CN108273754B

CN108273754B - Test sorting machine

Info

Publication number: CN108273754B
Application number: CN201810081872.3A
Authority: CN
Inventors: 金斗佑; 金峻秀; 金成元
Original assignee: Techwing Co Ltd
Current assignee: Techwing Co Ltd
Priority date: 2014-06-23
Filing date: 2015-06-23
Publication date: 2020-08-25
Anticipated expiration: 2035-06-23
Also published as: JP6080134B2; CN105170476A; KR102123052B1; CN105170476B; TW201600866A; CN108273754A; KR20150146240A; TWI580975B; JP2016008969A

Abstract

According to an embodiment of the present invention, there is provided a test handler including: a loading unit for loading electronic components; a soak chamber for pre-cooling or pre-heating the loaded electronic parts so that the electronic parts have a set temperature for testing; a test chamber for testing the pre-cooled or pre-heated electronic components; a de-soak chamber for restoring a temperature of the tested electronic component to a predetermined level, the de-soak chamber including a flow path having a first inlet, an outlet, and a second inlet adjacent the outlet, the flow path being formed inside one sidewall of the de-soak chamber; a circulation unit for circulating air in the de-infusion chamber along a flow path; and an unloading unit for unloading the electronic part having the temperature restored to a preset level.

Description

Test sorting machine

This application is a divisional application of chinese patent application No. 201510349439.X entitled "test handler" filed on 23.06/2015.

Technical Field

The invention relates to a test handler.

Background

A test handler is an apparatus that supports testing of electronic components such as semiconductor devices manufactured through a predetermined manufacturing process, sorts the electronic components by grade according to the test results, and loads the sorted electronic components on a customer tray.

Fig. 1 is a plan view of a test handler 300 according to korean patent publication No. 10-2013-0105265 (hereinafter, referred to as a related art) filed by the applicant. Referring to the drawings, the test handler 300 may be configured to include a loading unit 320, a soak chamber 330, a de-soak (de-soak) chamber 350, and an unloading unit 380.

The test tray 310 may include a plurality of inserts in which electronic components may be safely placed and may be circulated along a closed path C defined by a plurality of transport systems (not shown).

The loading unit 320 loads the untested electronic components on the test tray positioned at the loading position, and the untested electronic components are loaded on a customer tray (not shown).

The soak chamber 330 may pre-heat or pre-cool the electronic components loaded on the transferred test tray 310 before the test so that the electronic components have a preset temperature for the test.

The test chamber 340 may test the electronic components loaded on the test tray 310 transferred to the test position after being preheated or pre-cooled in the soak chamber 330.

The de-soak chamber 350 may cool the electronic parts loaded on the test tray 310 transferred from the test chamber 340, which have completed the test condition, so that the electronic parts have a room temperature or a temperature at which no problem occurs at the time of unloading. Alternatively, the de-soak chamber 350 may heat the electronic components that complete the test conditions so that the electronic components have room temperature or a temperature at which condensation does not occur.

The unloading unit 380 may sort the electronic components from the test tray 310 located at the unloading position by rank according to the test result, and may unload the sorted electronic components on the empty customer tray.

As described above, the electronic components can circulate along the closed path 'C' in a state of being loaded on the test tray 310, wherein the closed path 'C' is connected to the soak chamber 330 again from the soak chamber 330, the test chamber 340, the desoak chamber 350, the unload position, and the load position in order.

In practice, the test handler 300 may be provided with a plurality of test trays 310 circulating along the closed path C. As described above, the soak chamber 330 may set the electronic components to a temperature conforming to the test conditions before the test. After the test is completed, the de-soak chamber 350 may restore the temperature of the electronic components to a pre-set level prior to unloading. With this configuration, the operation speed of the test apparatus and the unloading unit 380 is increased, and eventually the processing capacity of the apparatus is increased.

In particular, when the electronic component subjected to the test at a low temperature is directly sent to the unloading position, moisture may condense on the surface of the electronic component by room-temperature air, which may cause damage to the electronic component. Also, when the electronic component is held by the unloading unit 380, a pad mark may be left on the surface of the electronic component. In addition, when the electronic component tested at a high temperature is directly sent to the unloading position, the pads of the unloading unit 380 may be melted or adhered by the heat remaining in the electronic component. Therefore, it is necessary to provide the desoak chamber 350 as above in order to restore the tested electronic parts to room temperature or a predetermined temperature.

With the connection to such a de-soak chamber 350, the applicant has developed a test handler 300 comprising a de-soak chamber 350, the de-soak chamber 350 bringing about the effect of improved stability and reliability of the apparatus compared to conventional de-soak chambers. Fig. 2 is a front view showing one side wall 351 of the de-soak chamber 350 of the test handler 300 according to the related art, and fig. 3 is a front view showing the air flow inside the de-soak chamber 350. Referring to fig. 1-3, briefly describing the prior art, first, an empty space may be provided in one sidewall 351 of the de-infusion chamber 350. The empty space may be used as the flow path 351 a. An inlet 351a-1 and an outlet 351a-2 may be provided at upper and lower portions of the flow path 351a, respectively, and a fan 362 may be provided in the inlet 351a-1 and the outlet 351 a-2. Accordingly, air inside the de-infusion chamber 350 may be introduced into the flow path 351a via the inlet 351a-1 and then, may be discharged again into the inner space of the de-infusion chamber 350 via the outlet 351 a-2. The temperature of the electronic components loaded on the test tray 310 inside the de-soak chamber 350 can be effectively restored by this forced air circulation.

However, a recent trend is that the number of electronic parts processed per unit time is continuously increasing. The efficiency of cooling or heating of the electronic components in the de-infusion chamber is therefore highlighted as an important issue. This problem is solved considerably by the prior art. However, since the efficiency of cooling or heating of electronic components is preferably higher, the applicant aims to further improve the prior art.

In particular, since the upper portion of the de-infusion chamber is structurally scarce in space in many cases compared to the lower portion of the de-infusion chamber, the number of inlets and fans provided in the upper portion is also limited and, finally, the amount of air introduced becomes small. The amount of air to be discharged becomes small due to the limited amount of air to be introduced. Therefore, the management efficiency of the thermal management of the electronic component is limited (from the viewpoint of miniaturization of the entire apparatus, it is advantageous to form the inlet at the upper portion). To solve such a problem, the applicant studied how to efficiently cool or heat the electronic parts.

Disclosure of Invention

In view of the above, the present invention provides a test handler capable of increasing the flow rate and flow velocity of air to be discharged into a desoak chamber, thereby improving the efficiency of air circulation in an inner space of the desoak chamber

In addition, the present invention provides a test handler capable of uniformly discharging air in an inner space of a desoak chamber, thereby reducing temperature deviation of electronic parts.

According to an embodiment of the present invention, there is provided a test handler including: a loading unit for loading electronic components; a soak chamber for pre-heating or pre-cooling the loaded electronic parts to have the electronic parts with a set temperature for testing; a tester for testing the pre-cooled or pre-heated electronic components; a de-soak chamber for restoring a temperature of the tested electronic component to a preset level, the de-soak chamber including a flow path having a first inlet, an outlet, and a second inlet adjacent the outlet, the flow path being formed in one sidewall of the de-soak chamber; a circulation unit for circulating air in the de-infusion chamber along a flow path; and an unloading unit for unloading the electronic part having the temperature restored to the preset level.

In addition, the circulation unit includes an exhaust fan that enables air circulating through the flow path to be discharged into the interior space of the de-soak chamber via the outlet, the exhaust fan being spaced apart from the outlet by a predetermined distance in a direction of the interior space of the de-soak chamber, and the second inlet includes a space between the outlet and the exhaust fan.

In addition, the exhaust fan includes a main body, a wing portion provided inside the main body, and a fan cover in which only a center portion corresponding to the wing portion is kept open and an edge portion not corresponding to the wing portion is kept closed.

In addition, a second inlet is formed in the vicinity of the exhaust fan, the second inlet having a plurality of through holes communicating between the inner space of the de-soak chamber and the flow path.

In addition, the circulation unit includes a plurality of exhaust fans arranged adjacent to each other, and the test handler further includes: and a guide unit disposed inside the flow path, the guide unit causing the air circulating in the flow path to be discharged into the plurality of exhaust fans, respectively.

In addition, the plurality of exhaust fans form a plurality of rows, and the guide unit extends in a horizontal direction at a height corresponding to a lower end of the exhaust fan in one group constituting each of the plurality of rows to flow air in the horizontal direction to introduce air into each group of the exhaust fans, the plurality of guide units being disposed in each of the plurality of rows, wherein both ends of the guide unit disposed at the lowermost row are in contact with an inner side surface of the flow path, and both ends of the guide units disposed at the remaining rows except the lowermost row are spaced apart from the inner side surface of the flow path by a predetermined distance.

In addition, an outlet is formed to discharge air between a plurality of test trays positioned inside the de-soak chamber.

According to the embodiments of the present invention, it is possible to provide a test handler capable of increasing the flow rate and the flow velocity of air discharged into the de-soak chamber, thereby improving the efficiency of air circulation in the inner space of the de-soak chamber.

In addition, it is possible to provide a test handler capable of uniformly discharging air into an inner space of a desoak chamber, thereby reducing temperature deviation of electronic parts.

Drawings

FIG. 1 is a plan view of a test handler according to the prior art;

FIG. 2 is a front view of one side wall of the de-soak chamber of the test handler shown in FIG. 1;

FIG. 3 is a view showing the air flow inside the de-soak chamber of the test handler shown in FIG. 1;

FIG. 4 is a view schematically illustrating one sidewall and surrounding structure of a de-soak chamber of a test handler according to an embodiment of the present invention;

fig. 5A and 5B are views respectively showing a fan cover according to a comparative example and the fan cover according to the embodiment shown in fig. 4;

FIG. 6 is a front view of one side wall of a de-soak chamber of a test handler according to another embodiment of the present invention;

FIG. 7 is a view showing the interior of one of the side walls of the de-infusion chamber shown in FIG. 6; and

FIG. 8 is a plan view of the de-infusion chamber shown in FIG. 4.

Detailed Description

Hereinafter, embodiments of the technical concept according to the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions and/or constructions are not described in detail if they would unnecessarily obscure the features of the invention.

A test handler according to an embodiment of the present invention may include a loading unit, a soak chamber, a test chamber, a desoak chamber, a circulation unit, and an unloading unit. The above configuration is explained in detail with reference to fig. 1. Therefore, a repetitive explanation will be omitted in the following description, and the difference from the above-described configuration, the de-soak chamber, and the circulation unit will be described with priority.

Similar to the de-soak chamber of the test handler according to the prior art described with respect to fig. 2, the de-soak chamber of the test handler according to the present embodiment may have an empty space inside one of its side walls. The empty space may be used as a flow path. The air in the interior space of the de-infusion chamber may be introduced into the first inlet of the flow path by a separately provided circulation unit, and then, while flowing along the flow path, the air may be discharged again into the interior space of the de-infusion chamber through the outlet. As described above, the air inside the desoak chamber is forcibly circulated, so that the temperature of the electronic parts can be effectively restored.

The configuration of the de-infusion chamber, flow path, first inlet and outlet, etc. of the present embodiment can be similar to the prior art. In other words, as shown in fig. 2 and 3, the first inlet can be formed at an upper portion of one of the side walls of the de-infusion chamber and the outlet can be formed at a lower portion of the one of the side walls of the de-infusion chamber. As described above, in the case where the first inlet is formed at the upper portion and the outlet is formed at the lower portion, it may be advantageous in terms of miniaturization of the entire apparatus. Also as described in the prior art, a heating unit, such as a heater, would be placed adjacent the first inlet. In the case where the heating unit is disposed at a different position (e.g., a side portion) than the upper portion of the de-steeping chamber, there may occur a problem that the size of the entire apparatus becomes larger. However, even then, the positions of the first inlet and outlet of the present embodiment are not limited to the above. Basically, the first inlet and the outlet may be spaced apart from each other by a predetermined distance. The first inlet can be formed adjacent to a heating unit, such as a heater, and the outlet can be formed adjacent to a location inside the de-soak chamber where the test tray is placed.

Structurally, in some cases, the space in the upper portion of the de-infusion chamber may be smaller than the space in the lower portion of the de-infusion chamber. In this case, increasing the amount of air to be introduced into the flow path by simply increasing the size of the first inlet and the number of flow fans provided in the first inlet and the like may be limited. Due to this limitation, the amount of air to be discharged may also be limited, and eventually may prevent the temperature of the electronic components from being efficiently recovered.

The present embodiment proposes a scheme for effectively recovering the temperature of the electronic component even in the above case. First, a plurality of flow fans may be connected in series to the side of the first inlet, instead of a single flow fan, to increase the amount of air to be introduced into the flow path through the first inlet.

Alternatively, even in the case where the flow rate and flow velocity of the air introduced through the first inlet are limited, it is possible to discharge the air having a high flow rate and high flow velocity by additionally introducing the air through the second inlet adjacent to the outlet. To describe the second inlet in detail, fig. 4 is given.

Fig. 4 is a view schematically showing one side wall 10 and the surrounding structure of the desoak chamber of the test handler according to the present embodiment. As shown in fig. 4, the second inlet may include a space 14 between the outlet 13 and the exhaust fan 30.

Specifically, as shown in fig. 4, the air in the de-infusion chamber may be introduced into the flow path 11 via the first inlet by a circulation unit (e.g., a flow fan) provided in a side portion of the first inlet, and may be discharged via the outlet 13 by the circulation unit while flowing along the flow path 11. The circulation unit may include an exhaust fan 30 disposed at a side of the outlet 13, similar to the related art. The exhaust fan 30 may include a main body 31, a wing (not shown) provided inside the main body 31, and a fan cover 32 provided at one side (e.g., the left side in fig. 4) of the main body 31. The body 31 covers one side of the wing and keeps the same closed. The fan cover 32 may be coupled to the main body 31 by a coupling member 33. In the present embodiment, the exhaust fan 30 may be configured not to block the outlet 13, but may be spaced apart from the outlet 13 by a predetermined distance. To accomplish this, a connection member 34 may be provided between the rear side (e.g., the right side in fig. 4) of the main body 31 of the exhaust fan 30 and the inner side surface of one side wall of the de-soak chamber. The connecting member 34 allows air to be introduced from outside the flow path of the de-infusion chamber into the space between the outlet and the exhaust fan 30. Various shapes, sizes and attachment methods may be provided. The air introduced into the flow path 11 through the first inlet and discharged through the outlet 13 may pass through the exhaust fan 30 (see the middle dotted line). In the case where the exhaust fan 30 is in contact with the outlet 13 without the space 14, the air introduced into the flow path 11 may flow backward, and thus, may not pass through the exhaust fan 30. In other words, since the exhaust fan 30 is spaced apart from the outlet 13, the air introduced into the flow path 11 may be smoothly discharged by the exhaust fan 30. Besides, in the present embodiment, air that is not introduced into the first inlet, that is, air around the outlet 13 may be introduced into the space 14 between the outlet 13 and the exhaust fan 30 by the operation of the exhaust fan 30. Once the air is introduced, the air may pass through an exhaust fan 30 (see dashed lines in the top and bottom) and may be discharged into the interior space of the de-infusion chamber while maintaining a flow rate above a certain level. Thus, the flow rate and the flow velocity of the air to be discharged through the exhaust fan 30 may be increased. As the flow rate and the flow velocity increase, the air flow inside the de-soak chamber increases, and the air is uniformly discharged inside the de-soak chamber, so that the temperature of the electronic components can be quickly restored, and also the temperature deviation between the electronic components can be minimized.

Fig. 5A and 5B are views respectively showing a fan cover according to a comparative example and the fan cover according to the embodiment shown in fig. 4. The fan cover shown in fig. 5A is a fan cover applied to an exhaust fan of the related art.

In the case of the fan cover shown in fig. 5A, since the center portion of the circular shape and the edge portion are kept open, air cannot be collected, and instead some air is discharged into the edge portion. Therefore, the straightness of the air to be discharged may be weakened, and the flow rate and flow velocity of the air may be reduced accordingly. The reduction in flow and velocity can mean that a sufficient amount of air is not evenly discharged into the interior space of the de-infusion chamber.

On the other hand, the fan cover 32 according to the embodiment shown in fig. 5B is configured such that only the central portion 32a corresponding to the wing portion of the circular shape is kept open, while the other portion, i.e., the edge portion 32B not corresponding to the wing portion is kept closed. With this configuration, ambient air can be collected, so that the straightness of air to be discharged can be improved, and the flow rate and the flow velocity can be increased. Finally, a sufficient amount of air can be uniformly discharged into the inner space of the de-soak chamber, so that the temperature of the electronic components can be effectively restored, and temperature deviation between the electronic components can be minimized.

Tables 1 and 2 below provide a summary of the measurement results of the flow rate and the flow velocity of the air to be discharged according to the prior art and the present embodiment. As shown in fig. 5A, in the case of the prior art, it is configured to arrange the exhaust fan to block the outlet,and the edge portion of the fan cover is kept open. In the case of the present embodiment, as shown in fig. 4, the exhaust fan 30 is arranged to be spaced apart from the outlet 13 by a predetermined distance (set to 5mm in the test), and as shown in fig. 5B, the edge portion of the fan cover 32 is kept closed. In both the related art and the present embodiment, the number of exhaust fans is 5, and the arrangement thereof is shown in fig. 6. For convenience, the exhaust fan in the left side of the top row is referred to as a first exhaust fan, the exhaust fan in the right side of the top row is referred to as a second exhaust fan, the exhaust fan in the left side of the bottom row is referred to as a third exhaust fan, the exhaust fan in the center of the bottom row is referred to as a fourth exhaust fan, and the exhaust fan in the right side of the bottom row is referred to as a fifth exhaust fan. The flow rate is measured from a portion of the circular shape corresponding to the wing of the exhaust fan. Here, the unit of the flow rate is m³H and the flow rate is in m/s.

TABLE 1

Categories	Prior Art	The present embodiment
			1	6588.6	12003.0
2	3615.8	10371.7
			3	2574.6	10371.7
4	2636.7	10175.1
			5	8076.9	6197.7
Average	4968.5	9823.8

TABLE 2

In the case of flow, it can be seen that there is an increase in flow for all but one of the 5 exhaust fans, and it will be appreciated that the flow increases on average by about a factor of two. In the case of the flow rate, it can be seen that the flow rate is increased in all of the five exhaust fans, and it can be understood that the flow rate is increased by about 4 times on average.

Fig. 6 is a front view of one side wall 10 of the de-soak chamber of the test handler according to another embodiment of the present invention. In the present embodiment, the second inlet may include a plurality of through holes 15 formed near the outlet (the exhaust fan 30).

In particular, the first inlet can be formed at an upper portion of one of the side walls 10 of the de-infusion chamber. Then, the flow fan 20 may be disposed at a side of the first inlet. In addition, the outlet may be formed at a lower portion of one sidewall 10. Then, the exhaust fan 30 may be disposed at a side of the outlet. Details regarding the exhaust fan 30 are described above with respect to fig. 4-5B. If desired, a plurality of exhaust fans 30 may be employed, and a plurality of exhaust fans 30 may form a plurality of rows. In the present embodiment, a total of 5 exhaust fans are provided, i.e., two in the top row and three in the bottom row.

The air in the interior space of the de-infusion chamber, which is introduced into the first inlet by the flow fan 20, can flow downwards along the flow path and can be discharged again into the interior space of the de-infusion chamber via the outlet by the exhaust fan 30. In the present embodiment, a plurality of through holes 15 may be formed in the vicinity of the outlet. The plurality of through holes 15 may have a function as a second inlet. The air around the outlet, which is not introduced into the first inlet, may be introduced into the flow path inside one sidewall 10 through the plurality of through holes 15 by the operation of the exhaust fan 30, and then may be discharged again into the inner space of the de-infusion chamber through the outlet and the exhaust fan 30 s. With this arrangement, the flow rate and the flow velocity of the air to be discharged into the inner space of the de-infusion chamber can be increased. In addition, with the arrangement of the plurality of through holes 15, the vortex effect caused by the air pressure difference can be improved.

Meanwhile, it is shown in fig. 6 that the plurality of through holes 15 are formed to be 50 in total. However, the number of the through holes 15 may also be changed according to circumstances. In other words, as shown in the drawing, 10 through holes 15 of the central two rows of the total 4 rows of through holes 15 may not be formed. Alternatively, the through-holes 15 may be formed around only some of the outlets, and the through-holes 15 may not be formed around the remaining outlets. In addition, as shown in fig. 6, after the through-holes 15 are formed, some of the through-holes 15 may be blocked as needed.

Fig. 7 is a view showing the interior of one of the side walls 10 of the de-infusion chamber with the exhaust fan 30 shown in fig. 6 removed. As shown in fig. 7, the outlet 13 may be a single polygonal shape, or may be individually formed in a circular or polygonal shape. The exhaust fans 30 may be respectively provided at such separate outlets. In addition, as described above, a plurality of exhaust fans 30 may be employed in the present embodiment, and such a plurality of exhaust fans 30 may form a plurality of rows (two rows in the present embodiment).

In the present embodiment, the guide unit 40 may be provided inside the flow path. A plurality of guide units 40 may be provided in the present embodiment, and may be provided in each row of the exhaust fan 30. The guide unit 40 may extend in a horizontal direction (lateral direction) from a height corresponding to a lower end of the exhaust fan 30. With this configuration, the air flowing in the flow path in the top-to-bottom direction can be divided into the left horizontal direction and the right horizontal direction, and then introduced into each of the exhaust fans 30 in the group forming the row.

The length of the guide unit 40 may vary according to the row in which the guide unit 40 is disposed. For example, in the case of the lowermost row, since the air does not have to descend further, the end of the guide unit 42 disposed in the lowermost row may contact the inner surface of the flow path. However, in the case of the remaining rows except the lowermost row, since the air must descend from the relevant row to the next lower row, the end of the guide unit 41 may be spaced apart from the inner surface of the flow path by a predetermined distance. In other words, while the air introduced into the first inlet via the flow fan 20 descends along the flow path, the air may be divided into left and right by the guide unit 41 and may be directed toward the group of exhaust fans 30 forming the relevant row. Subsequently, the remaining air may descend forward toward the lower portion through the

spaces

16a, 16b between the guide unit 41 and the inner surface of the flow path, and then may be guided again to the horizontal direction by the guide unit 41 so as to be introduced toward the exhaust fans 30 in one group forming the relevant row. In the present embodiment, the air descending along the flow path may first collide with the guide unit 41 disposed in the first row, and then, the air may be divided into left and right. The air directed to the right may be directed toward the exhaust fan 30 in the first row, and the air directed to the left may descend to the second row through the space 16 a. The air descending to the second row may be directed toward the exhaust fan 30 located in the second row by the guide unit 42 disposed in the second row.

Table 3 below provides a summary of the results of measuring the air flow to be discharged according to the prior art and the present embodiment. In the case of the related art, as shown in fig. 5A, the exhaust fan is configured to be arranged to block the outlet, and an edge portion of the fan cover is kept open. In the case of the present embodiment, as shown in fig. 4, the exhaust fan 30 is disposed at a predetermined distance (set during the test)Set to 5mm) is spaced apart from the outlet 13 and, as shown in fig. 5B, the edge portion of the fan cover 32 is kept closed. In addition, a guide unit 40 as shown in fig. 7 is provided in the flow path, and a plurality of through holes 15 as shown in fig. 6 are formed. In both the related art and the present embodiment, the number of exhaust fans is 5, and the arrangement thereof is as shown in fig. 6. For convenience, the exhaust fan in the left side of the top row is referred to as the first exhaust fan, the exhaust fan in the right side of the top row is referred to as the second exhaust fan, the exhaust fan in the left side of the bottom row is referred to as the third exhaust fan, the exhaust fan in the middle of the bottom row is referred to as the fourth exhaust fan, and the exhaust fan in the right side of the bottom row is referred to as the fifth exhaust fan. The flow rate is measured from a portion of the circular shape corresponding to the wing of the exhaust fan. Here, the unit of the flow rate is m³H is used as the reference value. As a result of the test, it can be seen that there was an increase in flow in all 5 exhaust fans, and it is understood that the flow increased by about 3 times on average. In addition, even in the case of further including the guide unit 40 as compared with tables 2 and 3, it can be seen that an improved effect is achieved in the flow rate. In addition, the deviation of the amount of air to be introduced into each of the exhaust fans 30 may be reduced by the guide unit 40 as described above. With this arrangement, air can be uniformly discharged to the inner space of the de-soak chamber, and thus temperature deviation between the electronic components can be minimized.

TABLE 3

Categories	Prior Art	The present embodiment
			1	6588.6	18529.0
2	3615.8	13839.8
			3	2574.6	13550.3
4	2636.7	9168.5
			5	8076.9	8490.4
Average	4968.5	12715.6

Fig. 8 is a plan view of the desoak chamber 1 of the test handler shown in fig. 4. The electronic components subjected to the test can be transferred to the desoak chamber 1 in a state of being loaded on a plurality of test trays 2. A plurality of test trays 2 can be transferred in a state of being arranged in parallel in the desoak chamber 1. In the present embodiment, an outlet and an exhaust fan 30 may be disposed so as to discharge air between the test trays 2. With this configuration, the flow of air inside the de-soak chamber 1 becomes smooth, and eventually the temperature of the electronic components can be effectively recovered, and the temperature deviation between the electronic components can be minimized.

As described above, while embodiments of the present invention have been illustrated and described, it should be understood that various modifications, alterations, and substitutions to these embodiments will become apparent to those skilled in the art without departing from the scope of the present disclosure. Accordingly, the scope of the present invention should not be limited to the described embodiments, but should be defined by the appended claims and equivalents thereof.

Claims

1. A test handler, comprising:

a loading unit for loading electronic components;

a soak chamber for pre-cooling or pre-heating the loaded electronic parts so that the electronic parts have a set temperature for testing;

a test chamber for testing the pre-cooled or pre-heated electronic components;

a de-soak chamber for restoring a temperature of the electronic component subjected to the test to a predetermined level, the de-soak chamber including a flow path having a first inlet, an outlet, and a second inlet adjacent to the outlet, the flow path being formed inside one sidewall of the de-soak chamber;

a circulation unit for circulating air in the de-infusion chamber along the flow path; and

an unloading unit for unloading the electronic part having the temperature restored to a preset level,

wherein the circulation unit includes a connection member and an exhaust fan that enables air circulating in the flow path to be discharged into an internal space of the de-immersion chamber via the outlet, the exhaust fan being spaced apart from the outlet by a predetermined distance in a direction of the internal space of the de-immersion chamber,

wherein the second inlet includes a space between the outlet and the exhaust fan for introducing air around the outlet into the space,

wherein the exhaust fan comprises a main body, a wing part arranged in the main body,

wherein the body covers and holds closed one side of the wing, an

Wherein the connection member is disposed between a rear side of the main body of the exhaust fan and an inner side surface of the one sidewall of the de-soak chamber, and allows air to be introduced into the space between the outlet and the exhaust fan from outside a flow path of the de-soak chamber.

2. The test handler of claim 1, wherein the exhaust fan further comprises a fan cover in which only a central portion corresponding to the wing portion is kept open and an edge portion not corresponding to the wing portion is kept closed.

3. The test handler of claim 1, wherein the circulation unit includes a plurality of exhaust fans arranged adjacent to each other,

the test handler further includes:

a guide unit disposed in an inner portion of the flow path, the guide unit causing air circulating in the flow path to be discharged into the plurality of exhaust fans, respectively.

4. The test handler of claim 1, wherein the outlet is formed such that the air is discharged between a plurality of test trays positioned inside the de-soak chamber.

5. A test handler, comprising:

a loading unit for loading electronic components;

a test chamber for testing the pre-cooled or pre-heated electronic components;

wherein the circulation unit includes an exhaust fan that enables air circulating in the flow path to be discharged into the interior space of the de-infusion chamber via the outlet, and

wherein the second inlet is formed near the exhaust fan, the second inlet having a plurality of through holes communicating between the internal space of the de-soak chamber and the flow path.

6. The test handler of claim 5, wherein the circulation unit includes a plurality of exhaust fans arranged adjacent to each other,

the test handler further includes:

7. The test handler of claim 6, wherein the plurality of exhaust fans form a plurality of rows, and

the guide unit extends in a horizontal direction at a height corresponding to a lower end of the exhaust fan in one group constituting each of the plurality of rows to flow air in the horizontal direction to guide the air to each group of the exhaust fans,

a plurality of the guide units are disposed in each of the plurality of rows, wherein both ends of the guide units disposed at the lowermost row are in contact with an inner side surface of the flow path, and both ends of the guide units disposed at the remaining rows except the lowermost row are spaced apart from the inner side surface of the flow path by a predetermined distance.

8. The test handler of claim 5, wherein the outlet is formed such that the air is discharged between a plurality of test trays positioned inside the de-soak chamber.