CN108231984A - 一种相分离手段实现的钙钛矿图案化膜片及其制作方法 - Google Patents
一种相分离手段实现的钙钛矿图案化膜片及其制作方法 Download PDFInfo
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- CN108231984A CN108231984A CN201810094421.3A CN201810094421A CN108231984A CN 108231984 A CN108231984 A CN 108231984A CN 201810094421 A CN201810094421 A CN 201810094421A CN 108231984 A CN108231984 A CN 108231984A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Led Devices (AREA)
Abstract
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CN201810094421.3A CN108231984A (zh) | 2018-01-31 | 2018-01-31 | 一种相分离手段实现的钙钛矿图案化膜片及其制作方法 |
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CN201810094421.3A CN108231984A (zh) | 2018-01-31 | 2018-01-31 | 一种相分离手段实现的钙钛矿图案化膜片及其制作方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108987613A (zh) * | 2018-07-06 | 2018-12-11 | 致晶科技(北京)有限公司 | 钙钛矿量子点阵列的制备方法 |
WO2020149661A1 (en) * | 2019-01-16 | 2020-07-23 | Seoul National University R&Db Foundation | Biomimcry quantum scale composite, method for preparing thereof and quantum dot dye for solar cell comprising the same |
CN111490144A (zh) * | 2019-01-28 | 2020-08-04 | 致晶科技(北京)有限公司 | 量子点图案化薄膜的制备方法及图案化薄膜 |
CN113130823A (zh) * | 2019-12-30 | 2021-07-16 | Tcl集团股份有限公司 | 光电器件及其制备方法 |
Citations (8)
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CN101952195A (zh) * | 2008-02-13 | 2011-01-19 | 美光科技公司 | 嵌段共聚物圆柱体的一维阵列和其应用 |
US20140091435A1 (en) * | 2012-10-02 | 2014-04-03 | Tokyo Electron Limited | Etching of Block-Copolymers |
US20140131839A1 (en) * | 2012-11-14 | 2014-05-15 | Tokyo Electron Limited | Etching Method Using Block-Copolymers |
US20140370718A1 (en) * | 2013-06-14 | 2014-12-18 | Tokyo Electron Limited | Etch process for reducing directed self assembly pattern defectivity using direct current positioning |
CN105051870A (zh) * | 2013-04-16 | 2015-11-11 | 东京毅力科创株式会社 | 形成图案的方法 |
WO2016043005A1 (ja) * | 2014-09-17 | 2016-03-24 | 富士フイルム株式会社 | パターン形成方法、電子デバイスの製造方法、電子デバイス、ブロック共重合体、及び、ブロック共重合体の製造方法 |
WO2016043004A1 (ja) * | 2014-09-17 | 2016-03-24 | 富士フイルム株式会社 | パターン形成方法、パターン膜、電子デバイスの製造方法、電子デバイス、ブロック共重合体、及び、パターニング材料 |
CN107145039A (zh) * | 2017-04-26 | 2017-09-08 | 南京理工大学 | 一种简单快速图案化钙钛矿量子点的方法 |
-
2018
- 2018-01-31 CN CN201810094421.3A patent/CN108231984A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101952195A (zh) * | 2008-02-13 | 2011-01-19 | 美光科技公司 | 嵌段共聚物圆柱体的一维阵列和其应用 |
US20140091435A1 (en) * | 2012-10-02 | 2014-04-03 | Tokyo Electron Limited | Etching of Block-Copolymers |
US20140131839A1 (en) * | 2012-11-14 | 2014-05-15 | Tokyo Electron Limited | Etching Method Using Block-Copolymers |
CN105051870A (zh) * | 2013-04-16 | 2015-11-11 | 东京毅力科创株式会社 | 形成图案的方法 |
US20140370718A1 (en) * | 2013-06-14 | 2014-12-18 | Tokyo Electron Limited | Etch process for reducing directed self assembly pattern defectivity using direct current positioning |
WO2016043005A1 (ja) * | 2014-09-17 | 2016-03-24 | 富士フイルム株式会社 | パターン形成方法、電子デバイスの製造方法、電子デバイス、ブロック共重合体、及び、ブロック共重合体の製造方法 |
WO2016043004A1 (ja) * | 2014-09-17 | 2016-03-24 | 富士フイルム株式会社 | パターン形成方法、パターン膜、電子デバイスの製造方法、電子デバイス、ブロック共重合体、及び、パターニング材料 |
TW201619277A (zh) * | 2014-09-17 | 2016-06-01 | Fujifilm Corp | 圖案形成方法、圖案膜、電子元件的製造方法、電子元件、嵌段共聚合物及圖案化材料 |
CN107145039A (zh) * | 2017-04-26 | 2017-09-08 | 南京理工大学 | 一种简单快速图案化钙钛矿量子点的方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108987613A (zh) * | 2018-07-06 | 2018-12-11 | 致晶科技(北京)有限公司 | 钙钛矿量子点阵列的制备方法 |
WO2020149661A1 (en) * | 2019-01-16 | 2020-07-23 | Seoul National University R&Db Foundation | Biomimcry quantum scale composite, method for preparing thereof and quantum dot dye for solar cell comprising the same |
CN111490144A (zh) * | 2019-01-28 | 2020-08-04 | 致晶科技(北京)有限公司 | 量子点图案化薄膜的制备方法及图案化薄膜 |
CN111490144B (zh) * | 2019-01-28 | 2024-02-02 | 致晶科技(北京)有限公司 | 量子点图案化薄膜的制备方法及图案化薄膜 |
CN113130823A (zh) * | 2019-12-30 | 2021-07-16 | Tcl集团股份有限公司 | 光电器件及其制备方法 |
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Inventor after: Yu Jiadong Inventor after: Li Zongtao Inventor after: Tang Yong Inventor after: Du Xuewei Inventor after: Feng Siyang Inventor after: Yao Xianan Inventor before: Yu Guidong Inventor before: Li Zongtao Inventor before: Tang Yong Inventor before: Du Xuewei Inventor before: Feng Siyang Inventor before: Yao Xianan |
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Application publication date: 20180629 |