CN108231331A - Inductor - Google Patents

Inductor Download PDF

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Publication number
CN108231331A
CN108231331A CN201710520479.5A CN201710520479A CN108231331A CN 108231331 A CN108231331 A CN 108231331A CN 201710520479 A CN201710520479 A CN 201710520479A CN 108231331 A CN108231331 A CN 108231331A
Authority
CN
China
Prior art keywords
face
conductive pattern
coil
external electrode
pore electrod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710520479.5A
Other languages
Chinese (zh)
Inventor
权宰贤
曹廷昊
申知桓
朴成珍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN108231331A publication Critical patent/CN108231331A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/24Magnetic cores
    • H01F27/245Magnetic cores made from sheets, e.g. grain-oriented
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers
    • H01F2017/002Details of via holes for interconnecting the layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F2017/0066Printed inductances with a magnetic layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • H01F2027/2809Printed windings on stacked layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The present invention provides a kind of inductor, including:Main body, include coil, and include dielectric layer or magnetic layer, and including the first face opposite to one another and the second face, be connected to the first face and the second face and third face opposite to one another and fourth face, be connected to the first face and the second face and be connected to third face and fourth face and the 5th face and the 6th face opposite to one another, the both ends of the coil are exposed respectively by third face and fourth face;First external electrode and the second external electrode, are respectively arranged at third face and the fourth face of the main body, and are connected to the both ends of the exposing of the coil, and the coil includes:Multiple conductive patterns are formed as the belt shape with gap on each dielectric layer or magnetic layer;Pore electrod is crossed, is separated by be formed with preset space length along the direction for forming the conductive pattern, connects the conductive pattern being configured up and down, the pore electrod of crossing is formed as, and the length on the direction for forming the conductive pattern is more than the width on the direction intersected with it.

Description

Inductor
Technical field
The present invention relates to a kind of inductors.
Background technology
Inductor is one kind in the important passive element for forming electronic circuit together with resistance and capacitor, can quilt It is used in component eliminated noise or form LC resonance circuit etc..
Previous stacked inductor be using laser and on potsherd punching and form via, and to fill up via And the structure of interlayer connection is realized by conductive metal printed conductor pattern on potsherd.
But if laser punching is carried out on potsherd, when being removed after printed conductor pattern, due to electric conductivity Open circuit (open) undesirable possibility that metal falls that coil occurs by via increases.
[existing technical literature]
[patent document]
(patent document 1) South Korea country's granted patent the 10-1646505th
(patent document 2) Japan authorized patent the 4895193rd
Invention content
The purpose of the present invention is to provide a kind of design for crossing pore electrod is free, and can prevent the bad and Rdc that opens a way The inductor of (D.C. resistance) rise phenomenon.
One aspect of the present invention provides a kind of inductor, including:Main body comprising coil, and includes dielectric layer or magnetic Property body layer, and including the first face opposite to one another and the second face, be connected to the first face and the second face and third face opposite to one another And it fourth face, is connected to the first face and the second face and is connected to third face and fourth face and the 5th face and the 6th opposite to one another Face, the both ends of the coil are exposed respectively by third face and fourth face;And first external electrode and the second external electrode, Third face and the fourth face of the main body are respectively arranged at, and is connected to the both ends of the exposing of the coil, the coil Including:Multiple conductive patterns are formed as the belt shape with gap on each dielectric layer or magnetic layer;And via electricity Pole is separated by be formed with preset space length along the direction for forming the conductive pattern, connects the conductive pattern being configured up and down, described It crosses pore electrod to be formed as, the length on the direction for forming the conductive pattern is more than the width on the direction intersected with it.
An embodiment according to the present invention, having can prevent because a part is not formed in coil or pore electrod excessively does not have Open circuit caused by being formed completely is bad, and prevents because caused by declining the electrical connectivity between interlayer conductive pattern on Rdc Rise the effect of phenomenon.
Description of the drawings
Fig. 1 is the solid cut a part for the inductor of an embodiment according to the present invention and schematically shown Figure.
Fig. 2 is the stepped construction for showing dielectric layer and conductive pattern in the inductor of an embodiment according to the present invention Separation stereogram.
Fig. 3 is the I-I' line profiles of Fig. 1.
Fig. 4 is the plan view for the dielectric layer for showing conductive pattern formed in Fig. 2 and crossing pore electrod.
Fig. 5 is the plan view for the dielectric layer that the formation for showing according to another embodiment of the present invention had pore electrod.
Symbol description
100:Inductor 110:Main body
111:Dielectric layer 120:Coil
121-125:Conductive pattern
121a、122a:First leading part and the second leading part
131、132:First external electrode and the second external electrode
161、162、162':Cross pore electrod
Specific embodiment
Hereinafter, the preferred embodiment of the present invention is described in detail with reference to accompanying drawings.However, the embodiment of the present invention can deform For various other modes, the scope of the invention is not limited to implementation forms described below.Additionally, it is provided the implementation of the present invention The purpose of example is to be described more fully the present invention to those of ordinary skill in the art.
In the accompanying drawings, it is shown in order to which explanation definitely, the form and dimension of element etc. may be exaggerated.In addition, needle To the function in the identical thought range that is shown in the attached drawing of each embodiment or identical inscape, using identical attached Icon note illustrates.
In addition, recorded as long as no special opposition, when being recorded as " comprising " certain inscape throughout the specification When, it is not meant as excluding other inscapes, but means that other inscapes can also be included.
In addition, throughout the specification, when being recorded as being formed in " ... on ", refer not only to be in direct contact and formed, also Other inscapes can also be included between them by referring to, therefore based on context should properly be explained.
In addition, the part unrelated with explanation is omitted, in order to clearly state the present invention in order to conclusively show in the figure Various layers and region enlargedly show its thickness, throughout the specification, similar attached drawing have been used about similar part Label.
Fig. 1 is the solid cut a part for the inductor of an embodiment according to the present invention and schematically shown Figure, Fig. 2 are points for the stepped construction for showing dielectric layer and conductive pattern in the inductor of an embodiment according to the present invention From stereogram, Fig. 3 is the I-I' line profiles of Fig. 1.
Referring to figs. 1 to Fig. 3, the inductor 100 of an embodiment according to the present invention includes:Outside main body 110 and first 131 and second external electrode 132 of electrode.
Main body 110 includes coil 120.In addition, in the following description, for convenience of description, main body 110 is illustrated for by such as The dielectric layers such as ceramics form, but the material of the main body 110 of the present invention is not limited to ceramics or dielectric, for example, can change For magnetic layer etc..
The shape of this main body 110 is simultaneously not particularly limited, and actually can also be hexahedral shape.
If defining hexahedral direction in order to clearly state the embodiment of the present invention, X, the Y represented on attached drawing with And Z represents length direction, width direction and thickness direction respectively.
In addition, it is the first face 1 by two surface sets opposite to one another in the Z-direction of main body 110 for convenience of description And second face 2, and the two sides opposite to one another in the X direction and front end in the first face 1 of connection and the second face 2 is set as third face 3 and fourth face 4, and by the opposite to one another in the Y direction and front end in the first face 1 of connection and the second face 2 and connect third face 3 and The two sides of the front end of fourth face 4 is set as the 5th face 5 and the 6th face 6.
In addition, the main body 110 of the present embodiment can include top cover board 112 and lower part cover board 113.
Top cover board 112 and lower part cover board 113 can be made of the material identical with dielectric layer 111, and by coil 120 All parts in addition to extension embedded, prevent the basic electrical characteristics of coil 120 due to by outer so as to play The effect that portion impacts or declines due to exterior materials.
The coil 120 of the present embodiment includes the multiple conductive pattern 121-125 being laminated along Z-direction and by adjacent conductor pattern The multiple of 121-125 interconnections cross pore electrod (via electrode) 161,162.
Conductive pattern 121-125 can utilize following method and be formed:With techniques such as silk-screen printings in each dielectric The electrocondution slurry of conductive metal is included or with techniques metal linings such as plating with the printing of scheduled thickness on layer 111.
At this point, the conductive metal can be by conductive metals or their alloy such as silver-colored (Ag), copper (Cu), nickel (Ni) Deng composition.
In addition, conductive pattern 121,122 can be formed as the belt shape with gap.
Preferably, this conductive pattern substantially has spiral structure, but the present invention is not limited thereto, when necessary, It can be the polygons such as quadrangle, pentagon, hexagon either circle, ellipse etc. or can also be formed as irregular Shape.
In addition, one along the top in Z-direction and the lowermost conductive pattern 121,122 is configured in conductive pattern Dividing can be exposed respectively by the third face 3 and fourth face 4 of main body 110.
Draw for this purpose, can be each extended at the both ends of conductive pattern 121,122 and be formed with the first leading part 121a and second Line portion 122a, the first leading part 121a and the second leading part 122a pass through the third face 3 of main body 110 and fourth face 4 respectively Expose.
First external electrode 131 and the second external electrode 132 are respectively arranged at the third face 3 of main body 110 and fourth face 4.
First external electrode 131 and the second external electrode 132 are connected to the third face 3 and the 4th by main body 110 The the first connecting lead wire portion 121a and the second connecting lead wire portion 122a that face 4 is exposed.
In addition, the first external electrode 131 and the second external electrode 132 can be formed as the third from main body 110 when necessary Face 3 and fourth face 4 extend to the part in the first face 1, the second face 2, the 5th face 5 and the 6th face 6.
In such a case, it is possible to improve the affixed intensity of the first external electrode 131 and the second external electrode 132, main body 110 the first face 1 or the second face 2 can become attachment face.
Such first external electrode, 131 and second external electrode 132 can be by conductive metal material with good conductivity Material is formed.
For example, the first external electrode 131 and the second external electrode 132 can be by including in silver-colored (Ag) or copper (Cu) at least A kind of material or their alloy composition, the present invention is not limited thereto.
In addition, in the outer surface of the first external electrode 131 and the second external electrode 132, it may be necessary to form electroplated layer (not shown) could be formed with nickel (Ni) layer and tin (Sn) layer successively in the electroplated layer from interior.
Fig. 4 is to show that formation in fig. 2 has conductive pattern and crosses the plan view of one of the dielectric layer of pore electrod.
Fig. 4 shows to be configured at the conductive pattern 121 of the top and the mistake being formed on its conductive pattern 121 in z-direction Pore electrod 162, also only gap is different from the forming position for crossing pore electrod by other conductive patterns 122-125 in addition to this, mistake The shape of pore electrod is then similar, therefore, the conductive pattern 121 of the top and is formed in its conductive pattern 121 below to be configured at On cross pore electrod 162 on the basis of illustrate, but this is considered as including being directed to other explanations for crossing pore electrod.
The present embodiment cross pore electrod 162 can after each dielectric layer 111 forms through hole, that is, via (not shown), Electrocondution slurry with good conductivity is filled to the via and is formed.
The electrocondution slurry can be by least one in for example silver-colored (Ag), silver-palladium (Ag-Pd), nickel (Ni) and copper (Cu) Kind or their alloy composition, and the present invention is not limited thereto.
In addition, for crossing pore electrod 162, the length on the direction for being formed conductive pattern 121 is set as L, and will When the width on direction intersected with the L is set as W, L-shaped becomes than W long, for example, corner parts are formed as rectangular square Shape or ellipse in curved surface etc..
At this point, for the pore electrod 162 excessively of the present embodiment, the length on the direction for being formed conductive pattern 121 When being set as L, and the width on the direction intersected with the L being set as W, W can be the 70% of the line width of conductive pattern 121 with Under, L/W can be more than 1.5.
If stacked inductor is declined by high current, the electrical connectivity of via part, Rdc may rise.This When, although if electrical connectivity can be strengthened by expanding via, but if the W is more than the 70% of the line width of conductive pattern 121, And the L/W is less than 1.5, then it is conductive when being removed after laser punching and printed conductor pattern are carried out for potsherd Property metal can be fallen by via, consequently, it is possible to occur coil open circuit it is bad.
The inductor of the present invention can utilize lamination (Build Up) technique to make.Lamination process is to utilize laser drill etc. And form via and conductive pattern and the method being laminated along Z-direction by each layer.
With reference to Fig. 5, in this lamination process of utilization, the width of pore electrod 162 ' excessively can be formed as and conductive pattern 121 it is of same size.
If as discussed above by the width of pore electrod 162 ' and the width of conductive pattern 121 be formed as identical, then layer Between the lap of conductive pattern can reduce, consequently, it is possible to generating the length of coil integrally elongated effect.
Previous stacked inductor be using laser on potsherd punching and form via, and to fill up via and The structure of interlayer connection is realized by conductive metal printed conductor pattern on potsherd.
But if laser punching is carried out on potsherd, when being removed after printed conductor pattern, due to electric conductivity Open circuit (open) undesirable possibility that metal falls that coil occurs by via increases.
The open circuit of this coil is bad in order to prevent, the method that can use the size for reducing via.
But in this case, it since conductive metal is not discharged in via, crosses pore electrod and fails preferable landform Into it is possible that the electrical connectivity occurred between the bad or interlayer conductive pattern of open circuit declines and makes the Rdc of inductor (straight Leakage resistance) rise the problem of.
On the contrary, for the inductor according to the present embodiment, conductive pattern is partially forming will form pore electrod Direction on length be set as L, and when the width on the direction intersected with the L is set as W, can based Robust Design for L is made to compare W It is long, so as to solve the part being used to form in previous stacked inductor structure in the conductive metal of conductive pattern The open circuit for falling into via and occurring is bad.
In addition, according to this embodiment, it can the shape of pore electrod was freely designed using lamination (Build-Up) technique. Furthermore it is possible to prevent the pore electrod excessively occurred when the size of via is smaller from not formed, caused open circuit is bad and interlayer is led The phenomenon that Rdc that electrical connectivity between body pattern declines caused inductor rises.
The embodiment of the present invention is described in detail above, but the interest field of the present invention is not limited thereto, this The those of ordinary skill in field, which should be expressly understood that, is not departing from the technological thought of the present invention described in claim In the range of various modifications can be carried out and deformation.

Claims (6)

1. a kind of inductor, which is characterized in that including:
Main body, comprising coil, and comprising dielectric layer or magnetic layer, and including the first face opposite to one another and the second face, connection In the first face and the second face and third face opposite to one another and fourth face, it is connected to the first face and the second face and is connected to third face And fourth face and the 5th face and the 6th face opposite to one another, the both ends of the coil are revealed respectively by third face and fourth face Go out;And
First external electrode and the second external electrode, are respectively arranged at third face and the fourth face of the main body, and connect respectively In the both ends of the exposing of the coil,
The coil includes:Multiple conductive patterns are formed as the belt shape with gap on each dielectric layer or magnetic layer; And pore electrod is crossed, it is separated by be formed with preset space length along the direction for forming the conductive pattern, connects leading for configuration up and down Body pattern,
The pore electrod of crossing is formed as, and the length on the direction for forming the conductive pattern is more than on the direction intersected with it Width.
2. inductor according to claim 1, which is characterized in that
Length on the direction of the formation conductive pattern for crossing pore electrod is being set as L, on the direction intersected with the L Width when being set as W, W is the 70% of the line width of conductive pattern hereinafter, L/W is more than 1.5.
3. inductor according to claim 1, which is characterized in that
The pore electrod of crossing is formed as rectangle or ellipse.
4. inductor according to claim 1, which is characterized in that
The width for crossing pore electrod is formed as of same size with the conductive pattern.
5. inductor according to claim 1, which is characterized in that further include:
First leading part and the second leading part, are formed in a manner of being exposed respectively by the third face of the main body and fourth face In at least one of described conductive pattern.
6. inductor according to claim 1, which is characterized in that
First external electrode and the second external electrode are formed as extending to first from the third face of the main body and fourth face Face, the second face, the 5th face and the 6th face a part.
CN201710520479.5A 2016-12-14 2017-06-30 Inductor Pending CN108231331A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0170387 2016-12-14
KR1020160170387A KR20180068570A (en) 2016-12-14 2016-12-14 Inductor

Publications (1)

Publication Number Publication Date
CN108231331A true CN108231331A (en) 2018-06-29

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Application Number Title Priority Date Filing Date
CN201710520479.5A Pending CN108231331A (en) 2016-12-14 2017-06-30 Inductor

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CN (1) CN108231331A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102350875B1 (en) 2019-12-23 2022-01-13 주식회사 한국가스기술공사 A jig structure for assembling and disassembling piston of compressor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580350B1 (en) * 1999-03-31 2003-06-17 Taiyo Yuden Co., Ltd. Laminated electronic component
US20150084730A1 (en) * 2013-09-24 2015-03-26 Samsung Electro-Mechanics Co., Ltd. Multilayer inductor and method of manufacturing the same
US20160293320A1 (en) * 2015-04-06 2016-10-06 Samsung Electro-Mechanics Co., Ltd. Inductor device and method of manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5147517B2 (en) 1972-03-15 1976-12-15
JP2013162100A (en) 2012-02-08 2013-08-19 Taiyo Yuden Co Ltd Laminate inductor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580350B1 (en) * 1999-03-31 2003-06-17 Taiyo Yuden Co., Ltd. Laminated electronic component
US20150084730A1 (en) * 2013-09-24 2015-03-26 Samsung Electro-Mechanics Co., Ltd. Multilayer inductor and method of manufacturing the same
US20160293320A1 (en) * 2015-04-06 2016-10-06 Samsung Electro-Mechanics Co., Ltd. Inductor device and method of manufacturing the same

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Application publication date: 20180629