CN108206088B - Inductor - Google Patents
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- CN108206088B CN108206088B CN201710521468.9A CN201710521468A CN108206088B CN 108206088 B CN108206088 B CN 108206088B CN 201710521468 A CN201710521468 A CN 201710521468A CN 108206088 B CN108206088 B CN 108206088B
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- 238000010030 laminating Methods 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
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- 229910002113 barium titanate Inorganic materials 0.000 description 4
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- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
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- 230000004907 flux Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
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- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910009650 Ti1-yZry Inorganic materials 0.000 description 1
- 229910010252 TiO3 Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Inorganic materials [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
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- 229910052593 corundum Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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- 238000003475 lamination Methods 0.000 description 1
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- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/004—Printed inductances with the coil helically wound around an axis without a core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Abstract
The invention discloses an inductor. An inductor according to an embodiment of the present invention includes: a main body formed by laminating a plurality of insulating layers; first and second external electrodes disposed at an outer side of the main body; and a coil formed by a plurality of coil patterns arranged on the insulating layer being connected to each other by a coil connection portion, and both end portions being connected to the first and second external electrodes by coil lead-out portions, wherein at least one of the coil patterns arranged on the outmost outline is thicker than the coil pattern arranged on the central portion among the plurality of coil patterns.
Description
Technical Field
The present invention relates to an inductor.
Background
Recently, for a smart phone, signals of many frequency bands are used due to application of multi-band Long Term Evolution (LTE). Therefore, the high frequency inductor is mainly used for an impedance matching circuit in a Radio Frequency (RF) system for transmitting and receiving signals. High-frequency inductors are required to be small and have high capacity. Meanwhile, the high-frequency inductor is required to have a high-band magnetic resonance frequency (SRF) and low resistivity, and thus can be used at a high frequency of 100MHz or more. In addition, in order to reduce the loss at the frequency used, it is required to have a high Q characteristic.
In order to have such high Q characteristics, the characteristics of the material constituting the main body of the inductor are most affected, but the following technical solutions are actually required: even when the same material is used, the coil shape of the inductor can be optimized, and thus higher-level Q characteristics can be provided.
[ Prior art documents ]
[ patent document ]
(patent document 1) Korean patent laid-open publication No. 10-0869741
(patent document 2) Japanese laid-open patent publication No. 2001-085320
(patent document 3) Korean patent laid-open publication No. 10-0779981
Disclosure of Invention
An object of the present invention is to provide an inductor having a high level of Q characteristics and having a structure insensitive to process variations.
As a solution for solving the above technical problem, the present invention aims to propose an inductor of a novel structure by way of an example, specifically, including: a main body formed by laminating a plurality of insulating layers; first and second external electrodes disposed at an outer side of the main body; and a coil formed by a plurality of coil patterns arranged on the insulating layer being connected to each other by a coil connection portion, and both end portions being connected to the first and second external electrodes by coil lead-out portions, wherein at least one of the coil patterns arranged on the outmost outline is thicker than the coil pattern arranged on the central portion among the plurality of coil patterns.
As a solution for solving the above technical problem, the present invention aims to propose an inductor of a new structure by another example, specifically, including: a main body formed by laminating a plurality of insulating layers; first and second external electrodes disposed at an outer side of the main body; and a coil formed by coil patterns arranged on the insulating layer being connected to each other through a coil connection portion, and both end portions being connected to the first and second external electrodes through coil lead-out portions, wherein, among the plurality of coil patterns, a line width of at least one coil pattern arranged at an outmost outline is larger than a line width of a coil pattern arranged at a central portion.
With the inductor according to one embodiment of the present invention, at least a part of the coil patterns constituting the coil tracks of the spiral shape is prevented from overlapping adjacent coil patterns when viewed from the lamination direction, thereby reducing the proximity effect between the coil patterns, whereby the Q characteristic of the inductor can be improved.
Drawings
Fig. 1 is a perspective view schematically showing an inductor according to an embodiment of the present invention.
Fig. 2 is a front view schematically showing the inductor shown in fig. 1.
Fig. 3 is a plan view schematically showing the inductor shown in fig. 1.
Fig. 4 is a graph representing current density of a coil pattern of an inductor according to an embodiment of the present invention.
Fig. 5 is a graph showing current densities of coil patterns of an inductor according to a comparative example.
Fig. 6 is a graph of the results of measuring the Q factor (Q factor) with respect to the frequency of the inductor according to the comparative example and the inductor according to one embodiment of the present invention.
Fig. 7 is a sectional view schematically showing an inductor according to another embodiment of the present invention along the L direction.
Fig. 8 is a graph showing current densities of coil patterns of an inductor according to another embodiment of the present invention.
Fig. 9 is a graph of a result of measuring an inductance based on a design error for an inductor according to another embodiment of the present invention.
Fig. 10 is a graph of the result of measuring a Q factor (Q factor) based on a design error for an inductor according to another embodiment of the present invention.
Fig. 11 is an L-direction sectional view schematically showing an inductor according to still another embodiment of the present invention.
Fig. 12 is a graph showing current densities of coil patterns of an inductor according to still another embodiment of the present invention.
Description of the symbols
100: inductor 101: main body
120: coil 121: coil pattern
131: coil lead-out portion 132: coil connecting part
140: dummy patterns 181, 182: external electrode
Detailed Description
Hereinafter, preferred embodiments of the present invention are described with reference to the accompanying drawings.
However, the embodiments of the present invention may be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below.
Furthermore, the embodiments of the present invention are provided to more fully describe the present invention to those having ordinary skill in the art to which the present invention pertains.
The shapes and sizes of elements in the drawings may be exaggerated for more clear explanation.
The same reference numerals are given to the same constituent elements having the same functions within the same concept shown in the drawings of the respective embodiments, and the description is given.
Hereinafter, W, L, T in the drawings may be defined as a first direction, a second direction, and a third direction, respectively.
Fig. 1 is a perspective view schematically showing an inductor 100 according to an embodiment of the present invention, fig. 2 is a front view schematically showing the inductor shown in fig. 1, and fig. 3 is a plan view schematically showing the inductor shown in fig. 1.
Referring to fig. 1 to 3, a structure of an inductor 100 according to an embodiment of the present invention will be explained.
The body 101 of the inductor 100 according to the first embodiment of the present invention may be formed by laminating a plurality of insulating layers in a first direction parallel to the mounting surface.
The insulating layer 111 may be a magnetic layer or a dielectric layer.
In the case where the insulating layer 111 is a dielectric layer, the insulating layer 111 may include BaTiO3(barium titanate) based ceramic powder. In thatIn this case, the BaTiO3The ceramic powder may be, for example, BaTiO3(Ba) in which a part of Ca (calcium), Zr (zirconium), etc. is dissolved1-xCax)TiO3、Ba(Ti1-yCay)O3、(Ba1-xCax)(Ti1-yZry)O3Or Ba (Ti)1-yZry)O3Etc., and the present invention is not limited thereto.
When the insulating layer 111 is a magnetic layer, the insulating layer 111 may be selected from materials that can be used as a main body of an inductor, and may include, for example, resin, ceramic, ferrite, or the like. For the present embodiment, the magnetic layer may use a photosensitive insulating material, whereby a fine pattern based on a photolithography process may be realized. That is, the magnetic layer is formed using a photosensitive insulating material, so that the coil patterns 121, 122, 123, and 124, the coil drawing portion 131, and the coil connecting portion 132 are finely formed, thereby contributing to miniaturization and improvement of functions of the inductor 100. For this purpose, a photosensitive organic material or a photosensitive resin, for example, may be included in the magnetic layer. In addition, SiO may be contained as a Filler (Filler) component in the magnetic layer2/Al2O3/BaSO4Inorganic components such as Talc.
A first external electrode 181 and a second external electrode 182 may be disposed at the outside of the main body 101.
For example, the first and second external electrodes 181 and 182 may be disposed on the mounting surface of the body 101. The so-called mounting surface denotes a surface facing the printed circuit board when the inductor is mounted to the printed circuit board.
The external electrodes 181, 182 perform the role of electrically connecting the inductor 100 with a substrate when the inductor 100 is mounted to a Printed Circuit Board (PCB). The external electrodes 181, 182 are arranged on the main body 101 at the edge portions of the first direction and the second direction parallel to the mounting surface, spaced from each other. The external electrodes 181, 182 may include, for example, a conductive resin layer, a conductor layer formed on the conductive resin layer, but are not limited thereto. The conductive resin layer may include at least one conductive metal selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag) and a thermosetting resin. The conductive layer may include any one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn), and for example, a nickel (Ni) layer and a tin (Sn) layer may be sequentially formed.
Referring to fig. 1 to 3, a coil pattern 121 may be formed in the insulating layer 111.
The coil patterns 121 may be electrically connected to adjacent coil patterns 121 by means of the coil connection parts 132. That is, the spiral-shaped coil patterns 121 are connected by the coil connection parts 132 to form the coil 120. Both ends of the coil 120 are connected to the first external electrode 181 and the second external electrode 182, respectively, via the coil lead-out portions 131. The coil connection part 132 may have a wider line width than the coil pattern 121 in order to improve connectivity between the coil patterns 121, and include conductive vias penetrating the insulating layer 111.
Referring to fig. 1, the coil patterns 121 of the inductor 100 according to an embodiment of the present invention may further include more than two coil patterns 121 of the same shape, respectively.
Referring to fig. 2, dummy (dummy) electrodes 140 may be formed in the insulating layer 111 at positions corresponding to the external electrodes 181 and 182. The dummy electrode 140 may perform an action of improving the close adhesion between the external electrodes 181 and 182 and the body 101, or may perform an action of a connection bridge (bridge) in the case where the external electrodes are formed by metal plating.
As the material of the coil pattern 121, the coil lead-out portion 131, and the coil connecting portion 132, a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), or an alloy thereof, which is a metal having excellent conductivity, can be used. The coil pattern 121, the coil lead-out portion 131, and the coil connection portion 132 may be formed by a metal plating method, a printing method, or the like, but are not limited thereto.
As shown in fig. 2, with the inductor 100 according to the first embodiment of the present invention, the coil pattern 121, the coil lead-out portion 131, the coil connection portion 132, or the like is formed in the insulating layer 111, and then the insulating layer 111 is laminated in the first direction parallel to the mounting surface to be manufactured, so the inductor 100 can be manufactured more easily than the related art. Also, the coil 120 is disposed perpendicular to the mounting surface, so that a phenomenon that the magnetic flux is affected by the mounting substrate can be prevented.
Referring to fig. 2, for the coil 120 of the inductor 100 according to the first embodiment of the present invention, when projected from the first direction, the coil patterns 121 overlap to form a coil track having a number of coil turns of 1 turn or more.
Specifically, the first external electrode 181 is connected to the first coil pattern 121a through the coil drawing portion 131, and then the first coil pattern 121a, the second coil pattern 121b, the third coil pattern 121c, the fourth coil pattern 121d, the fifth coil pattern 121e, the sixth coil pattern 121f, the seventh coil pattern 121g, and the eighth coil pattern 121h are sequentially connected through the coil connecting portion 132. Finally, the eighth coil pattern 121h is connected by means of the second external electrode 182 and the coil drawing part 131, thereby forming the coil 120.
Referring to fig. 3, with the inductor 100 according to one embodiment of the present invention, at least one of the coil patterns 121a, 121h disposed at the outmost outline among the coil patterns 121 is formed to be thicker than the coil patterns 121b, 121c, 121d, 121e, 121f, 121g disposed at the central portion.
Generally, a high-frequency inductor is an element having an open magnetic circuit using a dielectric. In the high-frequency inductor, the equivalent series resistance at high frequency increases due to the loss of magnetic flux and the parasitic capacitance generated between the internal electrode and the external electrode, and the equivalent series resistance at high frequency causes the Q to decrease.
[ mathematical formula 1]
Q is a quality factor and does not have a specific unit of measurement, and X is an imaginary component of impedance and is defined as a product of inductance and each frequency. Rs represents the equivalent series resistance at the measurement frequency.
Referring to mathematical formula 1, the equivalent series resistance represents the following meaning: the sum of the direct current resistance having a constant value irrespective of the frequency variation and the alternating current resistance which changes in magnitude with the variation of the alternating frequency. Here, the ac resistance is an imaginary component of the impedance, and is not simply consumed as heat energy like the dc resistance (Rdc). That is, the ac resistance is a lossless resistance in which L is stored with energy by a magnetic field and C is stored with energy by an electric field. However, since a signal that should flow at a predetermined frequency accumulates as an electric field or a magnetic field and stagnates, the ac resistance may be finally classified as a resistance component. In particular, the ac resistance may increase based on a Skin effect (Skin effect) and a proximity effect (Parasitic effect) caused by an increase in the alternating frequency, thereby causing an increase in the equivalent series resistance.
The inductor in the related art forms the thickness of the coil pattern in a constant manner regardless of the position. However, in the case of the inductor according to one embodiment of the present invention, at least one of the coil patterns 121a, 121h disposed at the outmost outline among the coil patterns 121 is formed to have a thickness thicker than that of the coil patterns 121b, 121c, 121d, 121e, 121f, 121g disposed at the central portion.
Fig. 4 is a graph showing current densities of coil patterns of an inductor according to an embodiment of the present invention, and fig. 5 is a graph showing current densities of coil patterns of an inductor of a comparative example.
The hatched portions of fig. 4 and 5 indicate portions where the measured current density is high.
For the comparative example, if referring to part B of fig. 5, since the thickness of the coil patterns is formed in a constant manner regardless of the position, the current density of the edge portions of the coil patterns 121a ', 121 h' arranged at the outermost sides is measured to be high due to the proximity effect. The reason for this is that mutually repulsive forces are generated between two wires through which currents flow in the same direction. Therefore, with the coil patterns 121a ', 121 h' of the comparative example, the current cannot uniformly flow in the entire coil patterns, and this becomes a factor of increasing the equivalent series resistance.
However, referring to part a of fig. 4, the following fact can be confirmed: the inductor 1100 according to one embodiment of the present invention has less high current density portions in the outermost arranged coil patterns 121a, 121b than the comparative example.
This indicates that the thickness of the coil patterns 121a, 121h disposed at the outmost outline among the coil patterns 121 is formed to be thicker than the thickness of the coil patterns 121b, 121c, 121d, 121e, 121f, 121g disposed at the central portion, and thus the surface area is increased, thereby increasing the area through which the current can flow, thereby alleviating the increase in current density. That is, with the inductor 100 according to one embodiment of the present invention, it is formed to be thicker in thickness of at least one of the coil patterns 121a, 121h arranged at the outermost profile among the coil patterns 121 than the coil patterns 121b, 121c, 121d, 121e, 121f, 121g arranged at the central portion, and accordingly, the equivalent series resistance is reduced, whereby the Q characteristic of the inductor 100 can be improved.
Also, the inductor 100 according to one embodiment of the present invention forms all of the coil patterns 121a, 121h arranged at the outmost outline among the coil patterns 121 to be thicker than the coil patterns 121b, 121c, 121d, 121e, 121f, 121g, and accordingly, reduces the equivalent series resistance, thereby being able to improve the Q characteristic of the inductor 100.
[ Table 1]
The comparative example of table 1 is an example in which the inductance (L), the Q factor (Q), and the equivalent series resistance (Rs) of the inductor having the thickness of the coil pattern of 13 μm are measured in a position-independent manner, and the example is an example in which the inductance (L), the Q factor (Q), and the equivalent series resistance (Rs) of the inductor having the thickness of the coil pattern located at the outermost portion of 17 μm and the thickness of the coil pattern located at the central portion of 13 μm are measured. Referring to table 1, the following facts can be confirmed: the equivalent series resistance of the example was reduced by as much as 7.7% compared to the comparative example, thereby increasing the Q factor (Q factor) by 5.6%.
Fig. 6 is a graph of the results of measuring the Q factor (Q factor) with respect to the frequency of the inductor of the comparative example and the inductor according to one embodiment of the present invention.
Embodiment I is an inductor in which the thickness of the coil patterns 121a, 121h disposed at the outermost profile among the coil patterns 121 is formed thicker than the thickness of the coil patterns 121b, 121c, 121d, 121e, 121f, 121g disposed at the central portion, and comparative example II is an inductor in which the thickness of the coil patterns 121a ', 121 h' disposed at the outermost profile among the coil patterns 121 is the same as the thickness of the coil patterns 121b, 121c, 121d, 121e, 121f, 121g disposed at the central portion. Referring to fig. 6, the following facts can be confirmed: in the case of embodiment I, since the phenomenon of an increase in current density due to the proximity effect is reduced in the coil patterns 121a, 121h arranged at the outermost profile, the Q Factor (Q Factor) rises.
The inductor 100 according to an embodiment of the present invention may be configured such that the thickness of the coil pattern 121 becomes gradually thicker from the central portion toward the outer contour portion.
For example, it may also be formed as follows: the third and sixth coil patterns 121c and 121f are formed to have a thickness greater than that of the fourth and fifth coil patterns 121d and 121e, the second and seventh coil patterns 121b and 121g are formed to have a thickness greater than that of the third and sixth coil patterns 121c and 121f, and the first and eighth coil patterns 121a and 121h are formed to have a thickness greater than that of the second and seventh coil patterns 121b and 121 g.
As with another embodiment described later, the inductor 100 according to an embodiment of the present invention may also be formed as: at least one of the coil patterns 121a, 121h arranged at the outermost contour among the coil patterns 121 has a line width greater than that of the coil patterns 121b, 121c, 121d, 121e, 121f, 121g arranged at the central portion among the coil patterns 121.
Also, the inductor 100 according to an embodiment of the present invention may be further formed as: at least one of the coil patterns 121a, 121h arranged at the outmost outline among the coil patterns 121 has a surface area larger than that of the coil patterns 121b, 121c, 121d, 121e, 121f, 121g arranged at the central portion among the coil patterns 121.
Fig. 7 is a sectional view schematically showing an inductor 200 according to another embodiment of the present invention in an L direction, and fig. 8 is a graph showing current densities of coil patterns of the inductor 200 according to another embodiment of the present invention.
Referring to fig. 7 and 8, an inductor 200 according to another embodiment of the present invention includes: a body 201 including a plurality of insulating layers 211; the coil patterns 221a, 221b, 221c, 221d, 221e, 221f are disposed on the insulating layer 211.
For the coil patterns 221a, 221b, 221c, 221d, 221e, 221f of the inductor 200 according to another embodiment of the present invention, the line widths of the coil patterns 221a, 221f located at the outmost outline are greater than the line widths of the coil patterns 221b, 221c, 221d, 221e located at the central portion.
Therefore, referring to the portion C of fig. 8, the proportion of the coil patterns 221a, 221b, 221C, 221d, 221e, 221f having a higher current density among the coil patterns 221a, 221f located at the outermost portions can be reduced, thereby reducing the equivalent series resistance.
That is, in the inductor according to another embodiment of the present invention, the Q characteristic of the inductor can be improved by reducing the equivalent series resistance by forming the line widths of the coil patterns 221a and 221f positioned at the outermost contours to be larger than the line widths of the coil patterns 221b, 221c, 221d, and 221e positioned at the central portion.
Fig. 9 is a graph of a result of measuring an inductance based on a design error for an inductor according to another embodiment of the present invention, and fig. 10 is a graph of a result of measuring a Q factor based on a design error (Q factor) for an inductor according to another embodiment of the present invention. .
In the inductor according to another embodiment of the present invention, the line widths of the coil patterns 221a and 221f positioned at the outermost contours are formed to be greater than the line widths of the coil patterns 221b, 221c, 221d and 221e positioned at the central portions, whereby the Q characteristics of the inductor can be improved, and in addition, a technical effect of being insensitive to design errors occurring due to process variations can be obtained. Referring to fig. 9 and 10, the following facts can be confirmed: in the case where the line widths of the coil patterns 221a, 221f positioned at the outermost contours are formed to be larger than the line widths of the coil patterns 221b, 221c, 221d, 221e positioned at the central portions, the rate of change of the inductance or Q factor of the embodiment based on the increase of the design error is smaller.
In particular, the following facts can be confirmed: the rate of change of this inductance or Q factor is significantly reduced when the design error is 10 μm or less.
Fig. 11 is a sectional view schematically showing an L direction of an inductor 300 according to still another embodiment of the present invention, and fig. 12 is a graph showing a current density of a coil pattern of the inductor 300 according to still another embodiment of the present invention.
Referring to fig. 11 and 12, an inductor 300 according to still another embodiment of the present invention includes: a body 301 including a plurality of insulating layers 311; the coil patterns 321a, 321b, 321c, 321d, 321e, and 321f are disposed on the insulating layer 311.
For the coil patterns 321a, 321b, 321c, 321d, 321e, 321f according to still another embodiment of the present invention, a line width of one coil pattern 321f of the coil patterns located at the outmost profile is greater than line widths of the other coil patterns 321a, 321b, 321c, 321d, 321 e.
Therefore, referring to the portion D of fig. 12, the proportion occupied by the portion having a higher current density among the coil patterns 321f located at the outermost contour among the coil patterns 321a, 321b, 321c, 321D, 321e, 321f can be reduced, thereby reducing the equivalent series resistance.
That is, in the inductor according to the further embodiment of the present invention, the line width of the coil pattern 321f located at the outermost periphery is formed to be larger than the line widths of the coil patterns 321a, 321b, 321c, 321d, and 321e located at the central portion, thereby reducing the equivalent series resistance, and thus improving the Q characteristic of the inductor.
The embodiments described above are not independent of each other, and one embodiment may be implemented alone or two or more embodiments may be implemented in combination. Although the embodiments of the present invention have been described in detail, the present invention is not limited to the embodiments and the drawings, but is intended to be defined by the claims.
Therefore, various substitutions, modifications and changes of the form can be made by those having basic knowledge in the technical field of the present invention without departing from the scope of the technical idea of the present invention described in the claims, and those should be considered as falling within the scope of the present invention.
Claims (9)
1. An inductor, comprising:
a main body formed by laminating a plurality of insulating layers;
first and second external electrodes disposed at an outer side of the main body; and
a coil formed by a plurality of coil patterns respectively arranged on each of the plurality of insulating layers being connected to each other by a coil connection portion, and both end portions being connected to the first external electrode and the second external electrode by a coil lead-out portion,
wherein, among the plurality of coil patterns, a thickness of at least one of the coil patterns arranged at the outmost outline in a direction in which the plurality of insulating layers are laminated is thicker than a thickness of the coil pattern arranged at a central portion, the thickness being a thickness in an axial direction of the coil.
2. The inductor of claim 1, wherein the plurality of coil patterns are thicker and thicker as going from the central portion to the outer contour.
3. The inductor according to claim 1, wherein, among the plurality of coil patterns, a line width of at least one coil pattern arranged in an outmost coil pattern is larger than a line width of a coil pattern arranged in a central portion.
4. The inductor of claim 1, wherein at least one of the coil patterns arranged at the outmost outline has a larger surface area than a surface area of the coil pattern arranged at the central portion among the plurality of coil patterns.
5. The inductor of claim 1, wherein the plurality of coil patterns comprises two or more coil patterns of the same shape.
6. An inductor, comprising:
a main body formed by laminating a plurality of insulating layers;
first and second external electrodes disposed at an outer side of the main body; and
a coil formed by a plurality of coil patterns respectively arranged on each of the plurality of insulating layers being connected to each other by a coil connection portion, and both end portions being connected to the first external electrode and the second external electrode by a coil lead-out portion,
wherein, among the plurality of coil patterns, a line width of at least one coil pattern among the coil patterns arranged at the outermost contour in a direction in which the plurality of insulating layers are laminated is larger than a line width of a coil pattern arranged at a central portion, the line width being a line width in a direction perpendicular to an axial direction of the coil.
7. The inductor of claim 6, wherein, among the plurality of coil patterns, at least one of the coil patterns arranged at the outmost outline includes a portion that does not overlap with the coil pattern arranged at the central portion.
8. The inductor of claim 6, wherein at least one of the coil patterns arranged at the outmost outline has a larger surface area than a surface area of the coil pattern arranged at the central portion among the plurality of coil patterns.
9. The inductor of claim 6, wherein the plurality of coil patterns comprises more than two coil patterns of the same shape.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160174502A KR20180071644A (en) | 2016-12-20 | 2016-12-20 | Inductor |
| KR10-2016-0174502 | 2016-12-20 |
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| Publication Number | Publication Date |
|---|---|
| CN108206088A CN108206088A (en) | 2018-06-26 |
| CN108206088B true CN108206088B (en) | 2021-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710521468.9A Active CN108206088B (en) | 2016-12-20 | 2017-06-30 | Inductor |
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| KR (1) | KR20180071644A (en) |
| CN (1) | CN108206088B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102571361B1 (en) | 2016-08-31 | 2023-08-25 | 비쉐이 데일 일렉트로닉스, 엘엘씨 | Inductor having high current coil with low direct current resistance |
| KR102559344B1 (en) * | 2018-08-13 | 2023-07-25 | 삼성전기주식회사 | Indctor |
| KR102262905B1 (en) | 2018-12-17 | 2021-06-09 | 삼성전기주식회사 | Coil component |
| KR102139184B1 (en) | 2018-12-17 | 2020-07-29 | 삼성전기주식회사 | Coil component |
| KR102185050B1 (en) * | 2019-03-13 | 2020-12-01 | 삼성전기주식회사 | Coil electronic component |
| WO2021075789A1 (en) * | 2019-10-16 | 2021-04-22 | 엘지이노텍 주식회사 | Coil member for hand-shake correction, and camera module including same |
| KR20210115262A (en) * | 2020-03-12 | 2021-09-27 | 엘지이노텍 주식회사 | Coil substrate for correcting hand-shake and camera module having the same |
| US11948724B2 (en) | 2021-06-18 | 2024-04-02 | Vishay Dale Electronics, Llc | Method for making a multi-thickness electro-magnetic device |
| KR20230151248A (en) | 2022-04-25 | 2023-11-01 | 삼성전기주식회사 | Coil component |
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|---|---|---|---|---|
| CN1462457A (en) * | 2001-03-05 | 2003-12-17 | Tdk株式会社 | Planar coil and planar tranformer |
| CN104766692A (en) * | 2014-01-02 | 2015-07-08 | 三星电机株式会社 | Chip electronic component |
| CN106205954A (en) * | 2015-05-27 | 2016-12-07 | 三星电机株式会社 | Inducer and forming method thereof |
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| JP4357672B2 (en) | 1998-11-11 | 2009-11-04 | 株式会社半導体エネルギー研究所 | Exposure apparatus, exposure method, and manufacturing method of semiconductor device |
| KR100779981B1 (en) | 2005-12-09 | 2007-11-28 | 한국전자통신연구원 | High performance integrated inductor |
| KR100869741B1 (en) | 2006-12-29 | 2008-11-21 | 동부일렉트로닉스 주식회사 | A Spiral Inductor |
| KR101832554B1 (en) * | 2015-01-28 | 2018-02-26 | 삼성전기주식회사 | Chip electronic component and manufacturing method thereof |
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2016
- 2016-12-20 KR KR1020160174502A patent/KR20180071644A/en not_active Application Discontinuation
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1462457A (en) * | 2001-03-05 | 2003-12-17 | Tdk株式会社 | Planar coil and planar tranformer |
| CN104766692A (en) * | 2014-01-02 | 2015-07-08 | 三星电机株式会社 | Chip electronic component |
| CN106205954A (en) * | 2015-05-27 | 2016-12-07 | 三星电机株式会社 | Inducer and forming method thereof |
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| CN108206088A (en) | 2018-06-26 |
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