KR101258789B1 - Method and apparatus for separating and recovering electric/electronic components and metal composition of printed circuit board - Google Patents

Abstract

PURPOSE: A method and a device for separating and collecting the components and metal substances of a printed circuit board are provided to collect all metal substances including low contents of rare metals from a printed circuit board by differently sorting electric and electronic devices and components, dust, and the components which are separated from the printed circuit board. CONSTITUTION: A method for separating and collecting the components and metal substances of a printed circuit board(PCB) includes: a step(S100) of polishing a soldering surface of a PCB using a polishing device; a step(S200) of collecting dust generated by polishing the soldering surface; a step(S300) of detaching and collecting electric and electronic devices and components attached to the surfaces of the components of the PCB; a step(S400) of separating the electric and electronic devices and components by part; and a step(S500) of respectively separating and collecting metal substances from the PCB from which the dust and the electric and electronic devices and components are detached. [Reference numerals] (AA) Start; (BB) End; (S100) Remove a metal plate and parts attached to a soldering surface of a printed circuit board; (S200) Polish the soldering surface of the printed circuit board; (S300) Collect and remove dust produced during polishing; (S400) Separate and collect electric and electronic parts attached to the printed circuit board; (S500) Separate metal substances and separate each part of electric and electronic components

Description

Method for separating and recovering components and metal components of a printed circuit board and a method for separating and recovering them according to the present invention {Method and apparatus for separating and recovering electric / electronic components and metal composition of printed circuit board}

The present invention relates to a method of separating and recovering a component and a metal component of a printed circuit board, and more particularly, to a separating and recovering device. By using the separation recovery device according to the present invention, the electronic circuit components, dust, and the printed circuit board from which the parts are removed are recovered and subjected to different sorting treatments, thereby recovering all components and metal components from the printed circuit board. The present invention relates to a method for separating and recovering components and metal components of a printed circuit board.

In general, a printed circuit board (PCB) is a control part used in most electrical and electronic parts, and a non-metallic component such as epoxy, plastic, resin, and glass fiber is used as a main component (about 70% or more). Copper (Cu) (less than about 16%), soldering material (less than about 4%), iron (Fe), ferrite (less than about 3%), nickel (less than about 2%), silver Rare (Ag) (less than about 0.05%), gold (Au) (less than about 0.03%), palladium (Pd) (less than about 0.01%), other bismuth (Bi), antimony (Sb), tantalum (Ta) It is composed of metal (less than about 0.01%).

Waste printed circuit boards composed of this composition are currently recycled after being treated in two ways. The first is a two-step shredding process of the entire substrate, and then separated into metal and non-metal by magnetic screening, electrostatic screening, etc., and the wet process to recover the metal, the second method after the first shredding of the substrate, After pyrolysing the non-metallic component at about 800 ° C., the metal is extracted by dry melting or re-crushed, and is separated from the metal and the non-metal using magnetic separation, electrostatic separation, and the like.

However, the above-described prior art is only a process of extracting and recycling only precious metals such as gold and silver, and copper, iron, and nickel having a high content of components, and thus a recovery process for low content rare metals is not considered. Accordingly, there is a need for an extraction process and a high purity of low content rare metals.

The present invention is to solve the conventional problems as described above, the structure is complicated, the electrical circuit using the separation recovery device according to the present invention without breaking the printed circuit board to which many electrical and electronic components are attached Separation and recovery method of printed circuit boards to recover all components and metal components from printed circuit boards by recovering printed circuit boards from which electronic components, dust, and parts are removed, and performing different sorting processes therefrom. And to provide a separate recovery device accordingly.

The present invention provides a method of polishing a soldering surface of a printed circuit board using a polishing apparatus, recovering dust generated during polishing of the soldering surface of the printed circuit board, and polishing the soldering surface of the printed circuit board. Removing and recovering the electrical and electronic parts attached to the component surface, separating the electrical and electronic parts by parts, and separating and recovering the dust and metal components contained in each of the printed circuit boards from which the electronic and electronic parts are removed. It provides a method for separating and recovering a component and a metal component of a printed circuit board comprising the step.

According to another aspect of the invention, the present invention, the polishing apparatus for removing the electrical and electronic components attached to the printed circuit board by polishing the soldering surface of the printed circuit board; And a dust recovery part for recovering dust generated during polishing of the soldering surface of the printed circuit board.

According to the present invention, a method for separating and recovering a component of a printed circuit board and a metal component according to the present invention, by removing and separating an electrical and electronic component attached to a printed circuit board without breaking the printed circuit board, There is an effect that can efficiently recover the components and metal components at low cost.

In addition, it is possible to recover all metal components, including low content rare metals, from the printed circuit board by performing different sorting treatment on the metal plate material, electrical and electronic parts, dust, and printed circuit board separated from the printed circuit board. There is.

In addition, by performing a non-heat polishing method using a polishing apparatus to separate the electrical and electronic components from the printed circuit board, it is possible to prevent the human body damage or secondary pollution sources when separating the electrical and electronic components from the printed circuit board. In addition, it is advantageous to separate various electric and electronic components from the printed circuit board, and the process is simple and the processing capacity is increased, which is advantageous in industrialization.

1 is a perspective view of a component and a metal component separation recovery device of the printed circuit board of the present invention.
2 is a diagram illustrating an embodiment of a printed circuit board of the present invention.
3 is a view illustrating an operation in which a printed circuit board is mounted and transferred to the polishing apparatus shown in FIG. 1.
FIG. 4 is a side view of the component and the metal component recovery and recovery device of the printed circuit board shown in FIG. 1.
FIG. 5 is a plan view illustrating a component and a metal component separating and recovering device of the printed circuit board shown in FIG. 1.
6 is a flow chart showing the entire process of the separate recovery method of components and metal components of the printed circuit board of the present invention.
FIG. 7 is a process diagram illustrating a method of separating metal components contained in each of a metal plate, dust, and stripped printed circuit boards, and a method of separating electrical and electronic components by parts.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, and in the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and redundant description thereof will be omitted. Shall be.

1 to 5 illustrate a component and a metal component separation and recovery device 100 of a printed circuit board according to an embodiment of the present invention. The component and metal component separation and recovery device 100 of the printed circuit board is a device for recovering and recycling components and metal components from a printed circuit board (PCB), particularly a closed printed circuit board. 200 and the dust recovery unit 300.

1 to 3, the polishing apparatus 200 described in the embodiment of the present invention polishes the soldering surface 52 of both sides of the printed circuit board 50 to be attached to the printed circuit board 50. Means an apparatus for removing and recovering the electronic parts 1 to 28.

In general, a variety of electrical and electronic devices and components such as resistors, capacitors, IC chips, etc. are attached to the printed circuit board 50 by soldering, and these electrical and electronic parts contain various rare metals. It needs to be separated from the printed circuit board 50 and recycled.

In FIG. 2, various electrical and electronic components 1 to 28 are attached or mounted on the component surface 51, which is the opposite surface of the soldering surface 52 of the printed circuit board 50. Referring to the electrical and electronic components illustrated in FIG. 2 in order of reference numerals, respectively, a capacitor 1, a diode 2, an oscillator 3, a capacitor 4, a zener diode 5, an inductor 6, and a ceramic capacitor (7), variable inductor (8), cassette deck (9), variable resistor (10), IC chip (11), terminal (12), electrolytic capacitor (13), resistor (14), oxide film resistor (15) , Capacitor 16, EMI Filter 17, capacitor 18, IC chip 19, resistors 20, 21, inductors 22, 23, IC chips 24, 25, ceramic capacitors 26 Transistor 27 and wire 28.

Various researches have been conducted to separate electrical and electronic components from printed circuit boards. The first method is a manual separation method using a tool such as a chisel, hammer, or torch, and the second method prints up to about 250 ° C. A method of directly heating a circuit board or separating using a hot hot air or a liquid hot medium, and a third method has been proposed to dissolve the soldering material of the printed circuit board using a chemical solvent.

However, the first method has a problem that the processing speed is very slow and damages to the human body. The second method not only generates toxic harmful gas by heating the printed circuit board, but also has a different desoldering speed due to the variety of soldering materials. Therefore, there is a problem that the setting of a constant heating time is difficult and the separation efficiency is low. The third method uses a chemical solvent to dissolve the soldering material of the printed circuit board, so the dissolution rate is low, and thus the processing capacity is low. Secondary contaminants such as waste chemical solvents need to be treated after the treatment. there is a problem.

Compared with the conventional research as described above, in the present invention, in the state in which the printed circuit board 50 is not shredded, the electrical and electronic components are separated from the printed circuit board 50 by using the polishing apparatus 200. After the separation process of the electrical and electronic components, metal components are recovered through a separation process using physical properties such as specific gravity, magnetic properties, and shape.

Specifically, referring to FIGS. 3 to 5, the polishing apparatus 200 of the component and the metal component separation recovery device 100 of the printed circuit board of the present invention may be formed on the body portion 260 and the body portion 260. A plurality of cylinders 220 and a cylinder 220 for pressing the transfer roller 210 on which the printed circuit board 50 is stacked, the printed circuit board 50 stacked on the transfer roller 210, and the cylinder 220. Polishing stones 240 for grinding the soldering surface 52 of the transfer unit 230 to transfer the printed circuit board 50 on the transfer roller 210, the transfer circuit 230 by the transfer unit 230 by moving ) And the abrasive stone driving unit 250.

Specifically, the printed circuit board 50 is placed on the transfer roller 210 provided on the predetermined body portion 260. At this time, when the printed circuit board 50 is placed on the transfer roller 210, the soldering surface 52 of both sides of the printed circuit board 50 faces downward.

After the printed circuit board 50 is placed on the transfer roller 210, the printed circuit board 50 is pressed at a constant pressure by using the plurality of cylinders 220.

In the embodiment shown in Figures 1 to 4 the number of cylinders 220 is nine, there is an advantage that can be compressed by pressing the printed circuit boards of various sizes by arranging the nine pressure cylinders in a grid.

In addition, since the cylinder for crimping the printed circuit board 50 is a pressure cylinder type, the printed circuit board 50 can be passed through the polishing apparatus 200 by applying a constant pressure to the entire surface of the printed circuit board 50 so that the printed circuit board can be damaged during the polishing process. There is an advantage that can be prevented.

The conveying unit 230 means a means for compressing the cylinder 220 and conveying it on the conveying roller 210. Referring to FIG. 3, the conveying unit 230 includes a mounting table 231, a rotating table 232, and a conveying driving unit ( 233).

A cylinder 220 is mounted to the mount 231, and the mount 231 is coupled to the swivel 232 to be rotated together by the rotation of the swivel 232. The transfer driver 233 is configured as a drive motor capable of providing the shank moving pressure of the cylinder 220 and the rotation driving force of the swivel 232.

In the state where the printed circuit board 50 is compressed on the transport roller 210 due to the lower movement of the cylinder 220, the mounting table 231 is driven on the transport roller 210 by the power of the transport drive unit 233. As it rotates at a constant speed, the compressed printed circuit board 50 is transferred to the place where the abrasive stone 240 is installed. Since the cylinder 220 rotates while the pressure is applied, the printed circuit board 50 can move automatically, and it becomes possible to pass through the polishing apparatus 200 at a constant speed. There is an advantage that can be adjusted.

The abrasive stone driving unit 250 includes an abrasive stone support part 253, an up and down adjustment part 252, and an abrasive stone motor 251. Specifically, the abrasive stone 240 is installed in the abrasive stone support 253, the upper and lower control unit 252 is connected to the abrasive stone support 253. Therefore, in order to set the polishing depth of the printed circuit board 50 differently according to the height of the soldering surface 52 of the printed circuit board 50, the polishing depth is adjusted while moving the vertical adjustment part 252 up and down. Can be. The abrasive stone motor 251 supplies a rotational driving force to the abrasive stone 240, and if necessary to adjust the polishing depth, the vertical adjustment unit 252 supplies the power to operate up and down.

When the printed circuit board 50 is transferred onto the abrasive stone 240, the rotation of the rotating table 232 is stopped under the control of the transfer driver 233.

In this case, the soldering surface 52 of the printed circuit board 50 faces the abrasive stone 240, and the soldering surface 52 is polished and removed while the abrasive stone 240 is rotated by the abrasive stone driver 250. Components such as fixing pins (not shown) present on the soldering surface 52 of the printed circuit board 50 may also be removed during the polishing process.

In this case, the abrasive stone driver 250 may adjust the rotation RPM of the abrasive stone 240 necessary for polishing the soldering surface 52, for example, by setting the maximum value to 4000 ~ 5000 RPM can be controlled.

In the case of polishing the soldering surface 52 by rotating the abrasive stone 240, the polishing depth of the printed circuit board 50 may be set according to the height of the soldering surface 52 to bring about a difference in separation / removal rate. By setting the polishing depth to such a degree that the soldering surface 52 can be completely removed, the electronic and electronic components can be completely removed and separated. The adjustment of the polishing depth may be implemented by adjusting the height of the abrasive stone 240 is installed up and down by operating the vertical adjustment unit 252 up and down.

When the soldering surface 52 is removed as described above, most of the electrical and electronic components 1 to 28 attached to the printed circuit board 50 are automatically removed and separated. Even if it is, it is completely separated by a light impact such as tapping.

Compared with the conventional methods for separating electrical and electronic parts using such a polishing device and various studies, the separation process speed of the electrical and electronic parts is increased without generating toxic gas or secondary pollutants such as waste chemical solvents. Significantly faster, there is an advantage that it is very advantageous to apply to industrialization, automation.

Referring to FIG. 1, in the printed circuit board component and the metal component separating and recovering device 100, the dust collection to recover dust generated during polishing of the soldering surface of the printed circuit board using the polishing apparatus 200 is performed. The unit 300 further includes.

The dust recovery part 300 has one end coupled to the polishing apparatus 200, and coupled to the other end of the dust collecting duct 310 and the other end of the dust collecting duct 310 to collect dust generated during polishing. It includes a filter unit 320 for collecting the dust passed.

One side of the body portion 260 of the polishing apparatus 200 is formed with a suction hole 261 for collecting the dust, the dust collecting duct 310 is coupled to the suction hole 261. Referring to FIG. 1, the suction hole 261 is formed at one side of the body 260, and one dust collecting duct 310 is coupled to the suction hole 261, but the number thereof is not limited thereto. In order to increase dust collection efficiency, a plurality of suction holes may be formed at both sides of the body 260, and a plurality of dust collecting ducts may be respectively coupled to corresponding suction holes.

Dust generated when the soldering surface 52 of the printed circuit board 50 is polished and removed by the abrasive stone 240 is collected into the filter unit 320 through the suction hole 261 and the dust collecting duct 310, and collected. The dust is then classified into a plurality of stages.

The electrical and electronic components 1 to 28 are separated from the printed circuit board 50 through the polishing apparatus 200, and after dust is collected, the printed circuit board from which the dust and electrical and electronic components 1 to 28 are removed. (50) The metal components contained in each are separated and recovered.

When the component and the metal component separation recovery method of the printed circuit board using the component and the metal component separation recovery device 100 according to the present invention configured as described above will be described in detail by the following examples.

6 is a flow chart showing the entire process of the separate recovery method of components and metal components of the printed circuit board of the present invention.

Referring to FIG. 6, first, the metal sheet and parts attached to the soldering surface 52 of the printed circuit board 50 are removed in advance and recovered (S100). That is, before the printed circuit board 50 is placed on the transfer roller 210, when the metal plate material and parts are attached to the soldering surface 52 of the printed circuit board 50, the metal plate material and the parts are removed in advance and recovered. can do. In addition, when the metal plate material and parts on the back of the printed circuit board 50 are largely drawn to the outside, the printed circuit board 50 may be inserted into the polishing apparatus 200 in the process of pressing, conveying, and polishing the printed circuit board 50. 50 may be damaged, so it is necessary to prevent it. The metal components contained in the recovered metal sheet and parts are separated and recovered thereafter, and will be described in detail later.

In the present embodiment, a metal plate material such as a casing, a heat sink, and the like attached to the rear surface (soldering surface) of the substrate of the printed circuit board is removed in advance for a closed video printed circuit board (VCR PCB). If the metal plate or part is not attached to the soldering surface, the grinding process may be performed immediately. However, even if the same VCR PCB is used, the metal plate or part may be attached to the soldering surface for each manufacturer or year. Prior to direct entry into the grinding process, the metal plate or parts attached to the VCR PCB soldering surface in advance are manually cut and removed. In particular, if the externally drawn height of the part is 5 mm or more, it is cut and removed as with the metal plate part.

After removing the metal plate or the component and recovering it in advance, the printed circuit board 50 is placed on the transfer roller 210 provided on the body 260 and then printed using the plurality of cylinders 220. The circuit board 50 is pressed at a constant pressure, and in this state, the cylinder 220 is rotated at a constant speed on the transfer roller 210 by the transfer unit 230.

When the cylinder 220 rotates and the printed circuit board 50 is transferred to the abrasive stone 240 position, the rotation of the swivel table 232 is stopped under the control of the transfer driver 233, and the abrasive stone driver 250 As the abrasive stone 240 rotates, the soldering surface 52 and other components are polished and removed (step S200). Here, dust is generated while the soldering surface 52 and the like are polished, and the generated dust is recovered to the filter unit 320 through the dust collecting duct 310 (step S300).

On the other hand, after the polishing of the soldering surface 52 is completed, the electrical and electronic components attached to the component surface 51 of the printed circuit board 50 is removed and recovered (step S400). Most of the electronic and electronic components 1 to 28 attached to the printed circuit board 50 are automatically removed and separated, but even if there are electrical and electronic components 1 to 28 that cannot be separated, they have a light impact such as tapping. By this, easy separation is possible.

As a result of separating all of the waste VCR PCBs of the present embodiment, the weight of the metal plate and parts removed beforehand is about 14.6% of the total weight, about 14.9% on the separated electrical and electronic parts, about 11.8% on the dust, and the printed circuit is removed. The substrate accounted for about 57.8%.

That is, before the separation process, the loss ratio was only less than 1% compared to the total weight of the closed printed circuit board, and the metal contained in each of the metal sheets, dust, and stripped printed circuit boards secured through the above-described steps was removed. By separating and recovering the components, and separating the electronic components by parts (step S500), it is possible to secure an advantageous situation in which most of the metallic components contained in the printed circuit board can be recovered separately.

FIG. 7 is a flowchart illustrating a method of separating metal components contained in each of the metal plate material, dust, and stripped printed circuit boards, and a method of separating electrical and electronic components by parts in step S500 of FIG. 6. The method for separating metal components from the substrate and the method for separating parts of electrical and electronic components will be described in detail by way of examples.

Referring to FIG. 7, in relation to a method of separating and recovering a metal component of a metal plate material that is previously removed and recovered from the soldering surface 52 of the closed printed circuit board 50, the metal plate material has a high metal content. Therefore, the metal component is separated and recovered through the dry melting process (step S511).

Meanwhile, referring to the process of separating and recovering a metal component of the printed circuit board on which the electronic and electronic parts are removed (step S520), first, the printed circuit board (closed VCR PCB) is cut into a predetermined size (for example, 6 cm ㅧ 8 cm) ( Step S521), the cut circuit board is cut using a cutting mill (step S522).

The pulverized particles are passed through a particle size of a predetermined size, and then classified using a sieve having a predetermined size. Here, in order to efficiently perform classification according to the particle size, two-stage classification is performed. Specifically, after passing the pulverized particles through the particle diameter of a predetermined size, the sieve having a size of 710 μm (# according to the standard specification list) After the first sieve (sieve) using (25 sieve) (step S523), the second sieve using a sieve (# 80 sieve) having a body size of 180㎛ (step S524).

Here, it is determined whether the particle diameter of the pulverized particles exceeds 180㎛ (step S525), the non-passing particles that do not pass through the sieve having a body size of 180㎛, that is, the particles that do not pass through the sieve because the particle diameter exceeds 180㎛ Is selected using a shaking table (shaking table) (S526 step), the particles passing through the sieve having a body size of 180㎛, that is, the particle diameter is less than 180㎛ sieve passed through the sieve air separation method Screening the metal and non-metallic material through (S527 step).

Here, the air selection method is a technique for effectively selecting a mixture having different specific gravity by using air (wind power), in particular, when the air separator has a zigzag flow path, a predetermined air supply unit in the process of passing the particles through the zigzag flow path Air (air) supplied from (not shown) can effectively separate the metal and non-metallic material contained in the particles.

On the other hand, when the metal component separation recovery process (step S530) of the dust generated during polishing is described, the dust is classified into a plurality of steps (step S531).

For example, in the case of classifying the dust in seven stages, the treated particle size according to the standard specification list # 70 or more (eye size 212㎛ or more), # 70 ~ # 100 (eye size 150㎛ ~ 212㎛), # 100 ~ # 140 (eye size 106㎛ ~ 150㎛), # 140 ~ # 200 (eye size 75㎛ ~ 106㎛), # 200 ~ # 270 (eye size 53㎛ ~ 75㎛), # 270 ~ # 325 (eye Size 45 µm to 53 µm) and # 325 or less (eye size 45 µm or less). In this way, by classifying the dust in a plurality of stages, the recovery rate of the metal can be increased, and the metal and the non-metallic substance are selected through the air selection method for each classified dust (step S532).

As described above, the reason that the separation of the metal components from the printed circuit board from which the electronic and electronic components are removed is separated from the dust is because the dust is present in the fine powder and the metal components are almost the soldering materials. This is because the separation and recovery of the metal components can be simply processed as compared with the above.

Meanwhile, referring to the process of separating and recovering the removed electrical and electronic parts by parts (S540), the removed electrical and electronic parts are classified into reusable parts and then subjected to classification, magnetic screening, and heavy liquid separation.

In detail, the separated electrical and electronic parts may be separated and recovered for each part, and then the recovered metal components may be separated and recovered through reuse or metal extraction processes.

In order to separate parts by parts, first, the removed electric and electronic parts are classified using a sieve having a particle size of a predetermined size to determine whether the particle diameter of the electric and electronic parts exceeds a predetermined size, for example, 9.5 mm. (Step S541).

Here, the magnetic force selection for the electrical and electronic components that did not pass through the sieve (step S542), and the magnetic force selection (step S543) for the electrical and electronic components passed through the sieve, high specific gravity and low through the heavy liquid separation using the heavy liquid Separation by specific gravity (step S544).

Magnetic screening is a method of separating and screening magnetic materials and materials that do not. Magnetic and electronic components that do not pass through the sieve can be easily separated into metal (parts) simply by magnetic screening because of the large particle size. have.

In the case of the electric and electronic parts that have passed through the sieve, since magnetic separation is not possible, the separation of the heavy liquid is further performed after the magnetic separation. The heavy liquid separation is a method of separating and sorting by using the specific gravity difference of the particles. When the mixture composed of particles having different specific gravity is turbid with a liquid (heavy liquid) having a medium specific gravity between them as a medium, the particles are lighter than the liquid. Is floating and heavy particles are settled.

In this way, by separately recovering the removed electrical and electronic parts by parts (by metal), the process costs can be greatly reduced when the electrical and electronic parts are reused later or the electrical and electronic parts are introduced into the metal extraction process. There is this.

As described above, according to the present invention, the metal plate material, electrical and electronic parts, dust, and the printed circuit board in which the parts are separated according to the present invention are subjected to different sorting treatments. There is an effect of recovering the metal component, it is possible to reduce the cost in the process by easily separating the electrical and electronic components for each part.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1 ~ 28: Electrical and Electronic Component 50: Printed Circuit Board
51: component surface 52: soldering surface
100: separation and recovery device of the metal component of the printed circuit board
200: polishing apparatus 210: feed roller
20: cylinder 230: transfer part
240: abrasive stone 250: abrasive stone driving unit
260: body portion 261: suction hole
300: dust collection unit 310: dust collection duct
320: filter unit

Claims (12)

Polishing the soldering surface of the printed circuit board using a polishing apparatus;
Recovering dust generated during polishing of the soldering surface of the printed circuit board;
After polishing the soldering surface, removing and recovering the electrical and electronic components attached to the component surface of the printed circuit board;
Separating the electrical and electronic components by parts; And
And separating and recovering the metal component contained in each of the dust and the printed circuit board from which the electric and electronic parts have been removed. The method according to claim 1,
Separating the electrical and electronic components by parts,
Classifying the electric and electronic parts using a sieve having a particle size of a predetermined size;
Magnetically selecting the electric / electronic parts that have not passed through the sieve; And
Separation and recovery of the components and metal components of the printed circuit board comprising the step of separating the heavy liquid using the heavy liquid after the magnetic force selection for the electrical and electronic components passed through the sieve. The method according to claim 1,
Before the polishing of the soldering surface of the printed circuit board, the metal sheet and the components attached to the soldering surface of the printed circuit board further comprising the step of removing and recovering the separated and metal components of the printed circuit board further comprising Recovery method. The method according to claim 3,
Separating and recovering the metal component,
Separating and recovering the metal component contained in the metal plate member by performing a dry melt treatment on the metal plate member. The method according to claim 1,
Separating and recovering the metal component,
And separating and recovering the component and the metal component of the printed circuit board, comprising the steps of classifying the dust in a plurality of steps. The method according to claim 5,
Separating and recovering the metal component,
Separating and recovering the components and metal components of the printed circuit board further comprises the step of sorting the air for each dust classified in the plurality of steps. The method according to claim 1,
Separating and recovering the metal component,
Cutting the printed circuit board to a predetermined size with respect to the printed circuit board from which the electronic and electronic component is removed;
Grinding the printed circuit board cut to a predetermined size using a cutting mill;
Passing the pulverized particles to a particle size of a predetermined size, and then classifying the particles using a sieve having a predetermined size of the body; And
Printed circuit, characterized in that the passing particles of the sieve screening the metal and non-metallic material through the air screening, the non-passing particles of the sieve screening the metal and non-metallic material using a shaking table (shaking table) Separation and recovery method of components and metal components of the substrate. A polishing apparatus which removes and recovers electrical and electronic components attached to the printed circuit board by polishing a soldering surface of the printed circuit board; And
And a dust recovery part for recovering dust generated during polishing of the soldering surface of the printed circuit board. The method according to claim 8,
The polishing apparatus,
A transfer roller on which the printed circuit board is stacked;
A plurality of cylinders for pressing the printed circuit board stacked on the transport roller;
A transfer unit for moving the cylinder to transfer the printed circuit board onto the transfer roller; And
Separation and recovery of components and metal components of a printed circuit board comprising a polished stone for polishing the soldering surface of the printed circuit board transferred by the transfer unit. The method according to claim 9,
The polishing apparatus further includes a polishing stone driving unit for supplying a rotational driving force to the polishing stone,
The abrasive stone driving unit,
An abrasive stone support portion on which the abrasive stone is installed;
A vertical adjustment part connected to the abrasive stone support part and capable of moving; And
Separation and recovery device for a component and a metal component of a printed circuit board comprising a abrasive stone motor for supplying a rotational driving force to the abrasive stone. The method according to claim 9,
The transfer unit
A mounting table on which the cylinder is mounted;
A swivel coupled to the mount and rotating the mount; And
Separation and recovery device for a component and a metal component of the printed circuit board, characterized in that it comprises a transfer drive for supplying the moving pressure of the cylinder and the rotational driving force of the swivel. The method according to claim 8,
The dust recovery unit,
A dust collecting duct having one end coupled to the polishing apparatus to collect dust generated during polishing; And
And a filter unit coupled to the other end of the dust collecting duct to collect dust passing through the dust collecting duct.

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