KR102404314B1 - Coil component - Google Patents

Abstract

A body including a coil substrate, a coil pattern formed on at least one of the first and second main surfaces of the coil substrate, and an external electrode connected to the lead-out portion of the coil pattern and formed by plating, wherein the coil substrate and A contact area of the external electrode is smaller than a contact area between the lead-out portion of the coil pattern and the external electrode.

Description

Coil Component {COIL COMPONENT}

The present invention relates to a coil component.

An inductor, one of the coil components, is a typical passive device that removes noise by forming an electronic circuit along with resistors and capacitors.

Such inductors can be divided into stacked type and thin film type. Among them, thin film type inductors are suitable for making relatively thin, so they are being used in various fields recently. Attempts to make the thickness of the chip even thinner are continuing. Accordingly, in the technical field, a method capable of securing high performance and reliability even in the slimming trend of coil electronic components is required.

KR Patent Publication No. 10-2015-0071266 (2015.06.26.)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a coil component capable of preventing poor contact of external electrodes and improving inductance by increasing the volume of the body.

One of the various solutions proposed through the present invention is to form the external electrode by plating, but to appropriately control the contact area between the coil substrate and the lead-out portion of the coil pattern embedded in the body and the external electrode.

For example, the coil component according to the present invention is connected to a body including a coil substrate, a coil pattern formed on at least one of the first and second main surfaces of the coil substrate, and a lead-out portion of the coil pattern, and is subjected to plating. and an external electrode formed by

As one of the various effects of the present invention, poor contact between the coil substrate and the external electrode embedded in the body is effectively suppressed to prevent an excessive increase in contact resistance, and inductance, direct current bias (DC) through the volume increase of the body -Bias) characteristics and efficiency can be effectively improved.

Various and advantageous advantages and effects of the present invention are not limited to the above, and will be more easily understood in the course of describing specific embodiments of the present invention.

1 is a perspective view schematically illustrating an external shape of a coil component according to an embodiment of the present invention.
2 is a perspective view showing a coil pattern of a coil component according to an embodiment of the present invention.
3 is a cross-sectional view taken along line A-A' of FIG. 1 .
4 is a cross-sectional view taken along line B-B' of FIG. 1 .

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present embodiments may be modified in other forms or various embodiments may be combined with each other, and the scope of the present invention is not limited to the embodiments described below. In addition, the present embodiments are provided to more completely explain the present invention to those of ordinary skill in the art. For example, shapes and sizes of elements in the drawings may be exaggerated for clearer description.

Meanwhile, the expression “one example” used in this specification does not mean the same embodiment as each other, and is provided to emphasize and explain different unique features. However, the embodiments presented in the description below are not excluded from being implemented in combination with features of other embodiments. For example, even if a matter described in a particular embodiment is not described in another embodiment, it may be understood as a description related to another embodiment unless a description contradicts or contradicts the matter in another embodiment.

coil parts

Hereinafter, a coil component according to an embodiment of the present invention will be described, and in particular, a thin film type inductor will be described as an example thereof, but the present invention is not necessarily limited thereto.

FIG. 1 is a perspective view schematically illustrating an external appearance of a coil component according to an embodiment of the present invention, and FIG. 2 is a perspective view illustrating a coil pattern of a coil component according to an embodiment of the present invention. In this case, based on the bar shown in FIG. 1, in the following description, the 'length' direction is the 'L' direction of FIG. 1, the 'width' direction is the 'W' direction, and the 'thickness' direction is defined as the 'T' direction. can be

1 and 2 , the coil component 100 according to an embodiment of the present invention includes a body 110 , a coil substrate 112 , a coil pattern 120 , and external electrodes 131 and 132 . can be configured.

The body 110 forms the exterior of the coil component 100 . The body 110 may have a substantially hexahedral shape consisting of first and second surfaces facing in the longitudinal direction, third and fourth surfaces facing in the width direction, and fifth and sixth surfaces facing in the third direction. However, the present invention is not limited thereto.

The body 110 may include a magnetic material. The magnetic material is not particularly limited as long as it has magnetic properties, and for example, pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy Powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Ni-Cr Fe alloys such as alloy powder or Fe-Cr-Al alloy powder, amorphous alloys such as Fe-based amorphous and Co-based amorphous, Mg-Zn-based ferrite, Mn-Zn-based ferrite, Mn-Mg-based ferrite, Spinel ferrites such as Cu-Zn ferrite, Mg-Mn-Sr ferrite, Ni-Zn ferrite, Ba-Zn ferrite, Ba-Mg ferrite, Ba-Ni ferrite, Ba-Co ferrite, Hexagonal ferrites, such as Ba-Ni-Co type ferrite, and garnet type ferrites, such as Y type ferrite, are mentioned.

The magnetic material may include a metal magnetic powder and a resin mixture. The magnetic metal powder may include iron (Fe), chromium (Cr), or silicon (Si) as a main component, for example, iron (Fe)-nickel (Ni), iron (Fe), iron (Fe) -chromium (Cr) - may include silicon (Si), but is not limited thereto. The resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc. alone or in combination. The magnetic metal powder may be filled with a magnetic metal powder having an average particle diameter of 2 or more (D ₁ , D ₂ ). In this case, by compressing using bimodal metal magnetic powders of different sizes, the magnetic resin composite can be filled, and thus the filling rate can be increased.

The body 110 may be formed by pressing and curing a magnetic resin composite including a magnetic metal powder and a resin mixture in a sheet form and pressing and curing the upper and lower portions of the coil substrate 112 and the coil pattern 120, but must be It is not limited. In this case, the stacking direction of the magnetic resin composite may be perpendicular to the mounting surface of the coil component. Here, being perpendicular is a concept that includes not only a perfect 90° but also a case of approximately 90°, that is, about 60 to 120°.

The coil substrate 112 is disposed inside the body 110 and performs a function for supporting the coil pattern 120, for example, a polypropylene glycol (PPG) substrate, a ferrite substrate, or a metal-based soft magnetic substrate. can be formed with In this case, a through hole may be formed in the central region of the coil substrate 112 , and a magnetic material may be filled in the through hole to form a core region, and this core region constitutes a part of the body 110 . . As such, by forming the core region in a form filled with the magnetic material, the performance of the core component 100 may be improved.

The coil pattern 120 may be formed on at least one of the first and second main surfaces of the coil substrate 112 , and in the present embodiment, it is formed on both the first and second main surfaces in order to obtain a high level of inductance. was shown. That is, the first coil pattern 121 may be formed on the first main surface of the coil substrate 112 , and the second coil pattern 122 may be formed on the second main surface opposite to the first main surface. In this case, the first and second coil patterns may be electrically connected through vias (not shown) formed through the coil substrate 112 . In addition, the coil pattern 120 may be formed in a spiral shape. At the outermost portion of the spiral shape, the coil pattern 120 is exposed to the outside of the body region 110 for electrical connection with the external electrodes 131 and 132 . The first and second lead-out portions 121a and 122a may be provided, and the first and second lead-out portions 121a and 122a form a part of the outermost region of the coil pattern 120 and form the coil pattern 120 . ) can be formed integrally with The first and second lead-out portions 121a and 122a are respectively drawn out through the opposite surface of the body 110, for example, the first and second surfaces in the longitudinal direction, to be connected to the external electrodes 131 and 132. can

The coil pattern 120 may be formed of a material such as a metal having high electrical conductivity, for example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), or gold. (Au), copper (Cu), platinum (Pt), or an alloy thereof may be formed. In this case, as an example of a preferred process for producing a thin film shape, an electroplating method may be used, but other processes known in the art may be used as long as they can exhibit a similar effect.

The external electrodes 131 and 132 serve to electrically connect the coil component 100 to the circuit board when the coil component 100 is mounted on a circuit board or the like.

The external electrodes 131 and 132 are connected to the lead parts 121a and 121b, and may be respectively formed on the first and second surfaces of the body 110 in the longitudinal direction, but are not limited thereto. In addition, in some cases, the external electrode 130 may be formed to extend to the third, fourth, fifth, and/or sixth surface of the body 110 .

The external electrode 130 is formed by plating. Accordingly, it is possible to remove unnecessary parts of special implementation due to the application of external electrodes, and there is no need to make the area of the coil wider than necessary, so it is easy to reduce the size and increase the current. Moreover, since the external electrode 130 is formed by plating directly on the surface of the body 110, thickness control is easy, and the external electrode can be formed thinner, thereby maximizing the volume of the body 110, Accordingly, there is an advantage in that inductance, direct current bias (DC-Bias) characteristics and efficiency can be improved.

FIG. 3 is a cross-sectional view taken along line A-A' of FIG. 1 , and FIG. 4 is a cross-sectional view taken along line B-B' of FIG. 1 .

Referring to FIG. 3 , in the coil component according to an embodiment of the present invention, the contact areas between the coil substrate 112 and the external electrodes 131 and 132 are the lead portions 121a and 122a of the coil pattern and the external electrodes 131 and 131 . 132) is characterized in that it is smaller than the contact area.

The coil pattern 120 is formed on at least one of the first and second main surfaces of the coil substrate 112 , and not only the lead portions 121a and 122a of the coil pattern, but also the coil substrate 112 and the body 110 . It is exposed to the outside and comes into direct contact with the external electrodes 131 and 132 . However, since the coil substrate 112 is generally made of an insulating material, it is not easy to form the external electrodes 131 and 132 by plating in the area where the coil substrate 112 is exposed. In addition to causing a rise, problems such as lowering of fixing strength and poor lead rise may occur during SMD mounting.

Accordingly, in an embodiment of the present invention, the contact area between the coil substrate 112 and the external electrodes 131 and 132 is compared with the contact area between the lead-out portions 121a and 122a of the coil pattern and the external electrodes 131 and 132 . Thus, by making it relatively small, it was attempted to prevent an excessive increase in contact resistance and to solve problems such as a decrease in adhesion strength and poor soldering during SMD mounting.

Meanwhile, in the present invention, as described above, a specific means or method for reducing the contact area between the coil substrate 112 and the external electrodes 131 and 132 is not particularly limited, but as an example without limitation, the coil substrate A contact length between the coil substrate 112 and the external electrodes 131 and 132 in a direction perpendicular to the stacking direction of the coil substrate 112 and the coil pattern 120 is determined in the stacking direction of the coil substrate 112 and the coil pattern 120 . This can be achieved by making the contact length of the coil pattern lead-out portions 121a and 122a and the external electrodes 131 and 132 of the coil pattern in a direction perpendicular to the length smaller than the contact length.

In this case, the contact length between the coil substrate 112 and the external electrodes 131 and 132 may be appropriately determined in relation to the contact length between the lead portions 121a and 122a of the coil pattern and the external electrodes 131 and 132 . . Specifically, when a is the contact length between the coil substrate 112 and the external electrodes 131 and 132 , and b is the contact length between the lead-out portions 121a and 122a of the coil pattern and the external electrodes 131 and 132 , 0 It may be in a form that satisfies <a/b≤3/5, and when a/b satisfies the above range, it is faithful to the coil pattern 120 support function, which is the original function of the coil substrate 112 , and has a fixing strength during SMD mounting. It was possible to solve problems such as deterioration and lead rise failure.

Referring to FIG. 4 , a region of the coil substrate 112 that is not in contact with the external electrodes 131 and 132 is constant in the inner direction of the body 110 from the contact surface between the coil substrate 112 and the external electrodes 131 and 132 . It may be formed to be spaced apart from each other. In the present invention, for a specific method of forming regions of the coil substrate 112 that are not in contact with the external electrodes 131 and 132 to be spaced apart from the contact surfaces of the external electrodes 131 and 132 in the inner direction of the body 110 by a predetermined distance, Although not particularly limited, as an example without limitation, after the coil pattern 120 is formed on the coil substrate 112 , a part of the region in which the lead-out portions 121a and 122a of the coil pattern of the coil substrate 112 are formed is laser-cut. By etching by , this can be achieved.

In this case, the separation distance in the inner direction of the body 110 from the contact surface of the coil substrate 112 and the external electrodes 131 and 132 in a region of the coil substrate 112 that is not in contact with the external electrodes 131 and 132 is the coil. It may be appropriately determined in relation to the length of the lead-out portion of the pattern. Specifically, the separation distance in the inner direction of the body 110 from the contact surface of the coil substrate 112 and the external electrodes 131 and 132 in an area of the coil substrate 112 that is not in contact with the external electrodes 131 and 132 is determined. c, when the length of the lead-out portions 121a and 122a of the coil pattern is d, it may have a form satisfying 0<c<d, and when c satisfies the above range, the original coil substrate 112 is While faithful to the function of supporting the coil pattern 120 , it was possible to solve problems such as a decrease in fixing strength and poor lead rise during SMD mounting.

Meanwhile, in the present specification, expressions such as first, second, etc. are used to distinguish one component from another, and do not limit the order and/or importance of the corresponding components. In some cases, without departing from the scope of rights, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited by the appended claims. Accordingly, various types of substitution, modification and change will be possible by those skilled in the art within the scope not departing from the technical spirit of the present invention described in the claims, and it is also said that it falls within the scope of the present invention. something to do.

100: coil part
110: body
112: coil substrate
120: coil pattern
121: first coil pattern
121a: first withdrawal unit
122: second coil pattern
122a: second lead-out part
131: first external electrode
132: second external electrode

Claims (9)

a body including a substrate;
a coil pattern formed on at least one of the first and second main surfaces of the substrate; and
and an external electrode connected to the lead-out part of the coil pattern and formed by plating;
A contact area between the substrate and the external electrode is smaller than a contact area between the lead-out portion of the coil pattern and the external electrode,
A contact length between the substrate and the external electrode in the width direction of the body is smaller than a contact length between the lead-out portion of the coil pattern and the external electrode in the width direction of the body.
delete According to claim 1,
A coil component satisfying 0<a/b≤3/5 when a is a contact length between the substrate and the external electrode and b is a contact length between the lead-out portion of the coil pattern and the external electrode.
According to claim 1,
A region of the substrate that is not in contact with the external electrode is formed to be spaced apart from a contact surface between the substrate and the external electrode in an inward direction of the body by a predetermined distance.
5. The method of claim 4,
When a distance in the inner direction of the body from a contact surface of the substrate and the external electrode in an area of the substrate that is not in contact with the external electrode is c and the length of the lead-out part of the coil pattern is d, 0<c< Coil parts satisfying d.
According to claim 1,
The coil pattern includes a first coil pattern and a second coil pattern respectively formed on first and second main surfaces of the substrate, and the first coil pattern and the second coil pattern are connected to each other through a via hole. .
7. The method of claim 6,
The first and second coil patterns include first and second lead-out portions, respectively,
The first and second lead-out parts are respectively drawn out through opposite surfaces of the body to be connected to the external electrode.
According to claim 1,
The body is a coil component comprising a magnetic material.
According to claim 1,
The body is a coil part formed by pressing and curing a magnetic resin composite including a metal magnetic powder and a resin mixture in a sheet form, and pressing and curing the upper and lower portions of the substrate and the coil pattern.

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