CN108242441A - 一种led - Google Patents

一种led Download PDF

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Publication number
CN108242441A
CN108242441A CN201611202975.8A CN201611202975A CN108242441A CN 108242441 A CN108242441 A CN 108242441A CN 201611202975 A CN201611202975 A CN 201611202975A CN 108242441 A CN108242441 A CN 108242441A
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CN
China
Prior art keywords
substrate
heat
conducting block
luminescence
led
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Pending
Application number
CN201611202975.8A
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English (en)
Inventor
于景国
其他发明人请求不公开姓名
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Nanjing Lu Bo Lier Pml Precision Mechanism Ltd
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Nanjing Lu Bo Lier Pml Precision Mechanism Ltd
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Application filed by Nanjing Lu Bo Lier Pml Precision Mechanism Ltd filed Critical Nanjing Lu Bo Lier Pml Precision Mechanism Ltd
Priority to CN201611202975.8A priority Critical patent/CN108242441A/zh
Publication of CN108242441A publication Critical patent/CN108242441A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/641Heat extraction or cooling elements characterized by the materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明公开了一种led,包括基板、导热块、左电极、右电极、发光芯片和硅胶,其特征在于:所述的导热块在基板内,为同一平面层,所述的左电极在基板的左端,所述的右电极在基板的右端,所述的发光芯片在导热块上,所述的硅胶在基板上,所述的发光芯片在硅胶内;其特征还在于:所述的发光芯片为三颗发光芯片。本发明公开的一种led,使用三颗发光芯片并联连接在电极上,在利用导热块的导热作用将发光芯片的热量散发出去,形成高亮的led。

Description

一种led
技术领域
本发明涉及led分装结构领域,尤其是一种led。
背景技术
发光二极管简称为LED。由含镓(Ga)、砷(As)、磷(P)、氮(N)等的化合物制成。当电子与空穴复合时能辐射出可见光,因而可以用来制成发光二极管。在电路及仪器中作为指示灯,或者组成文字或数字显示。砷化镓二极管发红光,磷化镓二极管发绿光,碳化硅二极管发黄光,氮化镓二极管发蓝光。因化学性质又分有机发光二极管OLED和无机发光二极管LED。
Led虽然具有以上的特点,但是在大功率上还是欠缺,尤其是需要极高亮度的产所,单颗led无法胜任。
发明内容
针对以上问题,本发明公开的本发明公开的一种led,使用三颗发光芯片并联连接在电极上,在利用导热块的导热作用将发光芯片的热量散发出去,形成高亮的led。
本发明公开的一种led,包括基板、导热块、左电极、右电极、发光芯片和硅胶,其特征在于:所述的导热块在基板内,为同一平面层,所述的左电极在基板的左端,所述的右电极在基板的右端,所述的发光芯片在导热块上,所述的硅胶在基板上,所述的发光芯片在硅胶内;其特征还在于:所述的发光芯片为三颗发光芯片。
本发明公开的一种led,具有可靠的散热性,以及满足高亮度的使用要求。
附图说明
图1位本发明的结构示意图。
1、基板 2、导热块 3、左电极 4、右电极 5、发光芯片 6、硅胶。
具体实施方式
下面结合附图和具体实施方式,进一步阐明本发明,应理解下述具体实施方式仅用于说明本发明而不用于限制本发明的范围,在阅读了本发明之后,本领域技术人员对发明的各种等价形式的修改均落于本申请所附权利要求所限定的范围。
如图1所示,本发明公开了一种led,包括基板、导热块、左电极、右电极、发光芯片和硅胶,其特征在于:所述的导热块在基板内,为同一平面层,所述的左电极在基板的左端,所述的右电极在基板的右端,所述的发光芯片在导热块上,所述的硅胶在基板上,所述的发光芯片在硅胶内;其特征还在于:所述的发光芯片为三颗发光芯片。
作为一种优选,所述的三颗发光芯片为同一颜色发光芯片。
作为一种优选,所述的三颗发光芯片的颜色为白色。
作为一种优选,所述的三颗发光芯片的颜色为红色。
作为一种优选,所述的三颗发光芯片的颜色为蓝色。
作为一种优选,所述的三颗发光芯片的颜色为黄色。
作为一种优选,所述的导热块为铝材料制成。
作为一种优选,所述的导热块为铜材料制成。
作为一种优选,所述的导热块为合金材料制成。

Claims (4)

1.一种led,包括基板、导热块、左电极、右电极、发光芯片和硅胶,其特征在于:所述的导热块在基板内,为同一平面层,所述的左电极在基板的左端,所述的右电极在基板的右端,所述的发光芯片在导热块上,所述的硅胶在基板上,所述的发光芯片在硅胶内;其特征还在于:所述的发光芯片为三颗发光芯片。
2.根据权利要求1所述的一种led,其特征在于:所述的三颗发光芯片为同一颜色发光芯片。
3.根据权利要求2所述的一种led,其特征在于:所述的三颗发光芯片的颜色为白色、红色、蓝色、黄色。
4.根据权利要求1所述的一种led,其特征在于:所述的导热块为铝、铜、合金材料制成。
CN201611202975.8A 2016-12-23 2016-12-23 一种led Pending CN108242441A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611202975.8A CN108242441A (zh) 2016-12-23 2016-12-23 一种led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611202975.8A CN108242441A (zh) 2016-12-23 2016-12-23 一种led

Publications (1)

Publication Number Publication Date
CN108242441A true CN108242441A (zh) 2018-07-03

Family

ID=62703390

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611202975.8A Pending CN108242441A (zh) 2016-12-23 2016-12-23 一种led

Country Status (1)

Country Link
CN (1) CN108242441A (zh)

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Application publication date: 20180703