KR20180068570A - Inductor - Google Patents

Abstract

The present invention provides an inductor which comprises: a body which includes a dielectric layer or a magnetic layer and a coil, includes a first surface and a second surface facing each other, a third surface and a fourth surface connected to the first and second surfaces and facing each other, and a fifth surface and a sixth surface connected with the first and second surfaces, connected with the third and fourth surfaces and facing each other, and has both ends of the coil respectively exposed through the third and fourth surfaces; and a first external electrode and a second external electrode which are respectively arranged on the third and fourth surfaces of the body and are respectively connected to the both exposed ends of the coil. The coil includes: a plurality of conductive patterns which are formed in a band shape with a gap on each dielectric layer or magnetic layer; and a via electrode which is formed at a predetermined interval along a formed direction of a conductive pattern and connects the conductive pattern arranged vertically. The via electrode is formed to have the length of the direction, where the conductive pattern is formed, longer than the width of the direction intersecting the same. The inductor is provided to freely design a via electrode and prevent an open failure and a DC resistance (Rdc) ascending phenomenon.

Description

Inductor {Inductor}

The present invention relates to an inductor.

An inductor is one of the important passive components of an electronic circuit together with a resistor and a capacitor, and can be used for a component removing noise or forming an LC resonance circuit.

A conventional multilayer inductor is a structure in which vias are formed by punching a ceramic sheet using a laser, and a conductor pattern is printed on a ceramic sheet so as to fill vias, thereby interconnecting layers.

However, when the ceramic sheet is laser-punched, there is a high possibility that openings of the coils open due to the removal of the conductive metal through the vias when the conductor pattern is peeled off after printing.

Korean Patent No. 10-1646505 Japanese Patent No. 4895193

SUMMARY OF THE INVENTION An object of the present invention is to provide an inductor which is free of the design of the via electrode and can prevent an open fault and an Rdc (direct current resistance) rise phenomenon.

According to an aspect of the present invention, there is provided a magnetic recording medium comprising a dielectric layer or a magnetic layer and a coil, and having first and second surfaces opposed to each other, third and fourth surfaces connected to the first and second surfaces and facing each other, A body connected to two sides and connected to the third and fourth sides and including fifth and sixth sides facing each other, both ends of the coil being exposed through the third and fourth sides, respectively; And first and second external electrodes respectively disposed on the third and fourth surfaces of the body, respectively, and connected to both exposed ends of the coil; Wherein the coil includes: a plurality of conductor patterns formed in an arc shape having a gap on each of the dielectric layers or the magnetic layer; A via electrode formed at predetermined intervals along one direction in which the conductor pattern is formed and connecting the conductor patterns arranged up and down; Wherein the via electrode is formed to be longer than a width in a direction in which the conductor pattern is formed in a direction intersecting the inductor.

According to an embodiment of the present invention, an open defect caused by a part of the coil is not formed or the via electrode is not formed completely, and the Rdc rise There is an effect that the phenomenon can be prevented.

FIG. 1 is a perspective view schematically showing a part of an inductor according to an embodiment of the present invention.
2 is an exploded perspective view illustrating a laminated structure of a dielectric layer and a conductor pattern in an inductor according to an embodiment of the present invention.
3 is a sectional view taken along the line I-I 'in Fig.
FIG. 4 is a plan view showing a dielectric layer on which a conductor pattern and a via-electrode are formed in FIG. 2. FIG.
5 is a plan view showing a dielectric layer on which via electrodes are formed according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.

The shape and size of elements in the drawings may be exaggerated for clarity. The same reference numerals are used for the same components in the same reference numerals in the drawings of the respective embodiments.

In addition, "including" an element throughout the specification does not exclude other elements unless specifically stated to the contrary.

In addition, throughout the specification, to be formed on "on " means properly formed not only in direct contact, but also should be construed accordingly depending on the context which may mean that it may further include other components .

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and similar parts are denoted by similar reference numerals throughout the specification .

FIG. 1 is a perspective view schematically showing a part of an inductor according to an embodiment of the present invention, FIG. 2 is an exploded perspective view showing a laminated structure of a dielectric layer and a conductor pattern in an inductor according to an embodiment of the present invention, 3 is a sectional view taken along the line I-I 'in Fig.

Referring to FIGS. 1 to 3, an inductor 100 according to an embodiment of the present invention includes a body 110 and first and second external electrodes 131 and 132.

The body 110 includes a coil 120. In the following description, the body 110 is made of a dielectric layer such as ceramic for convenience of explanation. However, the material of the body 110 of the present invention is not limited to a ceramic or a dielectric. For example, This is possible.

The shape of the body 110 is not particularly limited, and may be substantially a hexahedral shape.

In order to clearly illustrate the embodiment of the present invention, when the directions of the hexahedron are defined, X, Y, and Z shown in the drawing indicate the longitudinal direction, the width direction, and the thickness direction, respectively.

For convenience of explanation, both sides of the body 110 opposed to each other in the Z direction are set as the first and second surfaces 1 and 2, the first and second surfaces 1 and 2 are opposed to each other in the X direction, 2 and 3 are set as the third and fourth surfaces 3 and 4 and the ends of the first and second surfaces 1 and 2 are connected to each other in the Y direction and the third and fourth surfaces 3 and 4 are connected to each other, And both surfaces connecting the tips of the fourth surfaces (3, 4) are set as the fifth and sixth surfaces (5, 6).

In addition, the body 110 of the present embodiment may include upper and lower covers 112 and 113.

The upper and lower covers 112 and 113 may be made of the same material as the dielectric layer 111 and the coil 120 may be completely buried except for the lead portion so that the basic electrical characteristics of the coil 120 Can be prevented from being lowered.

The coil 120 of this embodiment includes a plurality of conductor patterns 121-125 laminated in the Z direction and a plurality of via electrodes 161 and 162 connecting adjacent conductor patterns 121-125.

The conductor patterns 121 to 125 are formed by printing a conductive paste containing a conductive metal with a predetermined thickness on each of the dielectric layers 111 by a method such as screen printing or by a method such as electroplating .

At this time, the conductive metal may be a conductive metal such as silver (Ag), copper (Cu), nickel (Ni), or an alloy thereof.

Further, the conductor patterns 121 and 122 may be formed in a strip shape having a gap.

The conductor pattern is preferably a helical structure, but the present invention is not limited thereto. The conductor pattern may be a polygon such as a square, a pentagon, a hexagon, or a circle, an ellipse, or the like, or may be formed in an irregular shape .

A part of the conductor patterns 121 and 122 disposed at the uppermost and lowermost ends of the conductor patterns in the Z direction can be exposed through the third and fourth faces 3 and 4 of the body 110, respectively.

The first and second lead portions 121a and 122a are respectively extended to both ends of the conductor patterns 121 and 122 so as to be exposed through the third and fourth faces 3 and 4 of the body 110, .

The first and second external electrodes 131 and 132 are disposed on the third and fourth surfaces 3 and 4 of the body 110, respectively.

The first and second external electrodes 131 and 132 are connected to the first and second lead portions 121a and 122a exposed through the third and fourth faces 3 and 4 of the body 110, respectively.

The first and second external electrodes 131 and 132 may be connected to the first, second, fifth, and sixth faces 1, 2, 5, and 6 on the third and fourth faces 3 and 4 of the body 110, 6).

In this case, the bonding strength of the first and second external electrodes 131 and 132 can be improved, and the first surface 1 or the second surface 2 of the body 110 can be a mounting surface.

The first and second external electrodes 131 and 132 may be made of a conductive metal material having excellent conductivity.

For example, the first and second external electrodes 131 and 132 may be made of a material containing at least one of silver (Ag) and copper (Cu), or an alloy thereof, but the present invention is not limited thereto.

In addition, a plating layer (not shown) may be formed on the outer surfaces of the first and second external electrodes 131 and 132 if necessary, and the nickel (Ni) layer and the tin (Sn) .

FIG. 4 is a plan view showing one dielectric layer in which a conductor pattern and via-electrodes are formed in FIG. 2. FIG.

4 shows the conductor pattern 121 disposed at the uppermost position in the Z direction and the via electrode 162 formed in the conductor pattern 121. Other conductor patterns 122-125 are also formed between the gap and the via- The via-electrodes 162 formed on the conductor patterns 121 are arranged on the uppermost surface of the conductor pattern 121. However, since the via-electrodes 162 are formed on the conductor pattern 121, . ≪ / RTI >

The via-electrode 162 of this embodiment can be formed by forming a via (not shown) as a through hole in each dielectric layer 111 and then filling the via with a conductive paste having excellent conductivity.

The conductive paste may be composed of at least one of silver (Ag), silver-palladium (Ag-Pd), nickel (Ni) and copper (Cu), or an alloy thereof, but the present invention is not limited thereto .

When the length in the direction in which the conductor pattern 121 is formed is L and the width in the direction crossing the L is W, L is formed to be longer than W, and the via- A rectangular or curved ellipse having a corner portion at a right angle, or the like.

When the length in the direction in which the conductor pattern 121 is formed is L and the width in the direction intersecting the L is W, the via electrode 162 of the present embodiment has W, Of the line width, and L / W may be 1.5 or more.

When the stacked inductor becomes high-current, the electrical connectivity of the via portion is lowered, and Rdc can be increased. At this time, if the via is enlarged, the electrical connectivity can be enhanced. However, if the W exceeds 70% of the line width of the conductor pattern 121 and the L / W is less than 1.5, the ceramic sheet is laser punched to print the conductor pattern The conductive metal may escape through the via during peeling, resulting in open failure of the coil

The inductor of the present invention can be manufactured using a build-up method. The build-up method is a method of forming vias and conductor patterns for each layer by using a laser drill or the like and laminating them in the Z direction.

Referring to FIG. 5, when such a build-up method is used, the width of the via electrode 162 'may be the same as the width of the conductive pattern 121.

If the width of the via electrode 162 'and the width of the conductor pattern 121 are formed to be equal to each other, the overlapped portions of the interlayer conductor patterns may be reduced and the overall length of the coils may be increased.

A conventional multilayer inductor is a structure in which vias are formed by punching a ceramic sheet using a laser, and a conductor pattern is printed on a ceramic sheet so as to fill vias, thereby interconnecting layers.

However, when the ceramic sheet is laser-punched, there is a high possibility that openings of the coils open due to the removal of the conductive metal through the vias when the conductor pattern is peeled off after printing.

A method of reducing the size of the via may be used to prevent such an open failure of the coil.

However, in this case, there is a problem that the conductive metal is not discharged in the via, and the via electrode is not properly formed, resulting in an open failure or the electrical connection between the interlayer conductor patterns is deteriorated and the Rdc (direct current resistance) of the inductor is increased.

On the other hand, in the inductor according to the present embodiment, when a length in a direction in which a via-electrode is formed is L in a direction in which a conductor pattern is formed and W is a width in a direction crossing the L, L is longer than W It is possible to solve the open defect which is caused by the fact that a part of the conductive metal for forming the conductor pattern in the conventional layered inductor structure falls into the via.

Also, according to the present embodiment, the shape of the via-electrode can be freely designed using a build-up method. It is also possible to prevent an increase in the Rdc of the inductor due to the open failure due to the non-formation of the via electrode and the decrease in the electrical connectivity between the interlayer conductor patterns, which is generated when the via size is small.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be obvious to those of ordinary skill in the art.

100: inductor
110: Body
111: dielectric layer
120: Coil
121-125: Conductor pattern
121a, 122a: first and second lead portions
131, 132: first and second outer electrodes
161, 162, 162 'Via electrode

Claims (6)

A dielectric layer or a magnetic layer and a coil, and has first and second surfaces opposed to each other, third and fourth surfaces connected to the first and second surfaces and opposed to each other, first and second surfaces connected to the first and second surfaces, A body connected to the fourth surface and including fifth and sixth surfaces facing each other, both ends of the coil being exposed through the third and fourth surfaces, respectively; And first and second external electrodes respectively disposed on the third and fourth surfaces of the body, respectively, and connected to both exposed ends of the coil; / RTI >
The coil includes a plurality of conductor patterns formed in a strip shape having a gap on each of the dielectric layers or the magnetic material layers; A via electrode formed at predetermined intervals along one direction in which the conductor pattern is formed and connecting the conductor patterns arranged up and down; / RTI >
Wherein the via electrode is formed to have a length in a direction in which the conductor pattern is formed is longer than a width in a direction in which the conductor pattern is formed.
The method according to claim 1,
L is a length in a direction in which the conductor pattern is formed in the via electrode and L is a width in a direction intersecting the L. W is 70% or less of a line width of the conductor pattern and L / W is 1.5 Inductor.
The method according to claim 1,
Wherein the via electrode is formed in a rectangular shape or an elliptical shape.
The method according to claim 1,
The width of the via electrode being equal to the width of the conductor pattern.
The method according to claim 1,
And at least one of the conductor patterns has first and second lead portions formed to be exposed through third and fourth surfaces of the body, respectively.
The method according to claim 1,
Wherein the first and second external electrodes are formed to extend to portions of the first, second, fifth, and sixth surfaces on the third and fourth surfaces of the body.

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