CN108172699A - A kind of organic light emitting display panel and preparation method thereof - Google Patents
A kind of organic light emitting display panel and preparation method thereof Download PDFInfo
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- CN108172699A CN108172699A CN201810048688.9A CN201810048688A CN108172699A CN 108172699 A CN108172699 A CN 108172699A CN 201810048688 A CN201810048688 A CN 201810048688A CN 108172699 A CN108172699 A CN 108172699A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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Abstract
The embodiment of the invention discloses a kind of organic light emitting display panel and preparation method thereof, the preparation method of organic light emitting display panel includes：One underlay substrate is provided；Multiple independently arranged first sub-electrodes are prepared in underlay substrate side, interstitial site is formed between two neighboring first sub-electrode, interstitial site is filled with insulating layer, interstitial site includes the first interstitial site and the second interstitial site, includes at least one first interstitial site between two neighboring second interstitial site；Pixel defining layer is prepared at the second interstitial site, organic luminous display area domain is formed between two neighboring pixel defining layer；Same type organic luminous layer is prepared in organic light emitting display region；The side of layer and pixel defining layer far from the underlay substrate, which is shown, in organic light emission prepares second electrode.To sum up, in the case that organic luminous layer preparation process is constant in existing organic light emitting display panel is ensured, the pixel resolution of organic light emitting display panel is promoted.
Description
Technical field
The present embodiments relate to semiconductor display technology field more particularly to a kind of organic light emitting display panels and its system
Preparation Method.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display device have self-luminous,
Driving voltage is low, luminous efficiency is high, the response time is short, clarity and contrast are high, nearly 180 ° of visual angles, use temperature ranges are wide,
Flexible Displays and large area total colouring lamp plurality of advantages can be achieved, the display device for most having development potentiality is known as by industry.
At this stage, the OLED display device scale of mass production prepared based on vacuum technology, still, the investment in machinery and equipment
With maintenance cost is high, waste of material is serious, it is difficult to realize more large area, and cost remains high.It is prepared by inkjet printing technology
OLED display screen then has low cost, the technology of large area and product advantage, can also realize the precise positioning of printing, has figure
Case makes ability, saves material, and compatible with almost all kinds of substrate, is to realize low cost, full color typographical display device
Essential technology.
Inkjet printing making technology is the solution by tens of part per trillion liters (picoliters) (usually in a picoliters to tens picoliters
Between), it is sprayed in specific OLED display pixels with frequency more than hundreds of times every second, then removes solvent to form drying
The film forming process technique of film.There are preferable contraposition and mobile accuracy this requires equipment has, ensure each drop inkjet printing
Ink can be put into the pixel hole specified, while also need to the ink for ensureing to print every time in specified picoliters volume range
Interior, these all propose equipment accurate requirement.At this stage it is generally believed that InkJet printing processes are suitable only for preparing large scale electricity
Depending on because large size TV is (general picture element density ＜ 100PPI) of less demanding to display resolution, however, due to people couple
The promotion of image quality requirement, future television resolution ratio develop (picture element density ＞ 150PPI) towards 8K technologies, this will require inkjet printing
Equipment has higher contraposition and mobile accuracy, and the more accurate marking ink fixing fabric structure of smaller, increase certainly will be printed as by this
This.
Invention content
In view of this, the embodiment of the present invention provides a kind of organic light emitting display panel and preparation method thereof, existing to solve
The technical issues of pixel resolution can not be taken into account with inkjet printing precision in organic light emitting display panel in technology.
In a first aspect, an embodiment of the present invention provides a kind of preparation method of organic light emitting display panel, including：
One underlay substrate is provided；
Multiple independently arranged first sub-electrodes, two neighboring first sub-electrode are prepared in the underlay substrate side
Between form interstitial site, the interstitial site is filled with insulating layer；The interstitial site includes the first interstitial site and second
Interstitial site includes at least one first interstitial site between two neighboring second interstitial site；
Pixel defining layer is prepared at second interstitial site, is formed between the two neighboring pixel defining layer organic
Luminescence display region；
Same type organic luminous layer is prepared in the organic light emitting display region；
The side of layer and the pixel defining layer far from the underlay substrate, which is shown, in the organic light emission prepares second electrode.
Optionally, multiple independently arranged first sub-electrodes are prepared in the underlay substrate side, two neighboring described
Interstitial site is formed between one sub-electrode, the interstitial site is filled with insulating layer, including：
First electrode is prepared in the underlay substrate side；
Patterned process is carried out to the first electrode, obtains multiple independently arranged first sub-electrodes, two neighboring institute
It states and forms interstitial site between the first sub-electrode；
Insulating layer is filled in the interstitial site.
Optionally, patterned process is carried out to the first electrode, obtains multiple independently arranged first sub-electrodes, it is adjacent
Interstitial site is formed between two first sub-electrodes, including：
Photoresist layer is prepared in side of the first electrode far from the underlay substrate；
Patterned process is carried out to the photoresist layer, photoresist is obtained and retains region and photoresist lift off region, it is described
Photoresist lift off region exposes the first electrode；
The corresponding first electrode of the photoresist exposed region is performed etching, and removes the photoresist reserved area
The photoresist layer that domain is left, obtains multiple independently arranged first sub-electrodes, between two neighboring first sub-electrode
Form interstitial site.
Optionally, insulating layer is filled in the interstitial site, including：
Insulating layer is prepared at side of first sub-electrode far from the underlay substrate and the interstitial site；
The insulating layer of first sub-electrode far from the underlay substrate side is removed, the insulating layer is filled in institute
It states at interstitial site.
Optionally, insulation is prepared at side of first sub-electrode far from the underlay substrate and the interstitial site
Layer, including：
Use the vapor deposition of plasma enhanced chemical, at least one of sputtering and atomic layer deposition, described
First sub-electrode prepares insulating layer at side and the interstitial site far from the underlay substrate.
Optionally, the insulating layer of first sub-electrode far from the underlay substrate side is removed, including：
Using CMP process to the insulating layer of first sub-electrode far from the underlay substrate side
Carry out reduction processing；
The insulating layer remaining after reduction processing is rinsed using chemical rinses method, removes described completely
The insulating layer of one sub-electrode far from the underlay substrate side.
Optionally, the insulating layer includes SiO2、SiNX, A12O3, at least one of MgO, ZnO, NiO, AlN.
Optionally, using CMP process to first sub-electrode far from described in the underlay substrate side
When insulating layer carries out reduction processing, polishing fluid includes SiO2, Ce2O, ZrO2Wait abrasive grains and KOH and NH2OH additives.
Optionally, same type organic luminous layer is prepared in the organic light emitting display region, including：
By the way of inkjet printing, same type organic luminous layer is prepared in the organic light emitting display region.
Second aspect, the embodiment of the present invention additionally provides a kind of organic light emitting display panel, using described in first aspect
The preparation method of organic light emitting display faceplate panels is prepared, including：
Underlay substrate；
Multiple independently arranged first sub-electrodes positioned at the underlay substrate side, two neighboring first sub-electrode
Between form interstitial site, the interstitial site is filled with insulating layer；The interstitial site includes the first interstitial site and second
Interstitial site includes at least one first interstitial site between two neighboring second interstitial site；
Pixel defining layer at second interstitial site is formed between the two neighboring pixel defining layer organic
Luminescence display region；
Same type of organic luminous layer positioned at the organic light emitting display region；
The second electrode of the side of layer and the pixel defining layer far from the underlay substrate is shown positioned at the organic light emission.
Organic light emitting display panel provided in an embodiment of the present invention and preparation method thereof, by being prepared in underlay substrate side
Multiple independently arranged first sub-electrodes, form interstitial site between two neighboring first sub-electrode, and interstitial site includes first
Interstitial site and the second interstitial site include at least one first interstitial site between two neighboring second interstitial site, the
Pixel defining layer is prepared at two interstitial sites, forms organic luminous display area domain between two neighboring pixel defining layer, and
Organic light emitting display region prepares same type organic luminous layer, each same type of organic luminous layer corresponds at least two
First sub-electrode, that is, at least two organic luminescence display units can be formed by preparing an organic luminous layer, ensure have existing
In the case that machine luminescent layer preparation process is constant, the pixel resolution of organic light emitting display panel is promoted.
Description of the drawings
In order to clearly illustrate the technical solution of exemplary embodiment of the present, below to required in description embodiment
The attached drawing to be used does a simple introduction.Obviously, the attached drawing introduced is the part of the embodiment of the invention to be described
The attached drawing of attached drawing rather than whole, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of flow diagram of the preparation method of organic light emitting display panel provided in an embodiment of the present invention；
Fig. 2 is a kind of structure diagram of underlay substrate provided in an embodiment of the present invention；
Fig. 3 is that one kind provided in an embodiment of the present invention prepares multiple independently arranged first sub-electrodes in underlay substrate side
Structure diagram；
Fig. 4 is the structure diagram provided in an embodiment of the present invention in interstitial site filling insulating layer；
Fig. 5 is the structure diagram provided in an embodiment of the present invention that pixel defining layer is prepared in the second interstitial site；
Fig. 6 is the structure diagram provided in an embodiment of the present invention for preparing organic luminous layer；
Fig. 7 is the structure diagram provided in an embodiment of the present invention for preparing second electrode；
Fig. 8-Figure 11 is provided in an embodiment of the present invention multiple independently arranged first sub-electrodes to be prepared on underlay substrate
The structure diagram of each flow；
Figure 12-Figure 14 is the structural representation provided in an embodiment of the present invention in the interstitial site filling each flow of insulating layer
Figure；
Figure 15 is organic luminescence display unit arrangement knot in a kind of organic light emitting display panel provided in an embodiment of the present invention
Structure schematic diagram；
Figure 16 is that organic luminescence display unit arranges in another organic light emitting display panel provided in an embodiment of the present invention
Structure diagram；
Figure 17 is that organic luminescence display unit arranges in another organic light emitting display panel provided in an embodiment of the present invention
Structure diagram.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below with reference to attached in the embodiment of the present invention
Figure, by specific embodiment, is fully described by technical scheme of the present invention.Obviously, described embodiment is of the invention
Part of the embodiment, instead of all the embodiments, based on the embodiment of the present invention, those of ordinary skill in the art are not doing
The every other embodiment obtained under the premise of going out creative work, each falls within protection scope of the present invention.
The embodiment of the present invention provides a kind of preparation method of organic light emitting display panel, including providing a underlay substrate；
Underlay substrate side prepares multiple independently arranged first sub-electrodes, and interstitial site is formed between two neighboring first sub-electrode,
Interstitial site is filled with insulating layer；Interstitial site includes the first interstitial site and the second interstitial site, two neighboring second gap
Include at least one first interstitial site between position；Pixel defining layer, two neighboring pixel are prepared at the second interstitial site
Organic luminous display area domain is formed between definition layer；Same type organic luminous layer is prepared in organic light emitting display region；Having
The machine side far from underlay substrate of aobvious layer and pixel defining layer that shines prepares second electrode.Using above-mentioned technical proposal, adjacent two
Include at least one first interstitial site between a second interstitial site, pixel defining layer, phase are prepared at the second interstitial site
Organic luminous display area domain is formed between adjacent two pixel defining layers, and prepare same type in organic light emitting display region to have
Machine luminescent layer, each same type of organic luminous layer correspond at least two first sub-electrodes, that is, prepare an organic light emission
Layer can form at least two organic luminescence display units, ensure in the case where existing organic luminous layer preparation process is constant,
Promote the pixel resolution of organic light emitting display panel.
It is the core concept of the present invention above, below in conjunction with the attached drawing in the embodiment of the present invention, to the embodiment of the present invention
In technical solution be clearly and completely described.Based on the embodiments of the present invention, those of ordinary skill in the art are not having
Under the premise of making creative work, all other embodiments obtained shall fall within the protection scope of the present invention.
Fig. 1 is a kind of flow diagram of the preparation method of organic light emitting display panel provided in an embodiment of the present invention, such as
Shown in Fig. 1, the preparation method of organic light emitting display panel provided in an embodiment of the present invention can include：
S110, a underlay substrate is provided.
Illustratively, Fig. 2 is a kind of structure diagram of underlay substrate provided in an embodiment of the present invention, as shown in Fig. 2, lining
Substrate 10 can be flexible substrate substrate, and material can include polyimides, polyethylene terephthalate, poly- naphthalene two
At least one of formic acid glycol ester, makrolon, polyarylate and polyether sulfone；Underlay substrate 10 can also be rigid substrate
Substrate is specifically as follows glass substrate or other rigid substrates.The embodiment of the present invention is to the type and material of underlay substrate 10
Material is without limiting.
S120, multiple independently arranged first sub-electrodes are prepared in the underlay substrate side, two neighboring described first
Interstitial site is formed between sub-electrode, the interstitial site is filled with insulating layer；The interstitial site includes the first interstitial site
With the second interstitial site, at least one first interstitial site is included between two neighboring second interstitial site.
Illustratively, Fig. 3 is provided in an embodiment of the present invention multiple independently arranged first to be prepared in underlay substrate side
The structure diagram of sub-electrode, as shown in figure 3, multiple independently arranged first sub-electrodes 201 are prepared in 10 side of underlay substrate,
First sub-electrode 201 can be the anode electrode of organic light emitting display panel.Optionally, the first sub-electrode 201 can be metal
Opaque electrode, such as its material can be Ag, Al, Au, Ni, TiN, Cr or their combination electrode, such as Ag/ITO,
Al/TiN；Optionally, the first sub-electrode 201 can also be transparent electrode, such as its material can be ITO, nano-silver thread, graphite
At least one of alkene.Optionally, interstitial site 30 is formed with, and interstitial site is filled out between two neighboring first sub-electrode 201
Filled with insulating layer 40, ensure two neighboring first sub-electrode, 201 insulation set.
Optionally, the interstitial site 30 in the embodiment of the present invention can include the first interstitial site 301 and the second gap digit
302 are put, and at least one first interstitial site 301 is formed between two neighboring second interstitial site 302, as shown in Figure 3.By
Interstitial site 30 is formed between two neighboring first sub-electrode 201, interstitial site includes the first interstitial site 301 and second
Interstitial site 302, and at least one first interstitial site 301 is formed between two neighboring second interstitial site 302, therefore,
At least two first sub-electrodes 201 are formed between two neighboring second interstitial site 302.Fig. 3 is only between two neighboring second
Formed between gap position 302 there are one the first interstitial site 301, formed between two neighboring second interstitial site 302 there are two
It is illustrated for first sub-electrode 201.
Optionally, Fig. 4 be it is provided in an embodiment of the present invention interstitial site filling insulating layer structure diagram, such as Fig. 4
Shown, insulating layer 40 is filled between gap 30, for ensureing two neighboring first sub-electrode, 201 insulation set.Insulating layer 40
It can include SiO2、SiNX, A12O3, at least one of inorganic material such as MgO, ZnO, NiO, AlN, or resinous wood
At least one of organic materials such as material, organic silica gel material or Other substrate materials, the embodiment of the present invention is to the material of insulating layer
Material is without limiting.
S130, pixel defining layer is prepared at second interstitial site, shape between the two neighboring pixel defining layer
Into organic light emitting display region.
Illustratively, Fig. 5 is that the structure provided in an embodiment of the present invention that pixel defining layer is prepared in the second interstitial site is shown
It is intended to, as shown in figure 5, pixel defining layer 50 is prepared at the second interstitial site 302, shape between two neighboring pixel defining layer 50
Into organic light emitting display region, the color mixing between pixel can be prevented or reduce by pixel defining layer 50.Optionally, pixel
The material of definition layer 50 can include the organic insulations such as polyimides, polyamide, acrylic resin and cyclobutane and phenolic resin
At least one of material；Pixel defining layer 50 can also include SiO2、SiNx、Al2O3、CuOx、Tb4O7、Y2O3、Nb2O5With
Pr2O3Wait at least one of inorganic insulating materials；Moreover, pixel defining layer 50 can also have organic insulation and inorganic
The multilayered structure that insulating materials is alternatively formed.
S140, same type organic luminous layer is prepared in the organic light emitting display region.
Illustratively, Fig. 6 is the structure diagram provided in an embodiment of the present invention for preparing organic luminous layer, organic luminous layer
60 are located at the organic light emitting display region that two neighboring pixel defining layer 50 limits.It is same type of organic in the embodiment of the present invention
Luminescent layer refers to the identical organic luminous layer of luminescent color, such as red organic luminous layer, green organic luminous layer, blue
Organic luminous layer etc..Optional organic luminous layer 60 can include the hole injection layer, hole transmission layer, transmitting that sequentially stack
Layer, electron transfer layer and electron injecting layer.Optionally, organic luminous layer 60 can utilize low molecule or macromolecule organic material shape
Into.
Optionally, same type of organic luminous layer is prepared in organic light emitting display region, can use inkjet printing
Mode, prepare same type of organic luminous layer in organic light emitting display region.Organic hair is prepared using inkjet printing mode
Photosphere can realize the precise positioning of printing, and pattern preparative capacibility is strong, and save material, at low cost.Optionally, have organic
Machine luminescence display region prepares same type of organic luminous layer, and sea can be the embodiment of the present invention pair by the way of vapor deposition
The specific method of organic luminous layer is prepared without limiting.
S150, the side preparation second of layer and the pixel defining layer far from the underlay substrate is shown in the organic light emission
Electrode.
Illustratively, Fig. 7 is the structure diagram provided in an embodiment of the present invention for preparing second electrode, as shown in fig. 7,
The side of organic luminous layer 60 and pixel defining layer 50 far from underlay substrate 10 prepares second electrode 70, and second electrode 70 can be
The electrode of whole face setting, is used cooperatively with multiple the first sub-electrodes 201 being separately provided, and realizes that organic light emitting display panel is normal
Display shines.
Optionally, the material of second electrode 70 can be Ag, Mg, Al, Au, Ni or combination electrode Mg:In Ag at least
It is a kind of.
To sum up, the preparation method of organic light emitting display panel provided in an embodiment of the present invention, by underlay substrate side
Multiple independently arranged first sub-electrodes are prepared, form interstitial site between two neighboring first sub-electrode, interstitial site includes
First interstitial site and the second interstitial site include at least one first interstitial site between two neighboring second interstitial site,
Pixel defining layer is prepared at the second interstitial site, organic luminous display area domain is formed between two neighboring pixel defining layer, and
And same type organic luminous layer is prepared in organic light emitting display region, each same type of organic luminous layer corresponds at least
Two the first sub-electrodes, that is, at least two organic luminescence display units can be formed by preparing an organic luminous layer, be ensured existing
Have organic luminous layer preparation process it is constant in the case of, promote the pixel resolution of organic light emitting display panel.
Optionally, multiple independently arranged first sub-electrodes, two neighboring first sub-electrode are prepared in underlay substrate side
Between form interstitial site, interstitial site is filled with insulating layer, can include：
The first electrode of flood setting is prepared in underlay substrate side；
Patterned process is carried out to first electrode, obtains multiple independently arranged first sub-electrodes, two neighboring first son
Interstitial site is formed between electrode；
Insulating layer is filled in interstitial site.
Optionally, patterned process is carried out to first electrode, obtains multiple independently arranged first sub-electrodes, it is two neighboring
Interstitial site is formed between first sub-electrode, can be included：
Photoresist layer is prepared in side of the first electrode far from the underlay substrate；
Patterned process is carried out to photoresist layer, photoresist is obtained and retains region and photoresist lift off region, photoresist stripping
First electrode is exposed from region；
The corresponding first electrode of photoresist exposed region is performed etching, and removes photoresist and retains the photoetching that region is left
Glue-line obtains multiple independently arranged first sub-electrodes, interstitial site is formed between two neighboring first sub-electrode.
Specifically, Fig. 8-Figure 11 is provided in an embodiment of the present invention multiple independently arranged first to be prepared on underlay substrate
The structure diagram of each flow of sub-electrode with reference to figure 8- Figure 11, prepares multiple independently arranged first sons on underlay substrate
Electrode specifically includes：
As shown in figure 8, prepare the first electrode 20 of flood setting in 10 side of underlay substrate.Optionally, steaming may be used
The method of plating prepares the first electrode 20 of flood setting in 10 side of underlay substrate.First electrode 20 can be the opaque electricity of metal
Pole, such as its material can be Ag, Al, Au, Ni, TiN, Cr；Or their combination electrode, such as Ag/ITO, Al/TiN；It can
Choosing, the first sub-electrode 201 can also be transparent electrode, such as its material can be ITO, nano-silver thread, in graphene extremely
Few one kind.
As shown in figure 9, prepare photoresist layer 80 in side of the first electrode 20 far from underlay substrate 10.
As shown in Figure 10, patterned process is carried out to photoresist layer 80, obtains photoresist and retain region 801 and photoresist stripping
From region 802, wherein, photoresist lift off region exposes first electrode 20.
As shown in figure 11,802 corresponding first electrode 20 of photoresist exposed region is performed etching, and removes photoresist guarantor
801 corresponding photoresist layer 80 of region is stayed, obtains multiple independently arranged first sub-electrodes 201, two neighboring first sub-electrode
Interstitial site 30 is formed between 201.Optionally, interstitial site 30 includes the first interstitial site 301 and the second interstitial site 302.
It should be noted that Figure 11 is identical with attached drawing shown in Fig. 3, it will be understood by those skilled in the art that Fig. 3 is represented in underlay substrate 10
Side prepares the structure diagram of the final state of multiple independently arranged first sub-electrodes 201, and Fig. 8-Figure 11 is represented in substrate
10 side of substrate prepares the structure diagram of multiple 201 each flows of independently arranged first sub-electrode, and Figure 11 corresponds to last
A flow is identical in final state attached drawing with shown in Fig. 3.
Optionally, insulating layer is filled in interstitial site, can included：
Insulating layer is prepared at side of first sub-electrode far from underlay substrate and the interstitial site；
Insulating layer of first sub-electrode far from the underlay substrate side is removed, insulating layer is filled at interstitial site.
Further, insulating layer of first sub-electrode far from underlay substrate side is removed, can be included：
Reduction processing is carried out to insulating layer of first sub-electrode far from underlay substrate side using CMP process；
Insulating layer remaining after reduction processing is rinsed using chemical rinses method, removes the first sub-electrode completely
Insulating layer far from underlay substrate side.
Specifically, Figure 12-Figure 14 is the knot provided in an embodiment of the present invention in the interstitial site filling each flow of insulating layer
Structure schematic diagram with reference to figure 12- Figure 14, is specifically included in interstitial site filling insulating layer：
As shown in figure 12, insulation is prepared at side of first sub-electrode 201 far from underlay substrate 10 and interstitial site 30
Layer 40.Optionally, the vapour deposition process of plasma enhanced chemical can be used, in the first sub-electrode 201 far from underlay substrate
Insulating layer 40 is prepared at 10 side and interstitial site 30.The material of insulating layer 40 can include SiO2、SiNX, A12O3、MgO、
At least one of ZnO, NiO, AlN.
As shown in figure 13, using CMP process to the first sub-electrode 201 far from the exhausted of 10 side of underlay substrate
Edge layer 40 carries out reduction processing.Optionally, using CMP process to the first sub-electrode 201 far from underlay substrate 10 1
When the insulating layer 40 of side carries out reduction processing, polishing fluid can include SiO2, Ce2O, ZrO2Wait abrasive grains and KOH and NH2OH adds
Add object.
As shown in figure 14, insulating layer 40 remaining after reduction processing is rinsed using chemical rinses method, completely
Remove insulating layer 40 of first sub-electrode 201 far from 10 side of underlay substrate.It is understood that no matter which kind of thinned work used
When skill carries out reduction processing to insulating layer 40 of first sub-electrode 201 far from 10 side of underlay substrate, due to needing to consider not hinder
The first sub-electrode 201 of evil, therefore, all can there are SI semi-insulations in a side surface of first sub-electrode 201 far from underlay substrate 10
Layer 40 is remaining.Therefore, in the embodiment of the present invention, chemical rinses method is continuing with to insulating layer 40 remaining after reduction processing
It is rinsed, the insulating layer 40 of the first side of the sub-electrode 201 far from underlay substrate 10 can be removed with it completely, completely revealed
First sub-electrode 201.Optionally, when insulating layer 40 is SiO2During material, HF can be used to carry out chemical rinses to insulating layer 40,
Removal insulating layer 40 of first sub-electrode 201 far from 10 side of underlay substrate completely.When insulating layer 40 is other insulating materials,
Can different rinsing liquids be used according to the characteristic of different insulative material, here to the type of rinsing liquid without limiting, also,
In addition to chemical rinses method, other can remove insulating layer 40 of first sub-electrode 201 far from 10 side of underlay substrate completely
The method of insulating layer 40 is also in the protection domain of the embodiment of the present invention.Also need explanation, attached drawing shown in Figure 14 and Fig. 4
It is identical, it will be understood by those skilled in the art that Fig. 4 represents the structure in the final state that insulating layer 40 is filled in interstitial site 30
Schematic diagram, Figure 12-Figure 14 represent the structure diagram in the filling 40 each flow of insulating layer of interstitial site 30, and Figure 14 corresponds to last
One flow is identical in final state attached drawing with shown in Fig. 4.
Optionally, with continued reference to Fig. 7, the embodiment of the present invention additionally provides a kind of organic light emitting display panel, described organic
Light emitting display panel is prepared using the preparation method of organic light emitting display panel provided in an embodiment of the present invention, specifically can be with
Including：
Underlay substrate 10；
Multiple independently arranged first sub-electrodes 201 positioned at 10 side of underlay substrate, two neighboring first sub-electrode 201
Between formed interstitial site 30, interstitial site 30 be filled with insulating layer 40；Interstitial site includes the first interstitial site 301 and second
Interstitial site 302 includes at least one first interstitial site 301 between two neighboring second interstitial site 302；
Pixel defining layer 50 at the second interstitial site 302 is formed between two neighboring pixel defining layer 50 organic
Luminescence display region；
Same type of organic luminous layer 60 positioned at organic light emitting display region；
The second electrode 70 of the side of layer 60 and pixel defining layer 50 far from underlay substrate 10 is shown positioned at organic light emission.
Organic light emitting display panel provided in an embodiment of the present invention includes at least one between two neighboring second interstitial site
A first interstitial site is provided with pixel defining layer at the second interstitial site, is formed between two neighboring pixel defining layer
Machine luminescence display region, and same type organic luminous layer is prepared in organic light emitting display region, each is same type of
Organic luminous layer corresponds at least two first sub-electrodes, i.e. an organic luminous layer can correspond at least two organic light emitting displays
Unit ensures that the pixel in the case where existing organic luminous layer preparation process is constant, promoting organic light emitting display panel is differentiated
Rate.
Optionally, Figure 15 is organic luminescence display unit in a kind of organic light emitting display panel provided in an embodiment of the present invention
Arrangement architecture schematic diagram, as shown in figure 15, in organic light emitting display panel provided in an embodiment of the present invention, organic luminous layer 60 can
To include, wherein, each red organic luminous layer 601, green organic luminous layer 602 and blue organic luminous layer 603 are at least
Corresponding two the first sub-electrodes 201, Figure 15 is only with each red organic luminous layer 601, green organic luminous layer 602 and blue
Organic luminous layer 603 illustrates for corresponding to two the first sub-electrodes 201.As shown in figure 15, each same type of has
Machine luminescent layer 60 corresponds at least two first sub-electrodes 201, that is, preparing an organic luminous layer 60 and can forming at least two has
Machine luminescence display unit ensures in the case where existing organic luminous layer preparation process is constant, promotes organic light emitting display panel
Pixel resolution.
Optionally, Figure 16 is organic light emitting display list in another organic light emitting display panel provided in an embodiment of the present invention
Identical permutation structure diagram, the arrangement of organic luminescence display unit shown in Figure 16 are arranged with organic luminescence display unit shown in figure 15
Difference, two neighboring 60 irregular alignment of organic luminous layer in Figure 16, not only ensureing to prepare an organic luminous layer 60 can be with shape
Into at least two organic luminescence display units, ensure in the case where existing organic luminous layer preparation process is constant, promoted organic
The pixel resolution of light emitting display panel；Simultaneously using pixel rendering method, the picture of organic light emitting display panel is further promoted
Plain resolution ratio.
Optionally, Figure 17 is provided in an embodiment of the present invention by organic light emitting display list in a kind of organic light emitting display panel
Identical permutation structure diagram, the arrangement of organic luminescence display unit shown in Figure 17 and the organic light emitting display shown in Figure 15 and Figure 16
Unit arrangement is different, the red organic luminous layer 601 of each in Figure 17, green organic luminous layer 602 and blue organic luminous layer
603 correspond to four the first sub-electrodes 201, and four organic luminescence display units can be formed by preparing an organic luminous layer 60, be protected
Card promotes the pixel resolution of organic light emitting display panel in the case where existing organic luminous layer preparation process is constant.Simultaneously
Using pixel rendering method, the pixel resolution of organic light emitting display panel is further promoted.
Note that it above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The present invention is not limited to specific embodiment described here, can carry out for a person skilled in the art various apparent variations,
It readjusts, be combined with each other and substitutes without departing from protection scope of the present invention.Therefore, although by above example to this
Invention is described in further detail, but the present invention is not limited only to above example, is not departing from present inventive concept
In the case of, other more equivalent embodiments can also be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (10)
1. a kind of preparation method of organic light emitting display panel, which is characterized in that including：
One underlay substrate is provided；
Multiple independently arranged first sub-electrodes are prepared in the underlay substrate side, between two neighboring first sub-electrode
Interstitial site is formed, the interstitial site is filled with insulating layer；The interstitial site includes the first interstitial site and the second gap
Position includes at least one first interstitial site between two neighboring second interstitial site；
Pixel defining layer is prepared at second interstitial site, organic light emission is formed between the two neighboring pixel defining layer
Display area；
Same type organic luminous layer is prepared in the organic light emitting display region；
The side of layer and the pixel defining layer far from the underlay substrate, which is shown, in the organic light emission prepares second electrode.
2. the preparation method of organic light emitting display panel according to claim 1, which is characterized in that in the underlay substrate
Side prepares multiple independently arranged first sub-electrodes, and interstitial site is formed between two neighboring first sub-electrode, described
Interstitial site is filled with insulating layer, including：
First electrode is prepared in the underlay substrate side；
Patterned process is carried out to the first electrode, obtains multiple independently arranged first sub-electrodes, two neighboring described the
Interstitial site is formed between one sub-electrode；
Insulating layer is filled in the interstitial site.
3. the preparation method of organic light emitting display panel according to claim 2, which is characterized in that the first electrode
Patterned process is carried out, multiple independently arranged first sub-electrodes are obtained, between being formed between two neighboring first sub-electrode
Gap position, including：
Photoresist layer is prepared in side of the first electrode far from the underlay substrate；
Patterned process is carried out to the photoresist layer, photoresist is obtained and retains region and photoresist lift off region, the photoetching
Glue stripping area exposes the first electrode；
The corresponding first electrode of the photoresist exposed region is performed etching, and removes the photoresist and retains region something lost
The photoresist layer stayed obtains multiple independently arranged first sub-electrodes, is formed between two neighboring first sub-electrode
Interstitial site.
4. the preparation method of organic light emitting display panel according to claim 2, which is characterized in that in the interstitial site
Insulating layer is filled, including：
Insulating layer is prepared at side of first sub-electrode far from the underlay substrate and the interstitial site；
Remove the insulating layer of first sub-electrode far from the underlay substrate side, the insulating layer be filled in it is described between
At gap position.
5. the preparation method of organic light emitting display panel according to claim 4, which is characterized in that in the described first son electricity
Insulating layer is prepared at side and the interstitial site extremely far from the underlay substrate, including：
Use the vapor deposition of plasma enhanced chemical, at least one of sputtering and atomic layer deposition, described first
Sub-electrode prepares insulating layer at side and the interstitial site far from the underlay substrate.
6. the preparation method of organic light emitting display panel according to claim 4, which is characterized in that removal first son
The insulating layer of the electrode far from the underlay substrate side, including：
The insulating layer of first sub-electrode far from the underlay substrate side is carried out using CMP process
Reduction processing；
The insulating layer remaining after reduction processing is rinsed using chemical rinses method, removes first son completely
The insulating layer of the electrode far from the underlay substrate side.
7. the preparation method of organic light emitting display panel according to claim 1, which is characterized in that the insulating layer includes
SiO2、SiNX, A12O3, at least one of MgO, ZnO, NiO, AlN.
8. the preparation method of organic light emitting display panel according to claim 6, which is characterized in that thrown using chemical machinery
When light technique carries out reduction processing to the insulating layer of first sub-electrode far from the underlay substrate side, polishing fluid packet
Include SiO2, Ce2O, ZrO2Wait abrasive grains and KOH and NH2OH additives.
9. the preparation method of organic light emitting display panel according to claim 1, which is characterized in that in the organic light emission
Display area prepares same type organic luminous layer, including：
By the way of inkjet printing, same type organic luminous layer is prepared in the organic light emitting display region.
10. a kind of organic light emitting display panel, which is characterized in that shown using claim 1-9 any one of them organic light emissions
Show that the preparation method of panel is prepared, including：
Underlay substrate；
Multiple independently arranged first sub-electrodes positioned at the underlay substrate side, between two neighboring first sub-electrode
Interstitial site is formed, the interstitial site is filled with insulating layer；The interstitial site includes the first interstitial site and the second gap
Position includes at least one first interstitial site between two neighboring second interstitial site；
Pixel defining layer at second interstitial site forms organic light emission between the two neighboring pixel defining layer
Display area；
Same type of organic luminous layer positioned at the organic light emitting display region；
The second electrode of the side of layer and the pixel defining layer far from the underlay substrate is shown positioned at the organic light emission.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110137372A (en) * | 2019-05-15 | 2019-08-16 | 昆山维信诺科技有限公司 | Display panel and display device |
| CN110429204A (en) * | 2019-07-30 | 2019-11-08 | 昆山梦显电子科技有限公司 | Silicon substrate micro display screen and preparation method thereof |
| CN111048698A (en) * | 2018-10-11 | 2020-04-21 | 上海新微技术研发中心有限公司 | Method for manufacturing organic light-emitting diode structure |
| CN111490176A (en) * | 2019-01-28 | 2020-08-04 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and electronic device |
| CN112510068A (en) * | 2020-10-19 | 2021-03-16 | 南京昀光科技有限公司 | Silicon-based organic electroluminescent micro-display and preparation method thereof |
| CN112820845A (en) * | 2021-03-08 | 2021-05-18 | 安徽熙泰智能科技有限公司 | Anode structure for improving OLED cathode fracture and preparation method thereof |
| WO2023155245A1 (en) * | 2022-02-18 | 2023-08-24 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor, and display device |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111048698A (en) * | 2018-10-11 | 2020-04-21 | 上海新微技术研发中心有限公司 | Method for manufacturing organic light-emitting diode structure |
| CN111490176A (en) * | 2019-01-28 | 2020-08-04 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and electronic device |
| CN111490176B (en) * | 2019-01-28 | 2022-08-02 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and electronic device |
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| CN110137372B (en) * | 2019-05-15 | 2021-09-14 | 苏州清越光电科技股份有限公司 | Display panel and display device |
| CN110429204A (en) * | 2019-07-30 | 2019-11-08 | 昆山梦显电子科技有限公司 | Silicon substrate micro display screen and preparation method thereof |
| CN112510068A (en) * | 2020-10-19 | 2021-03-16 | 南京昀光科技有限公司 | Silicon-based organic electroluminescent micro-display and preparation method thereof |
| CN112820845A (en) * | 2021-03-08 | 2021-05-18 | 安徽熙泰智能科技有限公司 | Anode structure for improving OLED cathode fracture and preparation method thereof |
| CN112820845B (en) * | 2021-03-08 | 2023-03-10 | 安徽熙泰智能科技有限公司 | Anode structure for improving OLED cathode fracture and preparation method thereof |
| WO2023155245A1 (en) * | 2022-02-18 | 2023-08-24 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor, and display device |
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Application publication date: 20180615 |