CN108206088A - Inductor - Google Patents
Inductor Download PDFInfo
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- CN108206088A CN108206088A CN201710521468.9A CN201710521468A CN108206088A CN 108206088 A CN108206088 A CN 108206088A CN 201710521468 A CN201710521468 A CN 201710521468A CN 108206088 A CN108206088 A CN 108206088A
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- coil pattern
- inductor
- coil
- external electrode
- gabarit
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- 238000010586 diagram Methods 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000011575 calcium Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 229910002113 barium titanate Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910009650 Ti1-yZry Inorganic materials 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910010252 TiO3 Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- -1 that is Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/004—Printed inductances with the coil helically wound around an axis without a core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The present invention discloses a kind of inductor.Inductor according to an embodiment of the invention includes:Main body is laminated by multiple insulating layers;First external electrode and the second external electrode are arranged in the outside of the main body;And coil, it is interconnected to form by the multiple coil patterns for being arranged in the insulating layer by coil connecting portion, and both ends are connected to first external electrode and the second external electrode by coil lead division, wherein, in the multiple coil pattern, it is thicker than the coil pattern for being arranged in central portion to be arranged at least one of the coil pattern of most gabarit coil pattern.
Description
Technical field
The present invention relates to a kind of inductors.
Background technology
Recently, for smart mobile phone, because of multiband long term evolution (LTE:Long Term Evolution) should
With using the signal of numerous frequency bands.Therefore, inductor in high frequency is mainly used in transceiving radio frequency (RF) system of signal
Impedance matching circuit.Inductor in high frequency is required miniaturization, high capacity.At the same time, inductor in high frequency is requested to have height
The magnetic resonance frequency (SRF) and low-resistivity of frequency band, so as to be used in the high frequency of more than 100MHz.Also, in order to subtract
Loss under frequency used in few, it is desirable that have higher Q characteristic, this is truth.
In order to have higher Q characteristic as described above, maximum can be generated by forming the characteristic of the material of the main body of inductor
Influence, however truth is to need a kind of following technical solution:Even if in the case where using identical material, can also make
The coil shape of inductor optimizes, so as to have higher levels of Q characteristic.
[existing technical literature]
[patent document]
(patent document 1) Korean Patent Publication No. 10-0869741
(patent document 2) Japanese Laid-Open Patent Publication the 2001-085320th
(patent document 3) Korean Patent Publication No. 10-0779981
Invention content
One of the objects of the present invention is to provide a kind of Q characteristic with high level and have insensitive to process deviation
The inductor of structure.
As for solving the scheme of above-mentioned technical problem, the present invention is directed to propose a kind of new structure by an example
Inductor, specifically, including:Main body is laminated by multiple insulating layers;First external electrode and the second external electrode,
It is arranged in the outside of the main body;And coil, pass through coil connecting portion by the multiple coil patterns for being arranged in the insulating layer
It is interconnected to form, and both ends are connected to first external electrode and the second external electrode by coil lead division,
In, in the multiple coil pattern, it is arranged in during at least one of the coil pattern of most gabarit coil pattern ratio is arranged in
The coil pattern in centre portion is thicker.
As for solving the scheme of above-mentioned technical problem, the present invention is directed to propose a kind of new structure by another example
Inductor, specifically, including:Main body is laminated by multiple insulating layers;First external electrode and the second external electrode,
It is arranged in the outside of the main body;And coil, it is mutual by coil connecting portion by the coil pattern for being arranged in the insulating layer
It connects and is formed, and both ends are connected to first external electrode and the second external electrode by coil lead division, wherein,
In the multiple coil pattern, the line width ratio for being arranged at least one of the coil pattern of most gabarit coil pattern is arranged in
The line width bigger of the coil pattern in centre portion.
For inductor according to an embodiment of the invention, prevent from forming spiral when from stacking direction
At least part coil pattern in the coil pattern of the coil track of shape is overlapped in adjacent coil pattern, so as to reduce coil
Closing effect between pattern can improve the Q characteristic of inductor accordingly.
Description of the drawings
Fig. 1 is the perspective elevation for schematically showing inductor according to an embodiment of the invention.
Fig. 2 is the front elevation for schematically showing inductor shown in Fig. 1.
Fig. 3 is the plan view for schematically showing inductor shown in Fig. 1.
Fig. 4 is the figure of the current density for the coil pattern for representing inductor according to an embodiment of the invention.
Fig. 5 is the figure of the current density of the coil pattern for the inductor for representing comparative example.
Fig. 6 is the frequency phase measured with the inductor according to comparative example and inductor according to an embodiment of the invention
The figure of the result of the Q factor (Q factor) of pass.
Fig. 7 is the sectional view along L directions for schematically showing inductor according to another embodiment of the present invention.
Fig. 8 is the figure of the current density for the coil pattern for representing inductor according to another embodiment of the present invention.
Fig. 9 is the result that the inductance based on design error is measured to inductor according to another embodiment of the present invention
Figure.
Figure 10 is that the Q factor (Q based on design error is measured to inductor according to another embodiment of the present invention
Factor the figure of result).
Figure 11 is the sectional view in the L directions for schematically showing inductor according to still another embodiment of the invention.
Figure 12 is the figure of the current density for the coil pattern for representing inductor according to still another embodiment of the invention.
Symbol description
100:Inductor 101:Main body
120:Coil 121:Coil pattern
131:Coil lead division 132:Coil connecting portion
140:Dummy pattern 181,182:External electrode
Specific embodiment
Hereinafter, the preferred embodiment of the present invention is described with reference to the accompanying drawings.
However, the embodiment of the present invention can be deformed into various other forms, retouched the scope of the invention is not limited to following
The embodiment stated.
Also, it provides the embodiment of the present invention to be intended to the personnel for having average knowledge in the technical field belonging to the present invention
It is described more fully the present invention.
For explanation definitely, form and dimension of all elements etc. may be exaggerated diagram in the accompanying drawings.
Moreover, for the identical inscape of the function in the identical thought range that is shown in the attached drawing of each embodiment,
It assigns identical drawing reference numeral and illustrates.
Hereinafter, W, L, T in attached drawing may be defined as first direction, second direction, third direction respectively.
Fig. 1 is the perspective elevation for schematically showing inductor 100 according to an embodiment of the invention, and Fig. 2 is
The front elevation of inductor shown in Fig. 1 is schematically shown, Fig. 3 is the plan view for schematically showing inductor shown in Fig. 1.
Referring to figs. 1 to Fig. 3, the structure of inductor 100 according to an embodiment of the invention is illustrated.
The main body 101 of the inductor 100 of first embodiment according to the present invention can be put down by multiple insulating layers along with attachment face
Capable first direction is laminated and is formed.
The insulating layer 111 can be magnetosphere or dielectric layer.
In the case where insulating layer 111 is dielectric layer, insulating layer 111 may include BaTiO3(barium titanate) is ceramic powders
Deng.In the case, the BaTiO3Be ceramic powders for example can be BaTiO3Middle some Ca (calcium) of solid solution, Zr (zirconium)
Deng (Ba1-xCax)TiO3、Ba(Ti1-yCay)O3、(Ba1-xCax)(Ti1-yZry)O3Or Ba (Ti1-yZry)O3Deng, and the present invention
It is not limited thereto.
It is magnetospheric in insulating layer 111, insulating layer 111 can be from the object that the main body of inductor can be used as to use
It is selected in matter suitable for person, such as may include resin, ceramics, ferrite etc..For the present embodiment, magnetosphere can utilize photosensitive
Property insulating materials, can realize the fine pattern based on photoetching process accordingly.That is, magnetosphere is formed using photosensitive insulating material,
So as to which coil pattern 121,122,123,124 and coil lead division 131 and coil connecting portion 132 subtly be formed, thus
It can contribute to the miniaturization of inductor 100 and the raising of function.For this purpose, it may include such as photonasty organic matter in magnetosphere
Or photoresist.In addition, SiO can also be included as filler (Filler) ingredient in magnetosphere2/Al2O3/BaSO4/Talc
Etc. inorganic constituents.
The first external electrode 181 and the second external electrode 182 can be disposed in the outside of main body 101.
For example, the first external electrode 181 and the second external electrode 182 can be disposed at the attachment face of main body 101.So-called patch
Dress face represent when inductor by attachment to printed circuit board when towards the surface of printed circuit board.
External electrode 181,182 inductor 100 by attachment to printed circuit board (PCB) when perform make inductor 100 and
The effect of substrate electrical connection.External electrode 181,182 is spaced from each other in main body 101 to be arranged in first direction and is parallel to attachment
The edge of the second direction in face.External electrode 181,182 may include such as conductive resin layer, be formed in the electric conductivity
Conductor layer on resin layer, however be not limited thereto.Conductive resin layer may include from by copper (Cu), nickel (Ni) and silver (Ag)
More than any one selected in the group of composition conductive metal and heat-curing resin.Conductor layer may include from by nickel
(Ni), more than any one selected in the group that copper (Cu) and tin (Sn) are formed, for example, nickel (Ni) layer and tin (Sn) layer can be successively
It is formed.
Referring to figs. 1 to Fig. 3, coil pattern 121 can be formed in insulating layer 111.
Coil pattern 121 can be electrically connected by means of coil connecting portion 132 with adjacent coil pattern 121.That is, spiral shape
Coil pattern 121 connect to form coil 120 by coil connecting portion 132.The both ends of coil 120 pass through coil lead division
131 and connect respectively with the first external electrode 181 and the second external electrode 182.Coil connecting portion 132 is in order to improve coil pattern
Connectivity between 121 and can have compared with broader line width for coil pattern 121, and including running through leading for insulating layer 111
Electrical via.
With reference to Fig. 1, the coil pattern 121 of inductor 100 according to an embodiment of the invention can also respectively include
The coil pattern 121 of more than two same shapes.
With reference to Fig. 2, can be formed at the position corresponding to external electrode 181,182 in insulating layer 111 illusory
(dummy) electrode 140.The executable work for improving the clinging force between external electrode 181,182 and main body 101 of dummy electrode 140
It can perform the effect of connecting bridge (bridge) in the case of being formed with or external electrode by metal deposition.
As the material of coil pattern 121, coil lead division 131 and coil connecting portion 132, electric conductivity brilliance can be used
The electric conductivity such as metal, that is, copper (Cu), aluminium (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb) or their alloy
Substance.Can coil pattern 121, coil lead division 131 and coil connecting portion be formed by metal deposition method or print process etc.
132, however be not limited thereto.
As shown in Fig. 2, for the inductor 100 of first embodiment according to the present invention, formed in insulating layer 111
Coil pattern 121, coil lead division 131 or coil connecting portion 132 etc., then by insulating layer 111 along parallel with attachment face the
One direction be laminated and manufactured, therefore compared with the prior art for, can more easily manufacture inductor 100.Also, coil
120 are arranged orthogonally to attachment face, therefore the phenomenon that can prevent magnetic flux from being influenced by mounted substrate.
With reference to Fig. 2, for the coil 120 of the inductor 100 of first embodiment according to the present invention, when from first direction
During projection, coil pattern 121 is overlapped and forms the coil track with coil turn more than 1 circle.
If specifically being observed, the first external electrode 181 and first coil pattern 121a passes through coil lead division 131
Connection, then first coil pattern 121a, the second coil pattern 121b, tertiary coil pattern 121c, the 4th coil pattern 121d,
5th coil pattern 121e, the 6th coil pattern 121f, the 7th coil pattern 121g and the 8th coil pattern 121h sequentially lead to
Coil connecting portion 132 is crossed to connect.Finally, the 8th coil pattern 121h is by means of the second external electrode 182 and coil lead division 131
And connect, so as to form coil 120.
With reference to Fig. 3, for inductor 100 according to an embodiment of the invention, it is arranged in coil pattern 121
The thickness of at least one of coil pattern 121a, 121h of most gabarit coil pattern is formed as the coil than being arranged in central portion
The thickness of pattern 121b, 121c, 121d, 121e, 121f, 121g are thicker.
In general, inductor in high frequency is a kind of element for having and dielectric open-flux path being utilized.For inductor in high frequency
Speech, the parasitic capacitance generated because of the loss of magnetic flux and between internal electrode and external electrode make the equivalent series under high frequency
Resistance increases, and the equivalent series resistance under such high frequency causes the reduction of Q.
[mathematical expression 1]
For Q as factor of merit, and without special measurement unit, imaginary number components of the X as impedance are defined as inductance
With the product of each frequency.Rs represents the equivalent series resistance under measurement frequency.
With reference to mathematical expression 1, equivalent series resistance represents following meaning:It is independently straight with steady state value with frequency variation
Leakage resistance is with the sum of AC resistance of change of size occurs with the variation of alternative frequency.Here, AC resistance is as resistance
Anti- imaginary number components are not merely consumed as D.C. resistance (Rdc) as thermal energy.That is, AC resistance is its L by magnetic
Field, C are by electric field come the Loss-free resistor of energy accumulation.But the signal due to that should flow through at a predetermined frequency is accumulated into electric field
Or magnetic field and stagnate, therefore final AC resistance can also be classified as resistance components.In particular, AC resistance can be based on alternative frequency
Increase caused by skin effect (Skin effect) and closing effect (Parasitic effect) and increase, thus draw
Play the rising of equivalent series resistance.
Inductor of the prior art forms the thickness of coil pattern in a manner of unrelated and constant with position.However,
For inductor according to an embodiment of the invention, be arranged in coil pattern 121 most gabarit coil pattern 121a,
The thickness of at least one of 121h coil patterns be formed as than be arranged in central portion coil pattern 121b, 121c, 121d,
The thickness of 121e, 121f, 121g are thicker.
Fig. 4 is the figure of the current density for the coil pattern for representing inductor according to an embodiment of the invention, and Fig. 5 is
Represent the figure of the current density of the coil pattern of the inductor of comparative example.
The dash area of Fig. 4 and Fig. 5 represents the higher part of the current density measured.
For comparative example, if with reference to the part B of Fig. 5, due to by the thickness of coil pattern with unrelated with position
And constant mode is formed, and then makes to be arranged in the edge part of outermost coil pattern 121a ', 121h ' due to closing effect
The current density divided is measured as higher.The reason of this phenomenon is, two conducting wires that electric current flows through in same direction it
Between generate mutual exclusion power.It therefore, can not be in entire coil pattern for coil pattern 121a ', the 121h ' of comparative example
Electric current is flowed evenly through, and this can become the increased factor of equivalent series resistance.
However, with reference to the part A of Fig. 4, the fact that following can be confirmed:Compared with comparative example, a reality according to the present invention
Apply the inductor 1100 of example to be arranged in high current density part in outermost coil pattern 121a, 121b less.
This shows that the thickness that coil pattern 121a, 121h of most gabarit is arranged in coil pattern 121 is formed as than arrangement
Thicker in the thickness of coil pattern 121b, 121c, 121d, 121e, 121f, 121g of central portion, then surface area increases, so as to
Increase region available for current, thus alleviate the raising of current density.That is, to according to an embodiment of the invention
For inductor 100, by least one of coil pattern 121a, 121h for being arranged in most gabarit in coil pattern 121
Thickness be formed as coil pattern 121b, 121c, 121d, 121e, 121f, 121g than being arranged in central portion thickness it is thicker,
Accordingly, equivalent series resistance is reduced, thus, it is possible to improve the Q characteristic of inductor 100.
Also, inductor 100 according to an embodiment of the invention is by the most gabarit that is arranged in coil pattern 121
The thickness of coil pattern 121a, 121h be entirely formed to than coil pattern 121b, 121c, 121d, 121e, 121f, 121g it is thick
Degree is thicker, accordingly, reduces equivalent series resistance, thus, it is possible to improve the Q characteristic of inductor 100.
[table 1]
The comparative example of table 1 be in a manner of unrelated with position to the thickness of coil pattern to be taken as to 13 μm of inductor
The example that inductance (L), Q factor (Q) and equivalent series resistance (Rs) measure, embodiment therein are then outermost to that will be located at
The thickness of wide coil pattern be taken as 17 μm and the thickness of the coil pattern in centrally located portion is taken as 13 μm inductor electricity
The example that sense (L), Q factor (Q) and equivalent series resistance (Rs) measure.With reference to table 1, the fact that following can be confirmed:With than
It is compared compared with example, thus the equivalent series resistance reduction amount up to 7.7% of embodiment increases Q factor (Q factor)
5.6%.
Fig. 6 is to measure and the inductor of comparative example and the frequency dependence of inductor according to an embodiment of the invention
The figure of the result of Q factor (Q factor).
Embodiment I is that the thickness for coil pattern 121a, 121h that most gabarit is arranged in coil pattern 121 is formed as comparing cloth
It is placed in the thicker inductor of the thickness of coil pattern 121b, 121c, 121d, 121e, 121f, 121g of central portion, Comparative Example I I
It is then the coil pattern 121a ' that most gabarit is arranged in coil pattern 121, the thickness of 121h ' and the coil for being arranged in central portion
The identical inductor of the thickness of pattern 121b, 121c, 121d, 121e, 121f, 121g.With reference to Fig. 6, the fact that following can be confirmed:
In the case of embodiment I, due in coil pattern 121a, 121h for being arranged in most gabarit because leading to electric current during closing effect
The phenomenon that density increase, is reduced, therefore Q factor (Q Factor) rises.
Inductor 100 according to an embodiment of the invention may be configured as, and the thickness of coil pattern 121 becomes from central portion
To contour part and gradually it is thickening.
For example, it is also possible to it is formed as follows:The thickness shape of tertiary coil pattern 121c and the 6th coil pattern 121f
It is thicker as the thickness than the 4th coil pattern 121d and the 5th coil pattern 121e, the second coil pattern 121b and the 7th coil
The thickness of pattern 121g is formed as thicker than the thickness of tertiary coil pattern 121c and the 6th coil pattern 121f, and First Line
The thickness of thickness ratio the second coil pattern 121b and the 7th coil pattern 121g of circular pattern 121a and the 8th coil pattern 121h
It is thicker.
As aftermentioned another embodiment, inductor 100 according to an embodiment of the invention can also be formed
For:The line width that at least one of coil pattern 121a, 121h of most gabarit is arranged in coil pattern 121 is more than coil pattern
The line width of coil pattern 121b, 121c, 121d, 121e, 121f, 121g of central portion are arranged in 121.
Also, inductor 100 according to an embodiment of the invention may be formed as:It is arranged in coil pattern 121
It is more than in coil pattern 121 in the surface area of at least one of coil pattern 121a, 121h of most gabarit coil pattern and arranges
In the surface area of coil pattern 121b, 121c, 121d, 121e, 121f, 121g of central portion.
Fig. 7 is the sectional view along L directions for schematically showing inductor 200 according to another embodiment of the present invention,
Fig. 8 is the figure of the current density for the coil pattern for representing inductor 200 according to another embodiment of the present invention.
With reference to Fig. 7 and Fig. 8, inductor 200 according to another embodiment of the present invention includes:Main body 201, including multiple exhausted
Edge layer 211;Coil pattern 221a, 221b, 221c, 221d, 221e, 221f are arranged in insulating layer 211.
For coil pattern 221a, 221b of inductor 200 according to another embodiment of the present invention, 221c, 221d,
For 221e, 221f, the coil pattern in centrally located portion is more than positioned at the line width of coil pattern 221a, 221f of most gabarit
The line width of 221b, 221c, 221d, 221e.
Therefore, with reference to the C portion of Fig. 8, can will be located at most in coil pattern 221a, 221b, 221c, 221d, 221e, 221f
Ratio in coil pattern 221a, 221f of gabarit shared by the higher part of current density reduces, so as to reduce equivalent series
Resistance.
That is, for inductor according to another embodiment of the present invention, by the coil pattern that will be located at most gabarit
The line width of 221a, 221f are formed larger than the line width of coil pattern 221b, 221c, 221d, the 221e in centrally located portion, so as to drop
Low ESR, thus, it is possible to improve the Q characteristic of inductor.
Fig. 9 is the result that the inductance based on design error is measured to inductor according to another embodiment of the present invention
Figure, Figure 10 is that the Q factor (Q factor) based on design error is measured to inductor according to another embodiment of the present invention
Result figure..
For inductor according to another embodiment of the present invention, by positioned at the coil pattern 221a of most gabarit,
The line width of 221f is formed larger than the line width of coil pattern 221b, 221c, 221d, the 221e in centrally located portion, and thus, it is possible to change
The Q characteristic of kind inductor, and in addition to this can also obtain the design error occurred due to process deviation is insensitive
Technique effect.With reference to Fig. 9 and Figure 10, the fact that following can be confirmed:In the line for coil pattern 221a, 221f that will be located at most gabarit
In the case that width is formed larger than the line width of coil pattern 221b, 221c, 221d, 221e in centrally located portion, embodiment
The change rate smaller of increased inductance or Q factor based on design error.
In particular, it can confirm the fact that following:When design error is less than 10 μm, the change rate of this inductance or Q factor
It significantly reduces.
Figure 11 is the sectional view in the L directions for schematically showing inductor 300 according to still another embodiment of the invention, figure
12 be the figure of the current density for the coil pattern for representing inductor 300 according to still another embodiment of the invention.
With reference to Figure 11 and Figure 12, inductor 300 according to still another embodiment of the invention includes:Main body 301, including multiple
Insulating layer 311;Coil pattern 321a, 321b, 321c, 321d, 321e, 321f are arranged in insulating layer 311.
For coil pattern 321a, 321b, 321c, 321d, 321e, 321f according to still another embodiment of the invention
Speech, the line width of a coil pattern 321f in the coil pattern of most gabarit be more than other coil patterns 321a, 321b,
The line width of 321c, 321d, 321e.
It therefore, can will be in coil pattern 321a, 321b, 321c, 321d, 321e, 321f with reference to the D parts of Figure 12
Ratio occupied by the part higher positioned at current density in the coil pattern 321f of most gabarit reduces, so as to reduce equivalent string
Join resistance.
That is, for inductor according to still another embodiment of the invention, it will be positioned at the coil pattern 321f's of most gabarit
Line width is formed larger than the line width of coil pattern 321a, 321b, 321c, 321d, the 321e in centrally located portion, reduces accordingly equivalent
Series resistance, thus, it is possible to improve the Q characteristic of inductor.
Embodiments described above is not mutually independent, one embodiment can also individually be implemented or by two with
On embodiment combination and implement.Also, although the embodiment of the present invention has been described in detail above, it is of the invention
Embodiment and attached drawing are not limited to, and is intended to be defined according to claims.
Therefore, in the range of the technological thought for not departing from the present invention described in claim, belonging to the present invention
The personnel with basic knowledge can realize the displacement, deformation and change of various form in technical field, those are also regarded as
Belong to the scope of the present invention.
Claims (11)
1. a kind of inductor, wherein, including:
Main body is laminated by multiple insulating layers;
First external electrode and the second external electrode are arranged in the outside of the main body;And
Coil is interconnected to form, and both ends by the multiple coil patterns for being arranged in the insulating layer by coil connecting portion
Portion is connected to first external electrode and second external electrode by coil lead division,
Wherein, it in the multiple coil pattern, is arranged at least one of the coil pattern of most gabarit coil pattern and compares cloth
The coil pattern for being placed in central portion is thicker.
2. inductor as described in claim 1, wherein, the thickness of the multiple coil pattern tends to gabarit with from central portion
Portion and it is increasingly thicker.
3. inductor as described in claim 1, wherein, in the multiple coil pattern, it is arranged in the circuit diagram of most gabarit
Case is thicker than the coil pattern for being arranged in central portion.
4. inductor as described in claim 1, wherein, in the multiple coil pattern, it is arranged in the circuit diagram of most gabarit
The line width bigger of coil pattern of the line width of at least one of case coil pattern than being arranged in central portion.
5. inductor as described in claim 1, wherein, in the multiple coil pattern, it is arranged in the circuit diagram of most gabarit
The surface area that the surface area ratio of at least one of case coil pattern is arranged in the coil pattern of central portion is wider.
6. inductor as described in claim 1, wherein, the coil pattern respectively includes the line of more than two same shapes
Circular pattern.
7. a kind of inductor, wherein, including:
Main body is laminated by multiple insulating layers;
First external electrode and the second external electrode are arranged in the outside of the main body;And
Coil is interconnected to form, and both ends lead to by the coil pattern for being arranged in the insulating layer by coil connecting portion
It crosses coil lead division and is connected to first external electrode and second external electrode,
Wherein, in the multiple coil pattern, it is arranged in the line of at least one of the coil pattern of most gabarit coil pattern
The line width bigger of coil pattern of the width than being arranged in central portion.
8. inductor as claimed in claim 7, wherein, in the multiple coil pattern, it is arranged in the circuit diagram of most gabarit
The line width bigger of coil pattern of the line width of case than being arranged in central portion.
9. inductor as claimed in claim 7, wherein, in the multiple coil pattern, it is arranged in the circuit diagram of most gabarit
At least one of case coil pattern is thicker than the coil pattern for being arranged in central portion.
10. inductor as claimed in claim 7, wherein, in the multiple coil pattern, it is arranged in the circuit diagram of most gabarit
The surface area that the surface area ratio of at least one of case coil pattern is arranged in the coil pattern of central portion is wider.
11. inductor as claimed in claim 7, wherein, the coil pattern respectively includes more than two same shapes
Coil pattern.
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KR1020160174502A KR20180071644A (en) | 2016-12-20 | 2016-12-20 | Inductor |
KR10-2016-0174502 | 2016-12-20 |
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Cited By (1)
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CN111696748A (en) * | 2019-03-13 | 2020-09-22 | 三星电机株式会社 | Coil electronic component |
Families Citing this family (8)
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KR102464202B1 (en) | 2016-08-31 | 2022-11-04 | 비쉐이 데일 일렉트로닉스, 엘엘씨 | Inductor with high current coil with low DC resistance |
KR102559344B1 (en) * | 2018-08-13 | 2023-07-25 | 삼성전기주식회사 | Indctor |
KR102139184B1 (en) | 2018-12-17 | 2020-07-29 | 삼성전기주식회사 | Coil component |
KR102262905B1 (en) | 2018-12-17 | 2021-06-09 | 삼성전기주식회사 | Coil component |
CN114631305B (en) * | 2019-10-16 | 2023-12-19 | Lg伊诺特有限公司 | Coil component for correcting hand shake and camera module with coil component |
KR20210115262A (en) * | 2020-03-12 | 2021-09-27 | 엘지이노텍 주식회사 | Coil substrate for correcting hand-shake and camera module having the same |
US11948724B2 (en) | 2021-06-18 | 2024-04-02 | Vishay Dale Electronics, Llc | Method for making a multi-thickness electro-magnetic device |
KR20230151248A (en) | 2022-04-25 | 2023-11-01 | 삼성전기주식회사 | Coil component |
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CN1462457A (en) * | 2001-03-05 | 2003-12-17 | Tdk株式会社 | Planar coil and planar tranformer |
CN104766692A (en) * | 2014-01-02 | 2015-07-08 | 三星电机株式会社 | Chip electronic component |
CN105826050A (en) * | 2015-01-28 | 2016-08-03 | 三星电机株式会社 | Electronic component and manufacturing method thereof |
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CN111696748A (en) * | 2019-03-13 | 2020-09-22 | 三星电机株式会社 | Coil electronic component |
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CN108206088B (en) | 2021-07-06 |
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