JP2013195670A - Substrate with partition, manufacturing method thereof, color filter, and display element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate with a partition, which has high process stability and can be formed at a low cost.SOLUTION: The substrate with a partition comprises a substrate and a partition. The partition has a plurality of first partition lines and a plurality of second partition lines formed in a direction crossing the first partition lines. Shapes of cross sections in a direction orthogonal to a lengthwise direction, of the first partition lines and the second partition lines in non-crossing regions where the first partition lines do not cross the second partition lines, have heights gradually reduced from the highest parts in the cross sections toward end parts in a breadthwise direction of the cross sections. A maximum height of the partition in crossing regions where the first partition lines cross the second partition lines is higher than that in the non-crossing regions. A shape of each crossing region has, in an arbitrary cross section passing a perpendicular drawn onto a surface of the substrate from the highest part where the partition has the maximum height in the crossing region, a height gradually reduced from the highest part toward end parts in the breadthwise direction of the cross section.

Description

  The present invention relates to a substrate with a partition wall, a manufacturing method thereof, a color filter, and a display element.

In recent years, organic electroluminescence (hereinafter referred to as “organic EL”) display elements have attracted attention in the FPD (flat panel display) industry.
The organic EL display element is a self-luminous display element and is expected as a display that replaces liquid crystal in terms of wide color reproducibility, high viewing angle, low power consumption, and the like.

  As a method of colorizing the organic EL display element, a method of arranging RGB organic EL layers, a method of combining a white layer of organic EL and RGB color filters, and the like have been proposed.

  On the other hand, in place of the photolithography method and the vacuum film forming method using a metal mask, which are main technologies as a device manufacturing method, a droplet discharge method and a nozzle printing method are attracting attention as a low-cost process without a mask. There are increasing reports of applying these methods to methods for manufacturing organic EL display elements.

  The full-color organic EL display element has, for example, a structure in which RGB three-color organic EL layers are arranged in a region partitioned by a grid-shaped partition, or a RGB three-color organic EL layer on a white organic EL layer. It has a structure in which dye layers are arranged.

As a method for arranging the organic EL layer or the dye layer of these RGB three colors, the organic EL layer or the dye layer is formed in a region partitioned by the partition, after imparting liquid repellency to the partition. There has been proposed a method of applying a coating ink for forming a film by a printing process such as a droplet discharge method or a nozzle printing method (see, for example, Patent Document 1).
In this proposed technique, the organic EL layer or the dye layer is formed by making the partition walls liquid repellent so that the coating ink dropped on the partition walls flows into the region for reasons such as misalignment. The entire region is formed.
However, even when coating ink for forming an organic EL layer or a dye layer is applied to the region by a droplet discharge method or a nozzle printing method in a state in which liquid repellency is imparted to the partition, the horizontal surface of the partition There is a problem in that a residue of the applied ink is generated on the surface. In particular, in the nozzle printing method, as shown in FIG. 4, since the coating ink is continuously applied in the direction A, the coating ink is always applied on the partition wall, and the coating ink residue is applied on the partition wall. Is likely to occur. Such a residue causes bleeding or the like in the displayed image (see, for example, Patent Document 2), and causes a variation in the amount of the applied ink applied in the region. The thickness of the organic EL layer or the dye layer also becomes non-uniform, causing display unevenness (see, for example, Patent Document 3 and Patent Document 4). For this reason, the yield in manufacturing is deteriorated, and the process stability is lowered.

  As a general manufacturing method of the partition wall, a photolithography method using a photosensitive composition is known. An example of the process will be described with reference to FIGS. 1A to 1H. First, a substrate 1 is prepared (FIGS. 1A and 1E). Subsequently, a coating film 2 of the positive photosensitive composition is formed on the substrate 1 by coating the entire surface of the positive photosensitive composition coating solution on the substrate 1 using a spin coating method, a slit coating method, or the like. (FIGS. 1B and 1F). Next, an exposure process by UV irradiation is performed on the opening region 3 using a photomask (FIGS. 1C and 1G). Next, the coating film 2 formed in the opening region 3 is removed by immersing in a developing solution, and the partition wall 4 is formed by forming the opening (FIGS. 1D and 1H). Since the height of the partition wall 4 is determined by the entire surface coating process using the positive photosensitive composition coating solution, it is not good at changing the film thickness at a desired location. In addition, the cost is high because there are many processes. In this method, the problem that the residue of the coating ink is generated on the partition wall is particularly likely to occur when the coating ink for forming the organic EL layer or the dye layer is applied on the partition wall to be formed.

  With respect to the partition wall, a structure has been proposed in which an inclined portion is provided around the edge of the opening by using a step in the structure below the partition wall so that the coating ink can easily flow into the opening (see, for example, Patent Document 3). . However, in the proposed technique, since the partition walls are formed by the photolithography method, the heights of the partition walls are all equal in a region where there is no step in the lower layer structure. In particular, in the area near the middle line of each XY partition line, and at the intersection of the partition line in the X direction and the partition line in the Y direction, there is a wide horizontal surface on the substrate, and the coating ink remains in this region. Therefore, the yield cannot be improved sufficiently.

  Therefore, at present, there is a demand for providing a substrate with a partition wall that has high process stability and can be formed at low cost.

  An object of the present invention is to solve the above-described problems and achieve the following objects. That is, an object of the present invention is to provide a substrate with a partition wall that has high process stability and can be formed at low cost.

Means for solving the problems are as follows. That is,
The substrate with a partition wall of the present invention is a substrate with a partition wall having a substrate and a partition wall formed on the substrate,
The partition has a plurality of first partition lines and a plurality of second partition lines formed in a direction intersecting the first partition lines,
The shape of the cross section in the direction orthogonal to the longitudinal direction of the first partition line and the second partition line in a non-intersecting region where the first partition line and the second partition line do not intersect is the cross section. In the shape where the height gradually decreases from the position where the height is the maximum toward the end in the width direction of the cross section,
A maximum height of the partition wall in an intersecting region where the first partition line and the second partition line intersect is higher than a maximum height of the partition wall in the non-intersecting region;
The shape of the crossing region is an arbitrary cross section passing through a perpendicular drawn from the highest point where the height of the partition wall is maximum in the crossing region to the surface of the base material, and the end in the width direction of the cross section from the highest point The shape is characterized in that the height gradually decreases toward the part.

  According to the present invention, the conventional problems can be solved, and a substrate with a partition wall that can be formed at high cost with high process stability can be provided.

FIG. 1A is a schematic top view (No. 1) for explaining a method of forming a grid-like partition wall by a photolithography method. FIG. 1B is a schematic top view (No. 2) for explaining a method of forming a grid-like partition wall by a photolithography method. FIG. 1C is a schematic top view (No. 3) for explaining a method of forming a lattice-shaped partition wall by a photolithography method. FIG. 1D is a schematic top view (No. 4) for describing a method of forming a lattice-shaped partition wall by a photolithography method. FIG. 1E is a schematic cross-sectional view (No. 5) for describing the method of forming the lattice-shaped partition walls by the photolithography method. FIG. 1F is a schematic cross-sectional view (No. 6) for describing the method of forming the lattice-shaped partition walls by the photolithography method. FIG. 1G is a schematic cross-sectional view (No. 7) for describing the method of forming the grid-like partition walls by photolithography. FIG. 1H is a schematic cross-sectional view (No. 8) for describing the method of forming the lattice-shaped partition walls by photolithography. FIG. 2A is a schematic top view (No. 1) for explaining an example of a method for producing a substrate with a partition wall according to the present invention. FIG. 2B is a schematic top view (No. 2) for explaining an example of the method for producing the substrate with a partition wall according to the present invention. FIG. 2C is a schematic top view (No. 3) for explaining an example of the method for producing the substrate with a partition wall according to the present invention. FIG. 2D is a schematic cross-sectional view (No. 4) for explaining an example of the method for producing the substrate with a partition wall according to the present invention. FIG. 2E is a schematic cross-sectional view (No. 5) for explaining an example of the method for producing the substrate with a partition wall according to the present invention. FIG. 2F is a schematic cross-sectional view (No. 6) for explaining an example of the method for producing the partition-attached base material of the present invention. FIG. 3A is a schematic top view (No. 1) for explaining an example of the method for manufacturing the display element of the present invention. FIG. 3B is a schematic top view (No. 2) for explaining an example of the method for manufacturing the display element of the present invention. FIG. 3C is a schematic top view (No. 3) for explaining an example of the method for manufacturing the display element of the present invention. FIG. 3D is a schematic top view (No. 4) for explaining an example of the method for manufacturing the display element of the present invention. FIG. 3E is a schematic top view (No. 5) for explaining an example of the method for manufacturing the display element of the present invention. FIG. 3F is a schematic top view (No. 6) for explaining an example of the method for manufacturing the display element of the present invention. FIG. 3G is a schematic cross-sectional view (No. 7) for explaining an example of the method for producing the display element of the present invention. FIG. 3H is a schematic cross-sectional view (No. 8) for explaining an example of the method for manufacturing the display element of the present invention. FIG. 3I is a schematic cross-sectional view (No. 9) for explaining an example of the method for manufacturing the display element of the present invention. FIG. 3J is a schematic cross-sectional view (No. 10) for explaining an example of the method for producing the display element of the present invention. FIG. 3K is a schematic cross-sectional view (No. 11) for explaining an example of the method for manufacturing the display element of the present invention. FIG. 3L is a schematic cross-sectional view (No. 12) for explaining an example of the method for producing the display element of the present invention. FIG. 4 is a diagram for explaining a coating method of coating ink for forming an organic EL layer and a pigment layer. FIG. 5 is a diagram for explaining the light extraction direction in the display element of the present invention. FIG. 6A is a schematic top view (No. 1) for explaining another example of the method for manufacturing the display element of the present invention. FIG. 6B is a schematic top view (No. 2) for explaining another example of the method for manufacturing the display element of the present invention. FIG. 6C is a schematic top view (No. 3) for explaining another example of the method for manufacturing the display element of the present invention. FIG. 6D is a schematic top view (No. 4) for explaining another example of the method for manufacturing the display element of the present invention. FIG. 6E is a schematic top view (No. 5) for explaining another example of the method for manufacturing the display element of the present invention. FIG. 6F is a schematic cross-sectional view (No. 6) for explaining another example of the method for manufacturing the display element of the present invention. FIG. 6G is a schematic cross-sectional view (No. 7) for explaining another example of the method for producing the display element of the present invention. FIG. 6H is a schematic cross-sectional view (No. 8) for explaining another example of the method for producing the display element of the present invention. FIG. 6I is a schematic cross-sectional view (No. 9) for explaining another example of the method for manufacturing the display element of the present invention. FIG. 6J is a schematic cross-sectional view (No. 10) for explaining another example of the method for producing the display element of the present invention. FIG. 7A is a schematic top view (No. 1) for explaining an example of the method for producing the color filter of the present invention. FIG. 7B is a schematic top view (No. 2) for explaining an example of the method for producing the color filter of the present invention. FIG. 7C is a schematic top view (No. 3) for explaining an example of the method for producing the color filter of the present invention. FIG. 7D is a schematic cross-sectional view (No. 4) for explaining an example of the method for producing the color filter of the present invention. FIG. 7E is a schematic cross-sectional view (No. 5) for explaining an example of the method for producing the color filter of the present invention. FIG. 7F is a schematic cross-sectional view (No. 6) for explaining an example of the method for producing the color filter of the present invention. FIG. 8A is a top view of the line region of the lattice-shaped partition wall formed in Example 1 by AFM measurement. FIG. 8B is a cross-sectional view of the line region of the grid-shaped partition formed in Example 1 by AFM measurement. FIG. 8C is a three-dimensional view of the line region of the lattice-shaped partition formed in Example 1 by AFM measurement. FIG. 8D is a top view by AFM measurement of the crossing region of the lattice-shaped partition walls formed in Example 1. FIG. 8E is a cross-sectional view obtained by AFM measurement of the intersecting region of the lattice-shaped partition walls formed in Example 1. FIG. 8F is a three-dimensional diagram obtained by AFM measurement of the intersecting region of the lattice-shaped partition walls formed in Example 1. FIG. 9A is a diagram illustrating an example of the shape of the opening region. FIG. 9B is a diagram illustrating another example of the shape of the opening region. FIG. 9C is a diagram illustrating another example of the shape of the opening region. FIG. 9D is a diagram illustrating another example of the shape of the opening region. FIG. 10A is a schematic top view for explaining another example of the display element of the present invention. FIG. 10B is a schematic cross-sectional view for explaining another example of the display element of the present invention. FIG. 10C is a schematic cross-sectional view for explaining another example of the display element of the present invention. FIG. 11A is a top view of the line region of the lattice-shaped partition formed in Example 2 by AFM measurement. FIG. 11B is a cross-sectional view of the line region of the grid-shaped partition formed in Example 2 by AFM measurement. FIG. 11C is a three-dimensional view of the line region of the lattice-shaped partition formed in Example 2 by AFM measurement. FIG. 11D is a top view of the intersection region of the lattice-shaped partition formed in Example 2 by AFM measurement. FIG. 11E is a cross-sectional view obtained by AFM measurement of the crossing region of the lattice-shaped partition walls formed in Example 2. FIG. 11F is a three-dimensional view obtained by AFM measurement of the intersecting region of the lattice-shaped partition walls formed in Example 2. 12A is a top view of the line region of the lattice-shaped partition wall formed in Comparative Example 1 by AFM measurement. FIG. 12B is a cross-sectional view of the line region of the lattice-shaped partition wall formed in Comparative Example 1 by AFM measurement. FIG. 12C is a three-dimensional view of the line region of the lattice-shaped partition wall formed in Comparative Example 1 by AFM measurement. 12D is a top view by AFM measurement of the crossing region of the lattice-shaped partition walls formed in Comparative Example 1. FIG. 12E is a cross-sectional view obtained by AFM measurement of the crossing region of the lattice-shaped partition walls formed in Comparative Example 1. FIG. 12F is a three-dimensional view obtained by AFM measurement of the intersecting region of the lattice-shaped partition walls formed in Comparative Example 1. FIG. FIG. 13A is a diagram for explaining the scanning direction of the nozzle printer. FIG. 13B is a schematic diagram illustrating the residue generated on the lattice-shaped partition wall. FIG. 14 is a diagram for explaining a coffee stain shape.

(Base material with partition walls)
The base material with a partition of this invention has a base material and a partition at least, and also has another member as needed.

<Base material>
There is no restriction | limiting in particular as the material of the said base material, a shape, a magnitude | size, and a structure, According to the objective, it can select suitably.

Examples of the material for the substrate include inorganic materials and organic materials.
Examples of the inorganic material include glass. Examples of the glass include alkali-free glass and silica glass.
Examples of the organic material include plastic. Examples of the plastic include polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).

  A metal thin film, a metal oxide thin film, an insulating film, or the like may be formed on the surface of the substrate. Examples of the material for the metal thin film include aluminum (Al) and molybdenum (Mo). Examples of the material for the metal oxide thin film include ITO (indium tin oxide) and ATO (antimony-doped tin oxide). Examples of the material of the insulating film include acrylic resin, polyimide, polysiloxane, and the like. The substrate is preferably subjected to oxygen plasma irradiation, UV ozone irradiation, UV irradiation cleaning or the like in order to clean the surface or improve adhesion.

  Examples of the substrate include a glass substrate with ITO.

<Partition wall>
The partition is a partition formed on the substrate, and has a plurality of first partition lines and a plurality of second partition lines.
The partition wall is a partition wall for partitioning and forming a region for forming a dye layer, an organic EL layer, or the like (hereinafter sometimes referred to as “open region”) in a color filter or a display element.
There is no restriction | limiting in particular as a shape of the said opening area | region, According to the objective, it can select suitably, For example, the shape shown by FIG. 9A-FIG. 9D etc. are mentioned.
The size of the opening region is not particularly limited and can be appropriately selected depending on the purpose. For example, when the opening region is rectangular, the length in the longitudinal direction is 50 μm to 500 μm, and the length is short. The length in the hand direction is 15 μm to 200 μm.

The partition preferably has an insulating property.
The material of the partition wall is not particularly limited and can be appropriately selected depending on the purpose. For example, epoxy resin, acrylic resin, phenol resin, polyimide, polyamide, polyester, polyvinyl phenol, polyvinyl alcohol, polyvinyl acetate, Examples include polysulfone, fluororesin, polymer alloys of these resins, and polydimethylsiloxane (PDMS). Among these, epoxy resin, acrylic resin, polyimide, and polydimethylsiloxane (PDMS) are preferable from the viewpoint of heat resistance.
These materials are preferably at least one of a thermosetting resin and a UV curable resin.

The partition preferably has liquid repellency.
The method for imparting liquid repellency to the partition wall is not particularly limited and may be appropriately selected depending on the intended purpose. For example, a method of performing CF ₄ plasma treatment on the partition wall, A method for modifying a liquid repellent functional group such as —CF ₃ group, —CF ₂ group, —CH ₃ group, —CH ₂ group on the surface, and a liquid repellent functional group in a coating ink used for forming a partition wall Examples thereof include a method of adding a liquid repellent material.
Whether or not the partition wall is liquid repellent can be confirmed, for example, by measuring a contact angle. In this case, the contact angle of the partition wall can be easily measured by forming a film of the same material as the partition wall and measuring the contact angle of the film. The contact angle measurement method is not particularly limited and may be appropriately selected depending on the intended purpose. For example, the contact angle may be measured by a droplet method using OCA20 (manufactured by Eihiro Seiki Co., Ltd.).
Here, the liquid repellency means that, for example, the contact angle with respect to water is 90 ° or more, and the contact angle with respect to mesitylene is 30 ° or more. Mesitylene, also called 1,3,5-trimethylbenzene, is a highly soluble organic solvent that is widely used in the field of electronics, and forms a color filter dye layer, an organic EL (electroluminescence) light emitting layer, and the like. It is used as an organic solvent for coated inks.

<< First partition line and second partition line >>
The first partition line is a part of the partition and intersects with the second partition line. There are a plurality of the first partition lines, each of which faces substantially the same direction or the same direction.
The second partition line is a partition line which is a part of the partition and is formed in a direction intersecting with the first partition line. There are a plurality of the second partition lines, each of which faces substantially the same direction or the same direction.
The first partition line and the second partition line form a non-intersecting region where they do not intersect and an intersecting region where they intersect.
There is no restriction | limiting in particular as an angle which the said 1st partition line and the said 2nd partition line cross | intersect, Although it can select suitably according to the objective, It is preferable that it is substantially orthogonal or orthogonal.

-Non-intersection region-
The non-intersecting region is a region where the first partition line and the second partition line do not intersect in the partition.
The shape of the cross section in the direction perpendicular to the longitudinal direction of the first partition line and the second partition line in the non-intersecting region is from the position where the height is maximum in the cross section to the end in the width direction of the cross section. This is a shape whose height gradually decreases toward the portion (hereinafter, sometimes referred to as “gradually decreasing shape in the non-intersecting region”). Examples of the gradually decreasing shape in the non-intersecting region include an arc shape.
When the non-intersecting region has a gradually decreasing shape in the non-intersecting region, for example, when manufacturing a color filter or a display element, a coating ink for forming a pigment layer, an organic EL layer, or the like is used in the non-intersecting region. Even when applied on the non-intersecting region, the application ink applied to the non-intersecting region hardly moves on the non-intersecting region, and moves to the region partitioned by the partition wall. The dye layer, the organic EL layer, and the like are uniformly formed.
In the gradually decreasing shape in the non-intersecting region, the portion having the maximum height may be horizontal with respect to the surface of the base material when the minute region is observed. The width of the horizontal region is preferably smaller than the diameter (for example, 20 μm) of the droplet of the applied ink, preferably 1/5 or less of the diameter, and more preferably 1/10 or less. preferable. By doing so, the coating ink applied on the non-intersecting region can move to the region partitioned by the partition wall, hardly remaining on the non-intersecting region.

  The gradually decreasing shape in the non-intersecting region is not easy to form by ordinary photolithography, but can be easily formed by a coating process such as droplet discharge using a droplet discharge device. Specifically, it can be easily formed by the method for producing a substrate with partition walls of the present invention described later.

  Further, it can be said that the gradually decreasing shape in the non-intersecting region is a tapered shape having a taper angle. It is preferable that the taper angle from the position where the height is maximum in the cross section to the end portion in the width direction of the cross section is 5 ° or more with respect to the surface of the base material.

  The height of the maximum height in the cross section, that is, the maximum height of the partition wall in the non-intersecting region is not particularly limited and can be appropriately selected according to the purpose, but is 1.0 μm or more. Is preferred. Further, the maximum height is preferably 100 μm or less. This height is a height with the surface of the substrate as a reference plane.

  There is no restriction | limiting in particular as the width | variety of the said cross section in the said non-intersection area | region, Although it can select suitably according to the objective, 40 micrometers or less are preferable. The width is preferably 1 μm or more.

-Intersection area-
The intersecting region is a region where the first partition line and the second partition line intersect in the partition.
The maximum height of the partition wall in the intersection region is higher than the maximum height of the partition wall in the non-intersection region. Further, the shape of the intersecting region is an arbitrary cross section passing through a perpendicular line dropped from the highest point where the height of the partition wall is maximum in the intersecting region to the surface of the base material, and the width direction of the cross section from the highest point. This is a shape whose height gradually decreases toward the end (hereinafter sometimes referred to as “gradually decreasing shape in the intersecting region”). Examples of the gradually decreasing shape in the intersection region include an arc shape.
In a conventional method for forming a partition, for example, a photolithography method, it may be possible to form a slight inclination in the width direction of the partition line in a non-intersecting region where the partition line does not intersect due to development conditions or the like. However, in the intersecting region where the partition lines intersect, the upper part becomes flat. Then, when the coating ink for forming the organic EL layer or the dye layer is applied to the flat surface, a residue of the coating ink is generated on the flat surface. As a result, the amount of applied ink in the region partitioned by the partition wall varies, resulting in display unevenness, blurring, etc. in the displayed image, resulting in poor manufacturing yield and process stability. Decreases.
On the other hand, when the intersection region has a gradually decreasing shape in the intersection region as in the present invention, for example, when a color filter or a display element is manufactured, a coating ink that forms a pigment layer, an organic EL layer, or the like is provided. Even when applied on the intersecting region, the coating ink applied on the intersecting region moves to the region partitioned by the partition wall, hardly remaining on the intersecting region. In the region, a dye layer, an organic EL layer, and the like are uniformly formed.
The gradually decreasing shape in the intersecting area may be horizontal with respect to the surface of the base material when the maximum area where the height is maximum is observed. The width of the horizontal region is preferably smaller than the diameter (for example, 20 μm) of the droplet of the applied ink, preferably 1/5 or less of the diameter, and more preferably 1/10 or less. preferable. By doing so, the coating ink applied on the intersecting region can move to the region partitioned by the partition wall, hardly remaining on the intersecting region.

  There is no restriction | limiting in particular as a manufacturing method of the said base material with a partition, According to the objective, it can select suitably, However, The manufacturing method of the base material with a partition of this invention mentioned later is preferable. By doing so, it can be formed at low cost without using a complicated method such as a photolithography method.

  Since the substrate with a partition wall has high process stability as described above, it can be used as a substrate with a partition wall for manufacturing a display element, for example, a substrate with a partition wall for manufacturing an organic EL display element. Moreover, the said base material with a partition can be used as a base material with a partition for manufacturing a color filter.

(Manufacturing method of substrate with partition walls)
The method for manufacturing a substrate with a partition wall according to the present invention is a method for manufacturing a substrate with a partition wall in which droplets discharged by a droplet discharge device are applied onto the substrate to form a partition wall, and the first partition line It includes at least a forming step and a second partition line forming step, and further includes other steps as necessary.
The manufacturing method of the base material with a partition of this invention is a method of manufacturing the base material with a partition of this invention.

<Droplet ejection device>
The droplet discharge device is not particularly limited as long as it is a device capable of discharging droplets, and can be appropriately selected according to the purpose. Examples thereof include an inkjet device.
There is no restriction | limiting in particular as a method of discharging the said droplet, According to the objective, it can select suitably, For example, the method using a piezoelectric element, the method of discharging by electrostatic attraction, etc. are mentioned. Among these, the method of discharging by electrostatic suction is preferable in that the size of the droplet can be reduced.
By using the droplet discharge device, it is possible to manufacture the substrate with a partition wall at a low cost without using a complicated method such as a photolithography method.

<Base material>
There is no restriction | limiting in particular as said base material, According to the objective, it can select suitably, For example, the base material similar to the said base material illustrated in description of the said base material with a partition of this invention is mentioned. The preferred embodiment is also the same.

<Droplet>
The droplet is not particularly limited as long as it is a droplet capable of forming the partition wall, and can be appropriately selected according to the purpose. For example, the droplet includes at least a partition wall forming material and an organic solvent, and further required. Depending on the case, there may be mentioned droplets made of coating ink containing other components.

  There is no restriction | limiting in particular as said partition formation material, According to the objective, it can select suitably, For example, the material similar to the material of the said partition illustrated in description of the said base material with a partition of this invention is mentioned. The preferred embodiment is also the same.

As the organic solvent, a high boiling point solvent is preferable. Examples of the high boiling point solvent include mesitylene, γ-butyrolactone, propylene glycol, propylene carbonate, formamide, N, N-dimethylformamide, N, N-dimethylacetamide, 1,3-dimethyl-2-imidazolidinone, and cyclohexanone. And diethylene glycol methyl ether. When a solvent having a low boiling point is used, the coated ink applied is quick to dry, and the partition line is likely to have a so-called coffee stain shape with a thickened edge region, thereby forming the desired shape of the partition wall in the present invention. It becomes difficult. As shown in FIG. 14, the coffee stain shape is a shape in which the outer peripheral portion of the film 62 formed by the droplets applied on the substrate 61 is thicker than the central portion.
There is no restriction | limiting in particular as a boiling point of the said organic solvent, Although it can select suitably according to the objective, 150 degreeC or more is preferable and 200 degreeC or more is more preferable.

<First partition line forming step>
In the first partition line forming step, a droplet is ejected from the droplet ejection device while the ejection port of the droplet ejection device is moved relative to the substrate in the first direction. There is no particular limitation as long as it is a step of forming a plurality of first partition lines, and it can be appropriately selected according to the purpose.

  When forming the first partition line, the discharge port of the droplet discharge device may be moved relative to the substrate in the first direction. In this case, the substrate is fixed. In this state, the discharge port may be moved in the first direction, and the base material may be moved in the first direction while the discharge port is fixed. There is no restriction | limiting in particular as the method of moving the said discharge outlet, and the method of moving the said base material, According to the objective, it can select suitably.

  When forming one said 1st partition line, you may carry out what is called overcoating which scans the location which should form the partition line several times. The number of times of overcoating is not particularly limited as long as the first partition line can have a desired shape and size, and can be appropriately selected according to the purpose.

<Second partition line forming step>
In the second partition line forming step, the droplet discharge device is configured to move the droplet discharge device while moving the discharge port of the droplet discharge device relative to the base material in a second direction intersecting the first direction. There is no particular limitation as long as it is a step of forming a plurality of second partition lines by discharging droplets from the apparatus, and can be appropriately selected according to the purpose.

  In the second partition line forming step, a droplet is also applied to an intersecting region where the first partition line and the second partition line intersect. That is, in the second partition line forming step, a droplet is applied on the first partition line in the intersecting region. By doing so, a gradually decreasing shape in the intersection region is formed in the intersection region.

  The second direction is not particularly limited as long as it intersects with the first direction, and can be appropriately selected according to the purpose. However, the second direction is substantially orthogonal to the first direction. The direction to do is preferable.

  When forming the second partition line, it is only necessary to move the discharge port of the droplet discharge device relative to the substrate in the second direction. In this case, the substrate is fixed. In this state, the discharge port may be moved in the second direction, and the base material may be moved in the second direction while the discharge port is fixed. There is no restriction | limiting in particular as the method of moving the said discharge outlet, and the method of moving the said base material, According to the objective, it can select suitably.

  When forming one said 2nd partition line, you may carry out what is called overcoating which scans the location which should form the partition line several times. The number of times of overcoating is not particularly limited as long as the second partition line can have a desired shape and size, and can be appropriately selected according to the purpose.

  In the first partition line forming step and the second partition line forming step, the substrate may be heated after applying droplets on the substrate. The heating may be performed in each of the first partition line forming step and the second partition line forming step, or may be performed only in the second partition line forming step. There is no restriction | limiting in particular as said heating conditions, According to the objective, it can select suitably.

  In the method for manufacturing the substrate with a partition wall, the droplets applied on the substrate are dried by discharging the droplets from the droplet discharge device in the first direction and the second direction. A partition line having a gradually decreasing shape (for example, an arc shape) in the non-intersecting region is formed by reducing the surface area by surface tension in the process. Further, since the first direction and the second direction intersect, the intersection region has a maximum height higher than the maximum height of each partition line in the non-intersection region, and the intersection An intersection region having a gradually decreasing shape in the region is formed.

(Display element)
The display element of this invention has a base material with a partition, a lower electrode, an organic EL (electroluminescence) layer, and an upper electrode, and also has other members as necessary.
The display element can be referred to as an organic EL display element.

<Base material with partition wall>
The said base material with a partition is a base material with a partition of this invention.

<Lower electrode>
The lower electrode is not particularly limited as long as it is an electrode formed in a region partitioned by the partition walls of the base material with partition walls, and can be appropriately selected according to the purpose.
There is no restriction | limiting in particular as a material of the said lower electrode, According to the objective, it can select suitably, For example, a transparent conductive oxide, a metal, etc. are mentioned. Examples of the transparent conductive oxide include ITO (indium tin oxide) and IZO (indium-zinc oxide). Examples of the metal include silver and a silver-neodymium alloy.

  The method for forming the lower electrode is not particularly limited and may be appropriately selected depending on the purpose. For example, (i) a step of patterning by photolithography after film formation by sputtering, dip coating, or the like, (Ii) A step of directly forming a desired shape by a printing process such as inkjet, nanoimprint, or gravure may be used.

  In addition, the said lower electrode may be previously formed on the said base material, when manufacturing the said base material with a partition. Alternatively, the lower electrode may be formed on the substrate in a region partitioned by the partition after the partition is formed on the substrate.

<Organic EL layer>
The organic EL layer is not particularly limited as long as it is an organic EL layer formed on the lower electrode, and can be appropriately selected according to the purpose.
The organic EL layer is formed on the lower electrode formed on a region partitioned by the partition.

  Examples of the structure of the organic EL layer include a structure in which a hole transport layer and a light emitting layer are stacked.

<< Hole Transport Layer >>
The hole transport layer is not particularly limited as long as it is a layer having a hole transport material, and can be appropriately selected according to the purpose.

  There is no restriction | limiting in particular as said hole transport material, According to the objective, it can select suitably, For example, 3, 4- polyethylene dioxythiophene-polystyrene sulfonic acid (PEDOT / PSS) etc. are mentioned.

  A method for forming the hole transport layer is not particularly limited and may be appropriately selected depending on the intended purpose. However, a maskless coating process such as a droplet discharge method, a nozzle printing method, or a dispenser method is preferable, and the throughput From this viewpoint, the nozzle printing method is more preferable.

In the coating process, it is preferable to apply a dispersion in which the hole transport material is dispersed in a dispersion medium. Examples of the dispersion include a dispersion in which the hole transport material is dispersed in water.
There is no restriction | limiting in particular as an application quantity in the said application | coating process, According to the objective, it can select suitably.

  When the hole transport layer is formed by the coating process, for example, the dispersion liquid is discharged from the discharge device continuously in the direction of arrow A in FIG. At this time, the dispersion is also applied onto the partition wall region intersecting with the arrow A of the partition wall. Moreover, it is applied also to the partition region parallel to the arrow A due to misalignment. However, the base material with a partition has a gradually decreasing shape in the non-intersecting region and a gradually decreasing shape in the intersecting region, so that a residue due to the dispersion hardly occurs on the partition.

<< Light emitting layer >>
The light emitting layer is not particularly limited as long as it is a layer having a light emitting material, and can be appropriately selected according to the purpose.
The light emitting layer is a red light emitting layer (R), a green light emitting layer (G), and a blue light emitting layer (B), and these are arranged side by side to obtain a full color display element.

  There is no restriction | limiting in particular as said luminescent material, According to the objective, it can select suitably, For example, a high molecular organic EL material, a soluble low molecular organic EL material, etc. are mentioned.

  The method for forming the light emitting layer is not particularly limited and may be appropriately selected depending on the intended purpose. However, a maskless coating process such as a droplet discharge method, a nozzle printing method, a dispenser method or the like is preferable, and a throughput viewpoint. Nozzle printing method is more preferable.

In the coating process, it is preferable to apply a dispersion in which the light emitting material is dispersed in a dispersion medium. As the dispersion medium, a nonpolar solvent such as toluene or mesitylene is preferable because it does not dissolve the hole transport layer.
There is no restriction | limiting in particular as an application quantity in the said application | coating process, According to the objective, it can select suitably.

  In the case of forming the light emitting layer by the coating process, for example, the dispersion liquid is continuously discharged from the discharge device in the direction of arrow A in FIG. At this time, the dispersion is also applied onto the partition wall region intersecting with the arrow A of the partition wall. Moreover, it is applied also to the partition region parallel to the arrow A due to misalignment. However, the base material with a partition has a gradually decreasing shape in the non-intersecting region and a gradually decreasing shape in the intersecting region, so that a residue due to the dispersion hardly occurs on the partition.

<Upper electrode>
The upper electrode is not particularly limited as long as it is an electrode formed on the organic EL layer, and can be appropriately selected according to the purpose.
Examples of the material of the upper electrode include aluminum (Al), magnesium (Mg) -silver (Ag) alloy, aluminum (Al) -lithium (Li) alloy, and ITO.
There is no restriction | limiting in particular as a formation method of the said upper electrode, According to the objective, it can select suitably, For example, the method similar to the formation method of the said lower electrode, etc. are mentioned.

  The organic EL display element emits light by applying a predetermined voltage between the lower electrode (anode) and the upper electrode (cathode). Then, by arranging the light emitting layers of red (R), green (G), and blue (B), a full-color organic EL display element is obtained.

  The organic EL display element may have an electron transport layer such as LiF between the light emitting layer and the upper electrode (cathode). The electron transport layer can be formed, for example, by vapor deposition.

  The organic EL display element may have an electron injection layer between the electron transport layer and the upper electrode (cathode). Furthermore, a hole injection layer may be provided between the lower electrode (anode) and the hole transport layer.

When a transparent conductive oxide such as ITO or IZO is used for the lower electrode (anode) and magnesium (Mg) -silver (Ag) having a high reflectance is used for the upper electrode (cathode), the organic EL display The element is a so-called “bottom emission” organic EL display element that extracts light emission from the substrate side. In this case, in the organic EL display element shown in FIG.
Further, an alloy such as high reflectivity silver (Ag) or silver (Ag) -neodymium (Nd) is used for the lower electrode (anode), and translucent magnesium (Mg) -silver ( When Ag) or the like is used, the organic EL display element is a so-called “top emission” organic EL display element that extracts light emission from the side opposite to the substrate side. In this case, in the organic EL display element shown in FIG. Here, in FIG. 5, reference numeral 21 is a glass substrate, reference numeral 22 is an anode, reference numeral 23 is a partition line, reference numeral 26 is a hole transport layer, reference numeral 27 is a light emitting layer, reference numeral 28. Is the cathode.

Here, an example of the manufacturing method of the display element of this invention is demonstrated using FIG. 3A-FIG. 3L.
First, a conductive oxide thin film is formed on the glass substrate 21. Next, a photoresist pattern is formed on the conductive oxide thin film by photolithography. Thereafter, the conductive oxide thin film in the region where the resist pattern is not formed is removed by RIE (Reactive Ion Etching) or the like, and then the resist pattern is removed to form the anode 22 made of the conductive oxide thin film. (FIGS. 3A and 3G).

  Next, the partition line 23 is formed using an inkjet apparatus (FIGS. 3B and 3H). Subsequently, the partition line 24 is formed in a direction orthogonal to the partition line 23. Thus, the lattice-like partition wall 25 is formed (FIGS. 3C and 3I).

Next, oxygen plasma treatment and CF ₄ plasma treatment are performed to perform lyophilic treatment of the anode 22 and lyophobic treatment of the lattice-like partition walls 25.

  Subsequently, a hole transport layer ink using water as a solvent is applied using a nozzle printer, and then heat treatment is performed to form the hole transport layer 26 (FIGS. 3D and 3J).

  Subsequently, each red light emitting layer (R), green light emitting layer (G), and blue light emitting layer (B) light emitting layer ink (polymer organic EL light emitting material solution using mesitylene as a solvent) was added to the red light emitting layer (R). ), The green light emitting layer (G), and the blue light emitting layer (B) in this order, applied to a predetermined region, and heat-treated to form the light emitting layer 27 (FIGS. 3F and 3K).

  Finally, the cathode 28 is formed using a metal mask to obtain a full-color organic EL display element 20 (FIGS. 3G and 3L).

Next, another example of the method for manufacturing a display element of the present invention will be described with reference to FIGS. 6A to 6J.
First, partition lines 23 are formed on the glass substrate 21 using an ink jet apparatus. Immediately thereafter, the partition line 24 is formed in a direction orthogonal to the partition line 23. By doing so, the grid-like partition walls 25 are formed (FIGS. 6A and 6F).

  Next, after the surface modification of the partition lines 23 and 24 and the glass substrate 21 by UV irradiation treatment, the anode 22 is formed. Specifically, nano-Ag ink is discharged using a droplet discharge method device so as to spread over the entire region partitioned by the lattice-like partition wall 25, and then heat treatment is performed to form the anode 22 (FIG. 6B). And FIG. 6G).

  Subsequently, after surface modification of the partition lines 23 and 24 and the anode 22 by UV irradiation treatment, a hole transport layer ink using water as a solvent is applied using a nozzle printer, and heat treatment is further performed to perform the hole transport layer 26. (FIGS. 6C and 6H).

  Subsequently, each red light emitting layer (R), green light emitting layer (G), and blue light emitting layer (B) light emitting layer ink (polymer organic EL light emitting material solution using mesitylene as a solvent) was added to the red light emitting layer (R). ), The green light emitting layer (G), and the blue light emitting layer (B) in this order, applied to a predetermined region, and heat-treated to form the light emitting layer 27 (FIGS. 6D and 6I).

  Finally, the cathode 28 is formed using a metal mask to obtain a full-color organic EL display element 20 (FIGS. 6E and 6J).

(Color filters and display elements)
The color filter of this invention has a base material with a partition and a pigment | dye layer, and also has another member as needed.
The display element of this invention has the said color filter, and also has another member as needed.

<Base material with partition wall>
The said base material with a partition is a base material with a partition of this invention.

<Dye layer>
The dye layer is not particularly limited as long as it is a layer formed in a region partitioned by the partition walls of the base material with partition walls and has a dye, and can be appropriately selected according to the purpose. it can.

  The method for forming the dye layer is not particularly limited and may be appropriately selected depending on the intended purpose. However, a maskless coating process such as a droplet discharge method, a nozzle printing method, or a dispenser method is preferable, and a throughput viewpoint. Nozzle printing method is more preferable.

  The color filter preferably has a structure in which pigment layers of red (R), green (G), and blue (B) are arranged.

  A full color display element can be obtained by combining the color filter with, for example, a white organic EL element or a liquid crystal display element.

Here, an example of the manufacturing method of the color filter of this invention is demonstrated using FIG. 7A-FIG. 7F.
First, the partition line 32 is formed on the glass substrate 31 using an inkjet apparatus (FIGS. 7A and 7D). Immediately thereafter, the partition line 33 is formed in a direction orthogonal to the partition line 32. By doing so, a grid-like partition wall 34 is formed (FIGS. 7B and 7E).

Next, an oxygen plasma process and a CF ₄ plasma process are performed to perform a lyophilic process on the glass substrate 31 and a liquid repellent process on the lattice-shaped partition walls 34.

  Subsequently, each dye layer ink obtained by dissolving the dye materials of the red dye layer (R), the green dye layer (G), and the blue dye layer (B) in an organic solvent is converted into a red dye layer ( R), a green pigment layer (G), and a blue pigment layer (B) are applied in order to a predetermined region, and heat treatment is performed to form a pigment layer 35 to obtain a color filter 30 (FIGS. 7C and 7F). .

Furthermore, another aspect of the display element of the present invention will be described. This will be described with reference to FIGS. 10A to 10C.
First, the display element shown in FIGS. 3F and 3L is prepared. Here, the light emitting layer 27 in the display element is a white light emitting layer. A so-called “top emission type” display element is used.
Next, a sealing layer 29 is formed on the cathode 28 of the display element to produce a white organic EL element 40 (FIGS. 10A and 10B).

  Next, the color filter shown in FIGS. 7C and 7F is prepared.

  Then, the organic EL display element is produced by bonding the white organic EL element 40 and the color filter 50 via the adhesive layer 54 (FIG. 10C).

The material of the adhesive layer 54 is preferably a transparent material. Examples of the material of the adhesive layer include an epoxy resin and an acrylic resin.
The produced organic EL display element emits white light toward the color filter by applying a predetermined voltage between the anode and the cathode, and becomes a full-color organic EL display element through the color filter.
In this embodiment, the structure in which the color filter is disposed above the top emission type white organic EL element is described as an example of the organic EL display element. However, the color filter is disposed below the bottom emission type white organic EL element. It may be a structure.

  Examples of the present invention will be described below, but the present invention is not limited to the following examples.

  In Examples and Comparative Examples, the hole transport layer ink, the light emitting layer ink, and the dye layer ink were applied by a method in which the ink was continuously applied in the direction A as shown in FIG.

Example 1
A grid-like partition was formed on a glass substrate with ITO. Note that the partition walls were formed so that the number of openings (regions partitioned by the partition walls) was 30 rows × 10 columns in total. The formation method will be described with reference to FIGS. 2A to 2F.

  Specifically, first, coating ink was applied to a glass substrate 11 with an ITO thickness of 0.7 mm (FIGS. 2A and 2D) using an ink jet apparatus to form partition lines 12. As a coating ink applied with an inkjet apparatus, a coating ink obtained by diluting a photosensitive polyimide solution (DL-1000, manufactured by Toray Industries, Inc.) three times by mass with γ-butyrolactone was used. This coating ink had a solid content concentration of 7% by mass and a viscosity of 10 mPa · s. The partition line 12 was formed by repeatedly applying 15 times per line (FIGS. 2B and 2E).

  Immediately after that, the partition line 13 was formed in the direction orthogonal to the partition line 12 using the same coating ink. As with the partition line 12, overcoating was performed 15 times per line. Subsequently, by performing a heat treatment at 230 ° C. for 30 minutes, a partition-attached base material on which grid-like partition walls 14 were formed was produced (FIGS. 2C and 2F). The partition lines 12 and 13 have a width of 27 μm, a height of 1.2 μm, and the cross-sectional shape in the direction orthogonal to the longitudinal direction of the partition line is the highest at the center of the line width as shown in FIG. The arc shape gradually decreased in height from the edge toward the end in the width direction. The shape of the opening was a rectangle of 58 μm × 228 μm.

(Example 2)
In Example 1, except that the coating ink was changed to a coating ink obtained by diluting a photosensitive polyimide solution (DL-1000, manufactured by Toray Industries, Inc.) with propylene carbonate three times by mass, the same as in Example 1. The base material with a partition in which the grid | lattice-like partition 14 was formed was produced (FIG. 2C and FIG. 2F). The partition lines 12 and 13 have a width of 37 μm, a height of 1.0 μm, and the cross-sectional shape in the direction orthogonal to the longitudinal direction of the partition line is the highest at the center of the line width as shown in FIG. The arc shape gradually decreased in height from the edge toward the end in the width direction. The shape of the opening was a rectangle of 48 μm × 218 μm.

(Comparative Example 1)
A grid-like partition was formed on a glass substrate with ITO. The partition walls were formed so that the number of openings was 300 in total, 30 rows × 10 columns. A formation method will be described with reference to FIGS. 1A to 1H.

  Specifically, first, a coating solution (photosensitive polyimide solution, DL-1000, manufactured by Toray Industries, Inc.) is applied to the entire surface of the substrate 1 (a glass substrate with ITO having a thickness of 0.7 mm) (FIGS. 1A and 1E). did. The coating film 2 was formed by prebaking at 120 ° C. for 2 minutes (FIGS. 1B and 1F).

  Subsequently, g-line, h-line, and i-line mixed UV light is irradiated to the opening region 3 using a photomask (FIGS. 1C and 1G), and a developer NMD-W 2.38 manufactured by Tokyo Ohka Co., Ltd. is used. After development, a heat treatment was performed at 230 ° C. for 30 minutes to obtain a substrate with partition walls on which grid-like partition walls 4 were formed (FIGS. 1D and 1H). The partition line width was 25 μm, the height was 1.0 μm, and the cross-sectional shape in the direction perpendicular to the longitudinal direction of the partition line was rectangular, that is, the upper surface of the partition wall was planar. The shape of the opening was a rectangle of 60 μm × 200 μm.

<AFM measurement>
AFM (atomic force microscope) measurement of the lattice-shaped partition walls formed in Examples 1 and 2 and Comparative Example 1 was performed.
8A to 8C are a top view (FIG. 8A) of a line region (non-intersection region) of the lattice-shaped partition wall formed in Example 1, a cross-sectional view (FIG. 8B) of a line region (non-intersection region), and a line region ( A three-dimensional view (FIG. 8C) of (non-intersecting region) is shown. 8D to 8F show a top view (FIG. 8D), a cross-sectional view (FIG. 8E), and a three-dimensional view (FIG. 8F) of the intersecting region of the intersecting region of the grid-shaped partition formed in Example 1. FIG. The line region (non-intersecting region) has a maximum height of 1.2 μm and a cross section having an arc shape. The maximum height of the intersecting region is 0.8 μm higher than the line region (non-intersecting region). It was found that there is a slope in which the height gradually decreases from the point indicating the maximum height to the opening.
Next, in FIGS. 11A to 11C, a top view (FIG. 11A) of a line region (non-intersecting region) of the lattice-shaped partition formed in Example 2, a cross-sectional view (FIG. 11B) of the line region (non-intersecting region), A three-dimensional view (FIG. 11C) of a line region (non-intersecting region) is shown. 11D to 11F show a top view (FIG. 11D), a cross-sectional view (FIG. 11E) of the intersection region, and a three-dimensional view (FIG. 11F) of the intersection region of the grid-shaped partition walls formed in the second embodiment. The line area (non-intersecting area) has a maximum height of 1.0 μm and a cross-section having an arc shape, and the maximum height of the intersecting area is 0.6 μm higher than the line area (non-intersecting area). It was found that there is a slope in which the height gradually decreases from the point indicating the maximum height to the opening.
Next, in FIGS. 12A to 12C, a top view (FIG. 12A) of a line region (non-intersecting region) of the lattice-shaped partition wall formed in Comparative Example 1, a cross-sectional view (FIG. 12B) of the line region (non-intersecting region), A three-dimensional view (FIG. 12C) of a line region (non-intersecting region) is shown. 12D to 12F show a top view (FIG. 12D), a cross-sectional view (FIG. 12E), and a three-dimensional view (FIG. 12F) of the intersecting region of the latticed partition formed in Comparative Example 1. FIG. The maximum height of both the line region and the intersecting region was almost equal to 1 μm, and it was found that there were many flat surfaces as compared with the grid-like partition walls formed in Examples 1 and 2.

<Liquid treatment and liquid repellent treatment>
Next, the partition walls and glass substrate of the base material with lattice-like partition walls prepared in Example 1 and the partition wall and glass substrate of the base material with lattice-like partition walls prepared in Comparative Example 1 were subjected to oxygen plasma treatment using a dry etching apparatus. (Back pressure 10 Pa, power 500 W, O ₂ gas flow rate 50 sccm, treatment time 30 seconds) Then, the partition wall was further treated with CF ₄ plasma treatment (back pressure 2 × 10 ⁻⁵ Torr, power 6 W, CF ₍₄ gas flow rate 5 sccm, Ar gas flow rate 45 sccm, treatment time 30 seconds).

<< Contact angle measurement >>
The effects of lyophilic treatment and lyophobic treatment were confirmed.
First, the coating ink used in Example 1 and the coating liquid used in Comparative Example 1 were each applied onto the ITO-coated glass substrate by spin coating, and heat-treated at 230 ° C. for 30 minutes to prepare samples.
The sample and the glass substrate with ITO were subjected to lyophilic treatment and lyophobic treatment under the same conditions as the lyophilic treatment and lyophobic treatment, and the contact angle was measured. As a result, the coating film formed with the coating ink used in Example 1 and the coating liquid used in Comparative Example 1 has a contact angle with water and mesitylene of 90 ° and 40 °, respectively, and exhibits high liquid repellency. It was. On the other hand, the contact angles of water and mesitylene on the glass substrate with ITO were 15 ° and 5 °, respectively, indicating lyophilicity. From these, it was found that a good contact angle contrast was obtained.
The contact angle was measured by the droplet method using OCA20 (manufactured by Eiko Seiki Co., Ltd.).

<Residence rate>
About the base material with a grid | lattice-like partition of each of Example 1 and Comparative Example 1, using a nozzle printer, 1 in the direction of arrow A (the longitudinal direction of the opening) of FIG. 13A so that the nozzle passes once per opening. The lines were applied line by line, and the number of residues (symbol B in FIG. 13B) generated on the grid-like partition was examined.
As the coating ink, a hole transport layer ink and a light emitting layer ink were used. As the hole transport layer ink, a 3,4-polyethylenedioxythiophene-polystyrene sulfonic acid (PEDOT / PSS) solution having a solid content concentration of 1% by mass using water as a solvent was used. As the light emitting layer ink, a polymer organic EL light emitting material solution having a solid content concentration of 1% by mass using mesitylene as a solvent was used. The nozzle printer conditions were a nozzle diameter of 11 μm, a flow rate of 55 μL / min, and a speed of 3 m / sec. After applying these coating inks, the number of residues found on the grid-like partition walls was examined and evaluated using a microscope. The region of 10 columns × 30 rows was divided into 6 regions of 10 columns × 5 rows, and each region was evaluated according to the following criteria. Table 1 shows the evaluation results of the grid-like partition walls of Example 1 for each ink. Table 2 shows the evaluation results of the grid-like partition walls of Comparative Example 1.
○: The number of places with residues is 0 to 1 △: The number of places with residues is 2 to 5 places ×: The number of places with residues is 6 to 50 places

The row numbers were given in order from the end of the formed 30 rows.
From this result, it can be confirmed that the substrate with a partition wall of the present invention is effective in the coating process of the light emitting layer ink having a particularly low surface tension.

(Example 3)
A bottom emission type organic EL display element 20 was formed on a glass substrate 21. The formation method will be described with reference to FIGS. 3A to 3L.

First, a conductive oxide thin film made of ITO is formed on a glass substrate 21 having a thickness of 0.7 mm by DC sputtering at room temperature so as to have a thickness of 200 nm, followed by heat treatment at 250 ° C. for 30 minutes. went.
Next, after applying a photoresist by spin coating, pre-baking was performed at 90 ° C. for 30 minutes. Subsequently, using a photomask, g-line, h-line, and i-line mixed UV light was exposed to 150 mJ / cm ² and developed using a developer NMD-W 2.38 manufactured by Tokyo Ohka Kogyo Co., Ltd., at 120 ° C. Post baking was performed for 30 minutes to form a photoresist pattern. Thereafter, the ITO film in the region where the resist pattern is not formed is removed by RIE (Reactive Ion Etching), and then the resist pattern is removed to form the anode 22 made of the ITO film (FIGS. 3A and 3G). .

  Next, the partition line 23 was formed using the inkjet apparatus. As the coating ink, a coating ink obtained by diluting a photosensitive polyimide solution (DL-1000, manufactured by Toray Industries, Inc.) three times by mass with γ-butyrolactone was used. This coating ink had a solid content concentration of 7% by mass and a viscosity of 10 mPa · s. By repeatedly applying 30 times per line, the partition line 23 was formed (FIGS. 3B and 3H).

Immediately thereafter, the partition lines 24 were formed in the direction orthogonal to the partition lines 23 using the same coating ink. Similar to the partition line 23, the overcoating was performed 30 times per line. By performing heat treatment at 230 ° C. for 30 minutes, the lattice-like partition walls 25 were formed (FIGS. 3C and 3I). A total of 300 openings, 30 rows × 10 columns, were formed. The partition lines 23 and 24 in the non-intersecting region have a width of 32 μm and a height of 2.5 μm. The cross-sectional shape in the direction orthogonal to the longitudinal direction is the center of the line width as shown in FIG. 8B. The arc shape was high and gradually decreased from the width toward the end in the width direction. Further, the maximum height of the partition wall in the intersection region is 3.5 μm, which is 1.0 μm higher than the partition lines 23 and 24 in the non-intersection region, and the opening portion from the point indicating the maximum height as shown in FIG. 8E. It has been found that the height has a slope that gradually decreases.
The shape of the opening was a rectangle of 53 μm × 223 μm.

Next, under the same conditions as in Example 1, oxygen plasma treatment and CF ₄ plasma treatment were performed, and the lyophilic treatment of the anode 22 and the liquid repellent treatment of the lattice-like partition walls 25 were performed.

  Subsequently, after applying a 3,4-polyethylenedioxythiophene-polystyrene sulfonic acid (PEDOT / PSS) solution (hole transport layer ink) having a solid content concentration of 1% by mass using water as a solvent, using a nozzle printer, A hole transport layer 26 was formed by heat treatment at 200 ° C. for 10 minutes (FIGS. 3D and 3J).

  Subsequently, the light emitting layer ink of each of the red light emitting layer (R), the green light emitting layer (G), and the blue light emitting layer (B) (polymer organic EL light emitting material solution having a solid content concentration of 1% by mass using mesitylene as a solvent). Were applied to a predetermined region in the order of the red light emitting layer (R), the green light emitting layer (G), and the blue light emitting layer (B), followed by heat treatment at 200 ° C. for 10 minutes to form the light emitting layer 27 (FIG. 3E and FIG. 3K).

  Finally, silver (Ag) -magnesium (Mg) was deposited by vapor deposition using a metal mask to form the cathode 28, thereby producing a full-color organic EL display element 20 (FIGS. 3F and 3L).

  On the grid-like partition walls 25, no residue due to the coating ink when forming the hole transport layer 26 and the light emitting layer 27 was observed. Therefore, the desired hole transport layer 26 and the light emitting layer 27 are uniformly formed in each region partitioned by the partition wall, and the obtained organic EL display element 20 has bottom emission that does not blur and display unevenness. It showed good light emission characteristics of the mold.

Example 4
A top emission type organic EL display element 20 was formed on a glass substrate 21. The formation method will be described with reference to FIGS. 6A to 6J.

  First, partition lines 23 were formed on a glass substrate 21 having a thickness of 0.7 mm using an ink jet apparatus. As a coating ink, a photosensitive polyimide solution (DL-1000, manufactured by Toray Industries, Inc.) is diluted 3 times by mass with γ-butyrolactone, and a liquid repellent material (KBM-7103, manufactured by Shin-Etsu Chemical Co., Ltd.) is added. The applied ink was used. This coating ink had a solid content concentration of 7% by mass and a viscosity of 10 mPa · s. The partition wall line 23 was formed by overcoating 30 times per line.

Immediately thereafter, the partition lines 24 were formed in the direction orthogonal to the partition lines 23 using the same coating ink. Similar to the partition line 23, the overcoating was performed 30 times per line. By performing heat treatment at 230 ° C. for 30 minutes, the lattice-like partition walls 25 were formed (FIGS. 6A and 6F). A total of 300 openings, 30 rows × 10 columns, were formed. The partition lines 23 and 24 in the non-intersecting region have a width of 32 μm and a height of 2.5 μm. The cross-sectional shape in the direction orthogonal to the longitudinal direction is the center of the line width as shown in FIG. 8B. The arc shape was high and gradually decreased from the width toward the end in the width direction. Further, the maximum height of the partition wall in the intersection region is 3.5 μm, which is 1.0 μm higher than the partition lines 23 and 24 in the non-intersection region, and the opening portion from the point indicating the maximum height as shown in FIG. 8E. It has been found that the height has a slope that gradually decreases.
The shape of the opening was a rectangle of 53 μm × 223 μm.

Next, the surface of the partition lines 23 and 24 and the glass substrate 21 was modified by UV irradiation treatment (accumulated dose 1 J / cm ² ), and then the anode 22 was formed using nano silver (Ag) metal ink. Specifically, nano-Ag ink (NPS-J, manufactured by Harima Kasei Co., Ltd.) is discharged using a droplet discharge method apparatus so as to spread over the entire area partitioned by the lattice-like partition wall 25, and subsequently at 180 ° C. The anode 22 was formed by performing heat treatment for 30 minutes (FIGS. 6B and 6G).

Subsequently, after surface modification of the partition lines 23 and 24 and the anode 22 by UV irradiation treatment (accumulated dose 1 J / cm ² ), using a nozzle printer, a solid content concentration of 3% by mass using water as a solvent is obtained. A 4-polyethylenedioxythiophene-polystyrene sulfonic acid (PEDOT / PSS) solution (hole transport layer ink) was applied, and heat treatment was further performed at 200 ° C. for 10 minutes to form the hole transport layer 26 (FIG. 6C and FIG. 6H).

  Subsequently, the light emitting layer ink of each of the red light emitting layer (R), the green light emitting layer (G), and the blue light emitting layer (B) (polymer organic EL light emitting material solution having a solid content concentration of 1% by mass using mesitylene as a solvent). Were applied to a predetermined region in the order of the red light emitting layer (R), the green light emitting layer (G), and the blue light emitting layer (B), followed by heat treatment at 200 ° C. for 10 minutes to form the light emitting layer 27 (FIG. 6D and FIG. 6I).

  Finally, translucent silver (Ag) -magnesium (Mg) was deposited by vapor deposition using a metal mask to form the cathode 28, thereby producing a full-color organic EL display element 20 (FIGS. 6E and 6J). .

  On the grid-like partition walls 25, no residue due to the coating ink when forming the hole transport layer 26 and the light emitting layer 27 was observed. Therefore, the desired hole transport layer 26 and the light emitting layer 27 are uniformly formed in each region partitioned by the partition walls, and the obtained organic EL display element 20 has a top emission that is free from bleeding and display unevenness. It showed good light emission characteristics of the mold.

(Example 5)
A color filter 30 was formed on the glass substrate 31. A formation method will be described with reference to FIGS. 7A to 7F.

  First, partition lines 32 were formed on a glass substrate 31 having a thickness of 0.7 mm using an inkjet apparatus. As the coating ink, a coating ink in which a photosensitive polyimide solution (DL-1000, manufactured by Toray Industries, Inc.) was diluted three times by mass with γ-butyrolactone and carbon black was further added was used. This coated ink had a solid content concentration of 8% by mass and a viscosity of 13 mPa · s. The partition line 32 was formed by repeatedly applying 30 times per line (FIGS. 7A and 7D).

Immediately after that, the partition line 33 was formed in the direction orthogonal to the partition line 32 using the same coating ink. Similar to the partition line 32, overcoating was performed 30 times per line. By performing heat treatment at 230 ° C. for 30 minutes, the lattice-like partition walls 34 were formed (FIGS. 7B and 7E). A total of 300 openings, 30 rows × 10 columns, were formed. The partition lines 33 and 34 in the non-intersecting region have a width of 32 μm and a height of 3.0 μm, and the cross-sectional shape in the direction orthogonal to the longitudinal direction is the center of the line width as shown in FIG. 8B. The arc shape was high and gradually decreased from the width toward the end in the width direction. Further, the maximum height of the partition wall in the intersecting region is 4.0 μm, which is 1.0 μm higher than the partition lines 33 and 34 in the non-intersecting region, and the opening portion from the point indicating the maximum height as shown in FIG. 8E. It has been found that the height has a slope that gradually decreases.
The shape of the opening was a rectangle of 53 μm × 223 μm.

Next, under the same conditions as in Example 1, oxygen plasma treatment and CF ₄ plasma treatment were performed to perform lyophilic treatment of the glass substrate 31 and lyophobic treatment of the lattice-like partition walls 34.

  Subsequently, each dye layer ink prepared by dissolving the dye materials of the red dye layer (R), the green dye layer (G), and the blue dye layer (B) in propylene glycol monomethyl ether acetate (PGMEA) is used with a nozzle printer. Then, the red dye layer (R), the green dye layer (G), and the blue dye layer (B) are applied in order to a predetermined region and subjected to heat treatment at 200 ° C. for 10 minutes to form the dye layer 35. A filter 30 was produced (FIGS. 7C and 7F).

  On the grid-shaped partition walls 34, no residue due to the coating ink when forming the dye layer 35 was observed. Therefore, a desired dye layer 35 is uniformly formed in each region partitioned by the partition walls.

As an aspect of this invention, it is as follows, for example.
<1> A substrate with a partition wall having a substrate and a partition wall formed on the substrate,
The partition has a plurality of first partition lines and a plurality of second partition lines formed in a direction intersecting the first partition lines,
The shape of the cross section in the direction orthogonal to the longitudinal direction of the first partition line and the second partition line in a non-intersecting region where the first partition line and the second partition line do not intersect is the cross section. In the shape where the height gradually decreases from the position where the height is the maximum toward the end in the width direction of the cross section,
A maximum height of the partition wall in an intersecting region where the first partition line and the second partition line intersect is higher than a maximum height of the partition wall in the non-intersecting region;
The shape of the crossing region is an arbitrary cross section passing through a perpendicular drawn from the highest point where the height of the partition wall is maximum in the crossing region to the surface of the base material, and the end in the width direction of the cross section from the highest point It is the base material with a partition characterized by the shape which height becomes low gradually toward a part.
<2> The partition wall-attached substrate according to <1>, wherein the partition wall is liquid repellent.
<3> The partition wall-attached substrate according to any one of <1> to <2>, wherein the maximum height of the partition wall in the non-intersecting region is 1.0 μm or more.
<4> The substrate with a partition wall according to any one of <1> to <3>,
A lower electrode formed in a region partitioned by a partition wall of the substrate with the partition wall;
An organic EL layer formed on the lower electrode;
A display element having an upper electrode formed on the organic EL layer.
<5> The substrate with a partition wall according to any one of <1> to <3>,
A color filter comprising: a dye layer formed in a region partitioned by a partition wall of the substrate with the partition wall.
<6> A display element comprising the color filter according to <5>.
<7> A method for manufacturing a substrate with a partition wall, wherein a droplet discharged by a droplet discharge device is applied on a substrate to form a partition wall,
A plurality of first partition lines are formed by discharging droplets from the droplet discharge device while moving the discharge port of the droplet discharge device relative to the substrate in a first direction. 1 partition line forming step;
A plurality of second droplets are discharged from the droplet discharge device while moving the discharge port of the droplet discharge device relative to the substrate in a second direction intersecting the first direction. A second partition line forming step of forming two partition lines,
The substrate with a partition wall is a substrate with a partition wall according to any one of <1> to <3>.

DESCRIPTION OF SYMBOLS 11 Glass substrate 12 Partition line 13 Partition line 14 Grid-shaped partition 20 Organic EL display element 21 Glass substrate 22 Anode 23 Partition line 24 Partition line 25 Grid-shaped partition 26 Hole transport layer 27 Light emitting layer 28 Cathode 31 Glass substrate 32 Partition line 33 Partition line 34 Grid partition 35 Dye layer 30 Color filter

Japanese Patent No. 4305478 JP 2011-170249 A JP 2009-259570 A Japanese Patent No. 3328297

Claims (7)

A substrate with a partition wall having a substrate and a partition wall formed on the substrate,
The partition has a plurality of first partition lines and a plurality of second partition lines formed in a direction intersecting the first partition lines,
The shape of the cross section in the direction orthogonal to the longitudinal direction of the first partition line and the second partition line in a non-intersecting region where the first partition line and the second partition line do not intersect is the cross section. In the shape where the height gradually decreases from the position where the height is the maximum toward the end in the width direction of the cross section,
A maximum height of the partition wall in an intersecting region where the first partition line and the second partition line intersect is higher than a maximum height of the partition wall in the non-intersecting region;
The shape of the crossing region is an arbitrary cross section passing through a perpendicular drawn from the highest point where the height of the partition wall is maximum in the crossing region to the surface of the base material, and the end in the width direction of the cross section from the highest point A base material with a partition wall, characterized in that the height gradually decreases toward the part.   The substrate with a partition according to claim 1, wherein the partition is liquid repellent.   The base material with a partition according to claim 1, wherein the maximum height of the partition in the non-intersecting region is 1.0 μm or more. A substrate with a partition wall according to any one of claims 1 to 3,
A lower electrode formed in a region partitioned by a partition wall of the substrate with the partition wall;
An organic EL layer formed on the lower electrode;
A display element comprising an upper electrode formed on the organic EL layer. A substrate with a partition wall according to any one of claims 1 to 3,
A color filter comprising: a dye layer formed in a region partitioned by a partition wall of the substrate with the partition wall.   A display element comprising the color filter according to claim 5. A method of manufacturing a substrate with a partition wall by applying droplets discharged by a droplet discharge device on a substrate to form a partition wall,
A plurality of first partition lines are formed by discharging droplets from the droplet discharge device while moving the discharge port of the droplet discharge device relative to the substrate in a first direction. 1 partition line forming step;
A plurality of second droplets are discharged from the droplet discharge device while moving the discharge port of the droplet discharge device relative to the substrate in a second direction intersecting the first direction. A second partition line forming step of forming two partition lines,
The said base material with a partition is a base material with a partition in any one of Claim 1 to 3, The manufacturing method of the base material with a partition characterized by the above-mentioned.