KR101441860B1 - Apparatus for recovering valuable metals from printed circuit board and recovery method using the same - Google Patents

Abstract

The present invention relates to an apparatus for recovering valuable metal from a printed circuit board and a method for recovering the valuable metal using the same. The apparatus for recovering the valuable metal includes an incoming conveyor unit supplying a printed circuit board in such a way that a component side to which a component is mounted faces a predetermined direction; a solder side grinding unit transferring the printed circuit board supplied from the incoming conveyor unit and having a grinder wet-grinding a solder side, which is the opposite side of the component side; a component separation unit installed at a rear end of the solder side grinding unit, transferring the printed circuit board, and separating and discharging the component mounted to the component side from the printed circuit board; and a component side grinding unit having a grinder wet-grinding the component side of the printed circuit board discharged from the component separation unit. The method for recovering the valuable metal includes the steps of: (a) aligning the printed circuit board in such a way that a component side to which a component is mounted faces a predetermined direction and supplying the printed circuit board; (b) wet-grinding a solder side which is the opposite side of the component side; (c) separating the component mounted to the component side from the printed circuit board; and (d) wet-grinding the component side of the printed circuit board from which the component is separated. According to the present invention, grinding a solder side of a board, separating a component, and grinding a component side are performed continuously, thereby easily separating and recovering valuable metal and precious metal of high purity from a printed circuit board (PCB) and reusing the processed printed circuit board and thus increasing resource recovery rate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a device for recovering valuable metals from a printed circuit board and a method for recovering valuable metals from the printed circuit board.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for recovering valuable metals from a printed circuit board capable of effectively separating electronic components such as various IC devices attached to a printed circuit board and a substrate and a recovery method using the same.

Generally, when the entire components are grinded by grinding the printed circuit board and electronic components such as IC devices, the plastic components such as Epoxy, Polyamide, Polypropylene, Polyester and Polycarbonate are 30% And about 30% of the recovered metals such as copper, iron, nickel, tin, lead, aluminum and zinc, and ferrous and non-ferrous metals such as gold, silver and paradium Consists of.

Korean Patent Laid-Open Publication No. 2004-0071672 discloses a pretreatment apparatus and method for recovering metals and noble metals to be recovered from such a printed circuit board. Open Patent Publication No. 2003-0006792 discloses a method for recovering valuable metals from a waste printed circuit board, and Korean Utility Model No. 363908 discloses a pre-treatment apparatus for recovering valuable metals from an electronic scrap.

In the conventional preprocessing method for recovering the metal to be recovered from the printed circuit board, the printed circuit board and the electronic scrap are crushed at the same time by using a hammer mill or the like in a state where an electronic component such as an IC element is mounted on the printed circuit board, After sorting, secondarily, a plastic component containing a metal to be recovered of a printed circuit board and a metal component to be recovered of an electronic component such as an IC element are secondarily mixed with a ball mill or the like and simultaneously pulverized and then subjected to separation , And electromagnetism. The selected metal components are separated from the plastics and recovered metal components, and the selected recovered metal components are subjected to a refining process such as a dry smelting process and electrolysis, Such as precious metals such as Pd and Cu, are sorted, recovered and recycled.

However, the pretreatment methods used so far include a method of simultaneously cutting and crushing the plastic component of the printed circuit board, the metal component to be recovered, etc. of the electronic circuit with the printed circuit board and the electronic components such as the IC element mounted on the printed circuit board The dust is generated in a large amount during the process of cutting and dismounting the plastic component of the printed circuit board during the cutting and crushing operation and accordingly the disadvantages of the equipment requiring the high cost multi collecting equipment and the operation disadvantage It is economically burdened that the processing cost is comparatively high. In addition, since the printed circuit board itself is completely crushed and crushed in the course of pretreatment, the recycling of the printed circuit board itself and the recovery of the crushed plastic products The recycling rate of the printed circuit board is lowered This is a result of waste of resources. Since many metal particles are contained in the dust of pulverized plastics, complex devices such as dust collecting and sorting at various stages and processing are required to recover the valuable metals in the dust. It is required that the processing cost such as the equipment cost and the operation power cost is high, but the recovery rate of the valuable metal is relatively low, so that the processing cost is relatively higher than the recovery rate.

Therefore, there is a need to develop a recovery technology capable of effectively separating only electronic scrap such as various IC elements attached to the surface of a printed circuit board, which occupies most of the valuable metal and noble metal to be recovered.

Korean Patent Publication No. 2004-0071672 " Pre-treatment method and apparatus for recovering valuable metals from electronic scrap] Korean Patent Publication No. 2003-0006792 'Method of recovering valuable metal from a waste printed circuit board' Korea Registered Utility Model No. 363908 'Pretreatment system for recovering valuable metals from electronic scrap'

SUMMARY OF THE INVENTION The present invention is conceived to solve the problems as described above, and it is an object of the present invention to provide a device for recovering valuable metals from a printed circuit board capable of effectively separating and sorting electronic scraps such as various IC devices attached to the surface of a printed circuit board And a recovery method using the same.

According to another aspect of the present invention, there is provided an apparatus for recovering valuable metals from a printed circuit board, the apparatus comprising: an input conveyor unit for supplying a printed circuit board such that a component surface mounted with components is directed in a predetermined direction; A grinding part having a grinder for wet grinding the soldering surface opposite to the component surface while feeding the printed circuit board supplied from the grinding part; A component separating portion provided at a rear end of the brazed surface grind portion and separating the component mounted on the component surface while transferring the printed circuit board from the printed circuit board and discharging the component; And a component surface grinding unit having a grinder for wet grinding the component surface of the printed circuit board discharged from the component separating unit.

A feed bar including a feed roller rotating in the feeding direction of the printed circuit board and an elastic member for elastically supporting the feed roller is provided on the brazed surface grind part and the part separating part, It is preferable that a plurality of the surfaces are provided so as to elastically support the brazing surface and the brazing surface, respectively.

It is preferable that the component separating portion is provided with a component separating cutter including a drive shaft rotating in a predetermined direction and a plurality of cutter blades protruding from the outer periphery of the drive shaft and inclined in a rotating direction of the drive shaft.

And a pressing portion provided on the front end of the brazing surface grind portion or the component separating portion so as to be rotatable and including a pressing roller capable of pressing the component in the component surface direction of the printed circuit board, So that the printed circuit board is supplied to the brazed surface grind portion or the component separating portion in a state in which the height of the component mounted on the printed circuit board is uniformly maintained.

The lower part of the grinding part of the component surface is provided with a collecting tank which is opened at the upper part so that the electro-scrap that falls vertically can be stored, and a collecting tank which is installed at the upper part of the collecting tank and injects the fluid horizontally A plurality of separation plates installed on a bottom surface of the collecting tank so as to be spaced apart from each other in a spraying direction of the spraying nozzles; So that the electro-scrap that falls vertically can be separated and stored according to the specific gravity.

A method of recovering valuable metals from a printed circuit board according to the present invention comprises the steps of: (a) aligning a printed circuit board so that a component surface on which components are mounted faces in a predetermined direction, and (b) Wet grinding the solder side as the opposite side; (c) separating the component mounted on the component surface from the printed circuit board; And (d) wet grinding the component surface of the printed circuit board on which the component is separated.

In addition, it is preferable that the step (b) or the step (c) further comprises: (e) pressing the upper part of the component so that the height of the component mounted on the printed circuit board is uniform.

In addition, (f) the electronic scrap discharged in the step (d) may be separated and stored according to the specific gravity.

According to one embodiment of the present invention as described above, it is possible to effectively separate metal components on the surface of a printed circuit board and electronic components such as IC elements disposed on a printed circuit board, effectively and economically separating valuable metals and noble metals from the printed circuit board At the same time as the recovery, it is possible to prevent the loss caused by the additional process for separating the epoxy, polyamide substrate and glass fiber due to the breakage of the printed circuit board, and to recycle the processed printed circuit board itself. There is an advantageous effect that can be made.

In the process of recovering valuable metal or precious metal, electronic scrap is melted by current method and recovered as final valuable metal or precious metal. In the process of electric conduction during melting process in electric furnace, The cost of the recovered metal can be reduced by increasing the purity of the recovered metal of the electronic scrap and reducing the amount of the recovered metal.

1 is a block diagram of a valuable metal recovering apparatus according to an embodiment of the present invention;
2 is a schematic overall configuration diagram of a valuable metal recovering apparatus according to an embodiment of the present invention,
FIG. 3 is an operating state diagram of a grinded portion of a soldering surface according to an embodiment of the present invention,
4 is an operational state diagram of a part separator according to an embodiment of the present invention,
5 is a perspective view of an electronic scrap sorting unit according to an embodiment of the present invention,
6 is an operational state diagram of an electronic scrap sorting unit according to an embodiment of the present invention,
7 is a flowchart illustrating a method of recovering valuable metals according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings, which are intended to be illustrative of the invention in a manner that allows a person skilled in the art to easily carry out the invention, And this does not mean that the technical idea and scope of the present invention are limited.

FIG. 1 is a block diagram of a valuable metal recovering apparatus 100 according to an embodiment of the present invention, FIG. 2 is a schematic overall configuration diagram of a valuable metal recovering apparatus 100 according to an embodiment of the present invention, FIG. 3 is an operating state view of a brazing surface grinding part 20 according to an embodiment of the present invention, and FIG. 4 is an operational state view of a part separating part 30 according to an embodiment of the present invention.

The metal-free metal recovery apparatus 100 according to an embodiment of the present invention includes an input conveyor unit 10, a brazed surface grind unit 20, a component separation unit 30, and a component surface grind unit 40 .

The input conveyor unit 10 supplies the printed circuit board P such that the component surface CS on which the components are mounted faces in a predetermined direction and can be constituted by known means such as the conveyor belt shown in the drawing.

The grinded portion 20 of the soldering surface 20 is provided with a grinder 26 for grinding the solder surface SS which is the opposite surface of the component surface CS while transferring the printed circuit board supplied from the input conveyor portion 10 at the front end . This makes it possible not only to separate and recover the solder and the printed network attached to the printed circuit board but also to remove the parts mounted on the printed circuit board from the component separator 30 . In order to prevent the generation of dust, a wet grinding method is adopted and a spray nozzle 24 for spraying water onto the solder surface SS before grinding is provided at the front end of the grinder 26.

Particularly, according to an embodiment of the present invention, a soldering surface grinding portion 20 of a valuable metal recovering apparatus 100 is provided with a plurality of feeds (not shown) for elastically supporting a component surface CS and a soldering surface SS of a printed circuit board, A base 22 is provided.

The conveyance belt 22 includes a conveyance roller 221 and an elastic member 223. The conveyance roller 221 is driven by a separate driving source and rotates in the conveyance direction of the printed circuit board to convey the printed circuit board . The elastic member 223 elastically supports one side of the conveying roller 221 so that the conveying roller 221 can stably support the printed circuit board. This is because, in order to keep the grinding depth constant while the parts are fastened to the printed circuit board, it is necessary to change the supporting position on the component side CS side of the printed circuit board to which the components are fastened. The elastic member 223 is not limited to the illustrated coil spring, and various known means may be employed.

The component separating portion 30 is provided at the rear end of the above-described brazing surface grinding portion 20, and separates the component mounted on the component surface CS from the printed circuit board while discharging the printed circuit board. To this end, a feed roller 321 having the same structure as that of the feed belt 22 provided in the brazed surface grind part 20 and a feed belt 32 equipped with the elastic member 323 are provided. Since the conveying table 32 carries the printed circuit board and the parts are fastened to the printed circuit board in the part separating part 30, the conveying stand 32 separates the steel material parts from the printed circuit board through the separating means such as an electromagnet So as to separate the electronic parts from the recovered electronic parts. As the means for separating parts, a plurality of grips and the like capable of holding parts other than the above-described electromagnet may be employed. The separated parts are housed in a separate collection box and moved to a waste part sorting machine which is sorted by size by rotating body.

Particularly, the component separating portion 30 of the valuable metal recovering apparatus 100 according to an embodiment of the present invention may be provided with a component separating cutter 36.

The component separating cutter 36 includes a drive shaft 361 which is rotated in a predetermined direction by a drive source (not shown) and a plurality of gears 361 which are protruded on the outer peripheral edge of the drive shaft 361, And a cutter blade 363.

Since the cutter blade 363 advances in the pivoting direction as the drive shaft 361 rotates and is inclined in the pivoting direction, the distal end of the cutter blade 363 is connected to a part of the component mounted on the component surface CS of the printed circuit board And moves toward the lower side. The cutter blade 363 then hits the part from the bottom to the top as the drive shaft 361 rotates, thereby effectively separating the component from the substrate. A spray nozzle 34 for spraying water onto the component surface CS is provided at the front end of the component separator 36.

The component surface grinding section 40 is provided with a grinder 46 for wet grinding the component surface CS of the printed circuit board discharged from the component separating section 30 described above so that the component surface CS of the printed circuit board, So that it can be separated and recovered. Since the components are separated from the printed circuit board supplied to the component face grind part 40, the substrate can be transported by the conveyance belt 42 or the like, which is different from the solder side grind part 20 or the component separating part 30. [ have.

Meanwhile, the crude metal recovering apparatus 100 according to the embodiment of the present invention is further provided with a crimping portion 50 at the front end of the part separating portion 30.

The pressing portion 50 includes a pressing roller that is rotatably installed and presses the component in the direction of the component surface CS of the printed circuit board.

As described above, the component separating portion 30 is provided with the component separating cutter 36 so that the cutter blade 363 applies the blow from the lower part to the upper part of the component as the drive shaft 361 rotates. In this case, if the rotational direction of the drive shaft 361 is set to be opposite to the conveying direction of the printed circuit board, the amount of impact applied to the cutter blade 363 becomes large, and the cutter blade 363 is easily damaged. Therefore, it is preferable to make the rotating direction of the cutter blade 363 the same as the feeding direction of the printed circuit board.

At this time, since the height of the components mounted on the printed circuit board is different, when the component separator 36 having the same size of the cutter blade 363 is used, the distal end of the cutter blade 363 does not enter the lower part of the component, There arises a problem that the component can not be smoothly separated because it hits the upper part.

Therefore, the front end of the component separating section 30 is further provided with a crimping section 50, and the substrate is supplied to the component separating section 30 while the height of the component mounted on the printed circuit board is uniformly maintained by the pressing roller So that the components can be smoothly separated from the component separating section 30. [

The pressing portion 50 may be disposed at the front end of the brazed surface grinding portion 20, and in this case, it is also helpful to keep the grinding depth in the brazed surface grinding portion 20 constant.

FIG. 5 is a perspective view of an electronic scrap sorting unit 60 according to an embodiment of the present invention, and FIG. 6 is an operational state diagram of an electronic scrap sorting unit 60 according to an embodiment of the present invention.

The electronic scrap sorting unit 60 is further provided at the lower part of the component surface grinding unit 40 of the valuable metal recovering apparatus 100 according to an embodiment of the present invention.

In recovering valuable metals by using the above-mentioned input conveyor portion 10, the brazing surface grind portion 20, the component separating portion 30, and the component surface grinding portion 40, The grinding of the solder surface SS, the part separation, and the grinding operation of the component surface CS are continuously performed, thereby discharging parts such as solder and the printed network and the IC element from the solder surface SS. In order to smoothly collect the electronic scrap discharged, the printed circuit board is erected vertically so as to be fed and conveyed, and the feed conveyor unit 10, the brazed surface SS, the part surface CS grinded portions 20 and 40, It is preferable that the separator 30 is also arranged so as to be driven accordingly.

On the other hand, the electronic scrap discharged through the above-described part surface grinding part 40 is mainly a circuit printed on the part surface CS of the printed circuit board, but the parts not separated by the part separating cutter 36 are also cut together, . At this time, there is a need to selectively collect the printed network and components on the substrate.

The electronic scrap sorting unit 60 includes a collecting tank 62 having a resin discharge hole 621 and a separating plate 623 and an injection nozzle 64.

The collecting tank 62 is installed at a lower part of the component surface grinding part 40 and has a structure that the upper part is opened so that the electro scrap discharged vertically through the grinding operation can be received.

The spray nozzle 64 is installed on the collecting tank 62 and injects the fluid horizontally toward the vertically falling electronic scrap S. As a result, electronic scrap, which has a large specific gravity, falls down as it is, but electronic scrap such as a small specific gravity network moves in the direction of spraying depending on the specific gravity and falls. At this time, a plurality of separation plates 623 spaced apart in the spraying direction of the spray nozzle 64 are provided on the bottom surface of the collecting tank 62, so that they can be separated and stored according to the specific gravity of the scrap. A resin discharge hole 621 is formed on the lower side of the collection tank 62 so that the resin component floating in the collection tank 62 can be separated and discharged.

6 is a flowchart illustrating a method of recovering valuable metals according to an embodiment of the present invention.

The method for recovering valuable metals according to one embodiment of the present invention includes the steps of: (a) aligning and supplying a printed circuit board so that a component surface (CS) on which components are mounted faces in a predetermined direction; (b) (C) a step (S30) of separating the parts mounted on the part surface (CS) from the printed circuit board (S30), and (d) a step (S20) of wet grinding the soldering surface (SS) (S40) of wet-grinding the component surface (CS) of the separated printed circuit board.

(F) (d) may further include (e) compressing the upper part of the component so that the height of the component mounted on the printed circuit board is uniform before the step (b) or (c) The electronic scrap discharged in step S60 is separated and stored according to the specific gravity (S60).

The means for performing the steps (a) to (f) and the operation and effect are already described in the precious metal recovering apparatus 100, and therefore, this will be omitted.

As described above, an apparatus for recovering valuable metals from a printed circuit board according to the present invention and a recovering method using the same are characterized in that a grinding operation of a soldering surface (SS) of a substrate, a separating operation of parts and a grinding operation of a component surface (CS) It is possible to easily separate and recover valuable metals and noble metals of high purity from the PCB substrate, and the processed printed circuit board itself can be recycled, thereby increasing the resource recycling efficiency.

100: Oil-rich metal recovery device
P: printed circuit board CS: part surface
SS: soldering surface S: electronic scrap
10: Feed conveyor part
20: soldering surface grinding part 22: conveying stand
221: Feed roller 223: Elastic member
24: Spray nozzle 26: Grinder
30: part separating section 32:
321: Feed roller 323: Elastic member
34: Spray nozzle 36: Part separating cutter
361: drive shaft 363: cutter blade
40: part face grinding part 42: conveying belt
46: Grinder
50: a pressing part 52: a pressing roller
60: electronic scrap sorting unit 62:
621: resin discharge hole 623: separator plate
64: injection nozzle

Claims (8)

An input conveyor unit for supplying a printed circuit board such that a component surface on which the component is mounted faces in a predetermined direction;
A grinding portion having a grinder for wet grinding a solder surface, which is a surface opposite to the component surface, while transferring a printed circuit board supplied from the charging conveyor portion;
A component separating portion provided at a rear end of the brazed surface grind portion and separating the component mounted on the component surface while transferring the printed circuit board from the printed circuit board and discharging the component; And
And a component surface grinding portion having a grinder for wet grinding the component surface of the printed circuit board discharged from the component separating portion.
The method according to claim 1,
Wherein the brazed surface grinding portion and the component separating portion are provided,
There is provided a conveyance belt including a conveyance roller that rotates in a conveying direction of a printed circuit board and an elastic member that elastically supports the conveyance roller, wherein the conveyance belt has a plurality of Wherein the metal layer is a metal layer.
The method according to claim 1,
In the component separating portion,
And a component separating cutter formed on the outer peripheral edge of the drive shaft and including a plurality of cutter blades that are inclined in a rotating direction of the drive shaft. .
The method of claim 3,
At the front end of the solder side grind portion or the component separating portion,
And a pressing portion including a pressing roller rotatably installed and capable of pressing the component in the component surface direction of the printed circuit board,
And a printed circuit board is supplied from the printed circuit board to the soldering surface grind portion or the component separating portion in a state in which the height of the component mounted on the printed circuit board is uniformly maintained by the crimping portion. .
The method according to claim 1,
The printed circuit board is vertically erected and supplied and transported,
In the lower part of the part face grind part,
And an electronic scrap sorting unit including a scavenging tank having an open top and an injection nozzle horizontally disposed above the scavenging tank so that the electrostatic scrap falling vertically can be received,
A resin discharge hole is formed on the upper side of the collecting tank so that the floating resin can be discharged and a plurality of separating plates spaced apart in the spraying direction of the injection nozzle are provided on the bottom surface so that the vertically falling electronic scrap can be separated and stored Wherein the metal-rich metal is recovered from the printed circuit board.
(a) arranging a printed circuit board in such a manner that a component surface on which the component is mounted faces in a predetermined direction, and
(b) wet grinding the brazing surface which is the opposite surface of the component surface;
(c) separating the component mounted on the component surface from the printed circuit board; And
(d) wet grinding the component surface of the printed circuit board on which the component is detached; and recovering the valuable metal from the printed circuit board.
The method according to claim 6,
Prior to step (b) or step (c)
(e) pressing the upper part of the component so that the height of the component mounted on the printed circuit board is uniform.
The method according to claim 6,
(f) separating the electronic scrap discharged in the step (d) according to specific gravity; and recovering the metal scrap from the printed circuit board.

Images