CN108133190A - Optical finger print chip-packaging structure - Google Patents
Optical finger print chip-packaging structure Download PDFInfo
- Publication number
- CN108133190A CN108133190A CN201711413525.8A CN201711413525A CN108133190A CN 108133190 A CN108133190 A CN 108133190A CN 201711413525 A CN201711413525 A CN 201711413525A CN 108133190 A CN108133190 A CN 108133190A
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- China
- Prior art keywords
- optical sensor
- bare chip
- light source
- chip
- plastic
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Image Input (AREA)
Abstract
The invention discloses a kind of optical finger print chip-packaging structures, including substrate, optical sensor bare chip, the plastic-sealed body of transparent light transmission, several linear light source LED light, in the middle part of the optical sensor bare chip attachment to the upper surface of base plate, several linear light source LED light are distributed in around the optical sensor bare chip and are electrically connected at the upper surface of base plate, the plastic-sealed body will be combined after the optical sensor bare chip and several linear light source LED light plastic packagings package with the upper surface of base plate, form an overall structure；The optical sensor bare chip includes body part and the diffusing reflection portion with body part setting in a certain angle, the linear light source LED light sends out straight rays and is reflected into the corresponding finger induction region in the plastic-sealed body surface via the diffusing reflection portion, and the induction zone from finger pinhole imaging system to the optical sensor bare chip is identified.Overall package of the present invention simplifies stacked structure, reduces module group assembling flow, reduces production cost.
Description
Technical field
The present invention relates to fingerprint recognition module technical fields, are specifically related to a kind of optical finger print chip-packaging structure.
Background technology
Along with the rapid development in mobile Internet epoch, the information exchange between mobile terminal user also increases in formula at double
Long, at the same time all kinds of telecommunication frauds and identity information are stolen event and take place frequently repeatedly, the identification technology of the identity id information of user
The topic that safety problem is held in both hands into the heat to attract the attention of millions of people, in mobile Internet interaction, biological identification technology is led the epoch
Become a kind of emerging interaction technique down by public gradually accreditation, a kind of novel safe and reliable fingerprint identification technology to be existed
Application in each class of electronic devices brings glad tidings for mobile Internet terminal user.
At present, traditional optical finger print chip-packaging structure includes substrate or substrate, optical sensor bare chip (die), EMC
The plastic-sealed body and LED light of material；Wherein, LED light is external；Substrate is penetrated through by via hole, is connected thereto the pad of lower surface；
Optical sensor bare chip is electrically connected to substrate upper table by glue-line attachment to upper surface of base plate, optical sensor bare chip by gold thread
The pad in face；Plastic-sealed body will be combined after optical sensor bare chip, glue-line, gold thread etc. completely plastic packaging package with upper surface of base plate, shape
Into an entirety, LED light is arranged on the substrate in the outside of entire plastic-sealed body, and light source reaches finger surface by the glass on surface layer
It is reflected on optical sensor bare chip.The optical finger print chip package of this structure, because LED light is external, leads to the intensity of light source
Not enough, the stent of making LED light is needed, by LED light secondary welding to substrate, complicated, production technology is complicated, cost
Compare high.
Invention content
In order to solve the above-mentioned technical problem, the present invention proposes a kind of novel optical fingerprint chip-packaging structure, integrally has
More simplified stacked structure, and reduce production procedure, save production cost.
To achieve the above object, the present invention provides following technical solution：A kind of optical finger print chip-packaging structure, including base
Plate, optical sensor bare chip, the plastic-sealed body of transparent light transmission, several linear light source LED light, the optical sensor bare chip attachment are arrived
In the middle part of the upper surface of base plate, several linear light source LED light are distributed in around the optical sensor bare chip and electrically connect
The upper surface of base plate is connected to, the plastic-sealed body wraps up the optical sensor bare chip and several linear light source LED light plastic packagings
It is combined afterwards with the upper surface of base plate, forms an overall structure；The optical sensor bare chip include body part and with described
The diffusing reflection portion of body portion setting in a certain angle, it is anti-via the diffusing reflection portion that the linear light source LED light sends out straight rays
The corresponding finger induction region in the plastic-sealed body surface is mapped to, from finger pinhole imaging system to the sensing of the optical sensor bare chip
Area is identified.
As a kind of preferred embodiment of the present invention, the linear light source LED light is sent out in horizontal direction inwardly
Direct projection light in direct projection to the diffusing reflection portion, is re-reflected into the corresponding finger induction region in the plastic-sealed body surface.
As a kind of preferred embodiment of the present invention, the linear light source LED light is set close to the substrate.
As a kind of preferred embodiment of the present invention, at the linear light source LED light and the optical sensor bare chip
In sustained height.
As a kind of preferred embodiment of the present invention, the substrate is electrically connected thereon by the conductivity through-hole structure of perforation
The pad of lower surface, the optical sensor bare chip are mounted by glue-line to the upper surface of base plate, the optical sensor naked core
Piece is electrically connected to the pad of upper surface of base plate by gold thread.
As a kind of preferred embodiment of the present invention, the substrate is electrically connected thereon by the conductivity through-hole structure of perforation
The pad of lower surface, the optical sensor bare chip by LGA or BGA package mode be mounted on the upper surface of base plate,
Pad electrically directly with the upper surface of base plate is connect.
As a kind of preferred embodiment of the present invention, the material of the plastic-sealed body is glass fibre.
As a kind of preferred embodiment of the present invention, the diffusing reflection portion is in one with the top surface of the body part or ground
Clamp angle is set, and the angular dimension of the angle is determined according to the corresponding finger induction region in the plastic-sealed body surface.
As a kind of preferred embodiment of the present invention, the diffusing reflection portion is fixed using what is pasted with the body part
Mode is fixed on the body part.
Compared with prior art, beneficial effects of the present invention are as follows：Optical finger print chip-packaging structure of the present invention is by optics
It is combined with upper surface of base plate after sensing bare chip and the disposable plastic packaging package of linear light source LED light, is referred to compared to traditional optics
Line chip-packaging structure reduces the structure of module, whole to have more simplified stacked structure, reduces the assembling stream of module
Journey reduces production procedure, has saved and has been produced into.
Description of the drawings
Fig. 1 is one embodiment schematic diagram of optical finger print chip-packaging structure of the present invention；
In figure, 1- substrates, 2- optical sensor bare chips, the plastic-sealed body of the transparent light transmissions of 3-, 4- linear light source LED light, 21- sheets
Body portion, 22- diffusing reflections portion.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1, a kind of optical finger print chip-packaging structure, including substrate 1, optical sensor bare chip 2, glass fibre
The plastic-sealed body 3 of the transparent light transmission of material and several linear light source LED light.The substrate 1 is arrived in the attachment of optical sensor bare chip 2
Upper surface middle part, several linear light source LED light 4 are distributed in around the optical sensor bare chip 2, and be electrically connected at institute
State 1 upper surface of substrate, the plastic-sealed body 3 is by 4 complete plastic packaging packet of the optical sensor bare chip 2 and several linear light source LED light
It is combined after wrapping up in the upper surface of base plate, forms an overall structure；The linear light source LED light 4 sends out the straight line of horizontal direction
Light in direct projection to the optical sensor bare chip 2, is re-reflected into the corresponding finger induction region in 3 surface of plastic-sealed body, from
The induction zone of finger pinhole imaging system to the optical sensor bare chip 2 is identified.Wherein, the linear light source LED light 4 is direct
It is welded in the upper surface of the substrate 1.
The optical sensor bare chip 2 includes body part 21 and is set to the diffusing reflection portion of the surrounding of the body part 21
22.The body part 21 can be any shape.The diffusing reflection portion 22 is in a clamp with the top surface of the body part 21 or ground
Angle is set, and the angular dimension of the angle is determined according to the corresponding finger induction region in 3 surface of plastic-sealed body.The diffusing reflection
Portion 22 is pasted with the body part 21 use or other facilitate the fixed mode of accurate angle to be fixed on the body part 21.Institute
State finger induction region range once it is determined that, the angle of the diffusing reflection portion 22 and the upper and lower surface of the body part 21, that is, true
It is fixed.The light that the horizontal direction that the linear light source LED light 4 emits is propagated reflexes to finger by the diffusing reflection portion 22 and senses
Region, the induction zone from finger pinhole imaging system to the optical sensor bare chip 2 are identified.
In above-described embodiment, the substrate 1 can be electrically connected the pad of its upper and lower surface by the conductivity through-hole structure of perforation,
The attachment of glue-line 8 can be used to the upper surface of base plate in the optical sensor bare chip 2, and the optical sensor bare chip 2 passes through gold
Line is electrically connected to the pad of upper surface of base plate.In other embodiments, substrate 1 is electrically connected it by the conductivity through-hole structure of perforation
The pad of upper and lower surface, optical sensor bare chip 2 are mounted on and the upper surface of base plate, electricity by LGA or BGA package mode
Pad of the property directly with the upper surface of base plate is connect.
The present invention proposes a kind of novel optical fingerprint chip-packaging structure, using the plastic-sealed body 3 of transparent light transmission by optics sense
It is combined after answering bare chip 2 and 4 complete plastic packaging of linear light source LED light package with 1 upper surface of substrate, forms a kind of linear light source
Encapsulating structure built in LED light 4, wherein, linear light source LED light 4 is electrically soldered on substrate 1, and linear light source LED light 4 is sent out
Linear light source diffusing reflection to the corresponding finger induction region in 3 surface of plastic-sealed body, from finger pinhole imaging system to the optical sensor
The induction zone of bare chip 2 is identified.Linear light source LED light is placed in inside plastic-sealed body by encapsulating structure of the present invention, compared to biography
The optical finger print chip-packaging structure of system reduces the structure of module, whole to have more simplified stacked structure, reduces mould
The assembling flow path of group；And compared to traditional optical finger print chip package, an encapsulated moulding does not need to again weld LED light
It connects, and reduces production procedure, saved production cost.And in the present embodiment, as long as linear light source LED light 4 is arranged in
The outside of the optical sensor bare chip 2, positioning is simple and convenient and without other optical reflection elements of recalibration, significantly
The difficulty for simplifying optical finger print chip package.
Finally it should be noted that：The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify to the technical solution recorded in foregoing embodiments or carry out equivalent replacement to which part technical characteristic.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in the present invention's
Within protection domain.
Claims (9)
1. a kind of optical finger print chip-packaging structure, including substrate (1), optical sensor bare chip (2), transparent light transmission plastic packaging
Body (3), several linear light source LED light (4), the optical sensor bare chip attachment to upper surface of base plate middle part, Ruo Gansuo
It states linear light source LED light to be distributed in around the optical sensor bare chip and be electrically connected at the upper surface of base plate, the modeling
Envelope body will be combined after the optical sensor bare chip and several linear light source LED light plastic packagings package with the upper surface of base plate, shape
Integral structure；It is characterized in that：The optical sensor bare chip (2) including body part (21) and with the body part (21)
The diffusing reflection portion (22) of setting in a certain angle, the linear light source LED light (4) send out straight rays via the diffusing reflection portion
(22) the corresponding finger induction region in the plastic-sealed body (3) surface is reflected into, it is naked from finger pinhole imaging system to the optical sensor
The induction zone of chip is identified.
2. optical finger print chip-packaging structure according to claim 1, it is characterised in that：The linear light source LED light to
Inside sends out the direct projection light in horizontal direction, in direct projection to the diffusing reflection portion (22), is re-reflected into the plastic-sealed body (3) table
The corresponding finger induction region in face.
3. optical finger print chip-packaging structure according to claim 2, it is characterised in that：The linear light source LED light (4)
It is set close to the substrate (1).
4. optical finger print chip-packaging structure according to claim 3, it is characterised in that：The linear light source LED light (4)
With the optical sensor bare chip (2) in sustained height.
5. optical finger print chip-packaging structure according to claim 1, it is characterised in that：The substrate is led by perforation
Electric through-hole structure is electrically connected the pad of its upper and lower surface, and the optical sensor bare chip passes through glue-line (8) attachment to the substrate
Upper surface, the optical sensor bare chip are electrically connected to the pad of upper surface of base plate by gold thread.
6. optical finger print chip-packaging structure according to claim 1, it is characterised in that：The substrate is led by perforation
Electric through-hole structure is electrically connected the pad of its upper and lower surface, and the optical sensor bare chip is mounted on by LGA or BGA package mode
With the upper surface of base plate, electrically the pad directly with the upper surface of base plate connect.
7. optical finger print chip-packaging structure according to claim 1, it is characterised in that：The material of the plastic-sealed body is glass
Glass fiber.
8. optical finger print chip-packaging structure according to claim 1, it is characterised in that：The diffusing reflection portion (22) and institute
Top surface or the ground setting in a certain angle of body part (21) are stated, the angular dimension of the angle is according to the plastic-sealed body (3) table
The corresponding finger induction region in face determines.
9. optical finger print chip-packaging structure according to claim 1, it is characterised in that：The diffusing reflection portion (22) and institute
It states body part (21) and the body part (21) is fixed on using the fixed mode pasted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711413525.8A CN108133190A (en) | 2017-12-24 | 2017-12-24 | Optical finger print chip-packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711413525.8A CN108133190A (en) | 2017-12-24 | 2017-12-24 | Optical finger print chip-packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108133190A true CN108133190A (en) | 2018-06-08 |
Family
ID=62391857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711413525.8A Pending CN108133190A (en) | 2017-12-24 | 2017-12-24 | Optical finger print chip-packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108133190A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105205446A (en) * | 2015-08-19 | 2015-12-30 | 南昌欧菲生物识别技术有限公司 | Fingerprint detection apparatus |
| WO2016144108A1 (en) * | 2015-03-10 | 2016-09-15 | 크루셜텍 (주) | Display device capable of scanning images |
| CN106203408A (en) * | 2016-08-31 | 2016-12-07 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| CN107256401A (en) * | 2017-07-12 | 2017-10-17 | 昆山丘钛微电子科技有限公司 | Optical finger print chip-packaging structure |
-
2017
- 2017-12-24 CN CN201711413525.8A patent/CN108133190A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016144108A1 (en) * | 2015-03-10 | 2016-09-15 | 크루셜텍 (주) | Display device capable of scanning images |
| CN105205446A (en) * | 2015-08-19 | 2015-12-30 | 南昌欧菲生物识别技术有限公司 | Fingerprint detection apparatus |
| CN106203408A (en) * | 2016-08-31 | 2016-12-07 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| CN107256401A (en) * | 2017-07-12 | 2017-10-17 | 昆山丘钛微电子科技有限公司 | Optical finger print chip-packaging structure |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180608 |