CN108269749A - Liquid supplying unit, substrate board treatment and the method for removing bubble removing - Google Patents
Liquid supplying unit, substrate board treatment and the method for removing bubble removing Download PDFInfo
- Publication number
- CN108269749A CN108269749A CN201711469016.7A CN201711469016A CN108269749A CN 108269749 A CN108269749 A CN 108269749A CN 201711469016 A CN201711469016 A CN 201711469016A CN 108269749 A CN108269749 A CN 108269749A
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- Prior art keywords
- liquid
- space
- nozzle
- treatment
- collision
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/34—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/40—Mixing liquids with liquids; Emulsifying
- B01F23/45—Mixing liquids with liquids; Emulsifying using flow mixing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/80—After-treatment of the mixture
- B01F23/803—Venting, degassing or ventilating of gases, fumes or toxic vapours from the mixture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/10—Mixing by creating a vortex flow, e.g. by tangential introduction of flow components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
- B05B7/0408—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing two or more liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F2101/00—Mixing characterised by the nature of the mixed materials or by the application field
- B01F2101/58—Mixing semiconducting materials, e.g. during semiconductor or wafer manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/002—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being a degassed liquid
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Disclose the device and method for carrying out liquid handling to substrate.The substrate board treatment includes：Liquid supplying unit is configured to be blended with the first liquid and the treatment liquid of second liquid is supplied on base board unit, and wherein the liquid supplying unit includes：Nozzle is configured to discharge treatment liquid；First liquid is supplied to the nozzle by the first feed lines；And second liquid supply line, second liquid is supplied to the nozzle, and the nozzle includes：Main body has the blending space mixed for the first liquid and second liquid and the cushion space from blending space extension inside it；And collision component, it is located in cushion space and is configured to the flow velocity that reduction is supplied to the treatment liquid of cushion space.
Description
Technical field
The embodiment of inventive concepts described herein is related to the device and method for carrying out liquid handling to substrate, and
And more particularly relate to the device and method that bubble removing is removed from liquid.
Background technology
In order to manufacture semiconductor devices, pass through the various works such as photoetching, etching, ashing, ion implanting and thin film deposition
Sequence forms desired pattern on substrate.Over time, these processes can become various and complicated, and can generate dirt
Contaminate object and particle.Therefore, the cleaning process for cleaning substrate is performed before and after corresponding process.
In cleaning process, the mixed liquor for being mixed with different chemical product is usually supplied to substrate.Chemicals is being supplied to
It is mixed or is mixed in the inside of nozzle before nozzle.A large amount of bubble is generated during mixed chemical product.
As a result, substrate is supplied to containing bladdery mixed liquor.Bubble is when being supplied to substrate or being diffused into substrate
Rupture.The size of bubble is different, and when the bubbles burst, mixed liquor to all the winds splashes.The bubble attachment of splashing is in place
On device around the substrate, the device of surrounding polluted.
In addition, different from liquid, bubble can not be timely removed, and when bubble is stayed on substrate, technique can be caused to miss
Difference.
Invention content
The embodiment of present inventive concept provides produces for removing during two or more chemicals are mixed
The device and method of raw bubble.
Present inventive concept embodiment further provides for prevent the mixing liquid splashed in bubbles burst pollute base
The device and method of device around plate.
Inventive concept provides for the device and method to substrate progress liquid handling.The substrate board treatment packet
It includes：Substrate supporting unit is configured to supporting substrate；And liquid supplying unit, it is configured to be blended with the first liquid
The treatment liquid of body and second liquid is supplied on the substrate supported by substrate supporting unit, wherein the liquid supplying unit packet
It includes：Nozzle is configured to discharge treatment liquid；First feed lines are configured to the first liquid being supplied to this
Nozzle；And second liquid supply line, it is configured to second liquid is supplied to the nozzle, and the nozzle includes：It is main
Body has the blending space mixed for the first liquid and second liquid and the buffering sky from blending space extension inside it
Between；And collision component, it is located in cushion space and is configured to reduce the treatment liquid for being supplied to cushion space
Flow velocity.
Nozzle can also include partition board, which is configured to that blending space and cushion space are separated from each other and are had
First hole.When overlooking, collision component can be Chong Die with the first hole.Collision subject, the collision subject can be included by colliding component
It is configured to cushion space is divided into upper space and lower space and with open top receptacle shape, and be received
Treatment liquid in collision subject overflows and is supplied to lower space.The main body, which can also have from lower space, to be extended
And the discharge space including outlet side, nozzle can also include lower plate, which is configured to lower space is empty with discharge
Between be separated from each other and with lower opening, and when overlooking, lower opening can be positioned so that Chong Die with collision subject.Discharging space can
To be configured such that the width in the small region to its upper of the width of lower region thereof.
First liquid and second liquid can include generating the liquid of bubble when the first liquid and second liquid mixing.The
One liquid can include sulfuric acid, and second liquid can include hydrogen peroxide.
First hole can include multiple first holes, and partition board can also have the second hole, which can be located at partition board
In central area, and the first hole can be positioned so that around the second hole.The diameter in the first hole can be more than the diameter in the second hole.
The main body can also have：First passage, extends to blending space, and the first feed lines be connected to this first
Channel；Second channel extends to blending space, and second liquid supply line is connected to the second channel, first passage
Can at the position adjacent with the inner surface of mixing portion in face of in downward direction, and second channel can with mixing portion
The adjacent position of inner surface at set along the hand of spiral.
The another aspect conceived according to the present invention, a kind of liquid supplying unit is provided, supply is used for and is mixed with first
The treatment liquid of liquid and second liquid, the liquid supplying unit include：Nozzle is configured to discharge treatment liquid；First
Feed lines are configured to the first liquid being supplied to the nozzle；And second liquid supply line, it is configured to
Second liquid is supplied to the nozzle, and wherein the nozzle includes：Main body has inside it for the first liquid and second
The blending space of liquid mixing and the cushion space extended from blending space；And collision component, it is located in cushion space
And it is configured to reduce the flow velocity for the treatment liquid for being supplied to cushion space.
Nozzle can also include partition board, which is configured to that blending space and cushion space are separated from each other and are had
First hole, and when overlooking, collision component can be Chong Die with the first hole.Collision subject, the collision can be included by colliding component
Main body is configured to cushion space being divided into upper space and lower space and with open top receptacle shape, is received
Treatment liquid in collision subject can overflow and can be supplied to lower space.
First liquid can include sulfuric acid, and second liquid can include hydrogen peroxide.
The another aspect conceived according to the present invention, a kind of be used for from being wherein mixed with the first liquid and second liquid is provided
Treatment liquid in go the method for bubble removing, this method is included by mixing the first liquid in the blending space in nozzle is formed in
Body and second liquid are to form treatment liquid and by forcing treatment liquid with being located at the cushion space extended from blending space
In collision member impacts make a return journey bubble removing.The flow velocity for the treatment of liquid can be by being located between blending space and cushion space
Partition board increases, and can be in treatment liquid with reduce during collision member impacts.
Collision component can cause the flow path detour for the treatment of liquid so that treatment liquid stay in cushion space when
Between section increase.The collision component with open top receptacle shape can be included, and be accommodated in collision subject by colliding component
In treatment liquid can overflow.
First liquid can include sulfuric acid, and second liquid can include hydrogen peroxide.
Description of the drawings
By reference to being described below for the following drawings, above and other purpose and feature will become obvious, wherein, it removes
Non- to be otherwise noted, otherwise identical reference numeral represents identical component, and wherein in all each attached drawings：
Fig. 1 is the plan view for the base plate processing system for showing the first embodiment according to present inventive concept；
Fig. 2 is the sectional view for the substrate board treatment for showing Fig. 1；
Fig. 3 is the sectional view for the nozzle for showing Fig. 2；
Fig. 4 is the sectional block diagram along the vertical direction interception of the nozzle of Fig. 3；
Fig. 5 is the stereogram of the partition board and collision component that show Fig. 3；And
Fig. 6 is the view for showing to introduce direction along the first liquid and second liquid in the blending space of Fig. 4.
Specific embodiment
It can modify in a variety of manners to the embodiment of present inventive concept, and the range of present inventive concept should not
It is interpreted limiting for the embodiment conceived by the following description of the present invention.The embodiment for providing present inventive concept is used for
Present inventive concept is described more fully for those skilled in the art.Therefore, shape of the component in attached drawing etc. is exaggerated to emphasize
Clearer description.
To the embodiment of present inventive concept be described referring to figs. 1 to Fig. 6.
Fig. 1 is the plan view for the base plate processing system for showing the first embodiment according to present inventive concept.
With reference to figure 1, base plate processing system 1 has indexable module 10 and process handling module 20, and indexable module 10 includes more
A load port 120 and feeding frame 140.Load port 120, feeding frame 140 and process handling module 20 can cloth successively
It is set to row.Hereinafter, the direction that load port 120, feeding frame 140 and process handling module 20 are arranged is known as first direction
12, second direction 14 will be referred to as perpendicular to the direction of first direction 12 when overlooking, and with including first direction 12 and the
The direction that the plane in two directions 14 is vertical will be referred to as third direction 16.
The carrier 18 for wherein accommodating substrate W is placed on load port 120.Multiple load ports 120 are provided with, and
They embark on journey along the arrangement of second direction 14.Fig. 1 is shown provided with four load ports 120.However, the number of load port 120
Amount can be increased or decreased according to such as process efficiency of process handling module 20 or the situation of duty.It is formed in carrier 18
There are multiple slot (not shown) for being used to support substrate periphery.Third direction 16 is provided with multiple slots, substrate is located at carrier 18
In so that substrate is along the spaced stacking of turning up the soil of third direction 16.Front openings standard container (FOUP) is used as carrier
18。
Process handling module 20 includes buffer cell 220, feeder house 240 and multiple process chambers 260.Feeder house 240 disposes
Into causing its length direction parallel with first direction 12.Process chamber 260 is placed in the opposed of feeder house 240 along second direction 14
Side.Process chamber 260 is mutually symmetrical relative to feeder house 240.Some process chambers 260 are arranged along the length direction of feeder house 240.This
Outside, some process chambers 260 are arranged to be stacked with.That is, the process chamber with A × B (A be natural number with B) array
260 can be arranged in the opposite side of feeder house 240.Here, A is the process chamber set in along a first direction 12 a line
260 quantity and B is the quantity of process chamber 260 set in a line along third direction 16.When in feeder house 240
Opposite side set four or during six process chambers 260, process chamber 260 can be arranged to 2 × 2 arrays or 3 × 2 arrays.Place
The quantity of reason room 260 can increase or decrease.
Different from foregoing description, process chamber 260 can be provided only on the side of feeder house 240.In addition, process chamber 260 can
Individual layer is formed to be arranged on the side of feeder house 240 or opposite side.In addition, different from foregoing description, process chamber 260 can be by
Differently dispose.
Buffer cell 220 is placed between feeding frame 140 and feeder house 240.Buffer cell 220 is in 240 He of feeder house
The space stopped before by conveying for substrate W is provided between feeding frame 140.It is provided in buffer cell 220 to base
The slot (not shown) that plate W is positioned, multiple slots (not shown) are arranged spaced from each other along third direction 16.Buffer cell
220 in face of feeding frame 140 and buffer cell 220 in face of feeder house 240 while be unlimited.
Feed the conveying substrate W between the carrier 18 on load port 120 and buffer cell 220 of frame 140.Into
To being provided with indexable track 142 and position rotating mechanical hand 144 in frame 140.Indexable track 142 is arranged so that its longitudinal direction is put down
Row is in second direction 14.Position rotating mechanical hand 144 is mounted on indexable track 142, and along indexable track 142 in a second direction
14 are moved linearly by.Position rotating mechanical hand 144 has base portion 144a, main body 144b and multiple indexable arm 144c.Base portion 144a is pacified
It dresses up and is moved along indexable track 142.Main body 144b is connected to base portion 144a.Main body 144b is provided in base portion 144a upper edges
Third direction 16 to move.Main body 144b, which is provided on base portion 144a, to be rotated.Indexable arm 144c is connected to main body 144b, and
And it is configured to forwardly and rearwardly move relative to main body 144b.Multiple indexing arm 144c are configured to be driven respectively.Indexing
Arm 144c is positioned to along the spaced stacking of turning up the soil of third direction 16.When substrate W is transported to carrier from processing module 20
Using some indexable arm 144c when 18, when substrate W is transported to process handling module 20 from carrier 18, some turns can be used
Position arm 144c.The structure can be prevented during by position rotating mechanical hand 144, substrate W is set out before process
The particle generated from substrate W is attached to the substrate W after process.
The conveying substrate W between buffer cell 220 and process chamber 260 of feeder house 240.Guide rail 242 and master manipulator 244 are set
It puts in feeder house 240.Guide rail 242 is positioned to so that its length direction is parallel with first direction 12.Master manipulator 244 is pacified
On guide rail 242, and 12 linear movement along the first direction on indexable track 242.
Process chamber 260 can be provided on a substrate W and be sequentially performed process.It for example, can be in process chamber 260
In chemical process, rinsing process and drying process are carried out to substrate W.
Hereinafter, the substrate board treatment 300 being arranged in process chamber 260 will be described.Fig. 2 is the substrate for showing Fig. 1
The sectional view of processing unit.With reference to figure 2, substrate board treatment 300 includes process container 320, swivel head 340, lifting unit 360
With liquid supplying unit 380.Process container 320 has processing space, and the work of processing substrate W is performed inside the processing space
Skill.Process container 320 has open top cup-shaped.Process container 320 includes interior returnable 322 and outer returnable 326.
Returnable 322 and 326 recycles the different disposal liquid used in process.Interior returnable 322 is configured to have and surround
The annular shape of swivel head 340, and outer returnable 326 is configured to the annular shape around interior returnable 322.
Space between the inner space 322a of interior returnable 322 and outer returnable 326 and interior returnable 322 is used separately as
Entrance, treatment liquid are introduced in by the entrance in interior returnable 322 and outer returnable 326 respectively.Hold from recycling
Device 322 and 326 is connected respectively to returnable along vertically extending in downward direction the recovery line 322b and 326b of its bottom surface
322 and 326.Recovery line 322b and 326b discharge the treatment liquid introduced by returnable 322 and 326 respectively.It is discharged
Treatment liquid can be reused by external treatment liquid recovery system (not shown).
The substrate supporting unit 340 that swivel head 340 is configured to supporting substrate W and rotates substrate W.Swivel head 340
It is disposed in the processing space of process container 320.Swivel head 340 during process supporting substrate W and make substrate W rotate.
Swivel head 340 has main body 342, multiple supporting pins 344, multiple chuck pins 346 and support shaft 348.Main body 342 has when vertical view
When the upper surface with circular shape.The support shaft 348 that can be rotated by motor 349 is fixedly coupled to main body 342
Bottom.It is provided with multiple supporting pins 344.Supporting pin 344 can be arranged at the periphery of the upper surface of main body 342 to each other
It separates, and is projected upwards from main body 342.Supporting pin 334 is arranged to have generally annular in shape by a combination thereof.Supporting pin
The periphery of the rear surface of 344 supporting substrate W so that substrate W is spaced apart preset distance with the upper surface of main body 342.There is provided more
A chuck pin 346.Chuck pin 346 is arranged to than supporting pin 344 further from the center of main body 342.Chuck pin 346 is configured to
It is projected upwards from main body 342.The side of 346 supporting substrate W of chuck pin so that when swivel head 340 rotates, substrate W will not be from
Appropriate position is laterally detached from.Chuck pin 346 is arranged along the radial direction of main body 342 in spare space and Support Position
Between linear movement.Spare space is the position further from the center of main body 342 than Support Position.When substrate W is loaded onto rotation
In rotary head 340 or from swivel head 340 unload when, chuck pin 346 is located at spare space, and when performing process on substrate W
When, chuck pin 346 is located at Support Position.Side of the chuck pin 346 with substrate W at Support Position contacts.
Lifting unit 360 adjusts the relative altitude between container 320 and swivel head 340.Lifting unit 360 makes container 320
Linear movement up and down.When container 320 is made to move up and down, the relative altitude quilt of container 320 and swivel head 340
Change.Lifting unit 360 has stent 362, movable axis 364 and driver 366.Stent 362 is fixedly mounted in container 320
On outer wall, and the movable axis 364 moved up and down by driver 366 is fixedly coupled to stent 362.Process container
320 fall to so that when substrate W is located on swivel head 340 or is increased from swivel head 340, swivel head 340 protrudes everywhere
Manage the upside of container 320.When performing process, the height of container 320 is adjusted so that according to the treatment liquid for being supplied to substrate W
Type treatment liquid is introduced into preset returnable 360.
From it is described above those are different, lifting unit 360 can make swivel head 340 rather than process container 320 upward
With move down.
Treatment liquid is supplied on substrate W by liquid supplying unit 380.Multiple liquid supplying units 380 are provided with, and
Different types of liquid is supplied respectively.Each liquid supplying unit 380 includes drive member 381, nozzle 400, the first liquid and supplies
Answer pipeline and second liquid supply line.Nozzle 400 is moved to processing position and spare space by drive member 381.Here, place
Reason position is the position on the vertical top that nozzle 400 is positioned in process container 320, and spare space is that nozzle 400 holds from processing
The position that the vertical top of device 320 is deviateed.According to an example, processing position can be that nozzle 400 can supply liquid to
The position at the center of substrate W.Drive member 381 has arm 382, support shaft 386 and driver 388.Support shaft 386 is located at processing
The side of container 320.The length direction of support shaft 386 is set along third direction 16, and driver 388 is connected to support shaft
386 lower end.Driver 388 rotates and lifts support shaft 386.Support arm 382 is fixedly coupled to the upper of support shaft 386
End.Arm 382 has the longitudinal direction perpendicular to support shaft 386.
First feed lines 412 and second liquid supply line 414 are connected to nozzle 400.First liquid supply tube
Line 412 supplies the first liquid to nozzle 400, and second liquid supply line 414 supplies second liquid to nozzle 400.First liquid
It can be in the internal mix of nozzle 400 with second liquid.
Nozzle 400 can discharge treatment liquid.Nozzle 400 is mounted on the bottom surface of the end of arm 382.Nozzle 400 is logical
It crosses the rotation of support shaft 386 and is moved together with arm 382.For example, treatment liquid includes wherein being mixed with the first liquid and second
The mixing liquid of liquid.First liquid and second liquid can include generating bubble when the first liquid and second liquid mixing
Liquid.Any one of first liquid and second liquid include sulfuric acid, and another kind includes hydrogen peroxide.Selectively, first
Liquid has the property of strong acid, and second liquid has the property of highly basic.
Unlike this, it may be provided for the liquid supplying unit of supply rinse liquid and drying fluid.Rinse liquid
It is pure water, drying fluid is isopropanol (IPA).
Next, nozzle 400 will be described in further detail.
Fig. 3 is the sectional view for the nozzle 400 for showing Fig. 2.Fig. 4 is cutd open along what the vertical direction of the nozzle 400 of Fig. 3 intercepted
Face stereogram.With reference to figure 3 and Fig. 4, nozzle 400 includes main body 405, partition board 450, collision component 470 and lower plate 490.Nozzle 400
With introducing portion 420, mixing portion 440, buffer portion 460 and discharge part 480.Introducing portion 420, mixing portion
440th, buffer portion 460 and discharge part 480 dispose successively along direction from the upper side to the lower side.Introducing portion 420, mixing
Part 440, buffer portion 460 and discharge part 480 are arranged in the space being connected to each other.
First feed lines 412 and second liquid supply line 414 are connected to introducing portion 420.First passage 422
It is formed in introducing portion 420 with second channel 424.First passage 422 is used as the channel flowed through for first passage liquid, and second
Channel 424 is used as the channel flowed through for second liquid.First feed lines 412 are connected to first passage 422, second liquid
Supply line 414 is connected to second channel 424.First liquid and second liquid are supplied to mixed by introduction passage 422 and 424
Close part 440.According to one embodiment, first passage 422 can downwards, and second channel 424 can be towards spiral side
To.Second channel 424 can extend to inner surface from the outer surface of nozzle 400.The lower end of first passage 422 and second channel
424 lower end can be located near the inner surface of mixing portion 440.Therefore, when the first liquid can be by towards perpendicular to mixing unit
Points 440 in downward direction for seasonable, second liquid can be supplied along the hand of spiral relative to mixing portion 440.First liquid
Body and second liquid can form vortex while being flowed along the hand of spiral.
Mixing portion 440 has blending space 442 inside it.Blending space 442 is used as the first liquid and second liquid
The space of mixing.Blending space 442 is extended downwardly from one end of one end of first passage 422 and second channel 424.Mixing portion
440 inner surface is with annular shape.
Partition board 450 is between mixing portion 440 and buffer portion 460.Partition board 450 is by mixing portion 440 and buffer part
460 are divided to be separated from each other.Partition board 450 has the plate shape for including the first hole 452 and the second hole 454.For example, partition board 450 can have
Plate-like.The diameter of partition board 450 is less than the diameter of mixing portion 440.First hole 452 and the second hole 454 can be from partition board 450
Upper end extends to the hole of lower end.First hole 452 is located at the neighboring area of partition board 450, and the second hole 454 is located at the center of partition board 450
Region.Multiple first holes 452 are provided with, and multiple first holes 452 are arranged around the periphery in the second hole 454.For example, the first hole
452 can be bonded to each other to be arranged to annular shape.First hole 452 can be arranged to be separated from each other with identical interval.
The diameter in the first hole 452 is more than the diameter in the second hole 454.First hole 452 is used as treatment liquid being supplied to from mixing portion 440
The channel of buffer portion 460.The flow velocity for the treatment of liquid can be by increasing during first hole.Second hole 454 be used as
The hole of flow stream is formed at the central axis of blending space 442.The gas generated in cushion space 462 can be by second
Hole 454 is discharged to blending space.
The cushion space 462 extended downwardly from blending space 442 is formed in buffer portion 460.Treatment liquid can be temporary
It rests in cushion space 462.
Collision component 470 is located in cushion space 462.Component 470 is collided so that the flow path detour for the treatment of liquid.For
The treatment liquid and collision component 470 that cushion space 462 should be arrived are collided.It collides component 470 and includes collision subject 472 and annular slab
474.Fig. 5 is the stereogram of the partition board and collision component that show Fig. 3.With reference to figure 3 to Fig. 5, cushion space 462 is by collision component
472 are divided into upper space 462a and lower space 462b.Collision subject 472 has open top receptacle shape.That is, it touches
Hitting the inner space of main body 472 can be arranged in region included in upper space 462a.Collision subject 472 is oriented
In face of the first hole 452.That is, collision subject 472 is oriented the supply path of blocking treatment liquid.Therefore, pass through partition board 450
Treatment liquid is accommodated in collision subject 472.It the treatment liquid overflow that is accommodated in collision subject 472 and is supplied to
Lower space 462b.For example, collision subject 472 can be provided without the baffle in hole.
Annular slab 474 has the annular shape for surrounding collision subject 472.Annular slab 474 is located at the upper end of collision subject 472
At residing height.Multiple looping pits 476 are formed in annular slab 474.Looping pit 476 along annular slab 474 circumferentially.
The treatment fluid overflowed from collision subject 472 is supplied to lower space 462b by looping pit 476.For example, looping pit 476 can have
There is circular shape.Different from this, looping pit 476 can have shape of slit.
Selectively, collision component 470 can only include collision subject 472.The upper end of collision subject 472 can be connected to
The bottom surface of partition board 450.In this case, looping pit 476 can be formed on the side surface of collision subject 472.
Discharge part 480 has the discharge space 482 connected with outlet side inside it.Discharge space 482 has
Width space more smaller than the width of lower space 462b.Lower space 462b and discharge space 482 are separated by lower plate 490.
Multiple lower opening 492 are formed in lower plate 490.Treatment liquid is supplied to discharge space by lower opening 492 from lower space 462b
482.When overlooking, lower plate 490 is be overlapped with partition board 450 and collision subject 472.According to one embodiment, the diameter of lower plate 490
The diameter of partition board 450 and collision subject 472 can be less than.Discharge space 482 can be set such that the width of lower region thereof
Spend the width in small region to its upper.Therefore, bubble included in treatment liquid can be empty from discharge while being supplied
Between remove in 482.
According to the above embodiment, the first liquid and second liquid are mixed when being moved along the hand of spiral, so as to mix
Vortex is formed in part 440.This is because the flow path of second liquid can be formed such as from the second hole 454 of partition board 450
The flow stream of vortex, while towards the hand of spiral as shown in Figure 6.Therefore, the first liquid of mixing and the second liquid can be improved
The speed of body.
In addition, partition board 450 supplies flow velocity increased treatment liquid to collision subject 472.When treatment liquid and collision are led
When body 472 collides, bubbles burst, and the bubble generated in treatment liquid can be tentatively removed.
In addition, the treatment liquid being accommodated in collision subject 472 overflows and is moved to lower space 462b, and with
Form the bottom surface collision of lower space 462b.Then, in treatment liquid and the bottom surface collision for forming lower space 462b
Bubbles burst simultaneously, and secondary can remove the bubble generated in treatment liquid.
In addition, even if when bubble is not completely removed from the main body 405 of nozzle 400, can also remove with relatively
Large-sized bubble.Therefore, bubble with a smaller size is supplied on substrate, but will not be splashed to when the bubbles burst
On the device of surrounding.
The treatment liquid overflow that is accommodated in collision subject 472 and it is moved to lower space 462b.Treatment liquid is temporary
When rest in collision subject 472, and be supplied to the treatment liquid for answering buffer portion 460 flow velocity and be supplied to mixing portion
The flow velocity of 440 treatment liquid is compared to reduction.This provides the time for that can remove bubble removing before treatment liquid is discharged
Section.
In addition, treatment liquid is supplied to discharge space 482 when by lower plate 490 from lower space 462b.Lower plate 490
It is less than the diameter of lower space 462b with the diameter in discharge space 482.Therefore, when treatment liquid is by lower plate 490, treatment fluid
The flow velocity of body increases, and the flow for the treatment liquid discharged can be adjusted to process flow rate.
According to the embodiment of present inventive concept, wherein the treatment liquid in producing the nozzle of bubble is touched with collision component
It hits and temporal persistence.Therefore, the bubbles burst when treatment liquid is collided, and may insure in treatment liquid temporal persistence
For going the period of bubble removing.
In addition, according to the embodiment of present inventive concept, when treatment liquid passes through partition board, treatment liquid and collision component
Collision, while flow velocity increases.Therefore, bubble included in treatment fluid can be removed.
In addition, according to the embodiment of present inventive concept, mixed due to eliminating the first liquid and second liquid in nozzle
The bubble generated during conjunction, it is possible to the treatment liquid for eliminating bubble is supplied on substrate, therefore can prevent bubble from existing
The device of surrounding is ruptured and polluted on substrate.
In addition, according to the embodiment of present inventive concept, partition board has the second hole in central area.First liquid and
Two liquid by the flow stream in the second hole in mixing due to forming vortex, and can shorten the first liquid of mixing and the
The period that two liquid are consumed.
Present inventive concept has been illustrated in above description.In addition, the exemplary reality above describe present inventive concept
Mode is applied, and present inventive concept can use under various other combinations, variation and environment.That is, present inventive concept
It can be in the range for not departing from present inventive concept disclosed in the description, the range being equal with written disclosure content and/or sheet
It is modified and corrects in the case of the technology or knowledge of field technology personnel.Written embodiment describes implementation originally
The optimum state of the technical spirit of inventive concept, concrete application field and the purpose that can make present inventive concept are required each
Kind variation.Therefore, the detailed description of present inventive concept is not intended to for present inventive concept to be limited in disclosed embodiment shape
In state.Also, it is understood that appended claims include other embodiment.
Claims (20)
1. a kind of substrate board treatment, including：
Substrate supporting unit is configured to supporting substrate；With
Liquid supplying unit is configured to the treatment liquid for being wherein mixed with the first liquid and second liquid being supplied to by institute
On the substrate for stating substrate supporting unit support,
Wherein described liquid supplying unit includes：
Nozzle is configured to discharge the treatment liquid；
First feed lines are configured to first liquid being supplied to the nozzle；And
Second liquid supply line is configured to the second liquid being supplied to the nozzle,
Wherein described nozzle includes：
Main body has the blending space that mixes for first liquid and the second liquid and from the mixing inside it
Spatially extended cushion space；With
Component is collided, be located in the cushion space and is configured to reduce the place for being supplied to the cushion space
Manage the flow velocity of liquid.
2. substrate board treatment according to claim 1, wherein, the nozzle further includes：
Partition board is configured to the blending space and the cushion space being separated from each other and with the first hole.
3. substrate board treatment according to claim 2, wherein, when overlooking, the collision component and first hole
Overlapping.
4. substrate board treatment according to claim 3, wherein, the collision component includes：
Collision subject is configured to the cushion space being divided into upper space and lower space and with open top
Container shapes,
The treatment liquid being wherein accommodated in the collision subject overflows and is supplied to the lower space.
5. substrate board treatment according to claim 4, wherein, the main body also have from down space extension and
Discharge space including outlet side,
Wherein described nozzle further includes：
Lower plate is configured to the lower space and the discharge space being separated from each other and with lower opening；And
Wherein when overlooking, the lower opening is oriented Chong Die with the collision subject.
6. substrate board treatment according to claim 5, wherein, the discharge space is configured such that lower region thereof
The small region to its upper of width width.
7. the substrate board treatment according to any one of claim 2 to 6, wherein, first liquid and described second
Liquid is included in the liquid that bubble is generated when first liquid and second liquid mixing.
8. substrate board treatment according to claim 7, wherein, first liquid includes sulfuric acid, and
Wherein described second liquid includes hydrogen peroxide.
9. substrate board treatment according to claim 7, wherein, first hole includes multiple first holes,
Wherein described partition board also has the second hole,
Wherein described second hole is located in the central area of the partition board,
Wherein described first hole is positioned about second hole.
10. substrate board treatment according to claim 9, wherein, the diameter in first hole is more than second hole
Diameter.
11. substrate board treatment according to claim 10, wherein, also there is the main body first passage and second to lead to
Road, the first passage extends to the blending space and the first feed lines are connected to the first passage, described
Second channel extends to the blending space and second liquid supply line is connected to the second channel,
Wherein described first passage faces downwardly direction at the position adjacent with the inner surface of the blending space, and
Wherein described second channel is set at the position adjacent with the inner surface of the blending space along the hand of spiral.
12. a kind of liquid supplying unit for the treatment liquid that the first liquid and second liquid are mixed with for supply, the liquid
Supply unit includes：
Nozzle is configured to discharge the treatment liquid；
First feed lines are configured to first liquid being supplied to the nozzle；And
Second liquid supply line is configured to the second liquid being supplied to the nozzle,
Wherein described nozzle includes：
Main body has the blending space that mixes for first liquid and the second liquid and from the mixing inside it
Spatially extended cushion space；With
Component is collided, be located in the cushion space and is configured to reduce the place for being supplied to the cushion space
Manage the flow velocity of liquid.
13. liquid supplying unit according to claim 12, wherein, the nozzle further includes：
Partition board is configured to the blending space and the cushion space being separated from each other and with the first hole, and
Wherein when overlooking, the collision component is Chong Die with first hole.
14. liquid supplying unit according to claim 13, wherein, the collision component includes：
Collision subject is configured to the cushion space being divided into upper space and lower space and with open top
Container shapes,
The treatment liquid being wherein accommodated in the collision subject overflows and is supplied to the lower space.
15. the liquid supplying unit according to any one of claim 12 to 14, wherein, first liquid includes sulphur
Acid, and
Wherein described second liquid includes hydrogen peroxide.
16. a kind of method for removing bubble removing from the treatment liquid for being wherein mixed with the first liquid and second liquid, described
Method includes：
The place is formed by mixing first liquid and the second liquid in the blending space in nozzle is formed in
Manage liquid；And
By force the treatment liquid with positioned at from the collision member impacts in the cushion space that the blending space extends come
Remove bubble removing.
17. the method according to claim 11, wherein, by being located between the blending space and the cushion space
Partition board increases the flow velocity of the treatment liquid, and in the treatment liquid with reducing the place during collision member impacts
Manage the flow velocity of liquid.
18. according to the method for claim 17, wherein, the collision component so that the flow path of the treatment liquid is circuitous
It returns so that the period that the treatment liquid is stayed in the cushion space increases.
19. according to the method for claim 18, wherein, the collision component includes touching with open top receptacle shape
Component is hit, and
The treatment liquid being wherein accommodated in the collision subject is overflowed.
20. the method according to any one of claim 16 to 19, wherein, first liquid includes sulfuric acid, and
Wherein described second liquid includes hydrogen peroxide.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0184378 | 2016-12-30 | ||
| KR20160184378 | 2016-12-30 | ||
| KR1020170053272A KR101979606B1 (en) | 2016-12-30 | 2017-04-26 | Unit for supplying chemical, Apparatus for treating substrate, and Method for removal bubble |
| KR10-2017-0053272 | 2017-04-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108269749A true CN108269749A (en) | 2018-07-10 |
| CN108269749B CN108269749B (en) | 2021-12-24 |
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ID=62708343
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711469016.7A Active CN108269749B (en) | 2016-12-30 | 2017-12-29 | Liquid supply unit, substrate processing apparatus and method of removing bubbles |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10758875B2 (en) |
| CN (1) | CN108269749B (en) |
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| CN110858557A (en) * | 2018-08-23 | 2020-03-03 | 细美事有限公司 | Buffer unit, and apparatus and method for processing substrate using the same |
| CN112242327A (en) * | 2019-07-18 | 2021-01-19 | 细美事有限公司 | Cooling unit and substrate processing apparatus including the same |
| CN112750727A (en) * | 2019-10-31 | 2021-05-04 | 细美事有限公司 | Apparatus for processing substrate |
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| US20210035821A1 (en) * | 2018-01-23 | 2021-02-04 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning substrates |
| TWI835822B (en) * | 2019-07-19 | 2024-03-21 | 大陸商盛美半導體設備（上海）股份有限公司 | Methods and apparatus for cleaning substrates |
| JP7459628B2 (en) | 2020-04-03 | 2024-04-02 | 東京エレクトロン株式会社 | Operating method of liquid processing equipment and liquid processing equipment |
| GB202016750D0 (en) * | 2020-10-22 | 2020-12-09 | Lam Res Ag | Apparatus for processing a wafer-shaped article |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108269749B (en) | 2021-12-24 |
| US20180185795A1 (en) | 2018-07-05 |
| US10758875B2 (en) | 2020-09-01 |
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