JP6870804B2 - Coil parts - Google Patents

Description

The present invention relates to coil components.

An inductor, which is one of the coil components, is a typical passive element that forms an electronic circuit together with a resistor and a capacitor to remove noise.

Such inductors can be classified into winding type, laminated type, thin film type and the like. Of these, the thin film inductor is suitable for making it relatively thin, and has recently been used in various fields.

However, in the case of the conventional thin film inductor, since the coil conductor is formed on the insulating substrate, the electrode formation by plating and the application to the L-shaped electrode structure are restricted, and as a result, the characteristics of the product are deteriorated. There were disadvantages.

One of various objects of the present invention is to provide a coil component having excellent product characteristics.

One of the various solutions proposed throughout the present invention is to form a dummy pad on the other surface of the coil substrate at a position corresponding to the lead-out portion of the coil conductor formed on the other surface of the coil substrate, and to form the dummy pad through the via. It is to connect the drawer part and the above-mentioned dummy pad.

For example, the coil component according to the embodiment of the present invention is formed on a main body including a coil substrate inside, one surface of the coil substrate and another surface facing the coil substrate, respectively, and is formed on the first surface and the second surface of the main body, respectively. The first and second coil conductors having the first and second lead portions extending so as to be exposed, respectively, and the other surface of the coil substrate are formed at positions corresponding to the first lead portions. A first dummy pad exposed on the first surface of the main body and a first via for electrically connecting the first lead portion and the first dummy pad can be included.

One of the various effects of the present invention is that the coil component according to the embodiment of the present invention has excellent inductance characteristics and DC resistance characteristics.

Further, as another one of various effects of the present invention, there is an advantage that the coil component according to the embodiment of the present invention is excellent in self-resonance frequency (SRF, Self Resonance Frequency) characteristics.

As yet another effect of the various effects of the present invention, the coil component according to the embodiment of the present invention does not need to specify the surface forming the electrode portion, and the mounting surface of the coil component is placed on the main body 10. Since it can be an arbitrary surface, there is an advantage that workability is facilitated because it is not necessary to select an electrode forming surface in the manufacturing process.

The various and meaningful advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of explaining specific embodiments of the present invention.

It is a perspective view of the coil component by one Embodiment of this invention. It is a perspective view which shows so that the coil conductor of the coil component shown in FIG. 1 appears. (A) is a cross-sectional view of the coil component shown in FIG. 1 cut along the line AA', and (b) is a cross-sectional view of the coil component of FIG. 1 cut along the line BB'. .. (A) is a cut sectional view of a coil component according to another embodiment of the present invention, and (b) is a cut sectional view of a coil component according to still another embodiment of the present invention. It is a graph which shows the inductance of a coil component by the comparative example based on the prior art. It is a graph which shows the inductance of the coil component by Example 1. FIG. It is a graph which shows the inductance of the coil component by Example 2. FIG.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention can be transformed into various other embodiments, and the scope of the invention is not limited to the embodiments described below. Also, embodiments of the present invention are provided to more fully explain the present invention to those having average knowledge in the art. Therefore, the shape and size of the elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation.

On the other hand, the expression "one sample" as used herein does not mean the same embodiment, but is provided to emphasize and explain unique features that are different from each other. is there. However, it does not preclude that the embodiments presented in the following description are realized in combination with the features of other embodiments. For example, if a matter described in a particular embodiment is not described in another embodiment, it is relevant to the other embodiment unless there is an opposite or contradictory description in the other embodiment. Can be understood as an explanation.

Hereinafter, the coil component according to the embodiment of the present invention will be described. As an example thereof, an inductor will be described as an example for convenience, but the present invention is not necessarily limited to this, and it goes without saying that the contents of the present invention can be applied to coil components for various other purposes. Examples of coil components for various other uses include common mode filters (Common Mode Filter), ordinary beads (General Beads), and high frequency beads (GHz Beads).

FIG. 1 is a perspective view of a coil component according to an embodiment of the present invention, FIG. 2 is a perspective view showing the coil conductor of the coil component shown in FIG. 1 so as to appear, and FIG. 3 (a) is shown in FIG. It is sectional drawing which cut | cut the coil component along the line AA', and FIG. 3 (b) is the sectional view which cut the coil component of FIG. 1 along the line BB'.

Referring to the drawings, the coil component 100 according to the embodiment of the present invention includes a main body 10 including a coil substrate 21 inside, and a first coil conductor 22 formed on one surface of the coil substrate 21 and the other surface facing the coil substrate 21. The second coil conductor 23 and the electrode portion 30 can be included.

The main body 10 is a member that forms the appearance of the coil component 100. The main body 10 has a first surface S1 and a second surface S2 facing the first direction, a third surface S3 and a fourth surface S4 facing the second direction, and a fifth surface S5 and a third surface facing the third direction. It may have a generally hexahedral shape composed of 6-sided S6, but is not limited to this.

The main body 10 can contain a magnetic substance. The magnetic substance is not particularly limited as long as it has magnetic properties, and is, for example, pure iron powder, Fe—Si alloy powder, Fe—Si—Al alloy powder, Fe—Ni alloy powder, Fe—Ni. -Mo-based alloy powder, Fe-Ni-Mo-Cu-based alloy powder, Fe-Co-based alloy powder, Fe-Ni-Co-based alloy powder, Fe-Cr-based alloy powder, Fe-Cr-Si-based alloy powder, Fe -Ni-Cr alloy powder, Fe alloys such as Fe-Cr-Al alloy powder, amorphous alloys such as Fe-based amorphous and Co-based amorphous, Mg-Zn-based ferrite, Mn- Spinnel-type ferrites such as Zn-based ferrite, Mn-Mg-based ferrite, Cu-Zn-based ferrite, Mg-Mn-Sr-based ferrite, and Ni-Zn-based ferrite, Ba-Zn-based ferrite, Ba-Mg-based ferrite, and Ba- Hexagonal ferrites such as Ni-based ferrite, Ba-Co-based ferrite, and Ba-Ni-Co-based ferrite, and garnet-type ferrites such as Y-based ferrite can be mentioned.

The magnetic substance may contain a metal magnetic material powder and a resin mixture. The metallic magnetic powder can contain iron (Fe), chromium (Cr), or silicon (Si) as a main component, and for example, iron (Fe) -nickel (Ni), iron (Fe), iron (Fe). )-Chrome (Cr) -Silicon (Si) and the like can be included, but is not limited thereto. The resin may contain, but is not limited to, epoxy, polyimide, liquid crystal polymer, and the like alone or in admixture. The metal magnetic material powder may be filled with a metal magnetic material powder having two or more average particle diameters D ₁ and D _2. In this case, by crimping with bimodal metal magnetic powders having different sizes, the magnetic resin composite can be fully filled, so that the filling rate can be increased.

The main body 10 is formed by molding a magnetic resin composite containing a metal magnetic powder and a resin mixture into a sheet form, and pressing and hardening the upper and lower portions of the first and second coil conductors 22 and 23. However, it is not necessarily limited to this. At this time, the direction in which the magnetic resin composite in the form of a sheet is laminated can be set to be perpendicular to the mounting surface of the coil component. Here, the term "perpendicular" includes not only the case where the coil component is completely 90 ° with respect to the mounting surface, but also the case where the angle is about 90 °, that is, the angle is about 60 to 120 °. It is a concept.

The coil substrate 21 is provided inside the main body 10 and plays a role of supporting the first coil conductor 22 and the second coil conductor 23. For example, a polypropylene glycol (PPG) substrate, a ferrite substrate, a metal-based soft magnetic substrate, or the like. Can be formed with. In this case, a through hole can be formed in the central region of the coil substrate 21, and the through hole can be filled with the same substance as the substance forming the main body to form the core portion 15. Such a core portion 15 constitutes a part of the main body 10.

The first coil conductor 22 and the second coil conductor 23 are formed on one surface of the coil substrate 21 and the other surface facing the coil substrate 21, respectively. The first coil conductor 22 and the second coil conductor 23 can be formed in a spiral shape and can be electrically connected to each other via an internal via 28 penetrating the coil substrate 21. On the outermost side of the first coil conductor 22 and the second coil conductor 23, first and second extraction portions 22a and 23a exposed to the outside of the main body 10 for electrical connection with the electrode portion 30 are provided. The first and second drawer portions 22a and 23a are provided and are exposed on the first surface S1 and the second surface S2 of the main body 10, respectively. The first and second extraction portions 22a and 23a are formed integrally with the first coil conductor 22 and the second coil 23, respectively, in a form forming a part of the outermost regions of the first and second coils 22 and 23, respectively. Can be done.

The first coil conductor 22 and the second coil conductor 23 can be formed of a material such as a metal having high electrical conductivity, for example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni). , Titanium (Ti), Gold (Au), Copper (Cu), Platinum (Pt), or alloys thereof. In this case, the electroplating method can be used as an example of a preferable process for producing the thin film shape. However, other steps known in the art can also be used as long as they can produce the same effect.

The electrode portion 30 plays a role of electrically connecting the coil component to the circuit board or the like when the coil component is mounted on the circuit board or the like.

The electrode portion 30 can be formed by plating. In this case, not only the thickness can be easily adjusted, but also the thickness of the external electrode can be made thinner, so that the volume of the main body 10 can be increased, and the inductance, DC resistance characteristics, efficiency, etc. can be improved. It has the advantage that it can be improved.

The electrode portion 30 can be formed by containing a conductive substance, for example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), and copper. It can be formed of (Cu), platinum (Pt), tin (Sn), or an alloy thereof. On the other hand, when the electrode portion 30 is formed by plating, the electrode portion 30 does not have to contain a glass component and a resin.

Referring to FIG. 3A, the coil component according to the embodiment of the present invention is formed at a position corresponding to the first lead portion 22a on the other surface of the coil substrate 21 and is exposed on the first surface of the main body 10. 1 Includes dummy pad 24. Such a first dummy pad 24 is electrically connected to the first lead portion 22a via a first via 25 penetrating the coil substrate 21.

The first dummy pad 24 can also be formed of a material such as a metal having high electrical conductivity, for example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), It can be formed of gold (Au), copper (Cu), platinum (Pt), or an alloy thereof. Further, an electroplating method can be used as an example of a preferable step for forming the first dummy pad 24. However, other steps known in the art can also be used as long as they can produce the same effect.

As described above, in the case of the conventional coil component, since the coil conductor is formed on the insulating substrate, the insulating substrate is exposed on the surface of the main body, and as a result, it is difficult to form the electrode by plating. Therefore, in general, the electrode portion has been formed by using a conductive resin paste containing a conductive metal and a resin such as an epoxy resin. At this time, silver (Ag), which has a low resistivity, has been mainly used as the conductive metal contained in the conductive resin paste, but not only the material cost is high, but also poor contact with the coil conductor frequently occurs. As a result, it has become a cause of excessive increase in contact resistance. Further, since the two coil conductors are formed on the upper part and the lower part of the coil substrate, the application to the L-shaped electrode structure is limited, and the electrode must be formed over the entire side surface of the main body. There is a disadvantage that the parasitic capacitance component between the conductor and the electrode portion becomes excessive and the self-resonance frequency (SRF) characteristic of the coil component deteriorates.

On the other hand, in one embodiment of the present invention, the first dummy pad 24 is formed at a position corresponding to the first lead portion 22a on the other surface of the coil substrate 21, and the first dummy pad 24 is connected via the first via 25. 1 It was electrically connected to the lead portion 22a. As a result, in the coil component according to the present embodiment, the electrode portion 30 can be selectively formed only on one side of the main body 10 with the coil substrate 21 as a boundary, and as a result, the electrode portion is formed by plating and L. It can be applied to a character-shaped electrode structure.

According to one embodiment, the electrode portion 30 covers at least a part of the first dummy pad 24, and is formed so as to extend to the first surface S1 of the main body 10 and the third surface S3 connected to the first surface S1. The 1 electrode 31 and the second electrode 32 formed so as to cover at least a part of the second lead portion 23a and extend to the second surface S2 of the main body 10 and the third surface S3 connected to the second surface S2. Can include. At this time, the first surface S1 and the second surface S2 are arranged so as to face each other while forming the side surfaces of the main body 10, and the third surface S3 can be provided as a mounting surface for the coil component.

_{Further, the length H 1} of the portion of the first electrode 31 formed on the first surface S1 of the main body is longer than _{the length d 11} from the third surface S3 of the main body to the first dummy pad 24, and is the first of the main body. The length from the third surface S3 to the coil substrate 21 _{may be shorter than d 12 , and the length H 2} of the portion of the second electrode 32 formed on the second surface S2 of the main body is the third surface S3 to the third surface of the main body. 2 The length to the lead portion 23a _{may be longer than the length d 21 and} shorter than _{the length d 22} from the third surface S3 of the main body to the coil substrate 21.

The insulating layer 40 can be formed on the outer surface of the main body 10 except for the regions where the first and second electrodes 31 and 32 are formed. In this case, not only can the first lead portion 22a and the like be effectively prevented from being exposed to the outside, but also the spread of plating can be prevented from occurring in a region other than the region where the electrode portion 30 is formed. There is an advantage.

FIG. 4A is a cut sectional view of a coil component according to another embodiment of the present invention.

Referring to FIG. 4A, the coil component according to another embodiment of the present invention is formed at a position corresponding to the second lead portion 23a on one surface of the coil substrate 21 and is exposed on the second surface S2 of the main body 10. It further includes a second dummy pad 26 and a second via 27 that electrically connects the second lead portion 23a and the second dummy pad 26.

Since the coil component according to the present embodiment has a vertically symmetrical structure, the surface forming the electrode portion 30 can be an arbitrary surface on the main body 10. As a result, the manufacturing cost of the coil parts can be reduced, and the working time can be shortened because it is not necessary to select the electrode forming surface in the manufacturing process, which has an advantage that the workability is facilitated. Further, in the coil component according to the present embodiment, since it is not necessary to form the two coil conductors on the upper part and the lower part of the coil substrate, respectively, the deterioration of the self-resonance frequency characteristic due to the parasitic capacitance component between the coil conductor and the electrode portion is deteriorated. It has the advantage of being able to be suppressed.

Except for the configuration of the second dummy pad 26 and the second via 27, the configuration overlapping with the configuration of the coil component according to the embodiment of the present invention described above can be similarly applied.

FIG. 4B is a cut sectional view of a coil component according to still another embodiment of the present invention.

Referring to FIG. 4B, the electrode portion 30 of the coil component according to still another embodiment of the present invention covers at least a part of the first dummy pad 24 and is connected to the first surface S1 of the main body 10 and the electrode portion 30 thereof. The first electrode 31 extending over the third surface S3 and at least a part of the second lead portion 23a are covered, and the second surface S2 of the main body 10 and the third surface S3 connected to the second surface S2 are covered. It covers at least a part of the first lead portion 22a and the second electrode 32 formed so as to extend to the first surface S1 of the main body 10 and the fourth surface S4 connected to the first surface S1. A fourth electrode 34 formed so as to cover at least a part of the third electrode 33 and the second dummy pad 26 and extend to the second surface S2 of the main body 10 and the fourth surface S4 connected to the second surface S2. And further include. At this time, the first surface S1 and the second surface S2 are arranged so as to face each other while forming the side surfaces of the main body 10, and the third surface S3 and the fourth surface S4 form the upper and lower surfaces of the main body. Arranged so as to face each other, any surface of the third surface S3 and the fourth surface S4 can be provided as a mounting surface of the coil component.

In the case of this embodiment, since the electrode portion 30 also has a vertically symmetrical structure, it is not necessary to specify the mounting surface when mounting the coil component on a circuit board or the like. This has the advantage of facilitating workability.

Except for the configuration of the electrode portion 30, a configuration overlapping with the configuration of the coil component according to the other embodiment of the present invention described above can be similarly applied.

Table 1 shows data comparing the electrical characteristics of the conventional coil component and the coil component according to the present invention. At this time, the volume of the main body of the conventional coil component and the coil component according to the present invention was manufactured to be the same, and the material and thickness of the coil substrate, the material of the coil conductor, the number of turns, etc. were also manufactured to be the same. However, in the case of the electrode portion, the conventional coil component is formed over the entire first and second surfaces of the main body by using a conductive resin paste containing silver (Ag) and an epoxy resin, according to the present invention. In the case of coil parts, copper (Cu) plating was used to form an L-shaped structure. On the other hand, in Table 1 below, Example 1 is a coil component having only the first dummy pad 24 and the first via 25, and Example 2 is the first and second dummy pads 24 and 26, the first and the first. It corresponds to a coil component having second vias 25 and 27. With reference to Table 1, it can be confirmed that in the coil component according to the present invention, Rdc was reduced by about 9% and SRF was improved by about 20% or more.

FIG. 5 is a graph showing the inductance of the coil component according to the conventional example, FIG. 6 is a graph showing the inductance of the coil component according to the first embodiment, and FIG. 7 is a graph showing the inductance of the coil component according to the second embodiment.

From the above, according to some embodiments of the present invention, a coil component having excellent inductance characteristics and DC resistance characteristics can be easily manufactured at low cost in a short working time in the manufacturing process.

On the other hand, in the present specification, expressions such as first and second are used to distinguish one component from another, and limit the order and / or importance of the corresponding components. do not. In some cases, without departing from the scope of the present invention, the first component can be named the second component, and the second component can also be named the first component.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited to this, and various modifications and modifications are made within the scope of the technical idea of the present invention described in the claims. It is clear to those with ordinary knowledge in the art that this is possible.

10 Main body 15 Core part 21 Coil board 22 1st coil conductor 22a 1st lead part 23 2nd coil conductor 23a 2nd lead part 24 1st dummy pad 25 1st via 26 2nd dummy pad 27 2nd via 28 Internal via 30 Electrode 31 1st electrode 32 2nd electrode 33 3rd electrode 34 4th electrode

Claims (15)

The main body including the coil board inside,
First and second leads formed on one surface of the coil substrate and the other surface facing the coil substrate in one direction , respectively, extending so as to be exposed on the first surface and the second surface of the main body, respectively. The first and second coil conductors having a part,
Is formed at a position corresponding to the first lead portion at said other surface of said coil substrate, and the first dummy pad exposed on the first surface of the body,
A first via that electrically connects the first lead portion and the first dummy pad,
Look including the first surface, a second surface and the electrode portion formed on at least a portion of the third surface connected with these, of said body,
A coil component in which the length of the portion formed on the first surface of the electrode portion in the one direction is shorter than the length of the portion formed on the first surface in the one direction from the third surface to the coil substrate. The electrode portion is
A first electrode wherein the first surface covering at least a portion of the first dummy pad is formed before SL extending in the third surface,
At least a portion covering the front SL includes a second electrode formed to extend in the third surface, the coil component of claim 1, wherein said second lead portion at the second surface. The first surface and the second surface are arranged so as to face each other while forming a side surface of the main body.
The coil component according to claim 2 , wherein the third surface is provided as a mounting surface for the coil component. The length of the portions of the first and second electrodes formed on the first surface and the second surface, respectively , is longer than the length from the third surface to the first dummy pad or the second lead portion. The coil component according to claim 3 , which is shorter than the length from the third surface to the coil substrate. The coil component according to claim 4 , further comprising an insulating layer formed in a region excluding the region where the first and second electrodes are formed on the outer surface of the main body. A second dummy pad formed at a position corresponding to the second lead portion on one surface of the coil substrate and exposed on the second surface of the main body, and
A second via that electrically connects the second lead portion and the second dummy pad,
Further comprising a coil component according to any one of claims 1 to 5 a. The electrode portion is
A first electrode wherein the first surface covering at least a portion of the first dummy pad is formed before SL extending in the third surface,
A second electrode to which the second surface by covering at least a portion of the second lead portion, is formed prior SL extending in the third surface,
A third electrode wherein the first surface covering at least a portion of the first lead portion, is formed to extend in the fourth surface of the body opposite to the third surface,
At least a portion covering the front SL and a fourth electrode which is formed to extend in the fourth surface, the coil component according to claim 6 of the said second dummy pads at the second surface. The first surface and the second surface are arranged so as to face each other while forming a side surface of the main body.
The third and fourth surfaces are arranged so as to face each other while forming the upper and lower surfaces of the main body.
The coil component according to claim 7 , wherein any one of the third surface and the fourth surface is provided as a mounting surface for the coil component. The length of the portions of the first and second electrodes formed on the first surface and the second surface, respectively , is longer than the length from the third surface to the first dummy pad or the second lead portion. It is shorter than the length from the third surface to the coil substrate,
The length of the portions of the third and fourth electrodes formed on the first surface and the second surface, respectively , is longer than the length from the fourth surface to the first lead portion or the second dummy pad. The coil component according to claim 8 , which is shorter than the length from the fourth surface to the coil substrate. The coil component according to claim 9 , further comprising an insulating layer formed on the outer surface of the main body excluding the region where the first to fourth electrodes are formed. The coil component according to any one of claims 1 to 10 , wherein the first and second coil conductors are connected to each other via an internal via penetrating the coil substrate. The coil component according to any one of claims 1 to 11 , wherein the main body contains a magnetic substance. The coil component according to any one of claims 1 to 12 , wherein a through hole is formed in the core region of the coil substrate, and the through hole is filled with the same substance as the substance forming the main body. The electrode portion is formed by plating, the coil component according to any one of claims 13 claim 1. The electrodes are silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), and tin (Sn). The coil component according to claim 14 , which comprises one or more selected from the group consisting of.

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