CN104362246B - Method for encapsulating LED device with metal substrate - Google Patents
Method for encapsulating LED device with metal substrate Download PDFInfo
- Publication number
- CN104362246B CN104362246B CN201410676519.1A CN201410676519A CN104362246B CN 104362246 B CN104362246 B CN 104362246B CN 201410676519 A CN201410676519 A CN 201410676519A CN 104362246 B CN104362246 B CN 104362246B
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- Prior art keywords
- metal basal
- basal board
- pad pasting
- led chip
- layer
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses a method for encapsulating an LED device with a metal substrate. The method is used for solving the problems that a hollowed-out metal substrate deforms in the encapsulating process, and residual glue exists on the back face and the hollowed-out parts of the metal substrate. The method for encapsulating the LED device comprises the steps of film attaching, wherein an attaching film is attached to the back face of the hollowed-out metal substrate; conducting solid phase crystallization, wherein LED chips are fixed to the metal substrate, and solid phase crystallization is conducted on weld lines to form circuits; manufacturing fluorescent layers, wherein the fluorescent layers are manufactured on the LED chips; conducting encapsulating, wherein encapsulating layers are manufactured on the LED chips, and the LED chips are encapsulated; film removing, wherein the attaching film is removed; conducting slicing, wherein the metal substrate is cut, and each LED chip forms an independent unit. By means of the technology, glue cannot remain on the back of the metal substrate, the phenomenon of loose contact can be avoided, and the additional process for removing the residual glue is not needed.
Description
Technical field
The present invention relates to a kind of encapsulation technology of LED component.
Background technology
Prior art is mainly to be mainly thermosets, sheffield plate as base material, forms bowl with thermosets,
Form support, carry out die bond bonding wire in bowl, coat fluorescent glue, eventually form LED component.
If not making thermosetting bowl, because metal basal board has ductility, on metallic substrates die bond bonding wire when
Wait, metal basal board, it may happen that out of contior deformation, leads to product unqualified.In addition, need on metallic substrates
LED chip is packaged, existing hollow out metal basal board, when encapsulation, packaging plastic can be along the gap of hollow out or hole stream
Enter the back side of metal basal board, formed raised, this will lead to substrate when being welded on circuit board, loose contact.In order to avoid this
Plant the problem of the projection of hollow part, existing means are generally by the process flow that artificial removing glue is processed, artificial removing glue increases, and
It is easily destroyed coating, particularly sheffield plate, silver layer, once destroying, will lead to copper accelerated oxidation, it directly affects the matter of product
Amount and service life.
Content of the invention
The technical problem to be solved is to provide a kind of LED component method for packing with metal basal board, is used for
Solve the problems, such as that the back side of deformation that the metal basal board of hollow out produces in encapsulation process and metal basal board, hollow part occur residual
The problem of glue.
For solving above-mentioned technical problem, the technical solution adopted in the present invention is as follows：
A kind of LED component method for packing with metal basal board, it includes：
Pad pasting, in the back side patch last layer pad pasting of the metal basal board of hollow out substrate；
Die bond, LED chip is fixed on metallic substrates and die bond bonding wire forms circuit；
Make fluorescence coating, fluorescence coating is made on LED chip；
Encapsulation, makes encapsulated layer on LED chip and is encapsulated LED chip；
Striping, removes described pad pasting；
Section, cuts to metal basal board, makes each LED chip form separate unit；
Described pad pasting is composite membrane；It includes hard layer and soft layer, and wherein, soft layer is outside hard layer, and exposes
Hard layer；
In the step of pad pasting, the exposed portion of soft film is allowed to coat along metal basal board side and to stretch to upper surface of base plate
Edge；
In the step of encapsulation, by the soft layer partial encapsulation positioned at upper surface of base plate edge in it；
In striping step, cut along metal basal board side wall and remove pad pasting, then remove the patch being located at metal basal board bottom
Film, and retain the soft layer segment being located at upper surface of base plate edge.
Preferably：Described metal basal board is sheffield plate, gold plated copper sheets or nickel plating copper sheet.Sheffield plate can effectively prevent
Copper sheet aoxidizes, and silver has good heat-conductivity conducting, and because silver is softer, on silver layer, die bond is also easier to weld and beat
Line.Because gold is relatively valuable, so gold plated copper sheets then use under some special occasions.Nickel plating copper sheet is also to substitute sheffield plate
Mode.
Preferably：Described pad pasting is high-temperature resistance plastice.The softening temperature of high-temperature resistance plastice is more than the solidification temperature of packing colloid
Degree.Such as packing colloid is silica gel, then generally 150 DEG C of the solidification temperature according to silica gel, then the softening temperature of high-temperature resistance plastice
150 DEG C should be more than.
If packaging plastic is epoxy resin, because the solidification temperature of epoxy resin is in 120 DEG C～180 DEG C (different epoxies
Resin, its solidification temperature is different).If the temperature of this epoxy resin is a DEG C, then b DEG C of the softening temperature of high-temperature resistance plastice should be expired
Foot：B a.According to practical situation, high-temperature resistance plastice can be for example politef, and it can tolerate 260 DEG C of temperature；Also may be used
To be MPS, Polyetherimide, enhancement mode linear polyester, polyether-ether-ketone, polyimides, polypropylene, modified polyphenyl
The materials such as ether, polybenzimidazoles, polyphenylene sulfide.
Preferably：In the step of described making fluorescence coating, on LED chip, sprayed with fluorescent powder forms fluorescence coating.
Preferably：In the step of described making fluorescence coating, paste one layer of fluorescent film on the surface of LED chip and form fluorescence coating.
Fluorescent film needs to be made according to the size of chip in advance.The production method of fluorescent film is：By proportioning first in transparent silica gel
It is mixed into the materials such as fluorescent material, dispersant and firming agent, be then poured in latent channel mould version and solidified, further take out the glimmering of solidification
Light arogel piece, the size according to chip is cut to it.Another make fluorescent film method be：On hard transparent film
Sprayed with fluorescent powder and binding agent, make fluorescent material be evenly distributed on hyaline membrane, then it are carried out cutting standby.Patch fluorescent material
Film can make operation simplify with improve production efficiency.
Preferably：In the step of described encapsulation, on LED chip, die casting lens are to be packaged to LED chip.Die casting
Cheng Zhong, packaging plastic can enter in the gap of hollow out, and gap is probably hole or banding or strip slotted eye.
Preferably：In the step of described encapsulation, described lens are silica gel material.Lens can also be epoxy resin material with
And other materials, such as UV glue.
Preferably：Described fluorescence coating is the phosphor gel being solidificated in around LED chip, is described envelope in phosphor gel outer layer
Dress layer.
The application of above-mentioned this composite membrane, is because in press casting procedure, and colloid can produce squeezing action to pad pasting.If
The temperature drift of colloid, then pad pasting obvious ruckbildung can occur, its support degree can be had a greatly reduced quality, and its result is die casting colloid
Still may protrude from the bottom in hollow out gap.In order to avoid this situation, the contact with metal basal board for the pad pasting is preferably hard
Contact, when die casting, cast temperature is higher, and it also will not occur obvious softening behavior, and this can at utmost be avoided pressing
Casting colloid is by the back side depressing to metal basal board in gap.It is enclosed with soft layer in the periphery of hard layer, this soft layer and hard
Layer closely connects, and using after complete, convenient pad pasting is torn removal.The top bound edge that pad pasting is wrapped in metal basal board is optional
's.
This top bound edge is if it is present can be with the impact to pad pasting of expanding with heat and contract with cold of effective control metal basal board.Metal
, when die casting packaging plastic, because temperature typically can be in more than 100 degree, its deformation that can expand with heat and contract with cold, if patch for substrate
Film is mantle, then this deformation leads to pad pasting to deform upon；If this pad pasting is dura mater, this deformation leads to pad pasting to shift mistake
Position.For dura mater (i.e. the film containing hard layer), this soft layer can prevent it from getting loose when die casting.Hard layer is high temperature
Plastics, under the cast temperature of degree more than 100, keep its hardness.This hard layer, when die bond bonding wire, can prevent from acting on
External force on metallic substrates makes metal basal board that destructive deformation to occur.Because if metal basal board is when die bond bonding wire
It may happen that deformation, this deformation, when die casting, metal basal board can keep and solidify this opposite sex state, and then leads to
Metal basal board profile does not meet specification, in addition metal basal board bottom injustice (micro- curved surface) and the conduction that affects the metal basal board back side is led
Hot.Therefore hard layer combines soft layer layer structure, can improve quality and the using effect of pad pasting.In packaged chip
Afterwards, top bound edge may be enclosed packaging plastic, when therefore cutting, by the bound edge of side, after the completion of cutting, with handss or instrument by
Pad pasting is torn or throws off by side bound edge.But the top bound edge of soft layer is not certain needs, in certain embodiments, soft layer
Only include side bound edge.
You need to add is that, when die casting packaging plastic, may trapped air in hollow out gap.Air pressure meeting
Extrude soft pad pasting, cause pad pasting thinning in hollow part, thinning pad pasting is it may happen that bore a hole, or completes in encapsulation
Afterwards, it is inhaled in hollow out gap, it leads to remove the problems such as produce breakage during pad pasting, remain, and pad pasting also cannot re-use.Firmly
Matter layer can solve these problems just.
Preferably：Described soft layer and described encapsulated layer are silica gel.This identical material can make them that phase occurs
Capacitive, the top bound edge of for example above-mentioned soft layer, the two is all silica gel, then this top bound edge and packaging plastic can be very good to merge
Together.
Compared to existing technology, the invention has the beneficial effects as follows：
The present invention can solve the problems, such as that hollow out metal basal board occurs hollow out bottom residual packaging plastic after packaging.The present invention
Technique will not remain colloid behind in metal basal board, and the unit of luminous so made, in follow-up paster, will not come in contact not
Good problem is it is not required that additionally carry out except glue process for cull, for sheffield plate, it is to avoid except glue process is to silver layer
Destroy probability.Therefore film coating process can significantly improve the quality of product, and its process implementing is very simple, does not almost have cost
Increase.
Brief description
Fig. 1 is the pad pasting schematic diagram of first embodiment of the invention；
Fig. 2 is die bond schematic diagram；
Fig. 3 is the schematic diagram making fluorescence coating；
Fig. 4 is the schematic diagram of encapsulation；
Fig. 5 is the schematic diagram of striping；
Fig. 6 is the schematic diagram of section；
Fig. 7 is the structure explanatory diagram of the pad pasting of second embodiment of the invention；
Fig. 8 be the striping of second embodiment after structure explanatory diagram.
Brief description：
1st, hollow out；2nd, metal basal board；3rd, pad pasting；4th, LED chip；5th, phosphor powder layer；6th, lens；7th, lens monomer；8th, base
Plate monomer；9th, packaging plastic；30th, pad pasting；300th, hard layer；310th, soft layer；320th, side bound edge；330th, top bound edge.
Specific embodiment
The present invention proposes a kind of LED component method for packing with metal basal board, and metal basal board is hollow out substrate, including：
Pad pasting, pastes last layer pad pasting at the back side of metal basal board；Die bond, LED chip is fixed on metallic substrates simultaneously die bond bonding wire shape
Become circuit；Make fluorescence coating, fluorescence coating is made on LED chip；Encapsulation, makes encapsulated layer on LED chip and seals LED chip
Load；Striping, removes described pad pasting；Section, cuts to metal basal board, makes each LED chip form separate unit.
With reference to the accompanying drawings and detailed description the present invention is described in further detail.
The embodiment one of the LED component method for packing with metal basal board of the present invention is referring to shown in Fig. 1 to Fig. 6.
Metal basal board 2 is sheffield plate, and it is hollow out substrate, and hollow out includes installing hole, circuit board interlayer connection hole, welding
Hole, pin gap, special-shaped sheet separation, electric elements hole or stay the various engraved structure such as position.Metal basal board can also be aluminium base
Plate, can increase the various coats of metal thereon.
Referring to Fig. 1, after there is after choosing the metal basal board 2 of hollow out 1, paste last layer pad pasting 3 at the back side of metal basal board 2.Patch
Membrane process can be：First multiple metal basal boards are attached on a big pad pasting, then cutting or cutting are carried out to pad pasting so as to
Mate with single metal size of substrate.Pad pasting generally requires possesses certain adsorptivity, generally it is not recommended that using with viscose glue
Pad pasting, because subsequently needing to carry out chemistry removing glue, this will increase operation and cost；In a preferred embodiment, can adopt
Use electrostatic pad pasting；Or using itself having the material of certain viscosity, for example blue film.Should be noted package temperature not using blue film
The softening temperature of super blue toner, therefore packaging plastic can adopt UV glue.
Referring to Fig. 2, after the completion of pad pasting, carry out die bond technique.By LED chip 4 flip chip bonding on metal basal board 2 it is also possible to adopt
With the mode of elargol bonding, LED chip is fixed on metallic substrates.Metal basal board is that circuit-line is distributed with thereon, therefore,
After die bond, need to carry out bonding wire to it, will the electrode of LED chip link together with the electrode on metal basal board, form electricity
Line structure.In the case of requiring to reduce, aluminium base can be adopted.
Referring to Fig. 3, make fluorescence coating, fluorescence coating is made on LED chip.In one embodiment, make fluorescence coating
In step, on LED chip, sprayed with fluorescent powder forms fluorescence coating.In another embodiment, in the step making fluorescence coating,
Paste one layer of fluorescent film on the surface of LED chip and form fluorescence coating.
Referring to Fig. 4, after LED chip makes phosphor powder layer, then it is packaged, encapsulation is made on LED chip
LED chip is encapsulated by glue 9.The basic object of encapsulation is to protect LED chip, allows it to be hedged off from the outer world.Further,
Packaging plastic can be made lens 6, and then improve dioptric condition.In order to make lens arrangement, encapsulation can be to be entered with die casting mode
OK, that is, by lens die on LED chip die casting go out lens out.But encapsulating material is not limited to silica gel, can also be ring
Oxygen tree fat, epoxy resin is also used as making the material of lens.
Referring to Fig. 5, after making lens, then carry out film process, remove pad pasting.Striping can tear off or utilize work
Tool peels off pad pasting.
Referring to Fig. 6, then monoblock substrate is cut into slices, metal basal board is cut, so that each LED chip is formed solely
Vertical unit.Independent LED chip is had on substrate monomer 8, has independent lens monomer 7 in LED chip.
What Fig. 7 and Fig. 8 illustrated is second embodiment of the present invention.
With the difference of above-mentioned first embodiment, this example is that pad pasting is composite membrane.
This pad pasting 30 includes hard layer 300 and soft layer 310, and wherein, soft layer 310 is outside hard layer 300, and exposes
Hard layer.Soft layer 310 is more roomy than hard layer 300, has exposed portion.The material of hard layer can be epoxy resin, UV glue,
The even hard material such as glass, sapphire.
In the step of pad pasting, the exposed portion of soft film is allowed to coat along metal basal board side and to stretch to upper surface of base plate
, there is side bound edge 320 at edge in metal basal board side, has top bound edge 330 in the top surface edge of metal basal board.
In striping step, cut along metal basal board side wall and remove side bound edge 320, then remove and be located at metal basal board bottom
Pad pasting, and retain be located at upper surface of base plate edge top bound edge 330.Soft layer 310 and encapsulated layer are silica gel, so have
Fusion beneficial to them.
In other embodiments, top bound edge can not be produced, so can exempt the action of cutting, be conducive to pad pasting
Recycling.
Enter into the colloid in hollow out gap during die casting packaging plastic, after its solidification, the effect of reinforcement can be formed, this reinforcement
Influential point of tendons stops metal basal board under external force, deforms upon.But before encapsulation adhesive curing, in the case of there is no pad pasting, if
Metal basal board is deforming upon (deformation occurring when for example in die bond bonding wire), then after encapsulation adhesive curing, in hollow out gap
Packaging plastic may get off state cured for the abnormity of metal basal board, it leads to the deterioration of product quality.Using the present invention's
After Filming Technology, when die bond bonding wire, pad pasting plays sizing supporting role, prevents metal basal board from deforming upon.Behind
Die casting encapsulating and colloid solidification work after, metal basal board does not show obvious deformed state, and now, the colloid after solidification really rises
To the effect strengthening metal basal board hardness and control its ductility.
The innovation of the present invention, in addition to carrying out pad pasting at the metal basal board back side of hollow out, can also be to the gold of non-hollow out
Belong to substrate and carry out pad pasting.Pad pasting is carried out for non-metal base plate, then, when in die bond bonding wire, prolongs because metal basal board has
Malleability, it can deform upon, and pad pasting can hinder this deformation, and it makes metal basal board maintain the original state as far as possible, it is possible to reduce die bond
The destruction to metal basal board for the bonding wire.Therefore, film coating process can stop the deformation of metal basal board, improves performance and the matter of product
Amount.
Above-mentioned embodiment is only the preferred embodiment of the present invention it is impossible to limit the scope of protection of the invention with this,
The change of any unsubstantiality that those skilled in the art is done on the basis of the present invention and replacement belong to institute of the present invention
Claimed scope.
Claims (9)
1. a kind of LED component method for packing with metal basal board, it includes：
Pad pasting, in the back side patch last layer pad pasting of the metal basal board of hollow out；
Die bond, LED chip is fixed on metallic substrates and die bond bonding wire forms circuit；
Make fluorescence coating, fluorescence coating is made on LED chip；
Encapsulation, makes encapsulated layer on LED chip and is encapsulated LED chip；
Striping, removes described pad pasting；
Section, cuts to metal basal board, makes each LED chip form separate unit；
Described pad pasting is composite membrane；It includes hard layer and soft layer, and wherein, soft layer is outside hard layer, and exposes hard
Layer；
In the step of pad pasting, the exposed portion of soft film is allowed to coat along metal basal board side and to stretch to upper surface of base plate side
Edge；
In the step of encapsulation, by the soft layer partial encapsulation positioned at upper surface of base plate edge in it；
In striping step, cut along metal basal board side wall and remove pad pasting, then remove the pad pasting being located at metal basal board bottom, and
Retain the soft layer segment being located at upper surface of base plate edge.
2. the LED component method for packing with metal basal board according to claim 1 it is characterised in that：
Described metal basal board is sheffield plate, gold plated copper sheets or nickel plating copper sheet.
3. the LED component method for packing with metal basal board according to claim 1 it is characterised in that：Described pad pasting is
High-temperature resistance plastice.
4. the LED component method for packing with metal basal board according to claim 1 it is characterised in that：Described making is glimmering
In the step of photosphere, on LED chip, sprayed with fluorescent powder forms fluorescence coating.
5. the LED component method for packing with metal basal board according to claim 1 it is characterised in that：Described making is glimmering
In the step of photosphere, paste one layer of fluorescent film on the surface of LED chip and form fluorescence coating.
6. the LED component method for packing with metal basal board according to claim 1 it is characterised in that：Described encapsulation
In step, on LED chip, die casting lens are to be packaged to LED chip.
7. the LED component method for packing with metal basal board according to claim 6 it is characterised in that：Described encapsulation
In step, described lens are silica gel or epoxy resin material.
8. the LED component method for packing with metal basal board according to claim 1 it is characterised in that：
Described fluorescence coating is the phosphor gel being solidificated in around LED chip, is described encapsulated layer in phosphor gel outer layer.
9. the LED component method for packing with metal basal board according to claim 1 it is characterised in that：Described soft layer
It is silica gel with described encapsulated layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410676519.1A CN104362246B (en) | 2014-11-21 | 2014-11-21 | Method for encapsulating LED device with metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410676519.1A CN104362246B (en) | 2014-11-21 | 2014-11-21 | Method for encapsulating LED device with metal substrate |
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| CN104362246A CN104362246A (en) | 2015-02-18 |
| CN104362246B true CN104362246B (en) | 2017-02-22 |
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| CN201410676519.1A Active CN104362246B (en) | 2014-11-21 | 2014-11-21 | Method for encapsulating LED device with metal substrate |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104993033B (en) * | 2015-07-21 | 2019-01-08 | 福建天电光电有限公司 | The EMC metal bonding device and packaging method of distributed group III-nitride emitting semiconductor |
| CN106102402A (en) * | 2016-08-18 | 2016-11-09 | 强新正品（苏州）环保材料科技有限公司 | A kind of using method of silica gel sheet material |
| CN112767848B (en) * | 2021-01-12 | 2022-07-26 | 深圳市艾比森光电股份有限公司 | LED display module and manufacturing method thereof |
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|---|---|---|---|---|
| CN101471407A (en) * | 2007-12-24 | 2009-07-01 | 亿光电子工业股份有限公司 | Method for encapsulating thin type LED device |
| CN101777621A (en) * | 2010-01-19 | 2010-07-14 | 山东天诺光电材料有限公司 | High-heat-conductivity basal plate used for packaging high-power LED and preparation method |
| CN103094458A (en) * | 2011-11-07 | 2013-05-08 | 隆达电子股份有限公司 | Light source structure and manufacturing method thereof |
-
2014
- 2014-11-21 CN CN201410676519.1A patent/CN104362246B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101471407A (en) * | 2007-12-24 | 2009-07-01 | 亿光电子工业股份有限公司 | Method for encapsulating thin type LED device |
| CN101777621A (en) * | 2010-01-19 | 2010-07-14 | 山东天诺光电材料有限公司 | High-heat-conductivity basal plate used for packaging high-power LED and preparation method |
| CN103094458A (en) * | 2011-11-07 | 2013-05-08 | 隆达电子股份有限公司 | Light source structure and manufacturing method thereof |
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