CN108213957B - The compound wire-electrode cutting and processing method of micro-electrochemical machining laser and device - Google Patents
The compound wire-electrode cutting and processing method of micro-electrochemical machining laser and device Download PDFInfo
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- CN108213957B CN108213957B CN201711459307.8A CN201711459307A CN108213957B CN 108213957 B CN108213957 B CN 108213957B CN 201711459307 A CN201711459307 A CN 201711459307A CN 108213957 B CN108213957 B CN 108213957B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
- B23H7/02—Wire-cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
- B23H7/38—Influencing metal working by using specially adapted means not directly involved in the removal of metal, e.g. ultrasonic waves, magnetic fields or laser irradiation
Abstract
This application discloses a kind of compound wire-electrode cutting and processing methods of micro-electrochemical machining laser and device, the method at least include the following steps: the anode of the connection of the cathode of line electrode and power supply, workpiece and power supply connects；Laser enters line electrode, couples with line electrode；It is passed through electrolyte；Power on, line electrode is fed by projected route, and micro-electrochemical machining and the compound linear cutter of laser obtain object construction.The characteristics of the method and device comprehensive utilization wire electrochemical micro-machining and laser processing, realizes the high efficiency processing of high-precision, high surface integrity slit, microflute, microscopic three-dimensional structure etc..
Description
Technical field
This application involves a kind of compound wire-electrode cutting and processing method of micro-electrochemical machining laser and devices, belong to accurate, fine special type
Manufacture field.
Background technique
Wire electrochemical micro-machining is using minute yardstick (5~500 microns of diameter) line electrode as tool-electrode, tool electricity
Pole is moved relative to workpiece with scheduled motion profile, using electrochemical oxidation principle remove workpiece material, be suitable for processing slit,
The fine structures such as narrow slot, with no heat affecting, without residual stress, tool-electrode is lossless and processing performance is not by workpiece material
The features such as mechanical performance limits, before the fields such as aerospace, precision machinery, microelectronics, accurate measurement have a wide range of applications
Scape.
Compared with Precision EDM wire cutting, wire electrochemical micro-machining efficiency is still in reduced levels.Accurate electrical fire
The TRANSIENT HIGH TEMPERATURE removal workpiece material that yarn cutting processing is generated with micro discharge, material removal rate with higher, but its
There is the defects of electric discharge pit and heat affected layer in finished surface.And during wire electrochemical micro-machining, workpiece material with from
For sub- form by ablation, processing efficiency is limited by reaction particle diffusion rate, electrolysate in electric double layer near zone electrolyte
The factors such as the efficiency of machining area are discharged.To improve wire electrochemical micro-machining material removal rate, researchers at home and abroad
Propose the methods of the coaxial fliud flushing of line electrode, line electrode one-way movement, line electrode reciprocating motion, line electrode vibration, Workpiece vibration
(Zeng Yongbin, Yu Qia, Wang Shaohua, Zhu Di, CIRP Annals-Manufacturing Technology, 61,195-198
(2012)).Above method is conducive to improve micro- ruler to a certain extent in the way of workpiece and the relative motion of the Line tool electrode
The discharge of electrolysate, promotes the update of electrolyte in processing gap, improves material removal rate in degree processing gap.However,
The above method for improving wire electrochemical micro-machining efficiency, i.e., by the way of workpiece and line electrode relative motion, due to stream
Body movement characteristic, it is smaller on exchange of particles rate influence in the boundary layer of workpiece surface near zone, to its processing efficiency of raising
There are certain bottlenecks, limit further increasing for wire electrochemical micro-machining efficiency.
When laser processing interacts with workpiece material, when laser energy density is lower, the temperature in laser irradiation region
It increases, and when laser energy density is higher, workpiece material is removed in a manner of melting or distilling.Laser processing has processing
High-efficient, the features such as precision is good.Since wire electrochemical micro-machining central electrode need to enter inside workpiece material, laser energy
Field be difficult to electrolysis region composite, have no that micro-electrochemical machining wire cutting and lasing efficiency are compound in document before this and patent
Report.
Summary of the invention
According to the one aspect of the application, a kind of compound wire-electrode cutting and processing method of micro-electrochemical machining laser, comprehensive benefit are provided
The characteristics of with wire electrochemical micro-machining and laser processing, realize high-precision, high surface integrity slit, microflute, miniature three
Tie up the high efficiency processing of structure etc..
The compound wire-electrode cutting and processing method of micro-electrochemical machining laser, which is characterized in that at least include the following steps:
(1) line electrode is connect with electric cathode, and the anode of workpiece and power supply connects；
(2) laser enters line electrode, couples with line electrode；
(3) it is passed through electrolyte；Wherein, electrolyte is contacted with line electrode and workpiece；
(4) power on, line electrode is fed by projected route, and micro-electrochemical machining and the compound linear cutter of laser obtain target
Structure.
Optionally, laser described in step (2) is through over-focusing, subsequently into the end face center region of line electrode；
The end face center region of the line electrode refers to the region for deviateing end face center point pre-determined distance.
Optionally, the laser focuses the laggard line electrode of scale in a subtle way by condenser lens.
Optionally, it is coupled in step (2) with line electrode specifically: laser enters line electrode, in line electrode and electrolyte circle
Reflection and refraction occur for face, and refraction laser beam enters machining area, and reflection laser light beam is anti-in line electrode and electrolyte interface
It is emitted back towards and continues to transmit inside line electrode, continue that refraction and reflection occurs in line electrode and electrolyte interface, realize laser and line electricity
The coupling of pole.
Optionally, it is coupled in step (2) with line electrode specifically: laser enters line electrode, in line electrode and electrolyte circle
Reflection and refraction occur for face, and a part of laser beam enters machining area, and a part is reflected back in line electrode and electrolyte interface
Continue to transmit inside line electrode, continue that refraction and reflection occurs in line electrode and electrolyte interface, realizes laser and line electrode
Coupling, so that making a part of laser energy enter processing gap acts on workpiece material machining area.
Optionally, the line electrode includes the transparent conducting coating outside inner core and inner core；
Wherein, the cathode of the conductive coating and power supply connects.
Optionally, the minute yardstick line electrode includes inner core and high transparency conductive coating structure, micro-electrochemical machining wire cutting
Transparent conducting coating is connect with the cathode of Electrolyzed Processing power supply in process, and workpiece is connect with the anode of Electrolyzed Processing power supply.
Laser focuses the laggard line electrode of scale in a subtle way by condenser lens.
Optionally, the inner core of the line electrode is rock quartz core rod；
Wherein, the purity of the rock quartz core rod is greater than 99%, and light transmittance is greater than 90%, and diameter is 10~500 microns.
Optionally, the form of the rock quartz core rod is hollow capillary or solid mandrel.
Optionally, the transparent conducting coating is indium-tin oxide coatings；
Wherein, the light transmittance of the indium-tin oxide coatings is greater than 90%；With a thickness of 20~200 microns.
Optionally, the conductivity of the indium-tin oxide coatings is close to metal material.
Optionally, the high transparency of the minute yardstick line electrode, conductivity tin indium oxide (IndiumTin Oxide,
ITO) coating production includes coprecipitation, sol-gel processing, and it is micro- with a thickness of 20~200 to control it for the techniques such as hydro-thermal method
Rice.
Specifically, described its inner core of minute yardstick line electrode is high-purity, high transparency (being greater than 90%) minute yardstick quartz core
Stick, 10~500 microns of diameter, transparent conducting coating is indium-tin oxide coatings, light refractive index 1.858.It is described above
The form of the inner core rock quartz core rod of minute yardstick line electrode includes hollow capillary or solid minute yardstick plug.
As a kind of specific embodiment, the compound linear cutter technology of micro-electrochemical machining laser is included at least: being swashed
Light light beam injects the end face center neighbouring position of above-mentioned minute yardstick line electrode after condenser lens focuses, realize laser with it is above-mentioned
The coupling of minute yardstick line electrode.Laser enters line electrode, reflection and refraction occurs in line electrode and electrolyte interface, a part swashs
Light light beam enters machining area, and a part is reflected back in line electrode and electrolyte interface to be continued to transmit inside line electrode, continues
Refraction and reflection occur for line electrode and electrolyte interface, the coupling of laser and line electrode are realized, to make a part of laser energy
Workpiece material machining area is acted on into processing gap.Laser beam greatly enhancing inside minute yardstick line electrode can be realized simultaneously
Degree, low-loss transmission, ensure that laser energy field and electrochemical etching effect in the coupling in wire electrochemical micro-machining region.
Optionally, electrolyte described in step (3) is full of the gap between line electrode and workpiece.
Optionally, the compound wire-electrode cutting and processing method of micro-electrochemical machining laser is added using the compound wire cutting of micro-electrochemical machining laser
Tooling sets realization.
Optionally, the compound wire-electrode cutting and processing method of the micro-electrochemical machining laser realize high-precision, high surface integrity slit,
The high efficiency of microflute, microscopic three-dimensional structure etc. is processed.
Another aspect in the application, provides a kind of compound wire electric discharge machine of micro-electrochemical machining laser, and feature exists
In including at least: laser system, electrolysis system, displacement system；
The laser system includes laser；
The electrolysis system includes line electrode, power supply and electrolyte；The cathode of the line electrode and power supply connection, workpiece with
The anode connection of power supply；
The laser of the laser transmitting enters line electrode；
Institute's displacement system is connect with workpiece.
Optionally, the laser system further includes transmission laser system；
The laser is selected from the solid state laser of wavelength 532nm, the gas laser of wavelength 532nm, wavelength 532nm
At least one of semiconductor laser；
The transmission laser system is selected from the laser delivery optics that optical fiber or reflecting mirror form.
Optionally, the laser system further includes condenser lens；The laser that laser issues is poly- by the condenser lens
It is burnt.
Optionally, the electrolysis system further includes electrolyte pressurization-transport system；
The power supply is selected from DC power supply, high frequency pulse power supply or bipolar power supply.
Optionally, above-described Electrolyzed Processing power supply includes DC power supply, high frequency pulse power supply, bipolar power supply etc..
Optionally, electrolyte pressurization-transport system passes through pipeline flow-direction micro-electrochemical machining line using precision metering pump
Cutting processing region, using flowmeter real-time measurement flow of electrolyte.
Electrolyte pressurization-the transport system includes: precision metering pump and flowmeter.
Optionally, the electrolysis system further includes electrolysis liquor collecting device；The electrolysis liquor collecting device collection has made
Electrolyte.
Optionally, institute's displacement system includes motion platform, kinetic control system and industrial personal computer；
The industrial personal computer controls the movement of motion platform by motion controller, and workpiece is installed on the motion platform.
Optionally, industrial personal computer controls the movement of motion platform by motion controller, and workpiece is installed on the motion platform
On, the multi-shaft precise of workpiece motion s track is controlled to realize.
It optionally, further include processing signal acquisition system；
The processing signal acquisition system include Hall sensor, data collecting card, digital oscilloscope, in current probe
It is at least one.
Optionally, the processing signal acquisition system utilizes Hall sensor, data collecting card or digital oscilloscope, electricity
Stream probe real-time measurement electrochemical micromachining curent change situation.
As a kind of specific embodiment, the compound wire electric discharge machine of micro-electrochemical machining laser mainly includes following
Subsystem: laser, transmission laser system, electrolyte pressurization-transport system, motion platform, kinetic control system, electrolysis add
Work power supply, processing signal acquisition system etc..
Optionally, the compound wire electric discharge machine of the micro-electrochemical machining laser realize high-precision, high surface integrity slit,
The high efficiency of microflute, microscopic three-dimensional structure etc. is processed.
In the application: when laser energy is lower, laser and workpiece material interact the temperature rise generated in machining area
Be conducive to improve the diffusion rate of workpiece electric double layer and its near zone reactive ion with temperature gradient, and improve laser action area
The raising of domain electrolytic conductivity improves micro-electrochemical machining wire cutting to improve the velocity of ion exchange at electrochemical reaction interface
Processing efficiency.When laser energy is more than certain threshold value (related to the physical characteristic of workpiece material), workpiece material is made in laser
It is directly removed under, material removing method includes melting, distillation or the mixing of two ways.At the same time, electrolysis
It can remove the heat affected layer that laser processing generates, avoid the adverse effect of laser processing.Therefore, one kind proposed by the present invention is micro-
The thin electrolysis compound linear cutter technology of laser, it is synchronous with the laser processing zone of action to realize wire electrochemical micro-machining
Coupling, fully utilizes the advantage of wire electrochemical micro-machining and laser processing, effectively prevents two kinds of processing technologys
Deficiency provides a kind of thinking for the raising of wire electrochemical micro-machining efficiency.
A kind of compound wire-electrode cutting and processing method of micro-electrochemical machining laser and its device of the application, as shown in figures 1 and 3,
Be characterized in that: laser beam injects the end face center neighbouring position of minute yardstick line electrode after condenser lens focuses, and realizes and swashs
The coupling of light and above-mentioned minute yardstick line electrode.Wherein, minute yardstick line electrode includes inner core and high transparency conductive coating structure, micro-
Transparent conducting coating is connect with the cathode of Electrolyzed Processing power supply during thin electrolysis linear cutter, workpiece and Electrolyzed Processing power supply
Anode connection.Laser focuses the laggard line electrode of scale in a subtle way by condenser lens.Described its inner core of minute yardstick line electrode is height
Purity, high transparency (being greater than 90%) minute yardstick rock quartz core rod, 10~500 microns of diameter, transparent conducting coating is indium oxide
Tin conductive coating, light refractive index 1.858.The form of the inner core rock quartz core rod of minute yardstick line electrode includes hollow capillary
Or solid minute yardstick plug.The high transparency of minute yardstick line electrode, conductivity tin indium oxide (Indium Tin Oxide,
ITO) conductive coating preparation method includes coprecipitation, sol-gel processing, the techniques such as hydro-thermal method, control its with a thickness of 20~
200 microns.Laser enters line electrode, reflection and refraction occurs in line electrode and electrolyte interface, a part of laser beam enters
Machining area, a part is reflected back in line electrode and electrolyte interface to be continued to transmit inside line electrode, is continued in line electrode and electricity
It solves liquid interface and refraction and reflection occurs, the coupling of laser and line electrode is realized, so that a part of laser energy be made to enter between processing
Gap acts on workpiece material machining area.It realizes long length of the laser beam inside minute yardstick line electrode, low-loss transmission, protects
Laser energy field and electrochemical etching effect have been demonstrate,proved in the coupling in wire electrochemical micro-machining region.
The compound wire electric discharge machine of micro-electrochemical machining laser mainly includes following subsystem: laser, transmission laser system,
Electrolyte pressurization-transport system, motion platform, kinetic control system, Electrolyzed Processing power supply, processing signal acquisition system etc..
The beneficial effect that the application can generate includes:
1) the compound wire-electrode cutting and processing method of micro-electrochemical machining laser provided herein can be realized high-precision, high surface
The high efficiency of integrality slit, microflute, microscopic three-dimensional structure etc. is processed.
2) the compound wire-electrode cutting and processing method of micro-electrochemical machining laser provided herein, realizes micro-electrochemical machining wire cutting and adds
Work coupling synchronous with the laser processing zone of action, fully utilizes the advantage of wire electrochemical micro-machining and laser processing,
The deficiency of two kinds of processing technologys is effectively prevented, provides a kind of thinking for the raising of wire electrochemical micro-machining efficiency.
3) the compound wire electric discharge machine of micro-electrochemical machining laser provided herein can be realized high-precision, high surface
The high efficiency of integrality slit, microflute, microscopic three-dimensional structure etc. is processed.
4) the compound wire electric discharge machine of micro-electrochemical machining laser provided herein, realizes micro-electrochemical machining wire cutting and adds
Work coupling synchronous with the laser processing zone of action, fully utilizes the advantage of wire electrochemical micro-machining and laser processing,
The deficiency of two kinds of processing technologys is effectively prevented, provides a kind of thinking for the raising of wire electrochemical micro-machining efficiency.
Detailed description of the invention
Fig. 1 is the compound linear cutter technology schematic diagram of micro-electrochemical machining laser in a kind of embodiment of the application.
Fig. 2 is transmission schematic diagram of the laser in minute yardstick line electrode in a kind of embodiment of the application.
Fig. 3 is the compound wire electric discharge machine of micro-electrochemical machining laser in a kind of embodiment of the application.
Component and reference signs list:
1, Electrolyzed Processing power supply, 2, workpiece, 3, laser beam, 4, condenser lens, 5, rock quartz core rod, 6, high transparency oxidation
Indium tin conductive coating, 7, electrolyte inflow direction, 8, electrolyte outflow direction, 9, workpiece direction of feed, 10, machining profile, 11,
Laser focus on light beam, 12, deflecting light beams of the laser beam in rock quartz core rod, 13, laser beam is in high transparency tin indium oxide
Deflecting light beams in coating, 14, the reflected beams of the laser beam in rock quartz core rod, 15, laser beam high transparency aoxidize
The reflected beams in indium tin coating, 16, laser beam rock quartz core rod and indium-tin oxide coatings interface the reflected beams, 17, swash
Deflecting light beams of the light light beam through rock quartz core rod and indium-tin oxide coatings interface, 18, minute yardstick line electrode, 19, industrial personal computer, 20,
Motion controller, 21, motion platform, 22, electrolyte collecting tank, 23, used electrolyte, 24, laser, 25, beam expander,
26, reflecting mirror, 27, electrolyte liquid reserve tank, 28, controller, 29, precision metering pump, 30, check valve, 31, flowmeter, 32, Hall
Current sensor, 33, data collecting card.
Specific embodiment
The application is described in detail below with reference to embodiment, but the application is not limited to these embodiments.
Unless otherwise instructed, the components in embodiments herein are bought by commercial sources.
Embodiment 1
Illustrate the compound linear cutter technical principle of micro-electrochemical machining laser by Fig. 1 and Fig. 2, wherein Fig. 1 be fine electricity
The compound linear cutter technology schematic diagram of laser is solved, Fig. 2 is transmission schematic diagram of the laser in minute yardstick line electrode.
Laser beam 3 injects 18 end face center near zone of minute yardstick line electrode by condenser lens 4, realizes laser beam
With the coupling of minute yardstick line electrode 18.Minute yardstick line electrode 18 is the high transparency indium oxide by inner quartz plug 5 and outside
Tin conductive coating 6 is constituted.During wire electrochemical micro-machining, high transparency tin indium oxide conductive coating 6 and workpiece 2 are distinguished
It is connect with the cathode of Electrolyzed Processing power supply 1 and anode.Electrolyte is flowed into along minute yardstick line electrode 18 by electrolyte inflow direction 7 micro-
Wire electrochemical micro-machining region is flowed out along electrolyte outflow direction 8 in thin electrolysis linear cutter region.
Transmission of the laser in minute yardstick line electrode is as shown in Figure 2.The laser after the focusing of condenser lens 4 of laser beam 3
Focus on light beam 11 is injected with coupling angle α near the end face center position of minute yardstick line electrode 18, and laser focus on light beam is with incidence angle
θ1Rock quartz core rod 5 is injected, the refraction angle of deflecting light beams 12 of the laser beam in rock quartz core rod is θ2, according to light refraction law
There is n3sinθ1=n1sinθ2, wherein n3For air optical refractive index, n1For rock quartz core rod light refractive index (n1=1.5).Laser
Deflecting light beams 12 of the light beam in rock quartz core rod are with incidence angle θ3Directive is applied in rock quartz core rod 5 and high transparency tin indium oxide conduction
Reflection and refraction occur for the interface of layer 6, laser beam, wherein refraction light of the laser beam in high transparency indium-tin oxide coatings
The refraction angle of beam 13 is θ4, 14 be the reflected beams of the laser beam in rock quartz core rod, there is n1sinθ3=n2sinθ4.High transparency
Light refractive index (the n of tin indium oxide conductive coating 62=1.858) it is greater than light refractive index (the n of air3=1.0)；Work as laser light
When beam is transmitted from high transparency tin indium oxide conductive coating 6 into electrolyte, laser beam incidence angle is θ5, laser beam is in height
Reflection and refraction occur for light transmittance indium tin oxide transparent conductive coating 6 and electrolyte interface, and a part is in line electrode and electrolyte
Interface, which is reflected back, continues to transmit inside line electrode, continues that refraction and reflection occurs in line electrode and electrolyte interface, realizes laser
With the coupling of line electrode, thus make a part of laser energy enter processing gap act on workpiece material machining area.Utilize with
The upper laser beam is in transparent conducting coating and electrolyte interface reflection and refraction effect, it can be achieved that laser beam is in minute yardstick
Long length coupling inside line electrode and in processing gap, ensure that laser energy field and electrochemical etching effect in micro-electrochemical machining
The coupling in linear cutter region.
Embodiment 2
Fig. 3 is the compound wire electric discharge machine of micro-electrochemical machining laser comprising following subsystem: laser, laser transmission
System, electrolyte pressurization-transport system, motion platform, kinetic control system, Electrolyzed Processing power supply, processing signal acquisition system
Deng.The laser beam 3 that laser 24 issues makes laser beam using condenser lens 4 into crossing after beam expanding lens 25 by reflecting mirror 26
It is coupled with minute yardstick line electrode 18.Laser 24, which is adjusted, by industrial personal computer 19 issues the repetition rate of laser beam 3, laser energy
Etc. parameters.Electrolyte is flowed to micro-electrochemical machining wire cutting by check valve 30 and flowmeter 31 and is added by 29 pressurization of high-precision measuring pump
Work area, industrial personal computer 19 are read in real time by flowmeter 31 and adjust the flow for flowing to machining area electrolyte.Electrolyte, which flows through, to be added
It has used electrolyte 23 to flow into electrolyte collecting tank 22 behind the domain of work area, has prepared subsequent processing.Wire electrochemical micro-machining process
In, high transparency tin indium oxide conductive coating 6 and workpiece 2 are connect with the cathode of Electrolyzed Processing power supply 1 and anode respectively.Fine electricity
It solves in line cutting processing, utilizes the change of 33 real-time detection processing electric current i (t) of Hall current sensor 32 and data collecting card
Change trend.In addition, workpiece 2 is installed on motion platform 21 in process, industrial personal computer 19 passes through the control fortune of motion controller 20
The motion profile of moving platform 21, to realize the high-efficiency and precision processing of differently contoured microfabrication.
The 3 compound wire-electrode cutting and processing method of micro-electrochemical machining laser of embodiment
The compound wire-electrode cutting and processing method of micro-electrochemical machining laser in the present embodiment, comprising:
(1) cathode of line electrode and power supply connects, and the anode of workpiece and power supply connects；
In this step, the power supply is DC power supply.
Another embodiment, the power supply are high frequency pulse power supply.
Another embodiment, the power supply are bipolar power supply.
(2) laser enters line electrode, couples with line electrode；
In this step, the laser is through over-focusing, subsequently into the end face center region of line electrode；The line electrode
End face center region refers to the region for deviateing end face center point pre-determined distance.
A kind of specific embodiment, the laser are transmitted by optical fiber.
Another specific embodiment, the laser delivery optics that the laser is made up of reflecting mirror.
In this step, it is coupled with line electrode specifically: laser enters line electrode, occurs in line electrode and electrolyte interface
Reflection and refraction, a part of laser beam enter machining area, and a part is reflected back line electrode in line electrode and electrolyte interface
Inside continues to transmit, and continues that refraction and reflection occurs in line electrode and electrolyte interface, realizes the coupling of laser and line electrode, from
And so that a part of laser energy is entered processing gap and act on workpiece material machining area.
(3) it is passed through electrolyte；Wherein, electrolyte is contacted with line electrode and workpiece；
In this step, electrolyte transmission can be carried out by electrolyte liquid reserve tank, but is not limited to aforesaid way, appointed
What can be realized electrolyte contacted with line electrode and workpiece carry out micro-electrochemical machining wire cutting mode it is applicable.
In a kind of specific embodiment of this step, the electrolyte is full of the gap between line electrode and workpiece.
(4) power on, line electrode is fed by projected route, and micro-electrochemical machining and the compound linear cutter of laser obtain target
Structure.
In the above-mentioned methods, as an implementation, the line electrode includes the electrically conducting transparent outside inner core and inner core
Coating；
Wherein, the cathode of the transparent conducting coating and power supply connects.
A kind of specific embodiment is that the inner core of the line electrode is rock quartz core rod；Wherein, the rock quartz core rod is pure
Degree is greater than 99%, and light transmittance is greater than 90%, and diameter is 10~500 microns.
Another specific embodiment is that the conductive coating is indium-tin oxide coatings；Wherein, the tin indium oxide applies
The light transmittance of layer is greater than 90%, and conductivity is close to metal material；With a thickness of 20~200 microns.
Another specific embodiment is that the form of rock quartz core rod is hollow capillary or solid mandrel.
Another specific embodiment are as follows: the inner core of the line electrode is rock quartz core rod；Wherein, the rock quartz core rod
Purity is greater than 99%, and light transmittance is greater than 90%, and diameter is 10~500 microns；
The form of the rock quartz core rod is hollow capillary or solid mandrel；
The conductive coating is indium-tin oxide coatings；Wherein, the light transmittance of the indium-tin oxide coatings is greater than 90%, conduction
Rate is close to metal material；With a thickness of 20~200 microns.
Method in the present embodiment comprehensively utilizes the characteristics of wire electrochemical micro-machining and laser processing, realizes high-precision
The high efficiency of degree, high surface integrity slit, microflute, microscopic three-dimensional structure etc. is processed.
The 4 compound wire-electrode cutting device of micro-electrochemical machining laser of embodiment
The compound wire-electrode cutting device of micro-electrochemical machining laser in the present embodiment includes: laser system, electrolysis system, displacement system
System；
The laser system includes laser；
The electrolysis system includes line electrode, power supply and electrolyte；The cathode of the line electrode and power supply connection, workpiece with
The anode connection of power supply；
The laser of the laser transmitting enters line electrode；
Institute's displacement system is connect with workpiece.
As one of specific embodiment, the laser system further includes transmission laser system；
The transmission laser system is selected from the laser delivery optics that optical fiber or reflecting mirror form.
As one of specific embodiment, the laser system further includes condenser lens；What laser issued swashs
Light is focused by the condenser lens.
As one of specific embodiment, the electrolysis system further includes electrolyte pressurization-transport system；Institute
It states power supply and is selected from DC power supply, high frequency pulse power supply or bipolar power supply；Electrolyte pressurization-the transport system includes: precision
Metering pump and flowmeter.
As one of specific embodiment, the electrolysis system further includes electrolysis liquor collecting device；The electrolysis
Liquor collecting device collects the electrolyte used.
As one of specific embodiment, institute's displacement system includes motion platform, kinetic control system and work
Control machine；
The industrial personal computer controls the movement of motion platform by motion controller, and workpiece is installed on the motion platform.
As one of specific embodiment, described device further includes processing signal acquisition system；The processing letter
Number acquisition system includes Hall sensor, data collecting card, digital oscilloscope and current probe.
As one of specific embodiment, described device further includes processing signal acquisition system；The processing letter
Number acquisition system includes Hall sensor and data collecting card.
As one of specific embodiment, described device further includes processing signal acquisition system；The processing letter
Number acquisition system is Hall sensor.
As one of specific embodiment, described device further includes processing signal acquisition system；The processing letter
Number acquisition system includes data collecting card.
As one of specific embodiment, described device includes: laser, transmission laser system, electrolyte increasing
Pressure-transport system, motion platform, kinetic control system, Electrolyzed Processing power supply and processing signal acquisition system.
As one of specific embodiment, the laser is the solid state laser of wavelength 532nm.
As one of specific embodiment, the laser is the gas laser of wavelength 532nm.
As one of specific embodiment, the laser be wavelength 532nm semiconductor laser in extremely
Few one kind.
Device in the present embodiment can be carried out by principle involved in embodiment 1 or method described in embodiment 3
The high efficiency processing of high-precision, high surface integrity slit, microflute, microscopic three-dimensional structure etc. is realized in operation.
The above is only several embodiments of the application, not does any type of limitation to the application, although this Shen
Please disclosed as above with preferred embodiment, however not to limit the application, any person skilled in the art is not taking off
In the range of technical scheme, a little variation or modification are made using the technology contents of the disclosure above and is equal to
Case study on implementation is imitated, is belonged in technical proposal scope.
Claims (14)
1. a kind of compound wire-electrode cutting and processing method of micro-electrochemical machining laser, which is characterized in that at least include the following steps:
(1) cathode of line electrode and power supply connects, and the anode of workpiece and power supply connects；
(2) laser enters line electrode, couples with line electrode；
(3) it is passed through electrolyte；Wherein, electrolyte is contacted with line electrode and workpiece；
(4) power on, line electrode is fed by projected route, and micro-electrochemical machining and the compound linear cutter of laser obtain target knot
Structure；
Step couples in (2) with line electrode specifically: laser enters line electrode, line electrode and electrolyte interface occur reflection and
Refraction, refraction laser beam enter machining area, and reflection laser light beam is reflected back in line electrode in line electrode and electrolyte interface
Portion continues to transmit, and continues that refraction and reflection occurs in line electrode and electrolyte interface, realizes the coupling of laser and line electrode；
The line electrode includes the transparent conducting coating outside inner core and inner core；
Wherein, the cathode of the conductive coating and power supply connects.
2. the method according to claim 1, wherein laser described in step (2) is through over-focusing, subsequently into line
The end face center region of electrode；
The end face center region of the line electrode refers to the region for deviateing end face center point pre-determined distance.
3. the method according to claim 1, wherein the inner core of the line electrode is rock quartz core rod；
Wherein, the purity of the rock quartz core rod is greater than 99%, and light transmittance is greater than 90%, and diameter is 10 ~ 500 microns.
4. according to the method described in claim 3, it is characterized in that, the form of the rock quartz core rod is hollow capillary or solid
Plug.
5. the method according to claim 1, wherein the transparent conducting coating is indium-tin oxide coatings；
Wherein, the light transmittance of the indium-tin oxide coatings is greater than 90%；With a thickness of 20 ~ 200 microns.
6. the method according to claim 1, wherein electrolyte described in step (3) is full of line electrode and workpiece
Between gap.
7. a kind of device for the compound wire-electrode cutting and processing method of micro-electrochemical machining laser described in claim 1, which is characterized in that extremely
It less include: laser system, electrolysis system, displacement system；
The laser system includes laser；
The electrolysis system includes line electrode, power supply and electrolyte；The connection of the cathode of the line electrode and power supply, workpiece and power supply
Anode connection；
The laser of the laser transmitting enters line electrode；
Institute's displacement system is connect with workpiece.
8. device according to claim 7, which is characterized in that the laser system further includes transmission laser system；
The laser is selected from the solid state laser of wavelength 532nm, the gas laser of wavelength 532nm, wavelength 532nm and partly leads
At least one of body laser；
The transmission laser system is selected from the laser delivery optics that optical fiber or reflecting mirror form.
9. device according to claim 7, which is characterized in that the laser system further includes condenser lens；
The laser that laser issues is focused by the condenser lens.
10. device according to claim 7, which is characterized in that the electrolysis system further includes that electrolyte be pressurized-transports
System；
The power supply is selected from DC power supply, high frequency pulse power supply or bipolar power supply；
Electrolyte pressurization-the transport system includes: precision metering pump and flowmeter.
11. device according to claim 7, which is characterized in that the electrolysis system further includes electrolysis liquor collecting device；
The electrolysis liquor collecting device collects the electrolyte used.
12. device according to claim 7, which is characterized in that institute's displacement system includes motion platform, motion control system
System and industrial personal computer；
The industrial personal computer controls the movement of motion platform by motion controller, and workpiece is installed on the motion platform.
13. according to the described in any item devices of claim 7 to 12, which is characterized in that further include processing signal acquisition system；
The processing signal acquisition system include Hall sensor, data collecting card, digital oscilloscope, in current probe at least
It is a kind of.
14. device according to claim 7, which is characterized in that described device includes at least: laser, laser transmission system
System, electrolyte pressurization-transport system, motion platform, kinetic control system, Electrolyzed Processing power supply and processing signal acquisition system.
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| CN112823992A (en) * | 2019-11-19 | 2021-05-21 | 中国科学院宁波材料技术与工程研究所 | Laser and electrolyte combined processing method and processing device thereof |
| CN111872501B (en) * | 2020-07-24 | 2021-06-29 | 江西理工大学 | Electrolytic cutting machining device for removing adhesion products on surface of wire electrode on line |
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