CN108074704A - Stacked die magnetic bead and its manufacturing method - Google Patents
Stacked die magnetic bead and its manufacturing method Download PDFInfo
- Publication number
- CN108074704A CN108074704A CN201710532605.9A CN201710532605A CN108074704A CN 108074704 A CN108074704 A CN 108074704A CN 201710532605 A CN201710532605 A CN 201710532605A CN 108074704 A CN108074704 A CN 108074704A
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- magnetic bead
- stacked die
- die magnetic
- electrode
- coil electrode
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- 239000011324 bead Substances 0.000 title claims abstract description 116
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 claims abstract description 5
- 238000001914 filtration Methods 0.000 claims description 28
- 239000000126 substance Substances 0.000 claims description 11
- 229910017518 Cu Zn Inorganic materials 0.000 claims description 5
- 229910017752 Cu-Zn Inorganic materials 0.000 claims description 5
- 229910017943 Cu—Zn Inorganic materials 0.000 claims description 5
- 229910000859 α-Fe Inorganic materials 0.000 claims description 5
- 230000005389 magnetism Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
One embodiment of the invention provides a kind of stacked die magnetic bead, including：Main body is laminated with multiple magnetospheres along the first direction；External electrode is configured at the both ends of the surface of the second direction perpendicular to the first direction of the main body；Spiral helicine coil electrode is configured at the magnetosphere；And low dielectric section, at least a portion in being configured between the coil electrode and the external electrode, and dielectric constant are less than the magnetosphere.
Description
Technical field
The present invention relates to a kind of stacked die magnetic bead (chip bead) and its manufacturing methods.
Background technology
Recently, it is gradual for the necessity of the high frequency of the component carried with the high speed of the digital equipments such as mobile phone
It comes back, for the stacked die magnetic bead as the countermeasure component for noise, the requirement to high frequency is also gradually carrying
It is high.
Recently, such requirement is increased to ghz band, in the high band of several GHz, it is desirable that higher impedance.
In order to which stacked die magnetic bead is made to have good high frequency characteristics, being fabricated to makes between external electrode and coil electrode
The stray capacitance (stray capacitance) of generation is smaller critically important.
In order to inhibit the stray capacitance of stacked die magnetic bead, usually by coil configuration into perpendicular to attachment face, but by line
When circle is configured to perpendicular to attachment face, to ensure the performance of magnetic bead, increases, require the high-precision of cutting there are stacking number, occur
The shortcomings of intensity of product declines.
[prior art literature]
[patent document]
(patent document 1) Korean Patent Laid the 2014-0025063rd
(patent document 2) Korean Patent Laid the 2007-0060088th
The content of the invention
One in the purpose of the present invention is to provide a kind of stray electrical that can be reduced between external electrode and coil electrode
The stacked die magnetic bead of appearance.
As for solving the method for above-mentioned problem, a kind of stacking of new structure is provided by an example of the present invention
Chip magnetic bead specifically, provides following stacked die magnetic bead, including：Main body is laminated with multiple magnetism along the first direction
Layer；External electrode is configured at the both ends of the surface of the second direction perpendicular to the first direction of the main body；Spiral helicine coil
Electrode is configured at the magnetosphere；And low dielectric section, in being configured between the coil electrode and the external electrode extremely
A few part, and dielectric constant is less than the magnetosphere.
As for solving the method for above-mentioned problem, can effectively be manufactured newly by another example of the present invention to provide
The manufacturing method of the stacked die magnetic bead of type structure, specifically comprises the following steps：Prepare multiple formed by magnetic substance；
Described formation coil electrode；Described that is formed with the coil electrode is stacked and squeezed along the first direction and forms master
Body；And the both ends of the surface of the second direction vertical with the first direction in the main body form external electrode, in the line
At least a portion between circle electrode and the external electrode is formed with dielectric constant less than the magnetospheric low dielectric section.
At least one between coil electrode and external electrode of the stacked die magnetic bead of an embodiment according to the present invention
Dividing includes low dielectric section, therefore can increase the high frequency of stacked die magnetic bead by reducing the stray capacitance of stacked die magnetic bead
Lower capacitance, so as to improve noise removal capability.
In addition, the stacked die magnetic bead of an embodiment according to the present invention between coil electrode and external electrode at least
A part includes low dielectric section, therefore can improve direct current overlapping features by reducing the stray capacitance of stacked die magnetic bead,
So as to improve the noise removal capability in the state of application load.
Description of the drawings
Fig. 1 schematically shows the stereogram of the stacked die magnetic bead of an embodiment according to the present invention.
Fig. 2 schematically shows the sectional view of the stacked die magnetic bead of first embodiment according to the present invention, and Fig. 3 is schematic
Ground shows the plan view of the stacked die magnetic bead of first embodiment according to the present invention.
Fig. 4 schematically shows the sectional view of the stacked die magnetic bead according to comparative example, Fig. 5 schematically show according to than
Compared with the plan view of the stacked die magnetic bead of example.
Fig. 6 represents the stacked die based on the stacked die magnetic bead according to comparative example and an embodiment according to the present invention
The impedance variations of the frequency measurement of magnetic bead.
Fig. 7 represents the stacked die based on the stacked die magnetic bead according to comparative example and an embodiment according to the present invention
The impedance rate of change of the current measurement of magnetic bead.
Fig. 8 schematically shows the sectional view of stacked die magnetic bead according to the second embodiment of the present invention, and Fig. 9 is schematic
Ground shows the plan view of stacked die magnetic bead according to the second embodiment of the present invention.
Figure 10 schematically shows the sectional view of stacked die magnetic bead according to the third embodiment of the invention, Figure 11 signals
According to the third embodiment of the invention the plan view of stacked die magnetic bead is shown to property.
Figure 12 schematically shows the sectional view of stacked die magnetic bead according to the fourth embodiment of the invention, Figure 13 signals
The plan view of stacked die magnetic bead according to the fourth embodiment of the invention is shown to property.
Figure 14 schematically shows the sectional view of stacked die magnetic bead according to the fifth embodiment of the invention, Figure 15 signals
The plan view of stacked die magnetic bead according to the fifth embodiment of the invention is shown to property.
Figure 16 schematically shows the sectional view of stacked die magnetic bead according to the sixth embodiment of the invention, Figure 17 signals
The plan view of stacked die magnetic bead according to the sixth embodiment of the invention is shown to property.
Figure 18 schematically shows the flow of the manufacturing method of stacked die magnetic bead according to another embodiment of the present invention
Figure.
Figure 19 to Figure 22 schematically shows the manufacturing method of stacked die magnetic bead according to another embodiment of the present invention
Each step.
Symbol description
100：Stacked die magnetic bead 110：Main body
111：Magnetosphere 120：Filtering part
121：Coil electrode 122,123：Lead electrode
124：Via 125：Coil track
126：Peripheral portion 130：Cover
131、132：Cap rock 141,142：External electrode
150：Low dielectric section
Specific embodiment
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
However, the embodiment of the present invention can be deformed into various other modes, the scope of the invention is not limited to following
The embodiment of explanation.
Additionally, it is provided the purpose of the embodiment of the present invention is in order to more complete to those skilled in the art
Ground illustrates the present invention.
For explanation definitely, form and dimension of the element in attached drawing etc. may be exaggerated and show.
It in addition, will for the identical composition of the function that is shown in the identical thought range in the attached drawing of each embodiment
Element is illustrated using identical reference numeral.
Stacked die magnetic bead
Fig. 1 schematically shows the stereogram of the stacked die magnetic bead 100 of an embodiment according to the present invention, Fig. 2 signals
Property show first embodiment according to the present invention stacked die magnetic bead 100 sectional view, Fig. 3 schematically show according to this
The plan view of the stacked die magnetic bead 100 of the first embodiment of invention.
Referring to figs. 1 to Fig. 3, the structure of the stacked die magnetic bead 100 of first embodiment according to the present invention is illustrated.
With reference to Fig. 1, the stacked die magnetic bead 100 of first embodiment according to the present invention includes main body 110 and is configured at
The external electrode 141,142 in the outside of main body 110.
Main body 110 can be by multiple magnetospheres 111 along the first direction, i.e. short transverse Z is stacked and is formed.
Magnetosphere 111 can include the magnetic substance that can be used as stacked die magnetic bead.
Magnetosphere 111 can include by Fe2O3, the compositions such as NiO, ZnO, CuO magnetic substance, for example, magnetosphere 111 can be with
Including Ni-Cu-Zn based ferrites.
External electrode 141,142 can be formed in the following way：In second vertical with first direction Z of main body 110
Two end faces of direction X form electrode layer using electrocondution slurry of conducting particles etc. is included, and form metal-plated in electrode layer afterwards
Layer and formed.
The conducting particles that electrocondution slurry is included can be selected from the outstanding metallic of the electric conductivity such as copper, nickel, silver, palladium
Any one or their mixture selected, but be not limited thereto.
It, can be by electroplating (electrolytic plating) or electroless plating (electroless on the coat of metal
Plating) mode forms nickel coating and tin coating.For example, the outermost layer of the coat of metal can be tin coating, and in tin coating
Nickel electrode layer can be configured between electrode layer.
External electrode 141,142 can include the first external electrode 141 and the second external electrode 142.
First external electrode 141 and the second external electrode 142 can be connected to two ends of coil described below respectively
Portion.
Spiral helicine coil electrode 121 is configured on magnetosphere 111.
Coil electrode 121 can be printed by the way that the electrocondution slurry of the outstanding conducting particles of electric conductivity such as silver-colored (Ag) will be included and
It is formed or is formed the methods of plating can be passed through.
At least a portion in the magnetosphere 111 for being formed with coil electrode 121 configures leaded electrode 122,123.
Lead electrode 122,123 includes the first lead electrode 122 and the second lead electrode 123, and the first lead electrode 122 connects
The first external electrode 141 is connected to, the second lead electrode 123 is connected to the second external electrode 142.
It, will at least more than two formation for the stacked die magnetic bead 100 of first embodiment according to the present invention
The magnetosphere 111 for having coil electrode 121 is stacked, and adjacent coil electrode 121 is electrically connected by conductive via, so as to be formed
The coil of at least more than one.
With reference to Fig. 3, if from upper perspective stacked die magnetic bead 100, coil electrode 121 overlaps each other and forms coil
Track 125.There is a peripheral portion 126 in the circumferential arrangement of coil track 125, peripheral portion 126 includes outer periphery portion 126a and interior
Side periphery portion 126b.
The part that coil electrode 121 is formed in the magnetosphere 111 of composition main body 110 can be defined as filtering part 120,
Cover 130 can be configured in the top and the bottom of filtering part 120.
That is, cover 130 includes not forming the magnetosphere of coil electrode.
Cover 130 includes lower part cap rock 131 and top cap rock 132.
Also, cover 130 can also include insulating layer.
At least a portion between coil electrode 121 and external electrode 141,142 can be configured with low dielectric section 150.
Low dielectric section 150 has the dielectric constant less than magnetosphere 111.For example, low dielectric section 150 is configured in filtering part 120
On magnetosphere 111.
In addition, as shown in Fig. 2, in the case where coil electrode 121 and low dielectric section 150 are separated by and to be formed, in coil electrode
Magnetic substance is configured between 121 and low dielectric section 150, therefore subtracting for inductance can be minimized while stray capacitance is reduced
It is few.
When magnetosphere 111 is Ni-Cu-Zn based ferrites, the dielectric constant of magnetosphere 111 is about 16 or so.It is at this point, low
Dielectric section 150 can be formed by substance of the dielectric constant less than magnetosphere 111.For example, low dielectric section 150 can include from by
SiO2、B2O3、Al2O3、ZnO2, any one or their mixture that select in the group of compositions such as CaO, MgO.
The stacked die magnetic bead 100 of first embodiment according to the present invention is in coil electrode 121 and external electrode 141,142
Between at least a portion be configured with low dielectric section 150, therefore coil electrode 121 and external electrode 141,142 can be reduced
Stray capacitance.
Fig. 4 schematically shows the sectional view of the stacked die magnetic bead 100 ' according to comparative example, and Fig. 5 schematically shows root
According to the plan view of the stacked die magnetic bead 100 ' of comparative example.
With reference to Fig. 4 and Fig. 5 it has been confirmed that being formed with stray electrical between coil electrode 121 and external electrode 141,142
Hold C.
For coil for the vertical-type stacked die magnetic bead that attachment face vertically configures, external electrode configuration
In the both ends of the surface of the stacking direction of the coil electrode configured on the inside of main body, thus it is spuious between coil electrode and external electrode
Capacitance is very small.
But vertical-type stacked die magnetic bead exist in order to ensure magnetic bead performance and stacking number is more, it is desirable that height cutting
Precision, and the problems such as the intensity decline of product.
Such as the stacked die magnetic bead 100 ' of comparative example, the level flatly configured compared with attachment face for coil electrode
It is miscellaneous being formed compared with attachment face and between the multiple coil electrodes and external electrode of horizontal arrangement for type stacked die magnetic bead
Spurious capacitance C, therefore there are problems that high frequency characteristics decline.
In horizontal type stacked die magnetic bead, the internal diameter of coil electrode is being reduced in order to reduce stray capacitance C so that outer
In the case of the distance between portion's electrode and coil electrode are increased, although stray capacitance C is reduced, with the internal diameter of coil electrode
It reduces and generates capacitance reduction.
If increase coil in the horizontal type stacked die magnetic bead for the internal diameter for reducing coil electrode in order to ensure capacitance
The number of turn, then the quantity of the coil electrode adjacent with external electrode increases, therefore there are problems that stray capacitance C increases again.
But for the stacked die magnetic bead 100 of first embodiment according to the present invention, coil electrode 121 with
At least a portion between external electrode 141,142 is configured with low dielectric section 150, thus can reduce coil electrode 121 with it is outer
The stray capacitance of portion's electrode 141,142.
Fig. 6 is represented based on the stacked die magnetic bead (filament) according to comparative example and first embodiment according to the present invention
The impedance variations of the frequency measurement of stacked die magnetic bead (thick line).It is but real described below second in the effect that Fig. 6 is shown
Applying example can also confirm in the same manner into sixth embodiment.
With reference to Fig. 6, for the stacked die magnetic bead 100 of first embodiment according to the present invention, in coil electrode 121
At least a portion between external electrode 141,142 is configured with low dielectric section 150, thus can reduce coil electrode 121 with
The stray capacitance of external electrode 141,142, whereby it was confirmed that compared with comparative example, self-resonant frequency (SRF) is to high-frequency region
It is mobile.Accordingly it has been confirmed that the high frequency removal region of the stacked die magnetic bead 100 of first embodiment according to the present invention broadens,
And the capacitance under high frequency also increases, therefore noise removal capability is also improved.
Fig. 7 is represented based on the stacked die magnetic bead (filament) and the layer of an embodiment according to the present invention according to comparative example
The impedance rate of change of the current measurement of folded chip magnetic bead (thick line).It is but real described below second in the effect that Fig. 7 is shown
Applying example can also confirm in the same manner into sixth embodiment.
With reference to Fig. 7, for the stacked die magnetic bead 100 of first embodiment according to the present invention, in coil electrode 121
At least a portion between external electrode 141,142 is configured with low dielectric section 150, thus can reduce coil electrode 121 with
The stray capacitance of external electrode 141,142, whereby it was confirmed that, compared with comparative example, the impedance rate of change based on electric current application
Characteristic variations tail off.
That is, due to stacked die magnetic bead stray capacitance reduction, direct current overlapping features improve, apply load state
Under noise removal capability can improve.
Hereinafter, the stacked die magnetic bead according to second to sixth embodiment is illustrated with reference to Fig. 8 to Figure 17.
But for the composition identical with the stacked die magnetic bead of above-mentioned first embodiment, the description thereof will be omitted.
Fig. 8 schematically shows the sectional view of stacked die magnetic bead 200 according to the second embodiment of the present invention, and Fig. 9 shows
The plan view of stacked die magnetic bead 200 according to the second embodiment of the present invention is shown to meaning property.
With reference to Fig. 8 and Fig. 9, the low dielectric section 250 of stacked die magnetic bead 200 according to the second embodiment of the present invention configures
In on magnetosphere 111, and the whole region being configured between coil electrode 121 and external electrode 141,142, therefore can be notable
Reduce stray capacitance in ground.
For example, the low dielectric section 250 of stacked die magnetic bead 200 according to second embodiment is configured in filtering part 120, because
This can prevent inductance from reducing.
Figure 10 schematically shows the sectional view of stacked die magnetic bead 300 according to the third embodiment of the invention, Figure 11
Schematically show the plan view of stacked die magnetic bead 300 according to the third embodiment of the invention.
With reference to Figure 10 and Figure 11, the low dielectric section 350 of stacked die magnetic bead 300 according to the third embodiment of the invention can
It is configured at the region that the main body 110 of filtering part 120 connects with external electrode 141,142.
Since low dielectric section 350 is configured at the region that main body 110 connects with external electrode 141,142 in filtering part 120,
Therefore stray capacitance can be significantly decreased.
At this point, low dielectric section 350 is made to be configured with being separated by with coil electrode 121, so as to reduce stray capacitance
While prevent inductance from reducing.
Figure 12 schematically shows the sectional view of stacked die magnetic bead 400 according to the fourth embodiment of the invention, Figure 13
Schematically show the plan view of stacked die magnetic bead 400 according to the fourth embodiment of the invention.
With reference to Figure 12 and Figure 13, the low dielectric section 450 of stacked die magnetic bead 400 according to the fourth embodiment of the invention is matched somebody with somebody
Filtering part 120 is placed in, and the whole region that can be configured between coil electrode 121 and external electrode 141,142.
Accordingly, stacked die magnetic bead 400 according to the fourth embodiment of the invention can significantly decrease stray capacitance.
Figure 14 schematically shows the sectional view of stacked die magnetic bead 500 according to the fifth embodiment of the invention, Figure 15
Schematically show the plan view of stacked die magnetic bead 500 according to the fifth embodiment of the invention.
With reference to Figure 14 and Figure 15, the low dielectric section 550 of stacked die magnetic bead 500 according to the fifth embodiment of the invention can
It is formed at the whole region that main body 110 connects with external electrode 141,142.
For example, low dielectric section 550 may be formed at positioned at the main body 110 of filtering part 120 and cover 130 and external electrode 141,
The whole region of 142 parts to connect.
External electrode 141,142 includes：Base stage is configured at the both ends of the surface of the second direction X of main body 110；Band pole, from main body
The both ends of 110 second direction X extend towards adjacent face.
Since external electrode 141,142 includes band pole, stray capacitance is generated between band pole and coil electrode 121.
But the low dielectric section 550 of stacked die magnetic bead 500 according to the fifth embodiment of the invention is formed at main body
The whole region of 110 parts to connect with external electrode 141,142, thus with can reduce band pole and coil electrode 121 it
Between stray capacitance the advantages of.
Figure 16 schematically shows the sectional view of stacked die magnetic bead according to the sixth embodiment of the invention, Figure 17 signals
The plan view of stacked die magnetic bead according to the sixth embodiment of the invention is shown to property.
The low dielectric section 650 of stacked die magnetic bead 600 according to the sixth embodiment of the invention can be formed at filtering part 120
And the whole region of the coil electrode 121 of cover 130 and external electrode 141,142.
The low dielectric section 650 of stacked die magnetic bead 600 i.e., according to the sixth embodiment of the invention is configured at outer periphery
The part at the both ends of the second direction for being configured at main body 110 in portion 126a.
The low dielectric section 650 of stacked die magnetic bead 600 according to the sixth embodiment of the invention stops external electrode completely
141st, between 142 and coil electrode 121, therefore stray capacitance can be significantly decreased.
The manufacturing method of stacked die magnetic bead
Figure 18 schematically shows the flow of the manufacturing method of stacked die magnetic bead according to another embodiment of the present invention
Figure.
With reference to Figure 18, the manufacturing method of stacked die magnetic bead according to another embodiment of the present invention includes：It prepares by magnetic
Property body formed multiple (sheet) step S110；The step S120 of coil electrode is formed on said sheets；It will be formed
State coil electrode described is stacked and squeezes and form the step S130 of main body along the first direction；And in the main body
The both ends of the surface of the second direction vertical with the first direction form the step S140 of external electrode.
Figure 19 to Figure 22 schematically shows the manufacturing method of stacked die magnetic bead according to another embodiment of the present invention
Each step.
Reference Figure 19 is first carried out preparing the step S110 of multiple.
In the manufacturing method of stacked die magnetic bead according to another embodiment of the present invention, piece refers to and according to above-mentioned
The corresponding composition of magnetosphere of the stacked die magnetic bead of one embodiment.
Piece 111 can be formed as with writing board shape.
Piece 111 can include the magnetic substance that can be used as stacked die magnetic bead.
Piece 111 can include by Fe2O3, the compositions such as NiO, ZnO, CuO magnetic substance, for example, piece 111 can include Ni-
Cu-Zn based ferrites.
But for the stacked die magnetic bead according to the above-mentioned 3rd to fourth embodiment, prepare piece 111 the step of
In, it can be formed as including low-dielectric rather than above-mentioned magnetic substance in the position for being equivalent to low dielectric section.
Then, as shown in figure 20, the step S120 that coil electrode 121 is formed in each on piece is performed.
Forming the step S120 of coil electrode 121 passed through the multiple coil electrodes 121 for being formed at layer different from each other
Hole 124 connects and may be constructed a coil.
For example, as illustrated in fig. 20, the one end for being configured at the coil electrode 121 of topmost is connected to the first lead electrode
122, the other end is connected to via 124.With reference to Figure 20 b, configured in the other end for being configured at the coil electrode 121 of topmost
Via 124 be connected to the coil electrode 121 positioned at central portion one end configuration via 124.Positioned at central portion
The one end that the via 124 of the other end configuration of coil electrode 121 is connected in the coil electrode 121 for being configured at lowest part is matched somebody with somebody
The via 124 put.As shown in Figure 20 c, the other end for being configured at the coil electrode 121 of lowest part is connected to the second lead electrode
123。
But it's not limited to that, in order to increase the number of turn of coil, can also increase the piece for being formed with coil electrode 121
111 quantity.It, can be appropriate when increasing the quantity for the piece 111 for being formed with coil electrode 121 to increase the number of turn of coil
The shape of ground adjustment coil electrode is so that adjacent coil electrode can connect to be in be wound up as spiral helicine shape by via.
In the step S120 for forming coil electrode 121, in order to coil electrode in the final product and external electrode it
Between at least a portion form the low dielectric section 150 of the magnetic substance that dielectric constant is included less than piece, can be formed in piece 111
Low dielectric section 150.
The shape of low dielectric section 150 such as can be adjusted suitably according to first to sixth embodiment stacked die magnetic bead.
Then, as shown in figure 21, the step S130 for being stacked the piece for being formed with coil electrode along the first direction is performed.
On the basis of stacked die magnetic bead according to first embodiment, as shown in figure 21, it can confirm that the of main body 110
The end face in two directions exposes low dielectric section 150, and the second lead electrode 123 of exposure.
Finally, as shown in figure 22, the both ends of the surface performed in the second direction vertical with first direction of main body 110 form outer
The step S140 of portion's electrode 141,142.
External electrode 141,142 can by the both ends of the surface of the second direction X vertical with first direction Z in main body 110,
After forming electrode layer using electrocondution slurry including conducting particles etc., form coating layer in electrode layer and formed.
The conducting particles that electrocondution slurry is included can be selected from the outstanding metallic of the electric conductivity such as copper, nickel, silver, palladium
Any one or their mixture selected, but it's not limited to that.
On coating layer, can nickel coating and tin coating be formed by plating or electroless plating.For example, coating layer is outermost
Layer can be tin coating, and nickel electrode layer can be configured between tin coating and electrode layer.
External electrode 141,142 can include the first external electrode 141 and the second external electrode 142, and outside first
141 and second external electrode 142 of electrode is connected to the first lead electrode 122 and the second lead electrode 123.
More than, the embodiment of the present invention is described in detail, but the invention is not limited in realities described above
Example and attached drawing are applied, but should be limited by the appended claims.
Therefore, in the range of the technological thought for not departing from the present invention recorded in claims, in the art
In have general knowledge level personnel can carry out it is various forms of displacement, deformation and change, and these will also belong to originally
The scope of invention.
Claims (16)
1. a kind of stacked die magnetic bead, which is characterized in that including：
Main body is laminated with multiple magnetospheres along the first direction；
External electrode is configured at the both ends of the surface of the second direction perpendicular to the first direction of the main body；
Spiral helicine coil electrode is configured at the magnetosphere；And
Low dielectric section, at least a portion in being configured between the coil electrode and the external electrode, and dielectric constant is low
In the magnetosphere.
2. stacked die magnetic bead according to claim 1, which is characterized in that
The low dielectric section is configured at the magnetosphere.
3. stacked die magnetic bead according to claim 1, which is characterized in that
The low dielectric section is configured at the magnetosphere, and is configured at entire between the coil electrode and the external electrode
Region.
4. stacked die magnetic bead according to claim 1, which is characterized in that
The main body includes the cover for possessing the filtering part of the coil electrode and being configured at the top and the bottom of the filtering part,
The low dielectric section is separated by with the coil electrode and is configured at the filtering part.
5. stacked die magnetic bead according to claim 1, which is characterized in that
The main body includes the cover for possessing the filtering part of the coil electrode and being configured at the top and the bottom of the filtering part,
The low dielectric section is configured at the whole region between the coil electrode of the filtering part and the external electrode.
6. stacked die magnetic bead according to claim 1, which is characterized in that
The main body includes the cover for possessing the filtering part of the coil electrode and being configured at the top and the bottom of the filtering part,
The low dielectric section is configured at the filtering part and the cover.
7. stacked die magnetic bead according to claim 1, which is characterized in that
The low dielectric section is configured at the whole region for the part that the external electrode connects with the main body.
8. stacked die magnetic bead according to claim 1, which is characterized in that
The magnetosphere is Ni-Cu-Zn based ferrites.
9. a kind of manufacturing method of stacked die magnetic bead, which is characterized in that comprise the following steps：
Prepare multiple formed by magnetic substance；
Coil electrode is formed at described；
Described that is formed with the coil electrode is stacked and squeezed along the first direction and forms main body；And
External electrode is formed in the both ends of the surface of the second direction vertical with the first direction of the main body,
At least a portion between the coil electrode and the external electrode is formed with dielectric constant less than the magnetism
The low dielectric section of layer.
10. the manufacturing method of stacked die magnetic bead according to claim 9, which is characterized in that
The low dielectric section is configured at the on piece.
11. the manufacturing method of stacked die magnetic bead according to claim 9, which is characterized in that
The low dielectric section is formed at the on piece, and is formed at the entire area between the coil electrode and the external electrode
Domain.
12. the manufacturing method of stacked die magnetic bead according to claim 9, which is characterized in that
The main body includes the cover for possessing the filtering part of the coil electrode and being configured at the top and the bottom of the filtering part,
The low dielectric section is separated by with the coil electrode and is formed at the filtering part.
13. the manufacturing method of stacked die magnetic bead according to claim 9, which is characterized in that
The main body includes the cover for possessing the filtering part of the coil electrode and being configured at the top and the bottom of the filtering part,
The low dielectric section is formed at the whole region between the coil electrode of the filtering part and the external electrode.
14. the manufacturing method of stacked die magnetic bead according to claim 9, which is characterized in that
The main body includes the cover for possessing the filtering part of the coil electrode and being configured at the top and the bottom of the filtering part,
The low dielectric section is formed at the filtering part and the cover.
15. the manufacturing method of stacked die magnetic bead according to claim 9, which is characterized in that
The low dielectric section is formed at the whole region for the part that the external electrode connects with the main body.
16. the manufacturing method of stacked die magnetic bead according to claim 9, which is characterized in that
The magnetic substance is Ni-Cu-Zn based ferrites.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0154242 | 2016-11-18 | ||
| KR1020160154242A KR101862479B1 (en) | 2016-11-18 | 2016-11-18 | Laminate chip bead and method of fabricating the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108074704A true CN108074704A (en) | 2018-05-25 |
Family
ID=62159242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710532605.9A Pending CN108074704A (en) | 2016-11-18 | 2017-07-03 | Stacked die magnetic bead and its manufacturing method |
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| Country | Link |
|---|---|
| KR (1) | KR101862479B1 (en) |
| CN (1) | CN108074704A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7360816B2 (en) * | 2019-05-24 | 2023-10-13 | 株式会社村田製作所 | Laminated coil parts |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04364710A (en) * | 1991-06-12 | 1992-12-17 | Murata Mfg Co Ltd | Chip transformer |
| JPH09246046A (en) * | 1996-03-14 | 1997-09-19 | Murata Mfg Co Ltd | Electronic component |
| JPH1092645A (en) * | 1996-09-18 | 1998-04-10 | Tokin Corp | Layered impedance element |
| JP2000331831A (en) * | 1999-05-18 | 2000-11-30 | Tokin Corp | Laminated impedance device |
| JP2003086426A (en) * | 2001-09-13 | 2003-03-20 | Nec Tokin Corp | Laminated impedance element |
| JP2004343084A (en) * | 2003-04-21 | 2004-12-02 | Murata Mfg Co Ltd | Electronic component |
| KR20140025063A (en) * | 2012-08-21 | 2014-03-04 | 삼성전기주식회사 | Chip inductor |
-
2016
- 2016-11-18 KR KR1020160154242A patent/KR101862479B1/en active IP Right Grant
-
2017
- 2017-07-03 CN CN201710532605.9A patent/CN108074704A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04364710A (en) * | 1991-06-12 | 1992-12-17 | Murata Mfg Co Ltd | Chip transformer |
| JPH09246046A (en) * | 1996-03-14 | 1997-09-19 | Murata Mfg Co Ltd | Electronic component |
| JPH1092645A (en) * | 1996-09-18 | 1998-04-10 | Tokin Corp | Layered impedance element |
| JP2000331831A (en) * | 1999-05-18 | 2000-11-30 | Tokin Corp | Laminated impedance device |
| JP2003086426A (en) * | 2001-09-13 | 2003-03-20 | Nec Tokin Corp | Laminated impedance element |
| JP2004343084A (en) * | 2003-04-21 | 2004-12-02 | Murata Mfg Co Ltd | Electronic component |
| KR20140025063A (en) * | 2012-08-21 | 2014-03-04 | 삼성전기주식회사 | Chip inductor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101862479B1 (en) | 2018-05-29 |
| KR20180056239A (en) | 2018-05-28 |
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Application publication date: 20180525 |