CN108249385A - A kind of MEMS package weld assembly - Google Patents
A kind of MEMS package weld assembly Download PDFInfo
- Publication number
- CN108249385A CN108249385A CN201810035507.9A CN201810035507A CN108249385A CN 108249385 A CN108249385 A CN 108249385A CN 201810035507 A CN201810035507 A CN 201810035507A CN 108249385 A CN108249385 A CN 108249385A
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- CN
- China
- Prior art keywords
- edge part
- mems package
- capping
- solder
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
Abstract
This application discloses a kind of MEMS package weld assemblies, pedestal including accommodating chip, the pedestal has the edge part higher than other positions, capping is used to support at the top of the edge part, any one in the edge part and the capping has groove in the region of the two contact, and the solder for welding the capping and the edge part after melting is filled in the groove.Above-mentioned MEMS package weld assembly can increase weld strength under the premise of device miniaturization is ensured, meet the application scenario of high-magnitude vibration, and can improve production efficiency.
Description
Technical field
The invention belongs to micro-electromechanical system field, more particularly to a kind of MEMS package weld assembly.
Background technology
MEMS, that is, Mirco-Electro-Mechanical-Systems, that is, MEMS, at present using solder
In the packing forms of welding, generally using pedestal, solder and the structure of capping, wherein pedestal and capping is planar structure, therefore
Seal mouth ring has planar structure, and what solder used is also laminated structure, and heating makes solder fusing, realizes that connection pedestal and capping are real
The purpose now encapsulated.However, the structure is after welding has been completed, welding region is limited, although the basic demand of encapsulation can be realized,
Weld strength is inadequate, can not meet the requirement of high-magnitude impact application, the application scenario vibrated such as high-magnitude.To solve above-mentioned ask
Topic, a kind of existing scheme be increase seal mouth ring width, but at present MEMS package development trend be miniaturization and it is integrated,
The width increase of seal mouth ring will certainly increase the area of device entirety, therefore the program and improper.
Invention content
To solve the above problems, the present invention provides a kind of MEMS package weld assembly, it can ensure device miniaturization
Under the premise of increase weld strength, meet the application scenario of high-magnitude vibration, and production efficiency can be improved.
A kind of MEMS package weld assembly provided by the invention, the pedestal including accommodating chip, the pedestal have height
Edge part in other positions, is used to support capping at the top of the edge part, any in the edge part and the capping
It is a that there is groove in the region of the two contact, it is filled with to weld the capping and the edge part after melting in the groove
Solder.
Preferably, in above-mentioned MEMS package weld assembly, the edge part and the capping are in the area of the two contact
Domain has groove.
Preferably, in above-mentioned MEMS package weld assembly, the cross section of the groove is semicircle.
Preferably, in above-mentioned MEMS package weld assembly, the cross section of the solder is circle.
Preferably, in above-mentioned MEMS package weld assembly, the solder is metal eutectic solder.
Preferably, in above-mentioned MEMS package weld assembly, the cross-sectional diameter of the solder is transversal with the groove
Face diameter is identical.
By foregoing description it is found that above-mentioned MEMS package weld assembly provided by the invention, due to including accommodating chip
Pedestal, the pedestal has the edge part higher than other positions, is used to support capping, the edge at the top of the edge part
Any one in portion and the capping has groove in the region of the two contact, is filled with to weld after melting in the groove
The capping and the solder of the edge part can improve the solder after melting and capping and the contact area of edge part in this way,
Therefore it can increase weld strength under the premise of device miniaturization is ensured, meet the application scenario of high-magnitude vibration, and more
Positioning when being put into convenient for solder can improve production efficiency.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention, for those of ordinary skill in the art, without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the schematic diagram of the first MEMS package weld assembly provided by the embodiments of the present application.
Specific embodiment
The present invention core concept be to provide a kind of MEMS package weld assembly, can be before device miniaturization be ensured
Increase weld strength is put, meets the application scenario of high-magnitude vibration, and production efficiency can be improved.
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment shall fall within the protection scope of the present invention.
As shown in FIG. 1, FIG. 1 is the embodiment of the present application to carry for the first MEMS package weld assembly provided by the embodiments of the present application
The schematic diagram of the first the MEMS package weld assembly supplied, the component include the pedestal 2 for accommodating chip 1, and the pedestal 2 has
Higher than the edge part 3 at other positions, the top of the edge part 3 is used to support capping 4, that is to say, that only described on pedestal 2
Edge part 3 can be in contact with the support capping 4, and other positions will not contact, in the edge part 3 and the capping 4
Any one has groove 5 in the region of the two contact, is filled with to weld the capping 4 and institute after melting in the groove 5
State the solder 6 of edge part 3.
It should be noted that just because of there is provided grooves 5, it can just increase connecing for the solder between edge part 3 and capping 4
Contacting surface is accumulated, although illustrating two grooves in Fig. 1, sets at least one groove that can realize increase in the present embodiment
The purpose of contact area, that is to say, that both can one groove be set in the top surface of edge part 3, it can also be in the bottom surface of capping 4
The position contacted with edge part 3 sets a groove, naturally it is also possible to above-mentioned two groove is set while as shown in Figure 1, this
Sample contact area meeting bigger preferably enhances the effect of weld strength, and the groove used here can have arbitrary shape
Shape is also not intended to limit the quantity of groove, can be all adjusted according to actual demand.
By foregoing description it is found that the first MEMS package weld assembly provided by the embodiments of the present application, due to including holding
Receive the pedestal for having chip, the pedestal has the edge part higher than other positions, and capping is used to support at the top of the edge part,
Any one in the edge part and the capping has groove in the region of the two contact, is filled with to melt in the groove
The solder of the capping and the edge part is welded after melting, the solder after melting in this way can be improved and cover and edge part connects
Contacting surface is accumulated, therefore can increase weld strength under the premise of device miniaturization is ensured, meets the application scenario of high-magnitude vibration,
And positioning when solder is put into is easily facilitated, production efficiency can be improved.
Second of MEMS package weld assembly provided by the embodiments of the present application is in the first above-mentioned MEMS package welding group
On the basis of part, following technical characteristic is further included：
The edge part and the capping have groove in the region of the two contact.
This preferred embodiment as shown in Figure 1, edge part and capping on corresponding region be both provided with groove, exist in this way
Solder can be accommodated in edge part and capping, it is equal with the contact area between edge part and capping after solder, which heats, to be melted
It can be increased, so as to make combination therebetween more secured, on the other hand, also be more favorable for solder in this way and be put into
Positioning in the process, working efficiency higher.
The third MEMS package weld assembly provided by the embodiments of the present application is in above-mentioned second of MEMS package welding group
On the basis of part, following technical characteristic is further included：
The cross section of the groove is semicircle.
In this case, the shape of groove can be surround a circle cylindric, easily facilitate being put into for solder, and
After this shape causes follow-up solder solidification, strain resistant ability is most strong, can more effectively improve anti shock and vibration ability, certainly this
Only it is a kind of preferred embodiment, it is not excluded that cross section is rectangle or the schemes such as triangle, trapezoidal, is not construed as limiting herein.
4th kind of MEMS package weld assembly provided by the embodiments of the present application is in the third above-mentioned MEMS package welding group
On the basis of part, following technical characteristic is further included：
The cross section of the solder is circle.
In this case, the shape of solder and the shape of groove match, and energy will be recessed after preferably ensureing melt solder
Slot area filling is full, seamless and empty, so as to ensure that fixed effect is more preferable, but is not intended to limit the specific size of solder herein.
5th kind of MEMS package weld assembly provided by the embodiments of the present application, be it is above-mentioned the first seal to the 4th kind of MEMS
In welding equipment connected components it is any on the basis of, further include following technical characteristic：
The solder is metal eutectic solder.
This is a kind of more common solder being easily obtained, and cost is relatively low, and fixed effect is preferable.
6th kind of MEMS package weld assembly provided by the embodiments of the present application is in above-mentioned 4th kind of MEMS package welding group
On the basis of part, following technical characteristic is further included：
The cross-sectional diameter of the solder is identical with the cross-sectional diameter of the groove.
In this scheme, solder can be placed in tune in groove, will not generate waste, can also fill up groove, into
Optimization and the high efficiency of fixed operation are realized on the basis of this saving.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications of these embodiments will be apparent for those skilled in the art, it is as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide range caused.
Claims (6)
1. a kind of MEMS package weld assembly, which is characterized in that the pedestal including accommodating chip, the pedestal have higher than it
The edge part at his position, is used to support capping at the top of the edge part, any one in the edge part and the capping exists
The region of the two contact has groove, is filled with to weld the capping and the weldering of the edge part after melting in the groove
Material.
2. MEMS package weld assembly according to claim 1, which is characterized in that the edge part and the capping exist
The region of the two contact has groove.
3. MEMS package weld assembly according to claim 2, which is characterized in that the cross section of the groove is semicircle
Shape.
4. MEMS package weld assembly according to claim 3, which is characterized in that the cross section of the solder is circle.
5. according to claim 1-4 any one of them MEMS package weld assemblies, which is characterized in that the solder is total to for metal
Brilliant solder.
6. MEMS package weld assembly according to claim 4, which is characterized in that the cross-sectional diameter of the solder and institute
The cross-sectional diameter for stating groove is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810035507.9A CN108249385A (en) | 2018-01-15 | 2018-01-15 | A kind of MEMS package weld assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810035507.9A CN108249385A (en) | 2018-01-15 | 2018-01-15 | A kind of MEMS package weld assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108249385A true CN108249385A (en) | 2018-07-06 |
Family
ID=62727130
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810035507.9A Pending CN108249385A (en) | 2018-01-15 | 2018-01-15 | A kind of MEMS package weld assembly |
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| CN (1) | CN108249385A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002290022A (en) * | 2001-03-27 | 2002-10-04 | Kyocera Corp | Wiring board, its manufacturing method, and electronic device |
| HK1128989A1 (en) * | 2003-06-26 | 2009-11-13 | Semiconductor Components Ind | Method for making a direct chip attach device and structure |
| CN102006030A (en) * | 2010-10-18 | 2011-04-06 | 台晶(宁波)电子有限公司 | Reinforced-airtightness oscillator device wafer-grade packaging structure |
| CN103988294A (en) * | 2011-10-10 | 2014-08-13 | 马维尔国际贸易有限公司 | Package assembly including a semiconductor substrate with stress relief structure |
| CN203983254U (en) * | 2014-06-19 | 2014-12-03 | 中国航天科工集团第三研究院第八三五七研究所 | The welding encapsulation of burying in a kind of bga chip |
| CN105584987A (en) * | 2014-11-12 | 2016-05-18 | 精工爱普生株式会社 | Physical quantity sensor, method for manufacturing physical quantity sensor, electronic device, and moving body |
| US20170077074A1 (en) * | 2015-09-14 | 2017-03-16 | Hongbin Shi | Method for manufacturing semiconductor package |
| CN206583873U (en) * | 2016-12-08 | 2017-10-24 | 中国科学院上海微系统与信息技术研究所 | The micro- thermal conductivity detector (TCD) of film-type |
-
2018
- 2018-01-15 CN CN201810035507.9A patent/CN108249385A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002290022A (en) * | 2001-03-27 | 2002-10-04 | Kyocera Corp | Wiring board, its manufacturing method, and electronic device |
| HK1128989A1 (en) * | 2003-06-26 | 2009-11-13 | Semiconductor Components Ind | Method for making a direct chip attach device and structure |
| CN102006030A (en) * | 2010-10-18 | 2011-04-06 | 台晶(宁波)电子有限公司 | Reinforced-airtightness oscillator device wafer-grade packaging structure |
| CN103988294A (en) * | 2011-10-10 | 2014-08-13 | 马维尔国际贸易有限公司 | Package assembly including a semiconductor substrate with stress relief structure |
| CN203983254U (en) * | 2014-06-19 | 2014-12-03 | 中国航天科工集团第三研究院第八三五七研究所 | The welding encapsulation of burying in a kind of bga chip |
| CN105584987A (en) * | 2014-11-12 | 2016-05-18 | 精工爱普生株式会社 | Physical quantity sensor, method for manufacturing physical quantity sensor, electronic device, and moving body |
| US20170077074A1 (en) * | 2015-09-14 | 2017-03-16 | Hongbin Shi | Method for manufacturing semiconductor package |
| CN206583873U (en) * | 2016-12-08 | 2017-10-24 | 中国科学院上海微系统与信息技术研究所 | The micro- thermal conductivity detector (TCD) of film-type |
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| PB01 | Publication | ||
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Application publication date: 20180706 |