CN108256441B - 指纹辨识装置、移动装置以及指纹辨识装置的制造方法 - Google Patents
指纹辨识装置、移动装置以及指纹辨识装置的制造方法 Download PDFInfo
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- CN108256441B CN108256441B CN201711455610.0A CN201711455610A CN108256441B CN 108256441 B CN108256441 B CN 108256441B CN 201711455610 A CN201711455610 A CN 201711455610A CN 108256441 B CN108256441 B CN 108256441B
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Classifications
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14698—Post-treatment for the devices, e.g. annealing, impurity-gettering, shor-circuit elimination, recrystallisation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662439674P | 2016-12-28 | 2016-12-28 | |
US62/439,674 | 2016-12-28 |
Publications (2)
Publication Number | Publication Date |
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CN108256441A CN108256441A (zh) | 2018-07-06 |
CN108256441B true CN108256441B (zh) | 2021-03-30 |
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Application Number | Title | Priority Date | Filing Date |
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CN201711455610.0A Active CN108256441B (zh) | 2016-12-28 | 2017-12-28 | 指纹辨识装置、移动装置以及指纹辨识装置的制造方法 |
Country Status (3)
Country | Link |
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US (1) | US10445551B2 (zh) |
CN (1) | CN108256441B (zh) |
TW (1) | TWI672779B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI649856B (zh) * | 2016-05-13 | 2019-02-01 | 精材科技股份有限公司 | 晶片封裝體與其製造方法 |
US10949642B2 (en) * | 2017-11-24 | 2021-03-16 | Integrated Biometrics, Llc | Method for capture of a fingerprint using an electro-optical material |
EP3739508B1 (en) * | 2019-03-21 | 2022-02-16 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint identification apparatus and electronic device |
CN110290241B (zh) * | 2019-06-24 | 2021-03-02 | Oppo广东移动通信有限公司 | 显示装置、电子设备及图像获取方法 |
Citations (3)
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JP2009042870A (ja) * | 2007-08-07 | 2009-02-26 | Hitachi Ltd | 生体認証装置及び情報端末 |
CN104102924A (zh) * | 2014-07-23 | 2014-10-15 | 上海思立微电子科技有限公司 | 具有模压保护层的指纹识别器件及指纹识别组件 |
CN205427873U (zh) * | 2015-09-16 | 2016-08-03 | 茂丞科技股份有限公司 | 指纹感测单元及指纹感测模块 |
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JP2003282791A (ja) * | 2002-03-20 | 2003-10-03 | Fujitsu Ltd | 接触型センサ内蔵半導体装置及びその製造方法 |
US7109574B2 (en) * | 2002-07-26 | 2006-09-19 | Stmicroelectronics, Inc. | Integrated circuit package with exposed die surfaces and auxiliary attachment |
WO2004093005A1 (ja) * | 2003-04-15 | 2004-10-28 | Fujitsu Limited | 情報処理装置 |
JP2004325288A (ja) * | 2003-04-25 | 2004-11-18 | Matsushita Electric Ind Co Ltd | 凹凸パターン検出装置、その製造方法、凹凸パターン検出方法および携帯機器 |
JP2008006146A (ja) * | 2006-06-30 | 2008-01-17 | Oki Electric Ind Co Ltd | 指紋認証方法とその装置 |
US8018065B2 (en) * | 2008-02-28 | 2011-09-13 | Atmel Corporation | Wafer-level integrated circuit package with top and bottom side electrical connections |
US8116540B2 (en) * | 2008-04-04 | 2012-02-14 | Validity Sensors, Inc. | Apparatus and method for reducing noise in fingerprint sensing circuits |
KR100952921B1 (ko) * | 2009-10-20 | 2010-04-16 | 정형준 | 지문 인식 장치 |
TWI508273B (zh) * | 2010-03-19 | 2015-11-11 | Xintec Inc | 影像感測元件封裝構件及其製作方法 |
TWI495113B (zh) * | 2010-03-22 | 2015-08-01 | Xintec Inc | 具有改良防焊堰體結構之封裝用光學蓋板、影像感測件封裝體及其製作方法 |
US9030440B2 (en) * | 2012-05-18 | 2015-05-12 | Apple Inc. | Capacitive sensor packaging |
TWI536272B (zh) * | 2012-09-27 | 2016-06-01 | 光環科技股份有限公司 | 生物辨識裝置及方法 |
US9651513B2 (en) * | 2012-10-14 | 2017-05-16 | Synaptics Incorporated | Fingerprint sensor and button combinations and methods of making same |
TWI536528B (zh) * | 2013-06-17 | 2016-06-01 | 茂丞科技股份有限公司 | 超薄型全平面式感測裝置 |
US9984270B2 (en) * | 2013-08-05 | 2018-05-29 | Apple Inc. | Fingerprint sensor in an electronic device |
TWI515829B (zh) * | 2013-08-30 | 2016-01-01 | 南茂科技股份有限公司 | 一種晶圓級之封裝方法及封裝結構 |
US9165793B1 (en) * | 2014-05-02 | 2015-10-20 | Invensas Corporation | Making electrical components in handle wafers of integrated circuit packages |
TW201543641A (zh) * | 2014-05-12 | 2015-11-16 | Xintex Inc | 晶片封裝體及其製造方法 |
TWI582918B (zh) * | 2014-11-12 | 2017-05-11 | 精材科技股份有限公司 | 晶片封裝體及其製造方法 |
CN105845639B (zh) * | 2015-01-16 | 2019-03-19 | 恒劲科技股份有限公司 | 电子封装结构及导电结构 |
TW201640418A (zh) * | 2015-05-04 | 2016-11-16 | 曦威科技股份有限公司 | 指紋檢測裝置、使用其之行動裝置以及其製造方法 |
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2017
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- 2017-12-26 US US15/854,421 patent/US10445551B2/en active Active
- 2017-12-28 CN CN201711455610.0A patent/CN108256441B/zh active Active
Patent Citations (3)
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JP2009042870A (ja) * | 2007-08-07 | 2009-02-26 | Hitachi Ltd | 生体認証装置及び情報端末 |
CN104102924A (zh) * | 2014-07-23 | 2014-10-15 | 上海思立微电子科技有限公司 | 具有模压保护层的指纹识别器件及指纹识别组件 |
CN205427873U (zh) * | 2015-09-16 | 2016-08-03 | 茂丞科技股份有限公司 | 指纹感测单元及指纹感测模块 |
Non-Patent Citations (2)
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Also Published As
Publication number | Publication date |
---|---|
CN108256441A (zh) | 2018-07-06 |
US20180181788A1 (en) | 2018-06-28 |
TW201824478A (zh) | 2018-07-01 |
US10445551B2 (en) | 2019-10-15 |
TWI672779B (zh) | 2019-09-21 |
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