CN108282961A - Ultrathin flexible RGB panel manufacture crafts - Google Patents
Ultrathin flexible RGB panel manufacture crafts Download PDFInfo
- Publication number
- CN108282961A CN108282961A CN201810065670.XA CN201810065670A CN108282961A CN 108282961 A CN108282961 A CN 108282961A CN 201810065670 A CN201810065670 A CN 201810065670A CN 108282961 A CN108282961 A CN 108282961A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- alcohol
- panel manufacture
- chip
- manufacture crafts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of ultrathin flexible RGB panel manufacture crafts, include the following steps：1) circuit of circuit back is removed；2) wiring board after cleaning and drying is face-up placed and is fixed, chip is positioned over to the front of wiring board with jig, and the inside of assist side is arranged circuit and is connected to chip；3) chip is sealed and is fixed with glue.The present invention removes the circuit of circuit back, reduces the height of wiring board, while using reverse installation process, the height of pin of positive cartridge chip is eliminated, to further decrease the overall height of flexible RGB panels.
Description
Technical field
The present invention relates to panel manufacture craft field more particularly to a kind of ultrathin flexible RGB panel manufacture crafts.
Background technology
RGB panels are commonly used to the fields such as LCD TV and keyboard as a kind of flexible circuit board for colour developing.Pacifying
When filling LCD TV or keyboard, in order to pursue the factors such as beauty, it will usually it is required that RGB panels are thin as far as possible.RGB panels are usual
It is set on wiring board and is made by just setting chip.And the wiring board purchased in the market is usually front by silver paste, anti-
Face by printing, drying and is sintered by aluminium paste.Since there is circuit on two sides so very thick.It is also wrapped simultaneously because just setting chip
The height of pin is included, so that manufactured RGB panels more thicken, usually 0.4mm or more.It is therefore desirable to reduce the faces RGB
The thickness of plate.
Invention content
To overcome disadvantages mentioned above, the purpose of the present invention is to provide a kind of ultrathin flexible RGB panel manufacture crafts.
In order to reach object above, the technical solution adopted by the present invention is：A kind of ultrathin flexible RGB panel manufacture crafts,
Include the following steps：
1) circuit of circuit back is removed；
2) wiring board after cleaning and drying is face-up placed and is fixed, chip is positioned over wiring board with jig
Front, and the inside of assist side is arranged circuit and is connected to chip；
3) chip is sealed and is fixed with glue.
Preferably, the chip is to be inverted chip.
Preferably, the material of the wiring board is FPC or BT.
Preferably, further comprising the steps of：
A) alcohol for being 5-13 with carbon atom number cleans the back side of wiring board；
B) alcohol for being 1-4 with carbon atom number cleans the back side of wiring board；
C) acid solution for being 2.0-6.9 with pH value cleans back side circuit and the drying of wiring board.
Preferably, the carbon atom for the alcohol that the step a) carbon atom numbers are 5-13 is 8-12, and carbon atom number is the alcohol of 5-13
Mass percent concentration be 70%-100%, scavenging period be 1-10 minutes.
Preferably, the alcohol that the carbon atom is 8-12 is terpinol；The mass percent concentration is 94%-99%；Institute
It is 2-6 minutes to state scavenging period.
Preferably, the carbon atom number for the alcohol that carbon atom number is 1-4 in the step b) is 2-3, and carbon atom number is the alcohol of 1-4
Mass percent concentration be 70%-100%, scavenging period be 1-10 minutes.
Preferably, the alcohol that the carbon atom number is 2-3 is ethyl alcohol；The mass percent concentration is 94%-99%；It is described
Scavenging period is 2-6 minutes.
Preferably, the pH value for the acid solution that pH value is 2.0-6.9 in the step c) is 2.0-5, the acid solution
Single acid or mixed acid solution are can be selected from, scavenging period is -5 minutes 1 second.
Preferably, the acid solution is selected from hydrochloric acid, sulfuric acid or phosphoric acid one of which or mixing；The scavenging period is 30
- 2 minutes seconds.
Beneficial effects of the present invention：It is dissolved in the principle of organic matter using metal ion, circuit backboard is cleaned using terpinol
The part metals ion in face, and the boiling point of terpinol is high, is not easy to evaporate, dosage is small when in use；It mixes by using similar
Principle so that terpinol can be dissolved in ethyl alcohol, and the low boiling point of ethyl alcohol, easily evaporation so that the surface of wiring board will not residual alcohol
Substance；It is reacted by using displacement so that the aluminium paste of PCB surface is cleared so that the height of wiring board is lowered；By
In using reverse installation process, the height of pin of positive cartridge chip is eliminated, to further decrease the overall height of flexible RGB panels.
Specific implementation mode
The preferred embodiments of the present invention will be described in detail below so that advantages and features of the invention can be easier to by
It will be appreciated by those skilled in the art that so as to make a clearer definition of the protection scope of the present invention.
【Embodiment 1】
The terpinol for being 98% with mass percent concentration cleans the back side 4 minutes of wiring board, uses mass percent concentration
The back side 4 minutes of wiring board is cleaned for 98% ethyl alcohol, the hydrochloric acid for being 4 with pH value cleans the back side circuit 1 minute of wiring board simultaneously
It is dry, the wiring board after cleaning and drying is face-up placed and fixed, chip will be inverted and be positioned over wiring board with jig
Front, and the inside of assist side is arranged circuit and is connected to chip is inverted, and is sealed and is fixed to being inverted chip with glue.
In the present embodiment, the material of the wiring board is FPC.
It is highly 0.02mm to measure final product to be.
【Embodiment 2】
The nonyl alcohol for being 94% with mass percent concentration cleans the back side 2 minutes of wiring board, is with mass percent concentration
The back side 2 minutes of 94% ethyl alcohol cleaning wiring board, the back side circuit for the sulfuric acid cleaned wiring board for being 2 with pH value 30 seconds are simultaneously done
It is dry, the wiring board after cleaning and drying is face-up placed and fixed, chip will be inverted and be positioned over wiring board just with jig
Face, and the inside of assist side is arranged circuit and is connected to chip is inverted, and is sealed and is fixed to being inverted chip with glue.
In the present embodiment, the material of the wiring board is BT.
It is highly 0.025mm to measure final product to be.
【Embodiment 3】
The lauryl alcohol for being 99% with mass percent concentration cleans the back side 6 minutes of wiring board, uses mass percent concentration
The back side 6 minutes of wiring board is cleaned for 99% propyl alcohol, the phosphoric acid for being 5 with pH value cleans the back side circuit 2 minutes of wiring board simultaneously
It is dry, the wiring board after cleaning and drying is face-up placed and fixed, chip will be inverted and be positioned over wiring board with jig
Front, and the inside of assist side is arranged circuit and is connected to chip is inverted, and is sealed and is fixed to being inverted chip with glue.
In the present embodiment, the material of the wiring board is FPC.
It is highly 0.027mm to measure final product to be.
【Embodiment 4】
The amylalcohol for being 70% with mass percent concentration cleans the back side 1 minute of wiring board, is with mass percent concentration
The back side of 70% propyl alcohol cleaning wiring board 6 minutes, with the mixed liquor of phosphoric acid and hydrochloric acid that pH value is 6, cleans the back of the body of wiring board
Upper thread road 2 minutes is simultaneously dry, the wiring board after cleaning and drying is face-up placed and fixed, is put chip is just set with jig
Be placed in the front of wiring board, and the inside setting circuit of assist side and be connected to chip is just set, with glue to just set chip into
Row is sealed and is fixed.
In the present embodiment, the material of the wiring board is BT.
It is highly 0.05mm to measure final product to be.
【Embodiment 5】
The tridecanol for being 100% with mass percent concentration cleans the back side 10 minutes of wiring board, dense with mass percent
The back side for the butanol cleaning wiring board that degree is 100% 10 minutes, the phosphoric acid for being 6.9 with pH value cleans the back side circuit 2 of wiring board
Minute is simultaneously dry, the wiring board after cleaning and drying is face-up placed and fixed, line is positioned over jig by chip is just set
The front of road plate, and the inside of assist side is arranged circuit and is connected to chip is just set, and is sealed with glue to just setting chip
And fixation.
In the present embodiment, the material of the wiring board is BT.
It is highly 0.06mm to measure final product to be.
The technical concepts and features of embodiment of above only to illustrate the invention, its object is to allow be familiar with technique
People understands present disclosure and is implemented, and it is not intended to limit the scope of the present invention, all according to spirit of that invention
The equivalent change or modification that essence is done should all cover within the scope of the present invention.
Claims (10)
1. a kind of ultrathin flexible RGB panel manufacture crafts, include the following steps：
1) circuit of circuit back is removed；
2) wiring board after cleaning and drying is face-up placed and is fixed, chip is being positioned over wiring board just with jig
Face, and the inside of assist side is arranged circuit and is connected to chip；
3) chip is sealed and is fixed with glue.
2. ultrathin flexible RGB panel manufacture crafts according to claim 1, it is characterised in that：The chip is to be inverted core
Piece.
3. ultrathin flexible RGB panel manufacture crafts according to claim 1, it is characterised in that：The material of the wiring board
For FPC or BT.
4. ultrathin flexible RGB panel manufacture crafts according to claim 1, it is characterised in that：It is further comprising the steps of：
A) alcohol for being 5-13 with carbon atom number cleans the back side of wiring board；
B) alcohol for being 1-4 with carbon atom number cleans the back side of wiring board；
C) acid solution for being 2.0-6.9 with pH value cleans back side circuit and the drying of wiring board.
5. ultrathin flexible RGB panel manufacture crafts according to claim 4, it is characterised in that：Step a) the carbon atoms
The carbon atom for the alcohol that number is 5-13 is 8-12, and the mass percent concentration for the alcohol that carbon atom number is 5-13 is 70%-100%, clearly
It is 1-10 minutes to wash the time.
6. ultrathin flexible RGB panel manufacture crafts according to claim 5, it is characterised in that：The carbon atom is 8-12
Alcohol be terpinol；The mass percent concentration is 94%-99%；The scavenging period is 2-6 minutes.
7. ultrathin flexible RGB panel manufacture crafts according to claim 4, it is characterised in that：Carbon is former in the step b)
The carbon atom number for the alcohol that subnumber is 1-4 is 2-3, and the mass percent concentration for the alcohol that carbon atom number is 1-4 is 70%-100%, clearly
It is 1-10 minutes to wash the time.
8. ultrathin flexible RGB panel manufacture crafts according to claim 7, it is characterised in that：The carbon atom number is 2-3
Alcohol be ethyl alcohol；The mass percent concentration is 94%-99%；The scavenging period is 2-6 minutes.
9. ultrathin flexible RGB panel manufacture crafts according to claim 4, it is characterised in that：PH value in the step c)
PH value for the acid solution of 2.0-6.9 is 2.0-5, and the acid solution can be selected from single acid or mixed acid solution, when cleaning
Between be -5 minutes 1 second.
10. ultrathin flexible RGB panel manufacture crafts according to claim 9, it is characterised in that：The acid solution is selected from
Hydrochloric acid, sulfuric acid or phosphoric acid one of which or mixing；The scavenging period is -2 minutes 30 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810065670.XA CN108282961A (en) | 2018-01-23 | 2018-01-23 | Ultrathin flexible RGB panel manufacture crafts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810065670.XA CN108282961A (en) | 2018-01-23 | 2018-01-23 | Ultrathin flexible RGB panel manufacture crafts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108282961A true CN108282961A (en) | 2018-07-13 |
Family
ID=62804791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810065670.XA Pending CN108282961A (en) | 2018-01-23 | 2018-01-23 | Ultrathin flexible RGB panel manufacture crafts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108282961A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0342669A2 (en) * | 1988-05-20 | 1989-11-23 | Mitsubishi Gas Chemical Company, Inc. | Method for preparing thin copper foil-clad substrate for circuit boards |
| CN201345309Y (en) * | 2009-01-14 | 2009-11-11 | 深圳华为通信技术有限公司 | Key-press circuit board and keyboard |
| CN102691981A (en) * | 2012-04-19 | 2012-09-26 | 浙江英特来光电科技有限公司 | High-density and integrally packaged RGB module and production method thereof |
| CN104167462A (en) * | 2013-05-16 | 2014-11-26 | 无锡尚德太阳能电力有限公司 | Poorly printed solar battery reworking method |
| CN104993021A (en) * | 2015-07-23 | 2015-10-21 | 上饶光电高科技有限公司 | Method for improving conversion efficiency of reworked pieces in solar cell screen printing |
| CN105742456A (en) * | 2014-12-12 | 2016-07-06 | 深圳统聚光电有限公司 | COB encapsulation method |
| CN106876521A (en) * | 2017-02-14 | 2017-06-20 | 苏州爱康光电科技有限公司 | A kind of silicon solar cell prints bad reworking method |
-
2018
- 2018-01-23 CN CN201810065670.XA patent/CN108282961A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0342669A2 (en) * | 1988-05-20 | 1989-11-23 | Mitsubishi Gas Chemical Company, Inc. | Method for preparing thin copper foil-clad substrate for circuit boards |
| CN201345309Y (en) * | 2009-01-14 | 2009-11-11 | 深圳华为通信技术有限公司 | Key-press circuit board and keyboard |
| CN102691981A (en) * | 2012-04-19 | 2012-09-26 | 浙江英特来光电科技有限公司 | High-density and integrally packaged RGB module and production method thereof |
| CN104167462A (en) * | 2013-05-16 | 2014-11-26 | 无锡尚德太阳能电力有限公司 | Poorly printed solar battery reworking method |
| CN105742456A (en) * | 2014-12-12 | 2016-07-06 | 深圳统聚光电有限公司 | COB encapsulation method |
| CN104993021A (en) * | 2015-07-23 | 2015-10-21 | 上饶光电高科技有限公司 | Method for improving conversion efficiency of reworked pieces in solar cell screen printing |
| CN106876521A (en) * | 2017-02-14 | 2017-06-20 | 苏州爱康光电科技有限公司 | A kind of silicon solar cell prints bad reworking method |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180713 |