CN108231718A - 具有金包覆层的金银铝铜合金复合键合丝及其制造方法 - Google Patents
具有金包覆层的金银铝铜合金复合键合丝及其制造方法 Download PDFInfo
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Abstract
一种具有金包覆层的金银铝铜合金复合键合丝,其特征在于包括芯线和包覆在芯线外面的金包覆层;所述芯线按重量计含有Ag 10‑30%,Al 5‑10%,Cu 2‑200 ppm,余量为金;所述金包覆层的厚度为20‑200nm。本发明还提供上述具有金包覆层的金银铝铜合金复合键合丝的一种制造方法。本发明的金银铝铜合金复合键合丝打线作业窗口(window)较大,可提升线材在焊点B点的强度,有效改善线材的抗老化能力与抗氧化能力,且成本较低。
Description
技术领域
本发明涉及IC、LED封装用的键合丝,具体涉及一种具有金包覆层的金银铝铜合金复合键合丝及其制造方法。
背景技术
键合丝(bonding wire,又称键合线)是连接芯片与外部封装基板(substrate)和/或多层线路板(PCB)的主要连接方式。
传统的由纯金材质制成的金键合丝,其具备优异的化学稳定性和导电导热性能,因而被广泛用作IC内引线。但随着国际金价的不断上涨, 金键合丝的价格也一路攀升,导致终端产品的成本过高,不利于企业提高竞争力。除此之外,金键合丝的抗拉强度较低,延伸率不容易控制。以上两方面因素成为阻碍金键合丝应用与发展的瓶颈。
为降低成本,不断涌现出各种键合丝,如银合金丝、金合金丝以及镀金银合金键合丝等等,其价格相对较低,也能满足不同客户的不同需求;但对于高端的LED,对产品的接合性及信赖性要求较高,常规的银合金以及镀金银合金丝因银的氧化,会出现键合氧化、银离子电位迁移、焊点共晶不好等缺陷,在可靠度性能方面也达不到客户的要求。
发明内容
本发明所要解决的技术问题是提供一种具有金包覆层的金银铝铜合金复合键合丝以及这种金银铝铜合金复合键合丝的制造方法,这种金银铝铜合金复合键合丝打线作业窗口(window)较大,可提升线材在焊点B点的强度,有效改善线材的抗老化能力与抗氧化能力。采用的技术方案如下:
一种具有金包覆层的金银铝铜合金复合键合丝,其特征在于包括芯线和包覆在芯线外面的金包覆层;所述芯线按重量计含有Ag 10-30%,Al 5-10%,Cu 2-200 ppm,余量为金;所述金包覆层的厚度为20-200nm。
本发明的金合金复合键合丝中,芯线中的银(Ag)和金能充分固溶,起到固溶强化的作用,提高线材的抗拉强度;铝(Al)有高温介金属稳定性,可提升线材在焊点B点的强度,有效改善线材的抗老化能力与抗氧化能力;同时,铜(Cu)的微量添加有助打线作业窗口(window)的提升,提升机台适应能力。在芯线表面设置金包覆层,可有效发挥金的特性,进一步起到抗氧化和抗硫化作用;而且,由于线材表面包覆有金层,可有效提升线材与芯片及基板的接合能力,有效提升可靠度性能。相对于纯金键合丝而言,本发明的金银铝铜合金复合键合丝用于IC、LED 封装中,能降低成本并改善纯金线抗拉强度不足的问题。
优选上述金包覆层成分是纯度为99%(2N)-99.99%(4N)的金。
本发明还提供上述具有金包覆层的金银铝铜合金复合键合丝的一种制造方法,其特征在于包括下述步骤:
(1)熔铸:按比例将Ag、Al和Cu加入到金原料中,经过真空熔炼和定向连续引铸工艺,获得直径为6-8毫米的芯线线材;
(2)拉丝:对步骤(1)得到的芯线线材进行拉丝,获得直径为50-280um的键合丝芯线;
(3)采用电镀工艺在步骤(2)获得的键合丝芯线表面上包覆金镀层,金镀层的厚度为150-500nm;
(4)对步骤(3)得到的包覆有金镀层的键合丝芯线继续进行拉丝,获得直径为15-40 um的金银铝铜合金复合键合丝,并使金镀层的厚度减小至20-200nm;
(5)最后退火:步骤(4)拉丝完成后,对金银铝铜合金复合键合丝进行最后退火,在退火过程中采用N2来做为退火气氛,退火炉有效长度为600-1000mm,退火温度为300-600℃,退火速率为60-120m/min;
(6)冷却:最后退火结束后,将金银铝铜合金复合键合丝冷却至20-30℃,得到所需的具有金包覆层的金银铝铜合金复合键合丝。
上述制造方法中,在拉丝至线径50-280um时包覆镀金层,之后再拉丝至线径15-40um,可有效控制成品金银铝铜合金复合键合丝上包覆层厚度的均匀性;另外,在线径50-280um时对键合丝芯线进行电镀,效率较高,成本较低,线材表面状况良好,因此所制备的金银铝铜合金复合键合丝的金包覆层均匀性好,焊线作业性和信赖性都更佳。
优选上述步骤(2)在拉丝过程中,对线材进行若干次中间退火,在退火过程中采用N2做为退火气氛,退火炉有效长度为600-2000mm,退火温度为500-800℃,退火速率为30-100m/min。
优选上述步骤(3)中的电镀工艺包括下述步骤:
(3-1)脱除有机物处理:将步骤(2)获得的键合丝芯线浸入温度为70-150℃的丙酮乙醇混合液中,浸入时间为1.4-8秒,脱除键合丝芯线表面的有机物;所述丙酮乙醇混合液中丙酮与乙醇的重量比例为1:5-10;
(3-2)脱除氧化物处理:将经过脱除有机物处理的键合丝芯线浸入温度为70-150℃、重量百分比浓度为30-50%的硝酸中,浸入时间为1.4-8秒,脱除键合丝芯线表面的氧化物;
(3-3)表面活化处理:将经过脱除氧化物处理的键合丝芯线浸入温度为70-150℃、重量百分比浓度为10-30%的硫酸中,浸入时间为1.4-8秒,对键合丝芯线进行表面活化处理;
(3-4)镀金:将经过表面活化处理的键合丝芯线浸入浓度为2-4g/L的镀金液中,在电镀电流为0.2-0.8A的条件下镀金,在键合丝芯线的表面上形成厚度为150-500nm的金镀层,该金镀层将键合丝芯线包覆;
(3-5)清洗:以纯水作为清洗液,对包覆有金镀层的键合丝芯线进行超音波清洗;
(3-6)吹干:利用风刀吹去附着在金镀层表面上的水;
进行电镀时,以5-30m/min 的速度连续释放步骤(2)获得的键合丝芯线,键合丝芯线依次经过上述脱除有机物处理、脱除氧化物处理、表面活化处理、镀金、清洗和吹干后,得到包覆有金镀层的键合丝芯线并收线。
优选上述步骤(3-4)中,采用的镀金液是氰化金钾溶液。
优选上述步骤(3-5)中,以纯水作为清洗液,对包覆有金镀层的键合丝芯线进行两道超音波清洗。
优选上述步骤(3-6)中,风刀气流为N2,其流速为5-20L/min。
本发明的金银铝铜合金复合键合丝与现有技术相比,具有以下有益效果:
(1)通过金镀层包覆金银铝铜合金芯线,形成的金银铝铜合金复合键合丝具有优异的抗氧化性能和抗硫化性能,抗拉强度高;
(2)本发明得到的金银铝铜合金复合键合丝具有50-60 um范围的HAZ,极大地降低了打线的弧高;
(3)本发明得到的金银铝铜合金复合键合丝打线作业窗口(window)较大,有助于提升机台适应能力;用于封装后,焊点接合性好,焊点B点的强度高,不易断裂,可靠度性能高;
(4)成本较低。
具体实施方式
实施例1
本实施例的具有金包覆层的金银铝铜合金复合键合丝包括芯线和包覆在芯线外面的金包覆层;所述芯线按重量计含有Ag 20%,Al 8%,Cu 100 ppm,余量为金;所述金包覆层的厚度为40nm。
本实施例中,具有金包覆层的金银铝铜合金复合键合丝的制造方法包括下述步骤:
(1)熔铸:按比例将Ag、Al和Cu加入到金原料中,经过真空熔炼和定向连续引铸工艺,获得直径为8毫米的芯线线材;
(2)拉丝:对步骤(1)得到的芯线线材进行拉丝,获得直径为100um的键合丝芯线;
本步骤(2)中,在拉丝过程中,对线材进行若干次中间退火,在退火过程中采用N2做为退火气氛,退火炉有效长度为1000mm,退火温度为600℃,退火速率为50m/min;
(3)采用电镀工艺在步骤(2)获得的键合丝芯线表面上包覆金镀层,金镀层的厚度为200nm;
(4)对步骤(3)得到的包覆有金镀层的键合丝芯线继续进行拉丝,获得直径为20 um的金银铝铜合金复合键合丝,并使金镀层的厚度减小至40nm;
(5)最后退火:步骤(4)拉丝完成后,对金银铝铜合金复合键合丝进行最后退火,在退火过程中采用N2来做为退火气氛,退火炉有效长度为800mm,退火温度为500℃,退火速率为80m/min;
(6)冷却:最后退火结束后,将金银铝铜合金复合键合丝冷却至25℃,得到所需的具有金包覆层的金银铝铜合金复合键合丝。
上述步骤(3)中的电镀工艺包括下述步骤:
(3-1)脱除有机物处理:将步骤(2)获得的键合丝芯线浸入温度为110℃的丙酮乙醇混合液中,浸入时间为3秒,脱除键合丝芯线表面的有机物;所述丙酮乙醇混合液中丙酮与乙醇的重量比例为1:8;
(3-2)脱除氧化物处理:将经过脱除有机物处理的键合丝芯线浸入温度为110℃、重量百分比浓度为40%的硝酸中,浸入时间为3秒,脱除键合丝芯线表面的氧化物;
(3-3)表面活化处理:将经过脱除氧化物处理的键合丝芯线浸入温度为110℃、重量百分比浓度为20%的硫酸中,浸入时间为3秒,对键合丝芯线进行表面活化处理;
(3-4)镀金:将经过表面活化处理的键合丝芯线浸入浓度为3g/L的镀金液中(采用的镀金液是氰化金钾溶液),在电镀电流为0.5A的条件下镀金,在键合丝芯线的表面上形成厚度为200nm的金镀层,该金镀层将键合丝芯线包覆;
(3-5)清洗:以纯水作为清洗液,对包覆有金镀层的键合丝芯线进行两道超音波清洗;
(3-6)吹干:利用风刀(风刀气流为N2,其流速为10L/min)吹去附着在金镀层表面上的水;
进行电镀时,以20m/min 的速度连续释放步骤(2)获得的键合丝芯线,键合丝芯线依次经过上述脱除有机物处理、脱除氧化物处理、表面活化处理、镀金、清洗和吹干后,得到包覆有金镀层的键合丝芯线并收线。
实施例2
本实施例的具有金包覆层的金银铝铜合金复合键合丝包括芯线和包覆在芯线外面的金包覆层;所述芯线按重量计含有Ag 10%,Al 10%,Cu 5 ppm,余量为金;所述金包覆层的厚度为120nm。
本实施例中,具有金包覆层的金银铝铜合金复合键合丝的制造方法包括下述步骤:
(1)熔铸:按比例将Ag、Al和Cu加入到金原料中,经过真空熔炼和定向连续引铸工艺,获得直径为6毫米的芯线线材;
(2)拉丝:对步骤(1)得到的芯线线材进行拉丝,获得直径为160um的键合丝芯线;
本步骤(2)中,在拉丝过程中,对线材进行若干次中间退火,在退火过程中采用N2做为退火气氛,退火炉有效长度为800mm,退火温度为400℃,退火速率为30m/min;
(3)采用电镀工艺在步骤(2)获得的键合丝芯线表面上包覆金镀层,金镀层的厚度为480nm;
(4)对步骤(3)得到的包覆有金镀层的键合丝芯线继续进行拉丝,获得直径为40um的金银铝铜合金复合键合丝,并使金镀层的厚度减小至120nm;
(5)最后退火:步骤(4)拉丝完成后,对金银铝铜合金复合键合丝进行最后退火,在退火过程中采用N2来做为退火气氛,退火炉有效长度为900mm,退火温度为500℃,退火速率为100m/min;
(6)冷却:最后退火结束后,将金银铝铜合金复合键合丝冷却至30℃,得到所需的具有金包覆层的金银铝铜合金复合键合丝。
上述步骤(3)中的电镀工艺包括下述步骤:
(3-1)脱除有机物处理:将步骤(2)获得的键合丝芯线浸入温度为140℃的丙酮乙醇混合液中,浸入时间为2.5秒,脱除键合丝芯线表面的有机物;所述丙酮乙醇混合液中丙酮与乙醇的重量比例为1:5;
(3-2)脱除氧化物处理:将经过脱除有机物处理的键合丝芯线浸入温度为140℃、重量百分比浓度为48%的硝酸中,浸入时间为2.5秒,脱除键合丝芯线表面的氧化物;
(3-3)表面活化处理:将经过脱除氧化物处理的键合丝芯线浸入温度为140℃、重量百分比浓度为25%的硫酸中,浸入时间为2.5秒,对键合丝芯线进行表面活化处理;
(3-4)镀金:将经过表面活化处理的键合丝芯线浸入浓度为3.5g/L的镀金液中(采用的镀金液是氰化金钾溶液),在电镀电流为0.2A的条件下镀金,在键合丝芯线的表面上形成厚度为480nm的金镀层,该金镀层将键合丝芯线包覆;
(3-5)清洗:以纯水作为清洗液,对包覆有金镀层的键合丝芯线进行两道超音波清洗;
(3-6)吹干:利用风刀(风刀气流为N2,其流速为20L/min)吹去附着在金镀层表面上的水;
进行电镀时,以25m/min 的速度连续释放步骤(2)获得的键合丝芯线,键合丝芯线依次经过上述脱除有机物处理、脱除氧化物处理、表面活化处理、镀金、清洗和吹干后,得到包覆有金镀层的键合丝芯线并收线。
实施例3
本实施例的具有金包覆层的金银铝铜合金复合键合丝包括芯线和包覆在芯线外面的金包覆层;所述芯线按重量计含有Ag 30%,Al 5%,Cu 50 ppm,余量为金;所述金包覆层的厚度为20nm。
本实施例中,具有金包覆层的金银铝铜合金复合键合丝的制造方法包括下述步骤:
(1)熔铸:按比例将Ag、Al和Cu加入到金原料中,经过真空熔炼和定向连续引铸工艺,获得直径为8毫米的芯线线材;
(2)拉丝:对步骤(1)得到的芯线线材进行拉丝,获得直径为240um的键合丝芯线;
本步骤(2)中,在拉丝过程中,对线材进行若干次中间退火,在退火过程中采用N2做为退火气氛,退火炉有效长度为1800mm,退火温度为550℃,退火速率为60m/min;
(3)采用电镀工艺在步骤(2)获得的键合丝芯线表面上包覆金镀层,金镀层的厚度为160nm;
(4)对步骤(3)得到的包覆有金镀层的键合丝芯线继续进行拉丝,获得直径为30 um的金银铝铜合金复合键合丝,并使金镀层的厚度减小至20nm;
(5)最后退火:步骤(4)拉丝完成后,对金银铝铜合金复合键合丝进行最后退火,在退火过程中采用N2来做为退火气氛,退火炉有效长度为800mm,退火温度为500℃,退火速率为80m/min;
(6)冷却:最后退火结束后,将金银铝铜合金复合键合丝冷却至20℃,得到所需的具有金包覆层的金银铝铜合金复合键合丝。
上述步骤(3)中的电镀工艺包括下述步骤:
(3-1)脱除有机物处理:将步骤(2)获得的键合丝芯线浸入温度为70℃的丙酮乙醇混合液中,浸入时间为8秒,脱除键合丝芯线表面的有机物;所述丙酮乙醇混合液中丙酮与乙醇的重量比例为1: 10;
(3-2)脱除氧化物处理:将经过脱除有机物处理的键合丝芯线浸入温度为70℃、重量百分比浓度为30%的硝酸中,浸入时间为8秒,脱除键合丝芯线表面的氧化物;
(3-3)表面活化处理:将经过脱除氧化物处理的键合丝芯线浸入温度为70℃、重量百分比浓度为10%的硫酸中,浸入时间为8秒,对键合丝芯线进行表面活化处理;
(3-4)镀金:将经过表面活化处理的键合丝芯线浸入浓度为2g/L的镀金液中(采用的镀金液是氰化金钾溶液),在电镀电流为0.8A的条件下镀金,在键合丝芯线的表面上形成厚度为160nm的金镀层,该金镀层将键合丝芯线包覆;
(3-5)清洗:以纯水作为清洗液,对包覆有金镀层的键合丝芯线进行两道超音波清洗;
(3-6)吹干:利用风刀(风刀气流为N2,其流速为5L/min)吹去附着在金镀层表面上的水;
进行电镀时,以8m/min 的速度连续释放步骤(2)获得的键合丝芯线,键合丝芯线依次经过上述脱除有机物处理、脱除氧化物处理、表面活化处理、镀金、清洗和吹干后,得到包覆有金镀层的键合丝芯线并收线。
实施例4
本实施例的具有金包覆层的金银铝铜合金复合键合丝包括芯线和包覆在芯线外面的金包覆层;所述芯线按重量计含有Ag 18%,Al 6%,Cu 150 ppm,余量为金;所述金包覆层的厚度为30nm。
本实施例中,具有金包覆层的金银铝铜合金复合键合丝的制造方法包括下述步骤:
(1)熔铸:按比例将Ag、Al和Cu加入到金原料中,经过真空熔炼和定向连续引铸工艺,获得直径为8毫米的芯线线材;
(2)拉丝:对步骤(1)得到的芯线线材进行拉丝,获得直径为200um的键合丝芯线;
本步骤(2)中,在拉丝过程中,对线材进行若干次中间退火,在退火过程中采用N2做为退火气氛,退火炉有效长度为1200mm,退火温度为750℃,退火速率为80m/min;
(3)采用电镀工艺在步骤(2)获得的键合丝芯线表面上包覆金镀层,金镀层的厚度为150nm;
(4)对步骤(3)得到的包覆有金镀层的键合丝芯线继续进行拉丝,获得直径为40 um的金银铝铜合金复合键合丝,并使金镀层的厚度减小至30nm;
(5)最后退火:步骤(4)拉丝完成后,对金银铝铜合金复合键合丝进行最后退火,在退火过程中采用N2来做为退火气氛,退火炉有效长度为1000mm,退火温度为450℃,退火速率为100m/min;
(6)冷却:最后退火结束后,将金银铝铜合金复合键合丝冷却至20℃,得到所需的具有金包覆层的金银铝铜合金复合键合丝。
上述步骤(3)中的电镀工艺包括下述步骤:
(3-1)脱除有机物处理:将步骤(2)获得的键合丝芯线浸入温度为95℃的丙酮乙醇混合液中,浸入时间为5秒,脱除键合丝芯线表面的有机物;所述丙酮乙醇混合液中丙酮与乙醇的重量比例为1:7;
(3-2)脱除氧化物处理:将经过脱除有机物处理的键合丝芯线浸入温度为95℃、重量百分比浓度为30%的硝酸中,浸入时间为5秒,脱除键合丝芯线表面的氧化物;
(3-3)表面活化处理:将经过脱除氧化物处理的键合丝芯线浸入温度为95℃、重量百分比浓度为15%的硫酸中,浸入时间为5秒,对键合丝芯线进行表面活化处理;
(3-4)镀金:将经过表面活化处理的键合丝芯线浸入浓度为2.5g/L的镀金液中(采用的镀金液是氰化金钾溶液),在电镀电流为0.7A的条件下镀金,在键合丝芯线的表面上形成厚度为150nm的金镀层,该金镀层将键合丝芯线包覆;
(3-5)清洗:以纯水作为清洗液,对包覆有金镀层的键合丝芯线进行两道超音波清洗;
(3-6)吹干:利用风刀(风刀气流为N2,其流速为15L/min)吹去附着在金镀层表面上的水;
进行电镀时,以15m/min 的速度连续释放步骤(2)获得的键合丝芯线,键合丝芯线依次经过上述脱除有机物处理、脱除氧化物处理、表面活化处理、镀金、清洗和吹干后,得到包覆有金镀层的键合丝芯线并收线。
对以上实施例1-4获得的具有金包覆层的金银铝铜合金复合键合丝进行性能测试(对比例采用市场上购买的常规80%Au金合金线)。
1、HAZ长度的测试方法
将实施例1-4与对比例的线材进行FIB (Focused Ion beam)聚焦离子束切割,利用SEM(scanning electron microscopy)扫描电镜进行观察,通过比较不同线材位置的晶体大小的变化,可以得到HAZ的长度信息。
2、老化测试方法
实施例1-4和对比例所得到线材在可靠度性能的差别主要在热冲击部分。具体老化试验条件如表1。试验封装形式是LED封装中的 SMD2835,BSOB打线,封装硅胶采用道康宁OE6650,封装好的样品在每次完成50个循环的热冲击后,观察是否还能电亮,记录失效死灯的个数。
表1
测试条件 | 时长(Hour)/回合(Cycle) |
305合金8温区标准回流焊(265℃) | 1 |
-40℃*30min-100℃*30min (转换时间小于20秒) | 50/100/…/500 |
3、硫化测试方法
将灌封好的样品灯珠放置于密闭容器内(升华一定的硫浓度),恒温85℃;硫化一定时间后取出测试光衰。
性能测试结果如表2所示。
表2
注:变形球真圆度不合格数是真圆度不良的变形压缩球以及偏心球的总和。
上述性能测试结果表明:
1、本发明实施例1-4的具有金包覆层的金银铝铜合金复合键合丝得到的HAZ远远低于对比例的线材。
2、本发明实施例1-4的具有金包覆层的金银铝铜合金复合键合丝的打线性能(变形球真圆度)明显优于对比例。
本发明线材优异的打线性能主要是因为该线材能够在确保稳定的烧球性能。
3、本发明实施例1-4的具有金包覆层的金银铝铜合金复合键合丝相对于对比例,可靠度性能得到很大提升。
本发明实施例1-4的具有金包覆层的金银铝铜合金复合键合丝经过450个循环的热冲击后,仍没有失效死灯情况(其中实施例4经过500个循环的热冲击后,仍没有失效死灯情况);而对比例则已经出现失效死灯(对比例只能经受400个循环的热冲击)。这说明本发明技术线材的可靠度性能更高。
4、硫化
本发明实施例1-4的具有金包覆层的金银铝铜合金复合键合丝经过硫化测试,光衰在20%以下;而对比例光衰在25%。这说明本发明技术线材的抗硫化能力更强。
Claims (7)
1.一种具有金包覆层的金银铝铜合金复合键合丝,其特征在于包括芯线和包覆在芯线外面的金包覆层;所述芯线按重量计含有Ag 10-30%,Al 5-10%,Cu 2-200 ppm,余量为金;所述金包覆层的厚度为20-200nm。
2.权利要求1所述的具有金包覆层的金银铝铜合金复合键合丝的制造方法,其特征在于包括下述步骤:
(1)熔铸:按比例将Ag、Al和Cu加入到金原料中,经过真空熔炼和定向连续引铸工艺,获得直径为6-8毫米的芯线线材;
(2)拉丝:对步骤(1)得到的芯线线材进行拉丝,获得直径为50-280um的键合丝芯线;
(3)采用电镀工艺在步骤(2)获得的键合丝芯线表面上包覆金镀层,金镀层的厚度为150-500nm;
(4)对步骤(3)得到的包覆有金镀层的键合丝芯线继续进行拉丝,获得直径为15-40 um的金银铝铜合金复合键合丝,并使金镀层的厚度减小至20-200nm;
(5)最后退火:步骤(4)拉丝完成后,对金银铝铜合金复合键合丝进行最后退火,在退火过程中采用N2来做为退火气氛,退火炉有效长度为600-1000mm,退火温度为300-600℃,退火速率为60-120m/min;
(6)冷却:最后退火结束后,将金银铝铜合金复合键合丝冷却至20-30℃,得到所需的具有金包覆层的金银铝铜合金复合键合丝。
3.根据权利要求2所述的具有金包覆层的金银铝铜合金复合键合丝的制造方法,其特征在于:步骤(2)在拉丝过程中,对线材进行若干次中间退火,在退火过程中采用N2做为退火气氛,退火炉有效长度为600-2000mm,退火温度为500-800℃,退火速率为30-100m/min。
4.根据权利要求2所述的具有金包覆层的金银铝铜合金复合键合丝的制造方法,其特征在于步骤(3)中的电镀工艺包括下述步骤:
(3-1)脱除有机物处理:将步骤(2)获得的键合丝芯线浸入温度为70-150℃的丙酮乙醇混合液中,浸入时间为1.4-8秒,脱除键合丝芯线表面的有机物;所述丙酮乙醇混合液中丙酮与乙醇的重量比例为1:5-10;
(3-2)脱除氧化物处理:将经过脱除有机物处理的键合丝芯线浸入温度为70-150℃、重量百分比浓度为30-50%的硝酸中,浸入时间为1.4-8秒,脱除键合丝芯线表面的氧化物;
(3-3)表面活化处理:将经过脱除氧化物处理的键合丝芯线浸入温度为70-150℃、重量百分比浓度为10-30%的硫酸中,浸入时间为1.4-8秒,对键合丝芯线进行表面活化处理;
(3-4)镀金:将经过表面活化处理的键合丝芯线浸入浓度为2-4g/L的镀金液中,在电镀电流为0.2-0.8A的条件下镀金,在键合丝芯线的表面上形成厚度为150-500nm的金镀层,该金镀层将键合丝芯线包覆;
(3-5)清洗:以纯水作为清洗液,对包覆有金镀层的键合丝芯线进行超音波清洗;
(3-6)吹干:利用风刀吹去附着在金镀层表面上的水;
进行电镀时,以5-30m/min 的速度连续释放步骤(2)获得的键合丝芯线,键合丝芯线依次经过上述脱除有机物处理、脱除氧化物处理、表面活化处理、镀金、清洗和吹干后,得到包覆有金镀层的键合丝芯线并收线。
5.根据权利要求4所述的具有金包覆层的金银铝铜合金复合键合丝的制造方法,其特征在于:步骤(3-4)中,采用的镀金液是氰化金钾溶液。
6.根据权利要求4所述的具有金包覆层的金银铝铜合金复合键合丝的制造方法,其特征在于:步骤(3-5)中,以纯水作为清洗液,对包覆有金镀层的键合丝芯线进行两道超音波清洗。
7.根据权利要求4所述的具有金包覆层的金银铝铜合金复合键合丝的制造方法,其特征在于:步骤(3-6)中,风刀气流为N2,其流速为5-20L/min。
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