CN108198930A - One kind is easily installed fixed deep ultraviolet LED encapsulation structure - Google Patents
One kind is easily installed fixed deep ultraviolet LED encapsulation structure Download PDFInfo
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- CN108198930A CN108198930A CN201711476441.9A CN201711476441A CN108198930A CN 108198930 A CN108198930 A CN 108198930A CN 201711476441 A CN201711476441 A CN 201711476441A CN 108198930 A CN108198930 A CN 108198930A
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- 238000005538 encapsulation Methods 0.000 title claims abstract 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000741 silica gel Substances 0.000 claims abstract description 18
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 18
- 238000009434 installation Methods 0.000 claims abstract description 8
- 239000010453 quartz Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 230000013011 mating Effects 0.000 claims 5
- 238000001816 cooling Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000007787 solid Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 25
- 230000017525 heat dissipation Effects 0.000 abstract description 19
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 239000000084 colloidal system Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000013022 venting Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 238000004332 deodorization Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
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- Led Device Packages (AREA)
Abstract
本发明涉及深紫外LED技术领域，具体涉及一种易于安装固定的深紫外LED封装结构。本发明涉及一种易于安装固定的深紫外LED封装结构，其特征在于：包括固定装置和散热装置，安装座上设有透镜，透镜通过安装圈固定设置在安装座上，安装座内固定设有硅胶，散热装置包括散热片，散热片固定设置在散热块上，散热块上端连接导热杆，导热杆通过螺纹孔与安装座连接，安装座内设有连接盘，连接盘上设有反光圈，连接盘中端设有与导热杆配套的螺纹凹槽，连接盘边缘与硅胶连接，固定装置包括固定块和滑动块。本发明可以实现封装结构的安装固定和拆卸，易于散热可以延长LED的使用寿命。
The invention relates to the technical field of deep ultraviolet LEDs, in particular to an easy-to-install and fix deep ultraviolet LED packaging structure. The invention relates to a deep ultraviolet LED packaging structure that is easy to install and fix, and is characterized in that it includes a fixing device and a heat dissipation device, a lens is arranged on the mounting seat, the lens is fixedly arranged on the mounting seat through a mounting ring, and the mounting seat is fixed with a Silicone, the heat dissipation device includes a heat sink, the heat sink is fixed on the heat dissipation block, the upper end of the heat dissipation block is connected to the heat conduction rod, the heat conduction rod is connected to the mounting seat through a threaded hole, a connecting plate is provided in the mounting seat, and a reflective ring is provided on the connecting plate. The middle end of the connection plate is provided with a threaded groove matching with the heat conduction rod, the edge of the connection plate is connected with silica gel, and the fixing device includes a fixing block and a sliding block. The invention can realize the installation, fixation and disassembly of the encapsulation structure, is easy to dissipate heat and prolongs the service life of the LED.
Description
技术领域technical field
本发明涉及深紫外LED技术领域，具体涉及一种易于安装固定的深紫外LED封装结构。The invention relates to the technical field of deep ultraviolet LEDs, in particular to an easy-to-install and fix deep ultraviolet LED packaging structure.
背景技术Background technique
紫外LED一般指发光中心波长在400nm以下的LED，但有时将发光波长大于380nm时称为近紫外LED，而短于300nm时称为深紫外LED。因短波长光线的杀菌效果高，因此紫外LED常用于冰箱和家电等的杀菌及除臭等用途，随着LED技术的进步，市面上深紫外波段的LED已经逐渐普及。目前，深紫外LED特别是深深紫外LED对封装工艺要求较高，是因为在封装过程中需要一些有机材料进行封装，例如胶体等，硅胶将玻璃盖板与设置有LED芯片的支架连接，LED芯片发射的深紫外光线对胶体进行破坏，不仅导致照明效率下降，而且导致玻璃盖板与支架之间接触松，同时在封装结构内部LED长期工作，内部温度较高，长期如此会导致LED灯源的老化，影响其工作效果，在一些特殊的工作环境下，封装结构不便于直接焊接，需要提供便于安装固定且易于卸下的固定结构。Ultraviolet LEDs generally refer to LEDs with a luminous center wavelength below 400nm, but sometimes they are called near-ultraviolet LEDs when the luminous wavelength is greater than 380nm, and deep-ultraviolet LEDs when they are shorter than 300nm. Due to the high bactericidal effect of short-wavelength light, ultraviolet LEDs are often used for sterilization and deodorization of refrigerators and home appliances. With the advancement of LED technology, LEDs in the deep ultraviolet band have gradually become popular in the market. At present, deep ultraviolet LEDs, especially deep ultraviolet LEDs, have high requirements for packaging technology, because some organic materials are needed for packaging in the packaging process, such as colloid, etc., and silica gel connects the glass cover plate with the bracket equipped with LED chips. The deep ultraviolet light emitted by the chip destroys the colloid, which not only leads to a decrease in lighting efficiency, but also leads to a loose contact between the glass cover and the bracket. At the same time, the LED inside the packaging structure works for a long time, and the internal temperature is high. The aging of the package affects its working effect. In some special working environments, the packaging structure is not convenient for direct welding, and it is necessary to provide a fixing structure that is easy to install and fix and easy to remove.
如中国专利号CN201621146965.2，申请日为2016年10月21日，公告日为2017年04月26日的实用新型专利中公开了一种深紫外LED封装结构，包括设置有支架、LED芯片和透光盖板，所述支架包括反光杯，所述LED芯片固定于所述反光杯内，所述支架还包括包围所述反光杯四周设置的支撑台，且所述支撑台的上表面开设有环绕所述反光杯四周的凹槽，所述透光盖板的下表面设置有与所述凹槽对应的反光层，所述透光盖板通过设置于所述凹槽内部的胶体与所述支架固定连接。在上述深紫外LED封装结构中，还包括围绕所述支撑台的四周边缘设置的外围结构，所述透光盖板的外侧面与所述外围结构的内侧面相抵。在上述深紫外LED封装结构中，还包括用于将所述支架分为正极部分和负极部分的绝缘层，所述绝缘层的下表面涂覆有油层，所述油层的宽度大于所述绝缘层的宽度。在上述深紫外LED封装结构中，所述支架上设置有至少一个透气通孔，所述透气通孔的一端与所述凹槽的侧壁相连通，另一端向外延伸至外。在上述深紫外LED封装结构中，还包括设置压在所述外围结构的顶面上的压片，所述压片延伸至所述透光盖板的至少部分上表面，所述压片与所述外围结构的顶面以及所述压片与所述透光盖板的上表面设有粘结层。在上述深紫外LED封装结构中，所述反光杯的内侧面为反光斜面。在上述深紫外LED封装结构中，所述反光斜面的表面设置有反光层。在上述深紫外LED封装结构中，所述反光层表面为具有粗糙度的表面。在上述深紫外LED封装结构中，所述透光盖板为石英玻璃。在上述深紫外LED封装结构中，所述支架为铝质支架。本实用新型所提供的一种易于安装固定的深紫外LED封装结构，包括设置有支架、LED芯片和透光盖板，所述支架包括反光杯，所述LED芯片固定于所述反光杯内，所述支架还包括包围所述反光杯四周设置的支撑台，且所述支撑台的上表面开设有环绕所述反光杯四周的凹槽，所述透光盖板的下表面设置有与所述凹槽对应的反光层，所述透光盖板通过设置于所述凹槽内部的胶体与所述支架固定连接。在该实用新型中，深紫外光线完全不能照射到胶体，不能对胶体造成破坏，避免透明盖板与支架之间接触松动，提高深紫外LED的寿命以及发光效率，实现了器件高可靠性的封装。For example, Chinese Patent No. CN201621146965.2, the application date is October 21, 2016, and the utility model patent with the announcement date is April 26, 2017 discloses a deep ultraviolet LED packaging structure, including a bracket, an LED chip and The light-transmitting cover plate, the bracket includes a reflective cup, the LED chip is fixed in the reflective cup, the bracket also includes a support platform surrounding the reflective cup, and the upper surface of the support platform is provided with Surrounding the groove around the reflective cup, the lower surface of the light-transmitting cover is provided with a reflective layer corresponding to the groove, and the light-transmitting cover is connected with the colloid arranged inside the groove The bracket is fixedly connected. In the above deep ultraviolet LED packaging structure, it further includes a peripheral structure arranged around the peripheral edge of the supporting platform, and the outer side of the light-transmitting cover plate abuts against the inner side of the peripheral structure. In the above deep ultraviolet LED packaging structure, it also includes an insulating layer for dividing the bracket into a positive part and a negative part, the lower surface of the insulating layer is coated with an oil layer, and the width of the oil layer is larger than that of the insulating layer width. In the above deep ultraviolet LED packaging structure, at least one venting through hole is provided on the bracket, one end of the venting through hole communicates with the side wall of the groove, and the other end extends outward. In the above-mentioned deep ultraviolet LED packaging structure, it also includes a pressing sheet arranged on the top surface of the peripheral structure, the pressing sheet extends to at least part of the upper surface of the light-transmitting cover plate, the pressing sheet and the A bonding layer is provided on the top surface of the peripheral structure and the upper surface of the pressing sheet and the transparent cover plate. In the above deep ultraviolet LED packaging structure, the inner surface of the reflective cup is a reflective slope. In the above deep ultraviolet LED packaging structure, the surface of the reflective slope is provided with a reflective layer. In the above deep ultraviolet LED packaging structure, the surface of the reflective layer is a rough surface. In the above deep ultraviolet LED packaging structure, the light-transmitting cover plate is quartz glass. In the above deep ultraviolet LED packaging structure, the bracket is an aluminum bracket. The utility model provides a deep ultraviolet LED packaging structure that is easy to install and fix, including a bracket, an LED chip and a light-transmitting cover plate, the bracket includes a reflective cup, and the LED chip is fixed in the reflective cup. The bracket also includes a supporting platform surrounding the reflective cup, and the upper surface of the supporting platform is provided with a groove surrounding the surrounding of the reflective cup, and the lower surface of the transparent cover is provided with a The reflective layer corresponds to the groove, and the light-transmitting cover plate is fixedly connected to the bracket through the glue provided inside the groove. In this utility model, the deep ultraviolet light cannot irradiate the colloid at all, and cannot cause damage to the colloid, avoids loose contact between the transparent cover plate and the bracket, improves the lifespan and luminous efficiency of the deep ultraviolet LED, and realizes high-reliability packaging of the device .
发明内容Contents of the invention
解决的技术问题Technical issues resolved
针对现有技术所存在的上述缺点，本发明提供了一种易于安装固定的深紫外LED封装结构，能够有效地克服现有技术所存在的深紫外LED封装结构散热效果不够理想的问题，同时解决了深紫外LED封装结构固定方式单一的问题。Aiming at the above-mentioned shortcomings existing in the prior art, the present invention provides a deep ultraviolet LED package structure that is easy to install and fix, which can effectively overcome the problem that the heat dissipation effect of the deep ultraviolet LED package structure in the prior art is not ideal, and at the same time solve the problem of Solved the problem of single fixing method of deep ultraviolet LED packaging structure.
技术方案Technical solutions
为实现以上目的，本发明通过以下技术方案予以实现：To achieve the above object, the present invention is achieved through the following technical solutions:
一种易于安装固定的深紫外LED封装结构，包括安装座，其特征在于：包括固定装置和散热装置，所述安装座上设有透镜，所述安装座上设有安装圈，所述透镜通过所述安装圈固定设置在所述安装座上，所述安装座内固定设有硅胶，所述散热装置包括散热片，所述散热片固定设置在散热块上，所述散热块上端连接导热杆，所述导热杆上设有螺纹，所述安装座中心部位设有螺纹孔，所述导热杆通过所述螺纹孔与所述安装座连接，所述安装座内设有连接盘，所述连接盘上设有反光圈，所述连接盘中端设有与所述导热杆配套的螺纹凹槽，所述连接盘边缘与所述硅胶连接，所述固定装置包括固定块和滑动块，所述固定块固定设置在所述安装座底部，所述滑动块上设有滑动卡块，所述安装座底部设有与所述滑动卡块配套的滑槽，所述滑动块通过所述滑槽与所述安装座滑动连接，所述固定块上设有螺纹杆，所述螺纹杆穿过所述固定块并与所述滑动块连接，所述滑动块上设有与所述螺纹杆配套的槽孔，所述螺纹杆末端设有卡合片，所述槽孔内设有与所述卡合片配套的圈槽，所述固定块上设有与所述螺纹杆配套的螺纹通孔。A deep ultraviolet LED packaging structure that is easy to install and fix, including a mounting base, characterized in that it includes a fixing device and a heat dissipation device, a lens is provided on the mounting base, a mounting ring is provided on the mounting base, and the lens passes through The installation ring is fixedly arranged on the installation seat, and silica gel is fixed inside the installation seat, and the heat dissipation device includes a heat dissipation fin, and the heat dissipation fin is fixedly arranged on the heat dissipation block, and the upper end of the heat dissipation block is connected to a heat conducting rod , the heat conduction rod is provided with threads, the center of the mounting base is provided with a threaded hole, the heat conduction rod is connected with the mounting base through the threaded hole, the mounting base is provided with a connecting plate, and the connection There is a reflective ring on the plate, the middle end of the connecting plate is provided with a threaded groove matching the heat conducting rod, the edge of the connecting plate is connected with the silica gel, the fixing device includes a fixing block and a sliding block, the The fixed block is fixedly arranged on the bottom of the mounting seat, the sliding block is provided with a sliding block, the bottom of the mounting seat is provided with a chute matched with the sliding block, and the sliding block is connected with the sliding block through the chute. The mounting base is slidingly connected, the fixed block is provided with a threaded rod, the threaded rod passes through the fixed block and is connected with the sliding block, and the sliding block is provided with a groove matching the threaded rod The end of the threaded rod is provided with an engaging piece, the slot hole is provided with a ring groove matching the engaging piece, and the fixing block is provided with a threaded through hole matching the threaded rod.
更进一步地，所述透镜为透明的石英透镜。Furthermore, the lens is a transparent quartz lens.
更进一步地，所述反光圈覆盖在所述硅胶上方。Furthermore, the reflective ring covers the silica gel.
更进一步地，所述固定装置在所述安装座底部设有四处且关于所述安装座底部的中心点中心对称。Furthermore, the fixing device is provided at four places on the bottom of the mounting seat and is symmetrical about the center point of the bottom of the mounting seat.
更进一步地，所述导热柱和所述散热块为导热良好的石英材质。Furthermore, the heat conduction column and the heat dissipation block are made of quartz material with good heat conduction.
更进一步地，所述安装座为玻璃材质封闭支架。Furthermore, the mounting seat is a closed bracket made of glass.
更进一步地，所述导热柱与所述连接盘的连接处设有密封垫圈。Furthermore, a sealing gasket is provided at the connection between the heat conduction column and the connecting pad.
有益效果Beneficial effect
采用本发明提供的技术方案，与已知的公有技术相比，具有如下有益效果：Compared with the known public technology, the technical solution provided by the invention has the following beneficial effects:
1、本发明通过增加固定装置的设计，达到了封装结构便于固定和拆卸的效果。1. The present invention achieves the effect that the packaging structure is easy to fix and disassemble by adding the design of the fixing device.
2、本发明通过增加散热装置的设计，达到了深紫外LED封装结构散热效果更加的效果。2. The present invention achieves a better heat dissipation effect of the deep ultraviolet LED packaging structure by increasing the design of the heat dissipation device.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings that are required in the description of the embodiments or the prior art. Apparently, the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other drawings according to these drawings without creative efforts.
图1为本发明的主体结构剖面图图；Fig. 1 is a sectional view figure of the main body structure of the present invention;
图2为本发明的散热和固定装置结构示意图；Fig. 2 is the structural representation of heat dissipation and fixing device of the present invention;
图3为本发明的固定装置示意图；Fig. 3 is a schematic diagram of the fixing device of the present invention;
图4为本发明的滑动块结构示意图；Fig. 4 is the structural representation of sliding block of the present invention;
图5为本发明的反光圈结构示意图。Fig. 5 is a structural schematic diagram of the reflective ring of the present invention.
图中的标号分别代表：1-安装座；2-透镜；3-反光圈；4-硅胶；5-导热杆；6-散热片；7-固定块；8-螺纹杆；9-滑动块；901-槽孔；10-卡合片；11-滑动卡块；12-安装圈；13-连接盘。The labels in the figure respectively represent: 1-mounting seat; 2-lens; 3-reflecting ring; 4-silica gel; 901-slotted hole; 10-engaging piece; 11-sliding block; 12-installation ring; 13-connecting plate.
具体实施方式Detailed ways
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
下面结合实施例对本发明作进一步的描述。The present invention will be further described below in conjunction with embodiment.
实施例Example
如图1至图5所示，本实施例的一种易于安装固定的深紫外LED封装结构，包括安装座1，其特征在于：包括固定装置和散热装置，安装座1上设有透镜2，安装座1上设有安装圈12，透镜2通过安装圈12固定设置在安装座2上，安装座1内固定设有硅胶4，散热装置包括散热片6，散热片6固定设置在散热块上，散热块上端连接导热杆5，导热杆5上设有螺纹，安装座1中心部位设有螺纹孔，导热杆5通过螺纹孔与安装座1连接，安装座1内设有连接盘13，连接盘13上设有反光圈3，连接盘13中端设有与导热杆5配套的螺纹凹槽，连接盘13边缘与硅胶4连接，固定装置包括固定块7和滑动块9，固定块7固定设置在安装座1底部，滑动块9上设有滑动卡块11，安装座1底部设有与滑动卡块11配套的滑槽，滑动块9通过滑槽与安装座1滑动连接，固定块7上设有螺纹杆8，螺纹杆8穿过固定块7并与滑动块9连接，滑动块9上设有与螺纹杆8配套的槽孔901，螺纹杆8末端设有卡合片10，槽孔901内设有与卡合片10配套的圈槽，固定块7上设有与螺纹杆8配套的螺纹通孔；透镜2为透明的石英透镜；反光圈3覆盖在硅胶4上方；固定装置在安装座1底部设有四处且关于安装座1底部的中心点中心对称；导热柱5和散热块为导热良好的石英材质；安装座1为玻璃材质封闭支架；导热柱5与连接盘13的连接处设有密封垫圈。As shown in Figures 1 to 5, an easy-to-install and fix deep-ultraviolet LED packaging structure of this embodiment includes a mounting base 1, which is characterized in that it includes a fixing device and a heat dissipation device, and the mounting base 1 is provided with a lens 2, The mounting base 1 is provided with a mounting ring 12, the lens 2 is fixedly arranged on the mounting base 2 through the mounting ring 12, the mounting base 1 is fixed with a silica gel 4, and the heat dissipation device includes a heat sink 6, and the heat sink 6 is fixedly mounted on the heat sink , the upper end of the heat dissipation block is connected to the heat conduction rod 5, the heat conduction rod 5 is provided with threads, the center of the mounting base 1 is provided with a threaded hole, the heat conduction rod 5 is connected to the mounting base 1 through the threaded holes, and the mounting base 1 is provided with a connecting plate 13, connected The disk 13 is provided with a reflective ring 3, the middle end of the connecting disk 13 is provided with a threaded groove matching the heat conducting rod 5, the edge of the connecting disk 13 is connected with the silica gel 4, and the fixing device includes a fixed block 7 and a sliding block 9, and the fixed block 7 is fixed Set on the bottom of the mounting base 1, the sliding block 9 is provided with a sliding block 11, the bottom of the mounting base 1 is provided with a chute matching with the sliding block 11, the sliding block 9 is slidably connected with the mounting base 1 through the chute, and the fixed block 7 A threaded rod 8 is provided on the top, and the threaded rod 8 passes through the fixed block 7 and is connected with the sliding block 9. The sliding block 9 is provided with a slotted hole 901 matching with the threaded rod 8, and the end of the threaded rod 8 is provided with an engaging piece 10, and the slot The hole 901 is provided with a ring groove matching with the engaging piece 10, and the fixed block 7 is provided with a threaded through hole matching with the threaded rod 8; the lens 2 is a transparent quartz lens; the reflective ring 3 is covered on the top of the silica gel 4; the fixing device There are four places at the bottom of the mounting base 1 and they are symmetrical about the center point of the bottom of the mounting base 1; the thermal conduction column 5 and the heat dissipation block are made of quartz material with good heat conduction; the mounting base 1 is a closed bracket made of glass material; The connection is provided with a sealing gasket.
使用时如图1和图2所示，LED封装在安装座1内，安装座1上的安装圈12上固定连接透镜2，石英材质的透镜2是透明材质，LED发光可以透过透镜2，硅胶4固定填充在安装座1内，硅胶4具有很强的吸附性且化学性质稳定，可以将内部多余的水分吸收掉，延长LED的使用寿命，将导热杆5放入安装座1上的通孔内，连接盘13与导热杆13连接，连接盘13也随之固定，反光圈3与连接盘13固定连接，当LED工作时，反光圈3可以将照射到硅胶4上的部分光线反射出去，减少了高温环境对硅胶4的影响，避免硅胶4的变形导致的LED工作效率变低，LED工作时，部分热量通过导热杆5传递到散热块，再通过散热片6散发到外界环境中，避免了持续的高温环境对LED的影响，使其使用寿命得到延长，如图3和图4所示，连接杆8穿过固定块7与滑动块9连接且固定块7上设有螺纹槽，螺纹杆8末端的卡合片10设置在槽孔901内，转动螺纹杆8时，固定块7不动，螺纹杆8会带动滑动块9移动，利用滑动块9和固定块7放置在需要固定位置，可以实现夹紧固定的效果，本发明在现有LED封装结构上做出改进，可以避免LED在过高温度下长期工作，避免了硅胶4的高温下变形，固定装置的设计便于封装结构实现固定。When in use, as shown in Figure 1 and Figure 2, the LED is packaged in the mounting base 1, and the mounting ring 12 on the mounting base 1 is fixedly connected to the lens 2. The lens 2 made of quartz is a transparent material, and the LED light can pass through the lens 2. The silica gel 4 is fixedly filled in the installation seat 1. The silica gel 4 has strong adsorption and stable chemical properties, which can absorb excess water inside and prolong the service life of the LED. In the hole, the connection plate 13 is connected with the heat conducting rod 13, and the connection plate 13 is also fixed accordingly, and the reflective ring 3 is fixedly connected with the connection plate 13. When the LED is working, the reflective ring 3 can reflect part of the light irradiated on the silica gel 4. , reducing the impact of the high temperature environment on the silica gel 4, avoiding the low working efficiency of the LED caused by the deformation of the silica gel 4, when the LED is working, part of the heat is transferred to the heat sink through the heat conducting rod 5, and then dissipated to the external environment through the heat sink 6, The impact of the continuous high temperature environment on the LED is avoided, and its service life is prolonged. As shown in Figure 3 and Figure 4, the connecting rod 8 passes through the fixed block 7 to connect with the sliding block 9 and the fixed block 7 is provided with a threaded groove. The engaging piece 10 at the end of the threaded rod 8 is arranged in the slotted hole 901. When the threaded rod 8 is rotated, the fixed block 7 does not move, and the threaded rod 8 will drive the sliding block 9 to move. Position, can achieve the effect of clamping and fixing, the present invention makes improvements on the existing LED packaging structure, can avoid long-term work of LED under high temperature, avoid the deformation of silica gel 4 at high temperature, and the design of the fixing device is convenient for packaging structure Achieve fixation.
以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不会使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be described in the foregoing embodiments The recorded technical solutions are modified, or some of the technical features are replaced equivalently; and these modifications or replacements will not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (7)
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