CN115081569A - Array LED patch management method, array LED control system and method - Google Patents
Array LED patch management method, array LED control system and method Download PDFInfo
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Abstract
The invention discloses an array LED patch management method, which comprises the following steps: data comparison; recording information and counting material trays; counting the blanking of LED patches and PCBA; carrying out data calculation by combining related information; and performing labeling processing on the PCBA according to data deduction. The invention also discloses an array LED control system and method. The invention ensures that the performance of the LEDs on the same PCBA is the same or close and the accuracy of the BIN label parameters on the PCBA, and solves the problem that the consistency of the lamp efficiency can still be ensured when the LEDs with different BIN parameters are used on the same product.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to an array LED patch management method, an array LED control system and an array LED patch management method.
Background
When a product adopts a large number of LEDs to realize the lighting effect, the common practice is to mount a large number of LEDs on a special Printed Circuit Board (PCB), mount the LEDs on the PCB and finish the test to manufacture an LED printed Circuit board assembly PCBA (LED PCB Assembly), then assemble the PCBA to the appointed position, and when the lighting special effect is needed, the LEDs on the PCBA are lightened through software, so that the preset lighting effect can be realized.
The method is limited by the technical level of current LED preparation, and the prepared LED has the problem of consistent performance. Even with the same model of LED, there may be differences in brightness, differences in color, and differences in forward voltage at the same current. In order to achieve mass production and minimize the problem of excessive consistency, LED manufacturers must perform further dispensing of the materials by sorting tests. Specifically, LEDs with brightness in the same range, color difference in the same area and forward voltage in the same range are screened and packaged together. The LED supplier identifies this division by BIN codes, different BIN codes representing different brightness, color and forward voltage, and the same BIN code representing the same brightness, color and forward voltage, all within the same range. LED suppliers typically encode the BIN for brightness, color, and forward voltage, print it on labels, and attach it to the individual packages.
Generally, when a complete machine manufacturer uses an LED for mounting, because the LED is packaged according to BIN codes, the LED in the same package (tray) is directly mounted, and the display effect has no obvious difference. However, in the case of mounting, when one package (tray) of LEDs is used up, the tray needs to be replaced, and LEDs with different colors, brightness and forward voltage are mixed. On the same product, if LEDs with obvious BIN code difference exist, the difference of visual display effect can be generated.
In view of the above technical problems, it is desirable to provide a method capable of solving the problem of LED uniformity during LED mounting.
Disclosure of Invention
The invention aims to provide an array LED patch management method, an array LED control system and an array LED patch management method, so as to ensure that the performances of LEDs on the same PCBA are the same or similar and the accuracy of BIN code marking on the PCBA, and to realize the consistency of the display effects of LEDs with different BIN codes when the LEDs are used on the same product.
In order to solve the technical problem, the invention provides an array LED patch management method, which comprises the following steps:
scanning to obtain the BIN codes and the LED quantity information on the LED tray, and comparing the obtained BIN codes with the BIN codes input last time;
feeding the material trays meeting the requirements after data comparison, inputting BIN codes and quantity information of the material trays, and counting the material trays;
preparing PCBA by mounting pieces, and blanking the PCBA and counting the blanking of the PCBA after finishing the preparation;
acquiring the number information of the current PCBAs, the number information of the currently used material trays and the number information of LEDs of each material tray, and calculating data by combining the number information of the LEDs assembled by each PCBA to obtain BIN codes with the total number of the LEDs on the PCBA being superior;
and radium etching the BIN codes with the dominant total quantity of the LEDs on the corresponding PCBA in a label form to serve as the BIN codes of the PCBA.
Further, in the array LED patch management method, the specific method of data comparison is as follows:
comparing whether the BIN codes on the two trays are the same or similar, and if the BIN codes are the same or similar, judging that the BIN codes meet the requirements; if the two are different and not close, the requirements are not met.
Further, in the array LED patch management method, when the LED patch management method judges that the LED patch management method does not meet the requirements, an alarm is given, and the material tray is replaced again for data comparison until the LED patch management method meets the requirements.
Further, in the array LED patch management method, the specific steps of calculating the BIN code with the highest total number of LEDs on the PCBA by the data calculation are as follows:
step one, acquiring serial number B of PCBA (printed Circuit Board Assembly) finished by one patch n ；
Step two, reading the recordNumber M of the charging trays n ；
Step three, judging M n Whether the value is equal to 1, if yes, entering a step nine; otherwise, entering the step four;
step four, reading the input LED quantity information Q on each material plate n ；
Step five, calculating M n-1 Total quantity QS of LEDs in each tray:
step six, combining the number L of the LEDs assembled on the PCBA n And calculating the number R of unused LEDs in a tray which is successfully loaded:
seventhly, judging whether R is larger than L n If yes, entering step eight, otherwise entering step nine;
step eight, the serial number is Mn-1 The BIN code on the material tray is used as the BIN code of the current PCBA;
step nine, taking the sequence number as M n As the BIN code of the current PCBA.
Further, in the array LED patch management method, the BIN code and the LED number information both adopt at least one of a barcode and a two-dimensional code.
Further, in the array LED patch management method, the BIN code includes an LED brightness BIN code, an LED color BIN code, and an LED forward voltage BIN code.
In addition, the invention also provides an array LED control system, which comprises a plurality of PCBAs, a storage unit, a processor, a communication interface and a power supply unit;
a plurality of the PCBAs each have a BIN encoded label thereon;
the PCBAs, the storage units and the communication interfaces are all electrically connected with the processor;
the memory unit is used for storing different BIN codes;
the processor is used for calling the BIN codes in the storage unit and correspondingly controlling the lighting effect of the PCBA according to the BIN codes;
the communication interface is used for being connected with external equipment and storing different BIN coded data into the storage unit through the external equipment;
the power supply unit supplies power to the whole control system.
Further, in the array LED control system, a housing is further included, and the PCBA, the storage unit, the processor, the communication interface, and the power supply unit are all installed in the housing.
In addition, the invention also provides an array LED control method, which adopts the LED control system, and the control method comprises the following steps:
scanning a label on the PCBA to obtain a BIN code and storing the obtained BIN code to a storage unit through external equipment by using a communication interface;
the processor reads the BIN codes of all the PCBAs to be lightened in the storage unit, and the controller controls the power supply unit to distribute adaptive current for the corresponding PCBAs according to different BIN codes, so that the display effects of different PCBAs are consistent.
Further, in the array LED control method, the method for controlling the power supply unit to distribute current to different PCBA by the controller is as follows:
the PCBA driving current with low BIN coding brightness level is increased or the PCBA driving current with high BIN coding brightness level is reduced.
Compared with the prior art, the invention at least has the following beneficial effects: the BIN codes and the LED quantity information of the charging tray are scanned and compared when the LED charging tray is charged, the charging tray is selected by comparing the same or similar BIN codes, the LED performances on the same PCBA are ensured to be the same or similar when the same PCBA is pasted, and then the BIN codes with the dominant total quantity of the LEDs on the PCBA are used as the BIN codes of the PCBA through data calculation such as the LED quantity information and the like, so that the accuracy of the BIN codes on the PCBA is ensured.
Furthermore, in the array LED control system and method provided by the invention, the BIN codes are obtained by obtaining the labels on the PCBA, and the reasonable distribution of the driving current is carried out according to the obtained BIN codes, so that the consistency of LED light effects can be still ensured when PCBAs with different BIN codes are used on the same product.
Drawings
Fig. 1 is a schematic structural diagram of an LED chip mounting production line according to a first embodiment of the present invention;
FIG. 2 is a flowchart of a method for managing LED patches in an array according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a label on an LED tray according to an embodiment of the invention;
FIG. 4 is a flowchart of the LED tray loading in the array LED patch management method according to the embodiment of the present invention;
fig. 5 is a flow chart of PCBA labeling in the array LED patch management method according to the first embodiment of the present invention;
FIG. 6 is a block diagram of an array LED control system according to a second embodiment of the present invention;
fig. 7 is a flowchart of a method for controlling an array LED according to a third embodiment of the present invention.
Detailed Description
A method of array LED patch management, an array LED control system and a method of the present invention will now be described in more detail with reference to the schematic drawings, in which preferred embodiments of the invention are shown, it being understood that a person skilled in the art may modify the invention herein described while still achieving the advantageous effects of the invention. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the invention.
The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is provided for the purpose of facilitating and clearly illustrating embodiments of the present invention.
Example one
As shown in fig. 1, fig. 1 is a LED chip mounting production line, which includes a feeding device 1, a printing machine 2, a chip mounter 3, an automatic detector 4, a reflow soldering furnace 5, an on-line detector 6 and a discharging device 7, which are arranged in sequence, wherein:
the feeding device 1 is used for feeding the PCB;
the printer 2 is used for printing solder paste on the PCB;
the chip mounter 3 pastes the LED on the PCB;
the automatic detector 4 is used for detecting whether the patch is correct or not;
the reflow oven 5 is used for heating the device and the PCB according to a preset temperature curve, and completing welding after the solder paste is melted to prepare PCBA;
the online detector 6 is used for carrying out paster yield inspection on the PCBA of the paster;
the blanking device 7 is used for conveying the PCBA out for blanking.
In addition, a scanning station (not shown in the figure) is arranged between the printer 2 and the chip mounter 3 and is used for scanning the labels on the LED trays;
and the tail end of the blanking device 7 is provided with a labeling station 8 for labeling the BIN code with the dominant quantity of LEDs on the PCBA to the PCBA as the BIN code of the PCBA.
As can be seen from fig. 1, there is a certain distance between the scanning station and the labeling station 8, and the reflow oven 5 requires a fixed reflow time. When the LED just changes new materials, the LED on the PCBA at the labeling station 8 is still the LED of the upper disc tray, so that the BIN code of the label and the BIN code of the LED scanning station are asynchronous.
Therefore, the present embodiment provides a method for managing LED array patches, which, on the premise of avoiding the above problems, ensures that the performance of LEDs on the same PCBA is the same or similar, and ensures the accuracy of BIN codes on the PCBA.
Specifically, as shown in fig. 2, the array LED patch management method includes the following steps:
s10, scanning to obtain the BIN codes and the LED quantity information on the LED tray, and comparing the obtained BIN codes with the BIN codes recorded last time;
s20, feeding the trays meeting the requirements after data comparison, recording BIN codes and quantity information of the trays, and counting the trays;
s30, preparing PCBA through the patch, and after the PCBA is finished, blanking and counting the PCBA;
s40, acquiring the number information of the current PCBAs, the number information of the currently used trays and the number information of LEDs in each tray, and performing data calculation by combining the number information of the LEDs assembled by each PCBA to obtain BIN codes with the total number of LEDs on the PCBAs being superior;
and S50, radium carving the BIN codes with the dominant total quantity of the LEDs on the corresponding PCBA in a label form to serve as the BIN codes of the PCBA.
Wherein, in an example, the BIN code and the LED quantity information on the LED charging tray are concentrated in a label, the label is as shown in fig. 3, and contains QTY (LED quantity information), CAT (luminance BIN code), HUE (color BIN code) and REF (forward voltage BIN code), each piece of information corresponds to a bar code, or is integrated into a two-dimensional code, the bar code or the two-dimensional code through the label on the charging tray is scanned, and the data such as the number of the LED, the luminance range, the color range and the forward voltage range of this feeding can be obtained.
Specifically, as shown in fig. 4, a feeding step of the LED tray is illustrated, which specifically includes:
step S100, starting a surface mounting process;
step S101, scanning codes on an LED outer package to obtain BIN codes and LED quantity information;
step S102, comparing the BIN code obtained this time with the BIN code input last time;
step S103, judging whether the codes are the same BIN codes or similar BIN codes; if yes, go to step S104; otherwise, alarming and returning to the step S101, and reloading;
step S104, inputting BIN codes and LED quantity information to finish LED feeding;
step S105, normally pasting the patch;
step S106, judging whether the LED is short of materials; if yes, entering step S101, scanning and reloading; if not, return to step S105.
Through the above process, it is ensured that the performance of the LEDs on the same PCBA is the same or similar.
Specifically, as shown in fig. 5, the steps of the label printing process of the PCBA are illustrated as follows:
step S200, starting a label printing process of the PCBA;
step S201, a newly completed PCBA and its serial number B are obtained n ；
Step S202, reading the number M of the trays recorded in the LED scanning station n ；
Step S203, judge M n Whether it is equal to 1; if yes, go to step S209; otherwise, go to step S204;
step S204, reading each M recorded by the LED scanning station position n The number Qn of LEDs corresponding to the material tray;
step S205, calculating the previous M n-1 The total quantity QS of the LEDs in each LED tray;
step S206, calculate QS minus front B n-1 Obtaining the number R of the LEDs used by the PCBA with the BIN codes;
step S207, judging whether R is larger than L n Half of (1); if yes, go to step S208, otherwise, go to step S209;
step S208, the serial number M of the material tray n-1 The BIN code is printed on the PCBA and then returns to the step S201;
step S209, the serial number M of the material tray n The BIN code (S) is applied to the PCBA and then the process returns to step S201.
Through the process, the problem that the labeled BIN codes and the BIN codes of the LED scanning stations are asynchronous is solved, and the BIN codes of the LEDs with large quantity can be used as the BIN codes of the PCBA when two LEDs are arranged on the PCBA, so that the accuracy of the BIN codes on the PCBA is ensured.
In summary, the BIN codes of the tray and the LED quantity information are scanned and compared when the LED tray is loaded, and the same or similar BIN codes are compared to select the tray for loading, so that the performance of the LEDs on the same PCBA is ensured to be the same or similar when the same PCBA is mounted, and the BIN codes with the dominant total number of the LEDs on the PCBA are calculated by the data such as the LED quantity information to serve as the BIN codes of the PCBA, so as to ensure the accuracy of the BIN codes on the PCBA.
Example two
As shown in fig. 6, the present embodiment provides an array LED control system, which includes a plurality of PCBA, a storage unit, a processor, a communication interface, a power supply unit, and a housing;
a plurality of PCBAs are provided with labels with BIN codes;
the PCBAs, the storage unit, the processor, the communication interface and the power supply unit are all arranged in the shell;
the PCBAs, the storage units and the communication interfaces are all electrically connected with the processor;
the storage unit is used for storing the BIN codes;
the processor is used for calling the BIN codes in the storage unit and correspondingly controlling the lighting effect of the PCBA according to the BIN codes;
the communication interface is used for being connected with external equipment and storing different BIN coded data into the storage unit through the external equipment;
the power supply unit supplies power to the whole control system.
By utilizing the array LED control system, the BIN codes of different PCBAs on the same system can be recorded, and then the LED brightness information on different PCBAs can be known, so that support can be provided for subsequent use.
EXAMPLE III
As shown in fig. 7, the present embodiment provides an array LED control method, which is implemented on the basis of the array LED control system provided in the second embodiment, and includes the following steps:
s1, scanning a label on the PCBA before assembling to obtain a BIN code, and transferring the obtained BIN code to a storage unit for storage through an external device by using a communication interface;
s2, the processor reads all the BIN codes of the PCBAs to be lighted in the storage unit, and the controller controls the power supply unit to distribute the adaptive current to the corresponding PCBAs according to different BIN codes, so that the display effects of different PCBAs are consistent.
Specifically, as shown in fig. 6, the array LED control system comprises a left PCBA and a right PCBA, both of which are equipped with LED arrays and both of which are provided with BIN-encoded labels;
optionally, the label may be a physical label or a two-dimensional code formed by laser engraving.
When the left PCBA is assembled, the BIN coded labels on the left PCBA are firstly scanned, when the right PCBA is assembled, the BIN coded labels on the right PCBA are then scanned, parameter information of the LEDs on the PCBA can be obtained after the BIN codes obtained through scanning, and then the parameter information is written into the designated positions of the storage unit through the communication interfaces and the processor.
When the LED is lighted, the processor can read the BIN codes in the storage unit and can control the left PCBA and the right PCBA according to the BIN codes. For example, if the BIN code of the left PCBA is read and the display luminance level is known to be low, and the BIN code of the right PCBA is known to be high, the drive current of the right PCBA is reduced and the drive current of the left PCBA is increased at the time of lighting, thereby achieving the effect of equalizing the luminance of the left and right PCBAs.
In summary, in the array LED control system and method provided by the present invention, the BIN codes are obtained by obtaining the labels on the PCBA, and the driving current is reasonably distributed according to the obtained BIN codes, so that when PCBA with different BIN codes are used on the same product, the consistency of the LED display effect can still be ensured.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. An array LED patch management method is characterized by comprising the following steps:
scanning to obtain the BIN codes and the LED quantity information on the LED tray, and comparing the obtained BIN codes with the BIN codes input last time;
feeding the material trays meeting the requirements after data comparison, inputting BIN codes and quantity information of the material trays, and counting the material trays;
preparing PCBA by mounting pieces, and blanking the PCBA and counting the blanking of the PCBA after finishing the preparation;
acquiring the number information of the current PCBAs, the number information of the currently used material trays and the number information of LEDs of each material tray, and calculating data by combining the number information of the LEDs assembled by each PCBA to obtain BIN codes with the total number of the LEDs on the PCBA being superior;
and radium carving the BIN codes with the dominant total quantity of the LEDs on the corresponding PCBA in a label form to serve as the BIN codes of the PCBA.
2. The array LED patch management method of claim 1, wherein the specific method of data comparison is:
comparing whether the BIN codes on the two material trays are the same or similar, and if the BIN codes are the same or similar, judging that the BIN codes meet the requirements; if the two are different and not close, the requirements are not met.
3. The array LED patch management method of claim 2, wherein when it is determined that the requirements are not met, an alarm is given, and the tray is replaced again for data comparison until the requirements are met.
4. The method for managing LED patches in an array according to claim 1, wherein the specific steps of calculating the BIN code with the total number of LEDs on the PCBA being the dominant by data calculation are as follows:
step one, acquiring serial number B of PCBA (printed Circuit Board Assembly) finished by one patch n ；
Step two, reading the recorded material tray number M n ；
Step three, judging M n Whether the value is equal to 1, if yes, entering a step nine; otherwise, entering the step four;
step four, reading the input LED quantity information Q on each material plate n ；
Step five, calculating M n-1 Total quantity QS of LEDs in each tray:
step six, combining the number L of the LEDs assembled on the PCBA n And calculating the number R of unused LEDs in a tray which is successfully loaded:
seventhly, judging whether R is larger than L n If yes, entering step eight, otherwise entering step nine;
step eight, setting the serial number as M n-1 The BIN code on the material tray is used as the BIN code of the current PCBA;
step nine, taking the sequence number as M n As the BIN code of the current PCBA.
5. The array LED patch management method of claim 1, wherein the BIN code and the LED number information each employ at least one of a bar code and a two-dimensional code.
6. The array LED patch management method of claim 1 wherein said BIN codes include LED brightness BIN codes, LED color BIN codes, and LED forward voltage BIN codes.
7. An array LED control system is characterized by comprising a plurality of PCBAs, a storage unit, a processor, a communication interface and a power supply unit;
a plurality of the PCBAs each have a BIN encoded label thereon;
the PCBAs, the storage units and the communication interfaces are all electrically connected with the processor;
the storage unit is used for storing different BIN codes;
the processor is used for calling the BIN codes in the storage unit and correspondingly controlling the display effect of the PCBA according to the BIN codes;
the communication interface is used for being connected with external equipment and storing different BIN coded data into the storage unit through the external equipment;
the power supply unit supplies power to the whole control system.
8. The arrayed LED control system of claim 7, further comprising a housing, the PCBA, storage unit, processor, communications interface, and power supply unit all mounted within the housing.
9. An array LED control method, characterized in that the LED control system according to any one of claims 7 or 8 is used, and the control method comprises the following steps:
scanning a label on the PCBA to obtain a BIN code and storing the obtained BIN code to a storage unit through external equipment by using a communication interface;
the processor reads the BIN codes of all PCBAs to be lightened in the storage unit, and the controller controls the power supply unit to distribute adaptive current for the corresponding PCBAs according to different BIN codes, so that the display effects of different PCBAs are consistent.
10. The method of array LED control of claim 9, wherein the method by which the controller controls the power supply unit to distribute current to different PCBAs is:
the PCBA driving current with low BIN coding brightness level is increased or the PCBA driving current with high BIN coding brightness level is reduced.
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