CN108247358A - A kind of PCB moves back pin apparatuses and moves back pin method - Google Patents
A kind of PCB moves back pin apparatuses and moves back pin method Download PDFInfo
- Publication number
- CN108247358A CN108247358A CN201810127281.5A CN201810127281A CN108247358A CN 108247358 A CN108247358 A CN 108247358A CN 201810127281 A CN201810127281 A CN 201810127281A CN 108247358 A CN108247358 A CN 108247358A
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- China
- Prior art keywords
- pin
- pcb board
- pcb
- moves back
- apparatuses
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
- B23P23/04—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass for both machining and other metal-working operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crushing And Grinding (AREA)
Abstract
The invention discloses a kind of PCB to move back pin apparatuses, including cutting mechanism and pressing roll mechanism, cutting mechanism is set at the top of pressing roll mechanism, conveying mechanism is provided between cutting mechanism and pressing roll mechanism, cutting mechanism cuts the pin position on pcb board side, and pressing roll mechanism is delivered to by pcb board crushing remaining around pin, separation pcb board and pin by conveying mechanism.This, which moves back pin apparatuses and realizes automatic move back, takes pcb board side pin, solve the problems, such as that the traditional artificial pin that moves back easily damages pcb board or pin, and significant increase moves back the efficiency of pin operation, reduce labor intensity and cost of labor, pin can completely be exited, recycled simultaneously, reducing the production cost of PCB.It also discloses and moves back pin method, this method stripping pin is efficient, required operating personnel's quantity is few, labor intensity is low, and the removal of pin and the separation of pcb board fragment can automate progress, reduce the damage probability to pcb board and pin, product yield is improved, suitable for industrial applications.
Description
Technical field
The invention belongs to printed circuit board production technical fields, relate in particular to a kind of move back online and take pcb board side pin
Device and method.
Background technology
Printed circuit board (Printed Circuit Board, PCB) due to being made of terahertz wave quasi-optics, therefore
It is known as printed circuit board or printed wiring board again, is a kind of important electronic unit, plays and provide branch for electronic component
Support and the effect of electrical connection.After electronic equipment uses printed circuit board, due to the consistency of similar printed board, avoid artificial
The mistake of wiring, and can realize electronic component inserting or attachment, automatic tin soldering, automatic detection automatically, it ensure that electronic equipment
Quality, improve production efficiency, reduce cost.In printed circuit board production industry, printed circuit board common at present
Single sided board, dual platen and multi-layer board are generally comprised, with the continuous renewal of electronic product, multi-layer board has been increasingly becoming main circuit
Panel products.
In multilayer printed circuit board production process, pcb board is mostly made using prepreg process for pressing, each layer during pressing
Aligning accuracy between line pattern is to wiring board qualification rate important, therefore frequently in edges of boards in pressing working procedure
It prevents prepreg from sliding deviation by way of pin positioning, before upper pcb board, drills out on pcb board side and approached with pin diameter
Pin locating holes, then pin is fixed in pin locating holes, removes pin from plate after process finishing.Traditional PCB
The method that plate moves back pin includes the following steps：Personnel take plate to transport vehicle → hand haulage to Tui Ding areas → people to drill hole line side storehouse
Work move back nail puller take (each product will repeat this action) → be positioned over transport vehicle → transport to lower process → plate putting machine into
Row puts plate → corase grinding operation, this to move back that nail process efficiency is low, hand labor intensity is big, and if operation is unskilled, extracts pin
During damage also easily caused to pcb board or damage shop bolt.
Invention content
For this purpose, the present invention be exactly to solve above-mentioned technical problem, so as to propose one kind can move back automatically take pcb board side pin,
The PCB of high degree of automation moves back pin apparatuses and moves back pin method.
In order to solve the above technical problems, the technical scheme is that：
The present invention provides a kind of PCB and moves back pin apparatuses, including cutting mechanism and pressing roll mechanism, the cutting mechanism setting
At the top of the pressing roll mechanism, conveying mechanism, the cutting mechanism are provided between the cutting mechanism and the pressing roll mechanism
The pin position on pcb board side is cut, by conveying mechanism be delivered to pressing roll mechanism by pcb board crushing remaining around pin, point
From pcb board and pin.
Preferably, further including the leakage sieve for sieving pcb board residue and pin, the leakage sieve is set to the roller machine
Below structure.
Preferably, the driving mechanism that the leakage sieve includes sieve and the sieve is driven to move in the horizontal direction, described
The leakage of pcb board residue is removed and pin is sent to one by sieve goes out magazine.
Preferably, the cutting mechanism includes milling cutter and drives the driving mechanism of the milling cutter progress cutting operation, institute
State a diameter of 2mm of milling cutter.
Preferably, the rotating speed of the milling cutter is 28krpm, the speed of travel around the pin is 18m/min, described
Spacing between milling cutter and pin is 0.5mm.
Preferably, the pressure of the pressure roller is 6-8kg/cm3。
Preferably, a diameter of 3.0mm of the sieve pore of the leakage sieve.
It moves back pin apparatuses the present invention also provides a kind of using the PCB and carries out the method for moving back pin, including following step
Suddenly：
S1, the pcb board with pin is transported and moves back pin apparatuses to PCB and move back nail processing：Cutting mechanism first is by pin
And surrounding pcb board cuts together, the pcb board with pin drops down onto conveying mechanism and is delivered to pressing roll mechanism, by pin
Nail surrounding pcb board pulverizes；
S2, pin are delivered to out magazine and are recycled；
S3, remove pin pcb board be delivered to corase grinding workshop section carry out corase grinding operation.
Preferably, the step of pcb board residue that will be pulverized crosses leakage sieve separation with pin is further included after the step S1.
The above technical solution of the present invention has the following advantages over the prior art：
(1) PCB of the present invention moves back pin apparatuses, including cutting mechanism and pressing roll mechanism, the cutting mechanism setting
At the top of the pressing roll mechanism, conveying mechanism, the cutting mechanism are provided between the cutting mechanism and the pressing roll mechanism
The pin position on pcb board side is cut, by conveying mechanism be delivered to pressing roll mechanism by pcb board crushing remaining around pin, point
From pcb board and pin.This moves back pin apparatuses and the pin position on pcb board side (pin and its periphery P CB plates) is cut automatically first
It cuts, is then detached pin with pcb board by mechanical compaction roll mechanism, realize automatic move back and take pcb board side pin, solve tradition
It is artificial move back the problem of pin easily damages pcb board or pin, and significant increase moves back the efficiency of pin operation, and it is strong to reduce labour
Degree and cost of labor, while pin can completely be exited, recycled, it is for later use, reduce the production cost of PCB.
(2) it is of the present invention to move back pin apparatuses using the PCB and carry out the method for moving back pin, first with milling cutter to pin
It is cut around nail, is then detached pin with PCB fragments by mechanical compaction roll, and pin is moved back with leakage sieve and is taken to discharging
Box realizes and moves back the operation for taking pcb board side pin online, and this method stripping pin is efficient, required operating personnel's quantity is few, labor
Fatigue resistance is low, and the removal of pin and the separation of pcb board fragment can automate progress, reduce the damage to pcb board and pin
Probability improves product yield, suitable for industrial applications.
Description of the drawings
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is the structure diagram for moving back pin apparatuses described in the embodiment of the present invention；
Fig. 2 is to move back pin apparatuses cutting path schematic diagram described in the embodiment of the present invention；
Reference numeral is expressed as in figure：1- cutting mechanisms；2- pressing roll mechanisms；3- conveying mechanisms；4- leakage sieves；5- pins；6-
Pcb board.
The present invention can be implemented with many different forms, should not be construed as limited to embodiment set forth herein, on the contrary,
There is provided these embodiments so that the disclosure is thorough and complete, and will fully convey the concept of the invention to art technology
Personnel, the present invention will be defined by the claims.In the accompanying drawings, for clarity, the size of each device and opposite can be exaggerated
Size.In addition, term " comprising ", " having " and their any deformation, it is intended that cover non-exclusive include.
Specific embodiment
Embodiment
The present embodiment provides a kind of PCB to move back pin apparatuses, is used to automatically move back the shop bolt on the pcb board side after pressing
It removes, as shown in Figure 1, the PCB moves back pin apparatuses as upper and lower two layers design, specifically includes positioned at the cutting mechanism 1 on upper strata and position
It is provided with conveying mechanism 3 between the pressing roll mechanism 2 of lower floor, the cutting mechanism 1 and the pressing roll mechanism 2, in the present embodiment,
The conveying mechanism 3 is conveyer belt.
The cutting mechanism 1 includes milling cutter and for the milling cutter to be driven to carry out the driving machine of cutting operation and walking movement
Structure, the milling cutter diameter used in the present embodiment is 2mm, as shown in Fig. 2, driving mechanism driving milling cutter high speed rotation and along pin
It follows closely the walking of 5 surrounding circumference, machine away pin 5 and its periphery P CB plates 6, the rotating speed of the milling cutter is 28krpm, around the pin
The speed of travel of nail is 18m/min, and the spacing between the milling cutter and pin is 0.5mm.
For the pressing roll mechanism 2 as shown in the figure, it includes upper and lower, two pressure rollers, two pressure rollers can under driving device driving
It relatively rotates, applies pressure, the pcb board 6 with pin 5 that will be delivered among pressure roller pulverizes, and the spacing of two pressure rollers can root
It is adjusted according to the thickness of pcb board 6, the pressure between two pressure rollers is 6-8kg/cm3, preferably 7kg/cm in the present embodiment3.Such as figure
Shown, the pressing roll mechanism 2 is set to one end of 1 bottom of cutting mechanism, and the pan feeding side of pressing roll mechanism 2 is connected with conveyer
Structure 3, the conveying mechanism 3 are set to 1 bottom of cutting mechanism, for the PCB with pin that accepts and will cut
Plate, which is delivered at pressing roll mechanism 2, crushes processing.
Further to detach the pcb board fragment after crushing with pin 5, the pin apparatuses that move back further include one for sieving
The leakage sieve 4 of pcb board residue and pin 5, the leakage sieve 4 are set to 2 lower section of pressing roll mechanism, and the leakage sieve 4 had both been played PCB
The effect that plate residue is detached with pin 5, and play the role of pin 5 being sent in rewinding box and recycle, the leakage sieve packet
Include the sieve for sieving PCB residues and pin 5, the sieve diameter of the sieve is 3.0mm, PCB residues by sieve mesh
Leakage removes, and pin 5 stays in screen surface, further includes and the sieve is driven to move the pin 5 to transport screen surface in the horizontal direction
Driving motor, the driving motor drives the screen movement, pin 5 is sent to magazine.
The present embodiment also provide it is a kind of the method that pin apparatuses move back pin processing is moved back using the PCB, including such as
Lower step：
S1, the pcb board 6 with pin 5 is transported by transmitting device (such as conveyer belt, delivery roll) to the PCB and moves back pin
Device carries out moving back nail processing：It moves back first under the cutting mechanism 1 in pin apparatuses cuts pin 5 and surrounding pcb board 6 together
Come, the pcb board with pin 5 is dropped down onto on conveying mechanism 3, and is delivered to pressing roll mechanism 2 by between pressure roller by conveying mechanism 3
Extruding force roll processing, the pcb board around pin 5 is grinded up removing pin 5, and pressing roll mechanism 2 is by pcb board powder
After broken, pcb board residue falls on leakage sieve 4 with pin, and pcb board residue, which is leaked, to be removed, and pin 5 remaines in sieve.
Pin 5 after S2, separation, which is transported by sieve to going out magazine, to be recycled, with for later use.
S3, the pcb board 6 for eliminating pin 5 are delivered to corase grinding workshop section and carry out follow-up corase grinding operation.
Obviously, the above embodiments are merely examples for clarifying the description, and is not intended to limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And the obvious variation thus extended out or
Among changing still in the protection domain of the invention.
Claims (9)
1. a kind of PCB moves back pin apparatuses, which is characterized in that including cutting mechanism and pressing roll mechanism, the cutting mechanism is set to
At the top of the pressing roll mechanism, conveying mechanism is provided between the cutting mechanism and the pressing roll mechanism, the cutting mechanism will
The pin position on pcb board side is cut, and pressing roll mechanism is delivered to by pcb board crushing remaining around pin, separation by conveying mechanism
Pcb board and pin.
2. PCB according to claim 1 moves back pin apparatuses, which is characterized in that further includes to sieve pcb board residue and pin
The leakage sieve of nail, the leakage sieve are set to below the pressing roll mechanism.
3. PCB according to claim 2 moves back pin apparatuses, which is characterized in that the leakage sieve is included described in sieve and driving
The driving mechanism that sieve moves in the horizontal direction, the leakage of pcb board residue is removed and pin is sent to one by the sieve goes out magazine.
4. PCB according to claim 3 moves back pin apparatuses, which is characterized in that the cutting mechanism includes milling cutter and driving
The milling cutter carries out the driving mechanism of cutting operation, a diameter of 2mm of the milling cutter.
5. PCB according to claim 4 moves back pin apparatuses, which is characterized in that the rotating speed of the milling cutter is 28krpm, around
The speed of travel of the pin is 18m/min, and the spacing between the milling cutter and pin is 0.5mm.
6. PCB according to claim 5 moves back pin apparatuses, which is characterized in that the pressure of the pressure roller is 6-8kg/cm3。
7. PCB according to claim 6 moves back pin apparatuses, which is characterized in that it is described leakage sieve sieve pore it is a diameter of
3.0mm。
It moves back pin apparatuses 8. a kind of using such as claim 1-7 any one of them PCB and carries out the method for moving back pin, feature exists
In including the following steps：
S1, the pcb board with pin is transported and moves back pin apparatuses to PCB and move back nail processing：First cutting mechanism by pin and its
The pcb board of surrounding cuts together, and the pcb board with pin drops down onto conveying mechanism and is delivered to pressing roll mechanism, by pin week
Pcb board is enclosed to pulverize；
S2, pin are delivered to out magazine and are recycled；
S3, remove pin pcb board be delivered to corase grinding workshop section carry out corase grinding operation.
9. according to claim 8 move back pin method, which is characterized in that further includes the PCB that will be pulverized after the step S1
The step of plate residue crosses leakage sieve separation with pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810127281.5A CN108247358A (en) | 2018-02-08 | 2018-02-08 | A kind of PCB moves back pin apparatuses and moves back pin method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810127281.5A CN108247358A (en) | 2018-02-08 | 2018-02-08 | A kind of PCB moves back pin apparatuses and moves back pin method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108247358A true CN108247358A (en) | 2018-07-06 |
Family
ID=62744542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810127281.5A Pending CN108247358A (en) | 2018-02-08 | 2018-02-08 | A kind of PCB moves back pin apparatuses and moves back pin method |
Country Status (1)
| Country | Link |
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| CN (1) | CN108247358A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311134A (en) * | 2022-02-18 | 2022-04-12 | 鹤山市泰利诺电子有限公司 | Automatic pin installing mechanism for PCB drilling machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508068A (en) * | 2009-03-20 | 2009-08-19 | 江苏技术师范学院 | Element device and circuit board matrix separation device on circuit board |
| CN201693342U (en) * | 2010-01-18 | 2011-01-05 | 仁新设备制造（四川）有限公司 | Automatic disassembling machine of circuit board device |
| CN102423879A (en) * | 2011-09-01 | 2012-04-25 | 深圳市深联电路有限公司 | Automatic pin pulling apparatus used in circuit board shape milling, and method thereof |
| CN204413546U (en) * | 2015-01-28 | 2015-06-24 | 吴江市东风电子有限公司 | Circuit board moves back pin apparatuses |
-
2018
- 2018-02-08 CN CN201810127281.5A patent/CN108247358A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508068A (en) * | 2009-03-20 | 2009-08-19 | 江苏技术师范学院 | Element device and circuit board matrix separation device on circuit board |
| CN201693342U (en) * | 2010-01-18 | 2011-01-05 | 仁新设备制造（四川）有限公司 | Automatic disassembling machine of circuit board device |
| CN102423879A (en) * | 2011-09-01 | 2012-04-25 | 深圳市深联电路有限公司 | Automatic pin pulling apparatus used in circuit board shape milling, and method thereof |
| CN204413546U (en) * | 2015-01-28 | 2015-06-24 | 吴江市东风电子有限公司 | Circuit board moves back pin apparatuses |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311134A (en) * | 2022-02-18 | 2022-04-12 | 鹤山市泰利诺电子有限公司 | Automatic pin installing mechanism for PCB drilling machine |
| CN114311134B (en) * | 2022-02-18 | 2023-08-11 | 鹤山市泰利诺电子有限公司 | Automatic pin mounting mechanism for PCB drilling machine |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180706 |
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| RJ01 | Rejection of invention patent application after publication |