JP2018019059A - Coil component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coil component.SOLUTION: A coil component includes a body internally including a coil substrate, first and second coil conductors formed, respectively, on one surface of the coil substrate and the other surface opposite thereto, and having first and second leads formed to extend so as to be exposed to the first and second surfaces of the body, respectively, a first dummy pad formed on the other surface of the coil substrate at a position corresponding to the first lead, and exposing to the first surface of the body, and a first via for electrically connecting the first lead and the first dummy pad.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a coil component.

  An inductor, which is one of coil components, is a typical passive element that forms an electronic circuit together with a resistor and a capacitor to remove noise.

  Such an inductor can be classified into a winding type, a laminated type, a thin film type, and the like. Of these, thin-film inductors are suitable for relatively thinning and have recently been used in various fields.

  However, in the case of a conventional thin film inductor, a coil conductor is formed on an insulating substrate, so that electrode formation by plating and application to an L-shaped electrode structure are limited, resulting in deterioration of product characteristics. There were disadvantages.

  One of the various objects of the present invention is to provide a coil component having excellent product characteristics.

  One of various solutions proposed through the present invention is that a dummy pad is formed on the other surface of the coil substrate at a position corresponding to the lead-out portion of the coil conductor formed on the other surface of the coil substrate. It is to connect the lead portion and the dummy pad.

  For example, a coil component according to an embodiment of the present invention is formed on a main body including a coil substrate therein, one surface of the coil substrate and the other surface facing the main body, respectively, on the first surface and the second surface of the main body. First and second coil conductors having first and second lead portions formed so as to be exposed, and formed at positions corresponding to the first lead portions on the other surface of the coil substrate, A first dummy pad exposed on the first surface of the main body, and a first via that electrically connects the first lead portion and the first dummy pad may be included.

  One of the various effects of the present invention is that the coil component according to an embodiment of the present invention is excellent in inductance characteristics and DC resistance characteristics.

  Another advantage of the present invention is that the coil component according to the embodiment of the present invention is excellent in self-resonance frequency (SRF) characteristics.

  As still another of the various effects of the present invention, the coil component according to the embodiment of the present invention does not need to specify the surface on which the electrode part is formed, and the mounting surface of the coil component on the main body 10 is not necessary. Since any surface can be used, there is an advantage that workability is facilitated by eliminating the need to select an electrode forming surface in the manufacturing process.

  The various and significant advantages and effects of the present invention are not limited to those described above, and can be more easily understood in the course of describing specific embodiments of the present invention.

It is a perspective view of the coil component by one Embodiment of this invention. It is a perspective view shown so that the coil conductor of the coil component shown in FIG. 1 may appear. (A) is sectional drawing which cut | disconnected the coil component shown in FIG. 1 along the AA 'line, (b) is sectional drawing which cut | disconnected the coil component of FIG. 1 along the BB' line. . (A) is a cut sectional view of a coil component according to another embodiment of the present invention, and (b) is a cut sectional view of a coil component according to still another embodiment of the present invention. It is a graph which shows the inductance of the coil components by the comparative example based on a prior art. 3 is a graph showing the inductance of the coil component according to Example 1; 6 is a graph showing the inductance of a coil component according to Example 2.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of the elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer description.

  On the other hand, the expression “one example” as used herein does not mean the same embodiment as each other, but is provided to emphasize and explain different and unique features. is there. However, the embodiments presented in the following description do not exclude being implemented in combination with the features of other embodiments. For example, even if an item described in a specific embodiment is not described in another embodiment, it is related to the other embodiment as long as it is opposite to the item in the other embodiment or there is no contradictory description. Can be understood.

  Hereinafter, a coil component according to an embodiment of the present invention will be described. As an example, an inductor will be described as an example for convenience. However, the present invention is not necessarily limited to this, and it goes without saying that the contents of the present invention can be applied to coil components for various other purposes. Examples of coil components for various other applications include a common mode filter, normal beads, and high frequency beads (GHz Bead).

    FIG. 1 is a perspective view of a coil component according to an embodiment of the present invention, FIG. 2 is a perspective view showing a coil conductor of the coil component shown in FIG. 1, and FIG. 3 (a) is shown in FIG. FIG. 3B is a cross-sectional view of the coil component cut along the line AA ′, and FIG. 3B is a cross-sectional view of the coil component of FIG. 1 cut along the line BB ′.

  Referring to the drawings, a coil component 100 according to an embodiment of the present invention includes a main body 10 including a coil substrate 21 therein, and a first coil conductor 22 formed on one surface of the coil substrate 21 and the other surface opposite thereto. And the 2nd coil conductor 23 and the electrode part 30 can be comprised.

  The main body 10 is a member that forms the appearance of the coil component 100. The main body 10 includes a first surface S1 and a second surface S2 facing in the first direction, a third surface S3 and a fourth surface S4 facing in the second direction, and a fifth surface S5 and a third surface facing in the third direction. Although it may be a hexahedron shape formed by six faces S6, it is not limited to this.

  The main body 10 may include a magnetic material. The magnetic substance is not particularly limited as long as it has magnetic properties. For example, pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni -Mo-based alloy powder, Fe-Ni-Mo-Cu-based alloy powder, Fe-Co-based alloy powder, Fe-Ni-Co-based alloy powder, Fe-Cr-based alloy powder, Fe-Cr-Si-based alloy powder, Fe -Fe alloys such as Ni-Cr alloy powder or Fe-Cr-Al alloy powder, amorphous alloys such as Fe-based amorphous and Co-based amorphous, Mg-Zn-based ferrite, Mn- Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, spinel-type ferrites such as Ni-Zn-based ferrites, Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba- N System ferrite, can be cited Ba-Co ferrite, hexagonal ferrites such as Ba-Ni-Co ferrite, and garnet-type ferrite such as Y type ferrite.

The magnetic substance may include a metal magnetic powder and a resin mixture. The metal magnetic powder may contain iron (Fe), chromium (Cr), or silicon (Si) as a main component. For example, iron (Fe) -nickel (Ni), iron (Fe), iron (Fe) ) -Chrome (Cr) -silicon (Si) and the like, but is not limited thereto. The resin may include an epoxy, a polyimide, a liquid crystal polymer, or the like alone or in combination, but is not limited thereto. The metal magnetic powder may be filled with metal magnetic powder having two or more average particle diameters D ₁ and D ₂ . In this case, since the magnetic resin composite can be fully filled by pressure bonding using bimodal metal magnetic powders having different sizes, the filling rate can be increased.

  The main body 10 is formed by forming a magnetic resin composite containing a metal magnetic powder and a resin mixture into a sheet form, and pressing and curing the upper and lower portions of the first and second coil conductors 22 and 23. However, the present invention is not necessarily limited to this. At this time, the direction in which the sheet-shaped magnetic resin composite is laminated can be made perpendicular to the mounting surface of the coil component. Here, the term “perpendicular” includes not only the case of forming a complete 90 ° with respect to the mounting surface of the coil component but also the case of forming an angle of about 90 °, that is, the case of forming an angle of about 60 to 120 °. It is a concept.

  The coil substrate 21 is provided inside the main body 10 and plays a role of supporting the first coil conductor 22 and the second coil conductor 23. For example, a polypropylene glycol (PPG) substrate, a ferrite substrate, or a metal-based soft magnetic substrate is used. Can be formed. In this case, a through hole can be formed in the central region of the coil substrate 21, and the core portion 15 can be formed by filling the through hole with the same material as that forming the main body. Such a core portion 15 constitutes a part of the main body 10.

  The first coil conductor 22 and the second coil conductor 23 are respectively formed on one surface of the coil substrate 21 and the other surface facing the coil substrate 21. The first coil conductor 22 and the second coil conductor 23 can be formed in a spiral shape and can be electrically connected to each other via an internal via 28 that penetrates the coil substrate 21. On the outermost side of the first coil conductor 22 and the second coil conductor 23, there are first and second lead portions 22 a and 23 a exposed to the outside of the main body 10 for electrical connection with the electrode portion 30. The first and second lead portions 22a and 23a are exposed on the first surface S1 and the second surface S2 of the main body 10, respectively. The first and second lead portions 22a and 23a form a part of the outermost regions of the first and second coils 22 and 23, respectively, and are formed integrally with the first coil conductor 22 and the second coil 23. Can.

  The first coil conductor 22 and the second coil conductor 23 can be formed of a material such as a metal having high electrical conductivity. For example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni) , Titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or an alloy thereof. In this case, an electroplating method can be used as an example of a preferable process for producing a thin film. However, other steps known in the art can be used as long as the same effect can be obtained.

  The electrode unit 30 plays a role of electrically connecting the coil component to the circuit board or the like when the coil component is mounted on the circuit board or the like.

  The electrode part 30 can be formed by plating. In this case, not only the thickness adjustment is easy, but also the thickness of the external electrode can be made thinner, so the volume of the main body 10 can be increased, and the inductance, DC resistance characteristics, efficiency, etc. can be increased. There is an advantage that it can be improved.

  The electrode unit 30 can be formed to include a conductive material. For example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), tin (Sn), or an alloy thereof. On the other hand, when forming the electrode part 30 by plating, the electrode part 30 does not need to contain a glass component and resin.

  Referring to FIG. 3A, the coil component according to the embodiment of the present invention is formed at a position corresponding to the first lead portion 22 a on the other surface of the coil substrate 21 and exposed to the first surface of the main body 10. 1 dummy pad 24 is included. Such a first dummy pad 24 is electrically connected to the first lead portion 22 a through a first via 25 penetrating the coil substrate 21.

  The first dummy pad 24 can also be formed of a material such as a metal having high electrical conductivity. For example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), It can be formed of gold (Au), copper (Cu), platinum (Pt), or an alloy thereof. An electroplating method can be used as an example of a preferable process for forming the first dummy pad 24. However, other steps known in the art can be used as long as the same effect can be obtained.

  As described above, in the case of the conventional coil component, since the coil conductor is formed on the insulating substrate, the insulating substrate is exposed on the surface of the main body, and as a result, it is difficult to form electrodes by plating. Therefore, in general, the electrode portion has been formed using a conductive resin paste containing a conductive metal and a resin such as an epoxy resin. At this time, silver (Ag) having a low specific resistance has been mainly used as the conductive metal contained in the conductive resin paste, but not only the material cost is high, but also poor contact with the coil conductor frequently occurs. As a result, an excessive increase in contact resistance has been caused. Furthermore, since the two coil conductors are formed on the upper and lower portions of the coil substrate, respectively, application to the L-shaped electrode structure is limited, and an electrode must be formed over the entire side of the main body. There is a disadvantage in that the parasitic capacitance (capacitance) component between the conductor and the electrode portion becomes excessive, and the self-resonance frequency (SRF) characteristic of the coil component is deteriorated.

  On the other hand, in one embodiment of the present invention, the first dummy pad 24 is formed at a position corresponding to the first lead portion 22 a on the other surface of the coil substrate 21, and the first dummy pad 24 is inserted through the first via 25. One lead portion 22a was electrically connected. Thus, in the coil component according to the present embodiment, the electrode part 30 can be selectively formed only on one side of the main body 10 with the coil substrate 21 as a boundary. As a result, formation of the electrode part by plating and L Application to a letter-shaped electrode structure is possible.

  According to one embodiment, the electrode unit 30 covers at least a part of the first dummy pad 24 and extends to the first surface S1 of the main body 10 and the third surface S3 connected thereto. A first electrode 31 and a second electrode 32 that covers at least a part of the second lead portion 23a and extends to the second surface S2 of the main body 10 and the third surface S3 connected thereto. Can be included. At this time, the first surface S1 and the second surface S2 are arranged to face each other while forming the side surface of the main body 10, and the third surface S3 can be provided as a mounting surface of the coil component.

The length H ₁ of the portion formed on the first surface S1 of the main body in the first electrode 31 is longer than the length d ₁₁ from the third surface S3 of the main body to the first dummy pad 24, the body 3 surface S3 may be shorter than the length d ₁₂ of up coil board 21, the length of H ₂ portion formed on the second surface S2 of the body at the second electrode 32, a third surface S3 of the main body It is sufficient that the length is longer than the length d ₂₁ to the two lead portions 23 a and shorter than the length d ₂₂ from the third surface S 3 of the main body to the coil substrate 21.

  Note that the insulating layer 40 may be formed in a region excluding the region where the first and second electrodes 31 and 32 are formed on the outer surface of the main body 10. In this case, it is possible not only to effectively prevent the first lead portion 22a and the like from being exposed to the outside, but also to prevent the plating from spreading in a region other than the region where the electrode portion 30 is formed. There is an advantage.

  FIG. 4A is a cross-sectional view of a coil component according to another embodiment of the present invention.

  Referring to FIG. 4A, a coil component according to another embodiment of the present invention is formed at a position corresponding to the second lead portion 23 a on one surface of the coil substrate 21 and exposed to the second surface S <b> 2 of the main body 10. It further includes a second dummy pad 26, and a second via 27 that electrically connects the second lead portion 23a and the second dummy pad 26.

  Since the coil component according to the present embodiment has a vertically symmetrical structure, the surface on which the electrode part 30 is formed can be an arbitrary surface on the main body 10. Accordingly, the manufacturing cost of the coil component can be reduced, and the work time can be shortened because it is not necessary to select the electrode forming surface in the manufacturing process. Further, in the coil component according to the present embodiment, since it is not necessary to form two coil conductors on the upper and lower portions of the coil substrate, the self-resonant frequency characteristics are deteriorated due to the parasitic capacitance component between the coil conductor and the electrode portion. There is an advantage that it can be suppressed.

  Except for the configuration of the second dummy pad 26 and the second via 27, the configuration overlapping with the configuration of the coil component according to the embodiment of the present invention described above can be similarly applied.

  FIG. 4B is a cross-sectional view of a coil component according to still another embodiment of the present invention.

  Referring to FIG. 4B, the electrode part 30 of the coil component according to still another embodiment of the present invention covers at least a part of the first dummy pad 24, and is connected to the first surface S1 of the main body 10 and the first surface S1. The first electrode 31 formed to extend to the third surface S3 and the second lead portion 23a are covered, and the second surface S2 of the main body 10 and the third surface S3 connected thereto are covered. Covering at least a part of the second electrode 32 and the first lead portion 22a, and extending to the first surface S1 of the main body 10 and the fourth surface S4 connected thereto. The fourth electrode 34 that covers at least a part of the third electrode 33 and the second dummy pad 26 and extends to the second surface S2 of the main body 10 and the fourth surface S4 connected thereto. And further including. At this time, the first surface S1 and the second surface S2 are arranged to face each other while forming the side surface of the main body 10, and the third surface S3 and the fourth surface S4 form the upper and lower surfaces of the main body. Arranged so as to face each other, any one of the third surface S3 and the fourth surface S4 can be provided as a mounting surface of the coil component.

  In the case of this embodiment, since the electrode part 30 also has a vertically symmetrical structure, when mounting a coil component on a circuit board etc., it is not necessary to specify a mounting surface. Thereby, there is an advantage that workability becomes easy.

  Except for the configuration of the electrode unit 30, the configuration overlapping with the configuration of the coil component according to the other embodiment of the present invention described above can be similarly applied.

  Table 1 shows data comparing the electrical characteristics of the conventional coil component and the coil component according to the present invention. At this time, the volume of the main body of the conventional coil component and the coil component according to the present invention was manufactured to be the same, and the material and thickness of the coil substrate, the material of the coil conductor, the number of turns, and the like were also manufactured. However, in the case of the electrode portion, the conventional coil component is formed over the entire first surface and second surface of the main body using a conductive resin paste containing silver (Ag) and an epoxy resin. In the case of a coil component, it was formed into an L-shaped structure using copper (Cu) plating. On the other hand, in Table 1 below, Example 1 is a coil component having only the first dummy pad 24 and the first via 25, and Example 2 is the first and second dummy pads 24, 26, This corresponds to a coil component having the second vias 25 and 27. Referring to Table 1, it can be confirmed that the coil component according to the present invention has Rdc reduced by about 9% and SRF improved by about 20% or more.

  5 is a graph showing the inductance of the coil component according to the conventional example, FIG. 6 is a graph showing the inductance of the coil component according to the first embodiment, and FIG. 7 is a graph showing the inductance of the coil component according to the second embodiment.

  As described above, according to some embodiments of the present invention, a coil component having excellent inductance characteristics and direct current resistance characteristics can be easily manufactured at low cost and in a short working time in the manufacturing process.

  On the other hand, in this specification, expressions such as “first” and “second” are used to distinguish one component from another component, and limit the order and / or importance of the corresponding component. do not do. In some cases, the first component can be named the second component and the second component can be named the first component without departing from the scope of the present invention.

  As mentioned above, although embodiment of this invention was described in detail, the scope of the present invention is not limited to this, and various correction and deformation | transformation are within the range which does not deviate from the technical idea of this invention described in the claim. It will be apparent to those having ordinary knowledge in the art.

DESCRIPTION OF SYMBOLS 10 Main body 15 Core part 21 Coil board | substrate 22 1st coil conductor 22a 1st lead part 23 2nd coil conductor 23a 2nd lead part 24 1st dummy pad 25 1st via 26 2nd dummy pad 27 2nd via 28 Internal via 30 Electrode portion 31 First electrode 32 Second electrode 33 Third electrode 34 Fourth electrode

Claims (16)

A body including a coil substrate inside;
The first and second lead portions are formed on one surface of the coil substrate and the other surface opposite to the coil substrate, and extend so as to be exposed on the first surface and the second surface of the main body, respectively. First and second coil conductors;
A first dummy pad formed at a position corresponding to the first lead portion on the other surface of the coil substrate and exposed on the first surface of the main body;
A coil component comprising: a first via that electrically connects the first lead portion and the first dummy pad.   The coil component according to claim 1, further comprising an electrode portion formed on an outer surface of the main body. The electrode part is
A first electrode that covers at least a part of the first dummy pad and extends to the first surface of the main body and the third surface connected to the first surface;
3. The second electrode according to claim 2, further comprising: a second electrode that covers at least a part of the second lead portion and extends to the second surface of the main body and the third surface connected to the second surface. Coil parts. The first surface and the second surface are disposed to face each other while forming a side surface of the main body,
The coil component according to claim 3, wherein the third surface is provided as a mounting surface of the coil component.   The lengths of the first and second electrodes formed on the first surface and the second surface are longer than the length from the third surface to the first dummy pad or the second lead portion. The coil component according to claim 4, wherein the coil component is shorter than a length from three surfaces to the coil substrate.   The coil component according to claim 5, further comprising an insulating layer formed in a region excluding a region where the first and second electrodes are formed on the outer surface of the main body. A second dummy pad formed at a position corresponding to the second lead portion on one surface of the coil substrate and exposed on the second surface of the main body;
A second via that electrically connects the second lead portion and the second dummy pad;
The coil component according to claim 2, further comprising: The electrode part is
A first electrode that covers at least a part of the first dummy pad and extends to the first surface of the main body and the third surface connected to the first surface;
A second electrode formed to extend over the second surface of the main body and the third surface connected thereto, covering at least a part of the second lead portion;
A third electrode formed to extend over the first surface of the main body and the fourth surface connected thereto, covering at least part of the first lead portion;
8. The fourth electrode according to claim 7, further comprising: a fourth electrode that covers at least a part of the second dummy pad and extends to the second surface of the main body and the fourth surface connected to the second surface. Coil parts. The first surface and the second surface are disposed to face each other while forming a side surface of the main body,
The third surface and the fourth surface are arranged to face each other while forming the upper and lower surfaces of the main body,
The coil component according to claim 8, wherein any one of the third surface and the fourth surface is provided as a mounting surface of the coil component. The lengths of the first and second electrodes formed on the first surface and the second surface are longer than the length from the third surface to the first dummy pad or the second lead portion. Shorter than the length from the 3rd surface to the coil substrate,
In the third and fourth electrodes, the lengths of the portions formed on the first surface and the second surface are longer than the length from the fourth surface to the first lead portion or the second dummy pad. The coil component according to claim 9, wherein the coil component is shorter than a length from four surfaces to the coil substrate.   The coil component according to claim 10, further comprising an insulating layer formed in a region excluding a region where the first to fourth electrodes are formed on an outer surface of the main body.   The coil component according to any one of claims 1 to 11, wherein the first and second coil conductors are connected to each other via an internal via penetrating the coil substrate.   The coil component according to any one of claims 1 to 12, wherein the main body includes a magnetic substance.   The coil component according to any one of claims 1 to 13, wherein a through hole is formed in a core region of the coil substrate, and the through hole is filled with the same material as that forming the main body.   The coil part according to any one of claims 2 to 14, wherein the electrode part is formed by plating.   The electrode portion includes silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), and tin (Sn). The coil component according to claim 15, comprising one or more selected from the group consisting of:

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