CN108198795A - 一种金钯银合金复合键合丝及其制造方法 - Google Patents
一种金钯银合金复合键合丝及其制造方法 Download PDFInfo
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Abstract
一种金钯银合金复合键合丝,其特征在于包括芯线和包覆在芯线外面的金镀层;所述芯线按重量计含有金45‑72%,银25‑49%,钯3‑6%;所述金镀层的厚度为20‑200nm。本发明还提供上述金钯银合金复合键合丝的一种制造方法。本发明的金合金复合键合丝具有优异的抗氧化性能和抗硫化性能,抗拉强度高,焊点接合性好,且能降低成本。
Description
技术领域
本发明涉及IC、LED封装用的键合丝,具体涉及一种金钯银合金复合键合丝及其制造方法。
背景技术
键合丝(bonding wire,又称键合线)是连接芯片与外部封装基板(substrate)和/或多层线路板(PCB)的主要连接方式。键合丝的发展趋势,从产品方向上,主要是线径细微化、高车间寿命(floor life)以及高线轴长度;从化学成分上,主要有铜线(包括裸铜线、镀钯铜线、闪金镀钯铜线)在半导体领域大幅度取代金线,而银线和银合金线在LED以及部分IC封装应用上取代金线。另外一个重要方向是金合金线的发展,以进一步降低成本并且保持或提高键合过程的各项性能要求。
传统的由纯金材质制成的金键合丝,其具备优异的化学稳定性和导电导热性能,因而被广泛用作IC内引线。但随着国际金价的不断上涨, 金键合丝的价格也一路攀升,导致终端产品的成本过高,不利于企业提高竞争力。除此之外,金键合丝的抗拉强度较低(例如直径20微米的金键合丝,在焊接后,其最高抗拉强度不足5克力),延伸率不容易控制。以上两方面因素成为阻碍金键合丝应用与发展的瓶颈。
发明内容
本发明所要解决的技术问题是提供一种金钯银合金复合键合丝以及这种金钯银合金复合键合丝的制造方法,这种金钯银合金复合键合丝具有优异的抗氧化性能和抗硫化性能,抗拉强度高,焊点接合性好,且能降低成本。采用的技术方案如下:
一种金钯银合金复合键合丝,其特征在于包括芯线和包覆在芯线外面的金镀层;所述芯线按重量计含有金45-72%,银25-49%,钯3-6%;所述金镀层的厚度为20-200nm。
本发明的金钯银合金复合键合丝中,芯线中除了金之外,还含有25-49%的银,银和金能充分固溶,起到固溶强化的作用,提高线材的抗拉强度;在此基础上加入含量3-6%的钯(Pd),能有效地改善线材的抗氧化、抗硫化性能和1焊球型,改善封装产品在热冲击试验中的可靠性,并提升线材强度。在芯线表面包覆金镀层,可有效发挥金的特性,进一步起到抗氧化和抗硫化作用;而且,由于线材表面包覆有金镀层,可有效提升线材与芯片及基板的接合能力,有效提升可靠性。简而言之,本发明的金钯银合金复合键合丝焊点接合性好、抗氧化抗硫化能力强、抗拉强度高,相对于纯金键合丝而言,本发明的金钯银合金复合键合丝用于IC、LED 封装中,能降低成本并改善纯金线抗拉强度不足的问题,而其他性能均能达到纯金键合丝的性能要求。
上述金镀层成分通常是纯度为99%(2N)-99.99%(4N)的金。
本发明还提供上述金钯银合金复合键合丝的一种制造方法,其特征在于包括下述步骤:
(1)熔铸:按比例将金、银和钯混合,经过真空熔炼和定向连续引铸工艺,获得直径为6-8毫米的芯线线材;
(2)拉丝:对步骤(1)得到的芯线线材进行拉丝,获得直径为15-40 um的芯线;
(3)采用电镀工艺在步骤(2)获得的芯线表面上形成金镀层,金镀层的厚度为20-200nm,得到镀金线;
(4)最后退火:步骤(3)电镀完成后,对镀金线进行最后退火,在退火过程中采用N2来做为退火气氛,退火炉有效长度为600-1000mm,退火温度为300-600℃,退火速率为60-120m/min;
(5)冷却:最后退火结束后,将镀金线冷却至20-30℃,得到所需的金钯银合金复合键合丝。
优选上述步骤(2)在拉丝过程中,对线材进行若干次中间退火,在退火过程中采用N2做为退火气氛,退火炉有效长度为600-2000mm,退火温度为500-800℃,退火速率为30-100m/min。
优选上述步骤(3)中的电镀工艺包括下述步骤:
(3-1)脱除有机物处理:将步骤(2)获得的芯线浸入温度为70-150℃的丙酮乙醇混合液中,浸入时间为1.4-8秒,脱除芯线表面的有机物;所述丙酮乙醇混合液中丙酮与乙醇的重量比例为1:5-10;
(3-2)脱除氧化物处理:将经过脱除有机物处理的芯线浸入温度为70-150℃、重量百分比浓度为30-50%的硝酸中,浸入时间为1.4-8秒,脱除芯线表面的氧化物;
(3-3)表面活化处理:将经过脱除氧化物处理的芯线浸入温度为70-150℃、重量百分比浓度为10-30%的硫酸中,浸入时间为1.4-8秒,对芯线进行表面活化处理;
(3-4)镀金:将经过表面活化处理的芯线浸入浓度为2-4g/L的镀金液中,在电镀电流为0.2-0.8A的条件下镀金,在芯线的表面上形成厚度为20-200nm的金镀层,该金镀层将芯线包覆;
(3-5)清洗:以纯水作为清洗液,对包覆有金镀层的芯线进行超音波清洗;
(3-6)吹干:利用风刀吹去附着在金镀层表面上的水;
进行电镀时,以5-30m/min 的速度连续释放步骤(2)获得的芯线,芯线依次经过上述脱除有机物处理、脱除氧化物处理、表面活化处理、镀金、清洗和吹干后,得到镀金线并收线。
优选上述步骤(3-4)中,采用的镀金液是氰化金钾溶液。
优选上述步骤(3-5)中,以纯水作为清洗液,对包覆有金镀层的芯线进行两道超音波清洗。
优选上述步骤(3-6)中,风刀气流为N2,其流速为5-20L/min。
本发明的金钯银合金复合键合丝与现有技术相比,具有以下有益效果:
(1)本发明的金钯银合金复合键合丝具有优异的抗氧化性能和抗硫化性能,抗拉强度高,焊点接合性好,可靠性高;
(2)本发明的金钯银合金复合键合丝具有53-60 um范围的HAZ,极大地降低了打线的弧高;
(3)本发明得到的金钯银合金复合键合丝在FAB烧球后,得到数目适中(从FAB剖面看长轴晶数目在6-10之间)的对称柱状晶,确保了变形球的真圆度;
(4)成本较低。
具体实施方式
实施例1
本实施例的金钯银合金复合键合丝包括芯线和包覆在芯线外面的金镀层;所述芯线按重量计含有金60%,银35%,钯5%;所述金镀层的厚度为100nm。
本实施例中,金钯银合金复合键合丝的制造方法包括下述步骤:
(1)熔铸:按比例将金、银和钯混合,经过真空熔炼和定向连续引铸工艺,获得直径为8毫米的芯线线材;
(2)拉丝:对步骤(1)得到的芯线线材进行拉丝,获得直径为15-40 um(如20 um)的芯线;
在拉丝过程中,对线材进行若干次中间退火,在退火过程中采用N2做为退火气氛,退火炉有效长度为1200mm,退火温度为700℃,退火速率为60m/min;
(3)采用电镀工艺在步骤(2)获得的芯线表面上形成金镀层,金镀层的厚度为100nm,得到镀金线;
(4)最后退火:步骤(3)电镀完成后,对镀金线进行最后退火,在退火过程中采用N2来做为退火气氛,退火炉有效长度为800mm,退火温度为500℃,退火速率为80m/min;
(5)冷却:最后退火结束后,将镀金线冷却至25℃,得到所需的金钯银合金复合键合丝。
上述步骤(3)中的电镀工艺包括下述步骤:
(3-1)脱除有机物处理:将步骤(2)获得的芯线浸入温度为100℃的丙酮乙醇混合液中,浸入时间为5秒,脱除芯线表面的有机物;所述丙酮乙醇混合液中丙酮与乙醇的重量比例为1:7;
(3-2)脱除氧化物处理:将经过脱除有机物处理的芯线浸入温度为100℃、重量百分比浓度为40%的硝酸中,浸入时间为5秒,脱除芯线表面的氧化物;
(3-3)表面活化处理:将经过脱除氧化物处理的芯线浸入温度为100℃、重量百分比浓度为20%的硫酸中,浸入时间为5秒,对芯线进行表面活化处理;
(3-4)镀金:将经过表面活化处理的芯线浸入浓度为2.5g/L的镀金液中(采用的镀金液是氰化金钾溶液),在电镀电流为0.6A的条件下镀金,在芯线的表面上形成厚度为100nm的金镀层,该金镀层将芯线包覆;
(3-5)清洗:以纯水作为清洗液,对包覆有金镀层的芯线进行两道超音波清洗;
(3-6)吹干:利用风刀(风刀气流为N2,其流速为15L/min)吹去附着在金镀层表面上的水;
进行电镀时,以15m/min 的速度连续释放步骤(2)获得的芯线,芯线依次经过上述脱除有机物处理、脱除氧化物处理、表面活化处理、镀金、清洗和吹干后,得到镀金线并收线。
实施例2
本实施例的金钯银合金复合键合丝包括芯线和包覆在芯线外面的金镀层;所述芯线按重量计含有金46%,银48%,钯6%;所述金镀层的厚度为200nm。
本实施例中,金钯银合金复合键合丝的制造方法包括下述步骤:
(1)熔铸:按比例将金、银和钯混合,经过真空熔炼和定向连续引铸工艺,获得直径为6毫米的芯线线材;
(2)拉丝:对步骤(1)得到的芯线线材进行拉丝,获得直径为15-40 um(如20 um)的芯线;
在拉丝过程中,对线材进行若干次中间退火,在退火过程中采用N2做为退火气氛,退火炉有效长度为800mm,退火温度为800℃,退火速率为50m/min;
(3)采用电镀工艺在步骤(2)获得的芯线表面上形成金镀层,金镀层的厚度为200nm,得到镀金线;
(4)最后退火:步骤(3)电镀完成后,对镀金线进行最后退火,在退火过程中采用N2来做为退火气氛,退火炉有效长度为1000mm,退火温度为600℃,退火速率为120m/min;
(5)冷却:最后退火结束后,将镀金线冷却至30℃,得到所需的金钯银合金复合键合丝。
上述步骤(3)中的电镀工艺包括下述步骤:
(3-1)脱除有机物处理:将步骤(2)获得的芯线浸入温度为148℃的丙酮乙醇混合液中,浸入时间为1.6秒,脱除芯线表面的有机物;所述丙酮乙醇混合液中丙酮与乙醇的重量比例为1:5;
(3-2)脱除氧化物处理:将经过脱除有机物处理的芯线浸入温度为148℃、重量百分比浓度为45%的硝酸中,浸入时间为1.6秒,脱除芯线表面的氧化物;
(3-3)表面活化处理:将经过脱除氧化物处理的芯线浸入温度为148℃、重量百分比浓度为30%的硫酸中,浸入时间为1.6秒,对芯线进行表面活化处理;
(3-4)镀金:将经过表面活化处理的芯线浸入浓度为4g/L的镀金液中(采用的镀金液是氰化金钾溶液。),在电镀电流为0.25A的条件下镀金,在芯线的表面上形成厚度为200nm的金镀层,该金镀层将芯线包覆;
(3-5)清洗:以纯水作为清洗液,对包覆有金镀层的芯线进行两道超音波清洗;
(3-6)吹干:利用风刀(风刀气流为N2,其流速为20L/min)吹去附着在金镀层表面上的水;
进行电镀时,以30m/min 的速度连续释放步骤(2)获得的芯线,芯线依次经过上述脱除有机物处理、脱除氧化物处理、表面活化处理、镀金、清洗和吹干后,得到镀金线并收线。
实施例3
本实施例的金钯银合金复合键合丝包括芯线和包覆在芯线外面的金镀层;所述芯线按重量计含有金72%,银25%,钯3%;所述金镀层的厚度为25nm。
本实施例中,金钯银合金复合键合丝的制造方法包括下述步骤:
(1)熔铸:按比例将金、银和钯混合,经过真空熔炼和定向连续引铸工艺,获得直径为8毫米的芯线线材;
(2)拉丝:对步骤(1)得到的芯线线材进行拉丝,获得直径为15-40 um(如20 um)的芯线;
在拉丝过程中,对线材进行若干次中间退火,在退火过程中采用N2做为退火气氛,退火炉有效长度为2000mm,退火温度为500℃,退火速率为100m/min;
(3)采用电镀工艺在步骤(2)获得的芯线表面上形成金镀层,金镀层的厚度为25nm,得到镀金线;
(4)最后退火:步骤(3)电镀完成后,对镀金线进行最后退火,在退火过程中采用N2来做为退火气氛,退火炉有效长度为600mm,退火温度为300℃,退火速率为60m/min;
(5)冷却:最后退火结束后,将镀金线冷却至20℃,得到所需的金钯银合金复合键合丝。
上述步骤(3)中的电镀工艺包括下述步骤:
(3-1)脱除有机物处理:将步骤(2)获得的芯线浸入温度为75℃的丙酮乙醇混合液中,浸入时间为7.5秒,脱除芯线表面的有机物;所述丙酮乙醇混合液中丙酮与乙醇的重量比例为1: 10;
(3-2)脱除氧化物处理:将经过脱除有机物处理的芯线浸入温度为75℃、重量百分比浓度为30%的硝酸中,浸入时间为7.5秒,脱除芯线表面的氧化物;
(3-3)表面活化处理:将经过脱除氧化物处理的芯线浸入温度为75℃、重量百分比浓度为12%的硫酸中,浸入时间为7.5秒,对芯线进行表面活化处理;
(3-4)镀金:将经过表面活化处理的芯线浸入浓度为2g/L的镀金液中(采用的镀金液是氰化金钾溶液),在电镀电流为0.8A的条件下镀金,在芯线的表面上形成厚度为25nm的金镀层,该金镀层将芯线包覆;
(3-5)清洗:以纯水作为清洗液,对包覆有金镀层的芯线进行两道超音波清洗;
(3-6)吹干:利用风刀(风刀气流为N2,其流速为6L/min)吹去附着在金镀层表面上的水;
进行电镀时,以6m/min 的速度连续释放步骤(2)获得的芯线,芯线依次经过上述脱除有机物处理、脱除氧化物处理、表面活化处理、镀金、清洗和吹干后,得到镀金线并收线。
对以上实施例1-3获得的金钯银合金复合键合丝进行性能测试(对比例采用市场上购买的常规80%Au金合金线)。
1、HAZ长度的测试方法
将实施例1-3与对比例的线材进行FIB (Focused Ion beam)聚焦离子束切割,利用SEM(scanning electron microscopy)扫描电镜进行观察,通过比较不同线材位置的晶体大小的变化,可以得到HAZ的长度信息。
2、老化测试方法
实施例1-3和对比例所得到线材在可靠性的差别主要在热冲击部分。具体老化试验条件如表1。试验封装形式是LED封装中的 SMD2835,BSOB打线,封装硅胶采用道康宁OE6650,封装好的样品在每次完成50个循环的热冲击后,观察是否还能电亮,记录失效死灯的个数。
表1
测试条件 | 时长(Hour)/回合(Cycle) |
305合金8温区标准回流焊(265℃) | 1 |
-40℃*30min-100℃*30min (转换时间小于20秒) | 50/100/…/500 |
3、硫化测试方法
将灌封好的样品灯珠放置于密闭容器内(升华一定的硫浓度),恒温85℃;硫化一定时间后取出测试光衰。
性能测试结果如表2所示。
表2
注:变形球真圆度不合格数是真圆度不良的变形压缩球以及偏心球的总和。
上述性能测试结果表明:
1、本发明实施例1-3的金钯银合金复合键合丝得到的HAZ远远低于对比例的线材。
2、本发明实施例1-3的金钯银合金复合键合丝的打线性能(变形球真圆度)明显优于对比例。
本发明线材优异的打线性能主要是因为该线材能够在确保稳定的烧球性能(包括FAB的居中性以防止偏心球和FAB内所生成的对称和数目合适的柱状晶)。
3、本发明实施例1-3的金钯银合金复合键合丝相对于对比例,可靠性得到很大提升。
本发明实施例1-3的金钯银合金复合键合丝经过450个循环的热冲击后,仍没有失效死灯情况;而对比例则已经出现失效死灯(对比例只能经受400个循环的热冲击)。这说明本发明技术线材的可靠性更高。
4、硫化
本发明实施例1-3的金钯银合金复合键合丝经过硫化测试,光衰在17%以下;而对比例光衰在25%。这说明本发明技术线材的抗硫化能力更强。
Claims (7)
1.一种金钯银合金复合键合丝,其特征在于包括芯线和包覆在芯线外面的金镀层;所述芯线按重量计含有金45-72%,银25-49%,钯3-6%;所述金镀层的厚度为20-200nm。
2.权利要求1所述的金钯银合金复合键合丝的制造方法,其特征在于包括下述步骤:
(1)熔铸:按比例将金、银和钯混合,经过真空熔炼和定向连续引铸工艺,获得直径为6-8毫米的芯线线材;
(2)拉丝:对步骤(1)得到的芯线线材进行拉丝,获得直径为15-40 um的芯线;
(3)采用电镀工艺在步骤(2)获得的芯线表面上形成金镀层,金镀层的厚度为20-200nm,得到镀金线;
(4)最后退火:步骤(3)电镀完成后,对镀金线进行最后退火,在退火过程中采用N2来做为退火气氛,退火炉有效长度为600-1000mm,退火温度为300-600℃,退火速率为60-120m/min;
(5)冷却:最后退火结束后,将镀金线冷却至20-30℃,得到所需的金钯银合金复合键合丝。
3.根据权利要求2所述的金钯银合金复合键合丝的制造方法,其特征在于:步骤(2)在拉丝过程中,对线材进行若干次中间退火,在退火过程中采用N2做为退火气氛,退火炉有效长度为600-2000mm,退火温度为500-800℃,退火速率为30-100m/min。
4.根据权利要求2所述的金钯银合金复合键合丝的制造方法,其特征在于步骤(3)中的电镀工艺包括下述步骤:
(3-1)脱除有机物处理:将步骤(2)获得的芯线浸入温度为70-150℃的丙酮乙醇混合液中,浸入时间为1.4-8秒,脱除芯线表面的有机物;所述丙酮乙醇混合液中丙酮与乙醇的重量比例为1:5-10;
(3-2)脱除氧化物处理:将经过脱除有机物处理的芯线浸入温度为70-150℃、重量百分比浓度为30-50%的硝酸中,浸入时间为1.4-8秒,脱除芯线表面的氧化物;
(3-3)表面活化处理:将经过脱除氧化物处理的芯线浸入温度为70-150℃、重量百分比浓度为10-30%的硫酸中,浸入时间为1.4-8秒,对芯线进行表面活化处理;
(3-4)镀金:将经过表面活化处理的芯线浸入浓度为2-4g/L的镀金液中,在电镀电流为0.2-0.8A的条件下镀金,在芯线的表面上形成厚度为20-200nm的金镀层,该金镀层将芯线包覆;
(3-5)清洗:以纯水作为清洗液,对包覆有金镀层的芯线进行超音波清洗;
(3-6)吹干:利用风刀吹去附着在金镀层表面上的水;
进行电镀时,以5-30m/min 的速度连续释放步骤(2)获得的芯线,芯线依次经过上述脱除有机物处理、脱除氧化物处理、表面活化处理、镀金、清洗和吹干后,得到镀金线并收线。
5.根据权利要求4所述的金钯银合金复合键合丝的制造方法,其特征在于:步骤(3-4)中,采用的镀金液是氰化金钾溶液。
6.根据权利要求4所述的金钯银合金复合键合丝的制造方法,其特征在于:步骤(3-5)中,以纯水作为清洗液,对包覆有金镀层的芯线进行两道超音波清洗。
7.根据权利要求4所述的金钯银合金复合键合丝的制造方法,其特征在于:步骤(3-6)中,风刀气流为N2,其流速为5-20L/min。
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