CN108264733A - External decoration moulding solvent-free epoxy resin composition and external decoration formative method - Google Patents
External decoration moulding solvent-free epoxy resin composition and external decoration formative method Download PDFInfo
- Publication number
- CN108264733A CN108264733A CN201711437729.5A CN201711437729A CN108264733A CN 108264733 A CN108264733 A CN 108264733A CN 201711437729 A CN201711437729 A CN 201711437729A CN 108264733 A CN108264733 A CN 108264733A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- component
- external decoration
- moulding
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/40—Plastics, e.g. foam or rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711437729.5A CN108264733A (en) | 2017-12-26 | 2017-12-26 | External decoration moulding solvent-free epoxy resin composition and external decoration formative method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711437729.5A CN108264733A (en) | 2017-12-26 | 2017-12-26 | External decoration moulding solvent-free epoxy resin composition and external decoration formative method |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108264733A true CN108264733A (en) | 2018-07-10 |
Family
ID=62772651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711437729.5A Pending CN108264733A (en) | 2017-12-26 | 2017-12-26 | External decoration moulding solvent-free epoxy resin composition and external decoration formative method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108264733A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111138807A (en) * | 2019-12-27 | 2020-05-12 | 北京纽维逊建筑工程技术有限公司 | Epoxy resin mud for hand-carved model and preparation method thereof |
CN112280361A (en) * | 2020-11-26 | 2021-01-29 | 湖南固特邦土木技术发展有限公司 | Solvent-free spraying type epoxy putty |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105017719A (en) * | 2014-04-16 | 2015-11-04 | 中冶建筑研究总院有限公司 | Flame retardant engravable epoxy resin mortar and preparation method thereof |
CN205905276U (en) * | 2016-06-29 | 2017-01-25 | 程乐军 | A mould for preparing false hillstone |
-
2017
- 2017-12-26 CN CN201711437729.5A patent/CN108264733A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105017719A (en) * | 2014-04-16 | 2015-11-04 | 中冶建筑研究总院有限公司 | Flame retardant engravable epoxy resin mortar and preparation method thereof |
CN205905276U (en) * | 2016-06-29 | 2017-01-25 | 程乐军 | A mould for preparing false hillstone |
Non-Patent Citations (4)
Title |
---|
唐传林等: "《绝缘材料工艺原理》", 31 May 1993, 机械工业出版社 * |
夏文干等编著: "《胶接手册》", 28 February 1989, 国防工业出版社 * |
梁国正等主编: "《模压成型技术》", 30 June 1999 * |
王德中主编: "《环氧树脂生产与应用》", 30 June 2001, 化学工业出版社 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111138807A (en) * | 2019-12-27 | 2020-05-12 | 北京纽维逊建筑工程技术有限公司 | Epoxy resin mud for hand-carved model and preparation method thereof |
CN112280361A (en) * | 2020-11-26 | 2021-01-29 | 湖南固特邦土木技术发展有限公司 | Solvent-free spraying type epoxy putty |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhang Jian Inventor after: Zhao Xijuan Inventor after: Yu Qinping Inventor after: Wang Wei Inventor after: Deng Kuan Inventor after: Zhang Teng Inventor after: Wang Mankai Inventor after: Wen Fengnian Inventor after: Yu Dadi Inventor after: Zheng Qi Inventor before: Yu Qinping Inventor before: Wang Wei Inventor before: Deng Kuan Inventor before: Zhang Teng Inventor before: Wang Mankai Inventor before: Wen Fengnian Inventor before: Yu Dadi Inventor before: Zheng Qi Inventor before: Zhao Xijuan |
|
CB03 | Change of inventor or designer information | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180710 |
|
RJ01 | Rejection of invention patent application after publication |