CN108215407A - 一种电路板板材 - Google Patents
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Abstract
本发明公开了一种电路板板材，包括板材材料、粘接剂和加强筋材料，所述加强筋材料由聚酯树脂、玻璃纤维、沥青基碳纤维、纳米石墨烯组成，所述板材材料由ABS树脂、邻苯二甲酸酯、环氧树脂胶、聚苯硫醚、正丁醇、丁苯橡胶、聚乙烯蜡、三氧化钼、椰油二乙醇酰胺、聚氯乙烯、聚苯乙烯、异氰酸酯、丙烯酸甲酯、N‑亚甲基双丙烯酰胺、三甲硅基甲基膦酸二甲酯、甲基丙烯酸甲酯、异氰酸酯制成；与现有技术相比，本发明采用ABS树脂为主要材料，添加多种具备弹性的材料，使板材具备高强度的韧性，且具有高效的散热性能，再结合本发明的加强筋网，从而更进一步得提高板材的强度，重量轻，具有推广应用的价值。
Description
技术领域
本发明涉及材料技术领域，尤其涉及一种电路板板材。
背景技术
电路板有陶瓷电路板，氧化铝陶瓷电路板，氮化铝陶瓷电路板，线路板，PCB板，铝基板，高频板，厚铜板，阻抗板，PCB，超薄线路板，超薄电路板，印刷(铜刻蚀技术)电路板等。电路板使电路迷你化、直观化，对于固定电路的批量生产和优化用电器布局起重要作用。电路板可称为印刷线路板或印刷电路板，现有技术中，线路板的板材虽然多种，但是，陶瓷类的电路板比较容器损坏，比较脆弱，而金属类的成本高，且重量大，因此，存在改进空间。
发明内容
本发明的目的就在于为了解决上述问题而提供一种电路板板材。
本发明通过以下技术方案来实现上述目的：
本发明包括板材材料、粘接剂和加强筋材料，所述加强筋材料由聚酯树脂、玻璃纤维、沥青基碳纤维、纳米石墨烯组成，所述板材材料由ABS树脂、邻苯二甲酸酯、环氧树脂胶、聚苯硫醚、正丁醇、丁苯橡胶、聚乙烯蜡、三氧化钼、椰油二乙醇酰胺、聚氯乙烯、聚苯乙烯、异氰酸酯、丙烯酸甲酯、N-亚甲基双丙烯酰胺、三甲硅基甲基膦酸二甲酯、甲基丙烯酸甲酯、异氰酸酯制成；
具体制作方法包括以下步骤：
(1)加强筋制作：将玻璃纤维、沥青基碳纤维、纳米石墨烯采用编织设备编织成网状；
(2)在编织的网状加强筋表面涂覆聚酯树脂；
(3)将ABS树脂、邻苯二甲酸酯、环氧树脂胶、聚苯硫醚、正丁醇、丁苯橡胶、聚乙烯蜡置于加热容器中230-250℃加热溶解；
(3)保温状态下，加入三氧化钼、椰油二乙醇酰胺、聚氯乙烯、聚苯乙烯、异氰酸酯、丙烯酸甲酯、N-亚甲基双丙烯酰胺、三甲硅基甲基膦酸二甲酯、甲基丙烯酸甲酯、异氰酸酯，用搅拌机搅拌均匀，呈粘性颗粒状；
(4)在冷却前，采用压力机以5吨力将搅拌均匀的颗粒物压制成0.5mm厚的板材，冷却成型备用；
(5)将步骤(2)制成的加强筋网置于两张步骤(4)支撑的板材中间，并涂覆所述粘接剂；
(6)采用压力机以15吨压力将板材压制，保持30min后即得成品。
具体地，按重量比，所述板材材料中所述ABS树脂占25％、邻苯二甲酸酯占5％、环氧树脂胶占25％、聚苯硫醚占3％、正丁醇占1.5％、丁苯橡胶占15％、聚乙烯蜡占5％、三氧化钼占2％、椰油二乙醇酰胺占1％、聚氯乙烯占2％、聚苯乙烯占2％、异氰酸酯占2％、丙烯酸甲酯占5％、N-亚甲基双丙烯酰胺占1.5％、三甲硅基甲基膦酸二甲酯占2％、甲基丙烯酸甲酯占2％、异氰酸酯占1％。
具体地，按重量比，所述加强筋材料中所述聚酯树脂占5％、玻璃纤维占65％、沥青基碳纤维占25％、纳米石墨烯占5％。
本发明的有益效果在于：
本发明是一种电路板板材，与现有技术相比，本发明采用ABS树脂为主要材料，添加多种具备弹性的材料，使板材具备高强度的韧性，且具有高效的散热性能，再结合本发明的加强筋网，从而更进一步得提高板材的强度，重量轻，具有推广应用的价值。
具体实施方式
下面对本发明作进一步说明：
本发明包括板材材料、粘接剂和加强筋材料，所述加强筋材料由聚酯树脂、玻璃纤维、沥青基碳纤维、纳米石墨烯组成，所述板材材料由ABS树脂、邻苯二甲酸酯、环氧树脂胶、聚苯硫醚、正丁醇、丁苯橡胶、聚乙烯蜡、三氧化钼、椰油二乙醇酰胺、聚氯乙烯、聚苯乙烯、异氰酸酯、丙烯酸甲酯、N-亚甲基双丙烯酰胺、三甲硅基甲基膦酸二甲酯、甲基丙烯酸甲酯、异氰酸酯制成；
具体制作方法包括以下步骤：
(1)加强筋制作：将玻璃纤维、沥青基碳纤维、纳米石墨烯采用编织设备编织成网状；
(2)在编织的网状加强筋表面涂覆聚酯树脂；
(3)将ABS树脂、邻苯二甲酸酯、环氧树脂胶、聚苯硫醚、正丁醇、丁苯橡胶、聚乙烯蜡置于加热容器中230-250℃加热溶解；
(3)保温状态下，加入三氧化钼、椰油二乙醇酰胺、聚氯乙烯、聚苯乙烯、异氰酸酯、丙烯酸甲酯、N-亚甲基双丙烯酰胺、三甲硅基甲基膦酸二甲酯、甲基丙烯酸甲酯、异氰酸酯，用搅拌机搅拌均匀，呈粘性颗粒状；
(4)在冷却前，采用压力机以5吨力将搅拌均匀的颗粒物压制成0.5mm厚的板材，冷却成型备用；
(5)将步骤(2)制成的加强筋网置于两张步骤(4)支撑的板材中间，并涂覆所述粘接剂；
(6)采用压力机以15吨压力将板材压制，保持30min后即得成品。
具体地，按重量比，所述板材材料中所述ABS树脂占25％、邻苯二甲酸酯占5％、环氧树脂胶占25％、聚苯硫醚占3％、正丁醇占1.5％、丁苯橡胶占15％、聚乙烯蜡占5％、三氧化钼占2％、椰油二乙醇酰胺占1％、聚氯乙烯占2％、聚苯乙烯占2％、异氰酸酯占2％、丙烯酸甲酯占5％、N-亚甲基双丙烯酰胺占1.5％、三甲硅基甲基膦酸二甲酯占2％、甲基丙烯酸甲酯占2％、异氰酸酯占1％。
具体地，按重量比，所述加强筋材料中所述聚酯树脂占5％、玻璃纤维占65％、沥青基碳纤维占25％、纳米石墨烯占5％。
以上显示和描述了本发明的基本原理和主要特征及本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。
Claims (3)
1.一种电路板板材，其特征在于：包括板材材料、粘接剂和加强筋材料，所述加强筋材料由聚酯树脂、玻璃纤维、沥青基碳纤维、纳米石墨烯组成，所述板材材料由ABS树脂、邻苯二甲酸酯、环氧树脂胶、聚苯硫醚、正丁醇、丁苯橡胶、聚乙烯蜡、三氧化钼、椰油二乙醇酰胺、聚氯乙烯、聚苯乙烯、异氰酸酯、丙烯酸甲酯、N-亚甲基双丙烯酰胺、三甲硅基甲基膦酸二甲酯、甲基丙烯酸甲酯、异氰酸酯制成；
具体制作方法包括以下步骤：
(1)加强筋制作：将玻璃纤维、沥青基碳纤维、纳米石墨烯采用编织设备编织成网状；
(2)在编织的网状加强筋表面涂覆聚酯树脂；
(3)将ABS树脂、邻苯二甲酸酯、环氧树脂胶、聚苯硫醚、正丁醇、丁苯橡胶、聚乙烯蜡置于加热容器中230-250℃加热溶解；
(3)保温状态下，加入三氧化钼、椰油二乙醇酰胺、聚氯乙烯、聚苯乙烯、异氰酸酯、丙烯酸甲酯、N-亚甲基双丙烯酰胺、三甲硅基甲基膦酸二甲酯、甲基丙烯酸甲酯、异氰酸酯，用搅拌机搅拌均匀，呈粘性颗粒状；
(4)在冷却前，采用压力机以5吨力将搅拌均匀的颗粒物压制成0.5mm厚的板材，冷却成型备用；
(5)将步骤(2)制成的加强筋网置于两张步骤(4)支撑的板材中间，并涂覆所述粘接剂；
(6)采用压力机以15吨压力将板材压制，保持30min后即得成品。
2.根据权利要求1所述的电路板板材，其特征在于：按重量比，所述板材材料中所述ABS树脂占25％、邻苯二甲酸酯占5％、环氧树脂胶占25％、聚苯硫醚占3％、正丁醇占1.5％、丁苯橡胶占15％、聚乙烯蜡占5％、三氧化钼占2％、椰油二乙醇酰胺占1％、聚氯乙烯占2％、聚苯乙烯占2％、异氰酸酯占2％、丙烯酸甲酯占5％、N-亚甲基双丙烯酰胺占1.5％、三甲硅基甲基膦酸二甲酯占2％、甲基丙烯酸甲酯占2％、异氰酸酯占1％。
3.根据权利要求1所述的电路板板材，其特征在于：按重量比，所述加强筋材料中所述聚酯树脂占5％、玻璃纤维占65％、沥青基碳纤维占25％、纳米石墨烯占5％。
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