CN108231642B - 基板的更换装置 - Google Patents

基板的更换装置 Download PDF

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Publication number
CN108231642B
CN108231642B CN201810026949.7A CN201810026949A CN108231642B CN 108231642 B CN108231642 B CN 108231642B CN 201810026949 A CN201810026949 A CN 201810026949A CN 108231642 B CN108231642 B CN 108231642B
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CN
China
Prior art keywords
substrate
stage
guide
carrying
axis direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810026949.7A
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English (en)
Chinese (zh)
Other versions
CN108231642A (zh
Inventor
青木保夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011107796A external-priority patent/JP5741926B2/ja
Priority claimed from JP2011107802A external-priority patent/JP5741927B2/ja
Priority claimed from JP2012085484A external-priority patent/JP5843161B2/ja
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to CN201810026949.7A priority Critical patent/CN108231642B/zh
Priority claimed from CN201280023704.XA external-priority patent/CN103534787B/zh
Publication of CN108231642A publication Critical patent/CN108231642A/zh
Application granted granted Critical
Publication of CN108231642B publication Critical patent/CN108231642B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201810026949.7A 2011-05-13 2012-05-11 基板的更换装置 Active CN108231642B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810026949.7A CN108231642B (zh) 2011-05-13 2012-05-11 基板的更换装置

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JPJP2011-107810 2011-05-13
JPJP2011-107802 2011-05-13
JPJP2011-107796 2011-05-13
JP2011107796A JP5741926B2 (ja) 2011-05-13 2011-05-13 物体交換システム、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体交換方法
JP2011107810 2011-05-13
JP2011107802A JP5741927B2 (ja) 2011-05-13 2011-05-13 物体搬出方法、物体交換方法、物体保持装置、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2012085484A JP5843161B2 (ja) 2011-05-13 2012-04-04 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JPJP2012-085484 2012-04-04
CN201810026949.7A CN108231642B (zh) 2011-05-13 2012-05-11 基板的更换装置
CN201280023704.XA CN103534787B (zh) 2011-05-13 2012-05-11 基板的更换装置
PCT/JP2012/003082 WO2012157231A1 (ja) 2011-05-13 2012-05-11 基板の交換装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201280023704.XA Division CN103534787B (zh) 2011-05-13 2012-05-11 基板的更换装置

Publications (2)

Publication Number Publication Date
CN108231642A CN108231642A (zh) 2018-06-29
CN108231642B true CN108231642B (zh) 2023-05-02

Family

ID=47176583

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810026949.7A Active CN108231642B (zh) 2011-05-13 2012-05-11 基板的更换装置

Country Status (2)

Country Link
CN (1) CN108231642B (ja)
WO (1) WO2012157231A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102171583B1 (ko) * 2013-04-01 2020-10-30 삼성디스플레이 주식회사 기판 고정 장치 및 그 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011065589A2 (en) * 2009-11-27 2011-06-03 Nikon Corporation Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1351199A (en) * 1997-12-03 1999-06-16 Nikon Corporation Substrate transferring device and method
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device
TWI232242B (en) * 2002-05-23 2005-05-11 Anelva Corp Substrate processing apparatus and processing method
JP4497972B2 (ja) * 2004-03-23 2010-07-07 株式会社オーク製作所 描画装置の基板の搬送機構
JP4530352B2 (ja) * 2004-12-21 2010-08-25 大日本スクリーン製造株式会社 基板載置装置
JP4745040B2 (ja) * 2005-12-05 2011-08-10 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
JP2008166348A (ja) * 2006-12-27 2008-07-17 Olympus Corp 基板搬送装置
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
JP2011233776A (ja) * 2010-04-28 2011-11-17 Nikon Corp 物体搬送装置、物体支持装置、物体搬送システム、露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法、及び物体搬送方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011065589A2 (en) * 2009-11-27 2011-06-03 Nikon Corporation Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method

Also Published As

Publication number Publication date
CN108231642A (zh) 2018-06-29
WO2012157231A1 (ja) 2012-11-22

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