surface of the aluminum substrate is provided with a layer of reflecting layer, and an electric isolation groove is arranged between two bonding pads of each bonding pad pair.
2. COB light source based on CSP LED chips as claimed in claim 1, characterized in that the substrate is circular or square; the reflecting layer on the surface of the aluminum substrate is white oil paint.
3. The CSP LED chip-based COB light source of claim 1 wherein the area of each pad pair is greater than the individual area of the CSP LED chip.
4. COB light source based on CSP LED chips according to claim 1 or 2 characterized in that the soldering area surface of all the pad pairs is plated with a layer of gold or sprayed with a layer of tin film.
5. COB light source based on CSP LED chips as claimed in claim 1, characterized in that the electrically isolated trench in the middle of the pad pair is a trench with a depth of 0.1mm-0.2 mm.
6. COB light source based on CSP LED chips as claimed in claim 1 or 5, characterized in that the pitch between the two electrodes of a single CSP LED chip is not less than the width of the pad-to-electrical isolation trench.
7. The CSP LED chip-based COB light source of claim 1 wherein the CSPLED chip comprises a flip-chip blue LED chip and a phosphor glue layer encapsulating the flip-chip blue LED chip.
8. COB light source based on CSP LED chip according to claim 6, characterized in that the CSP LED has 5 light emitting faces.
9. The CSP LED chip based COB light source of claim 1 wherein the CSP LED chip and pair of pads are connected by solder paste to form an electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822039578.4U CN209963088U (en) | 2018-12-05 | 2018-12-05 | COB light source based on CSP LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822039578.4U CN209963088U (en) | 2018-12-05 | 2018-12-05 | COB light source based on CSP LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209963088U true CN209963088U (en) | 2020-01-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822039578.4U Withdrawn - After Issue CN209963088U (en) | 2018-12-05 | 2018-12-05 | COB light source based on CSP LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209963088U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585637A (en) * | 2018-12-05 | 2019-04-05 | 中山市华南理工大学现代产业技术研究院 | COB light source and preparation method based on CSP LED chip |
| CN115081569A (en) * | 2022-07-20 | 2022-09-20 | 合肥龙旗智能科技有限公司 | Array LED patch management method, array LED control system and method |
-
2018
- 2018-12-05 CN CN201822039578.4U patent/CN209963088U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585637A (en) * | 2018-12-05 | 2019-04-05 | 中山市华南理工大学现代产业技术研究院 | COB light source and preparation method based on CSP LED chip |
| CN109585637B (en) * | 2018-12-05 | 2024-05-14 | 中山市华南理工大学现代产业技术研究院 | COB light source based on CSP LED chip and preparation method |
| CN115081569A (en) * | 2022-07-20 | 2022-09-20 | 合肥龙旗智能科技有限公司 | Array LED patch management method, array LED control system and method |
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Legal Events
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20200117 Effective date of abandoning: 20240514 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20200117 Effective date of abandoning: 20240514 |