CN211824746U - Temperature sensor and temperature detection equipment - Google Patents
Temperature sensor and temperature detection equipment Download PDFInfo
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- CN211824746U CN211824746U CN202020610689.0U CN202020610689U CN211824746U CN 211824746 U CN211824746 U CN 211824746U CN 202020610689 U CN202020610689 U CN 202020610689U CN 211824746 U CN211824746 U CN 211824746U
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- temperature sensor
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Abstract
The utility model relates to a packaging field discloses a temperature sensor and temperature-detecting equipment, this temperature sensor, include: a substrate; a light emitting chip on top of the substrate; a bonding pad assembly connected with the light-emitting chip is formed on the substrate; the first plastic packaging layer is arranged on the same layer as the welding pad component; the transparent cover for transmitting infrared rays is fixed on the top of the substrate and covers the outside of the light-emitting chip; surround the translucent cover second plastic envelope all around, the luminous chip that is located the base plate top is connected with the pad subassembly that forms on the base plate, accomplishes luminous chip and base plate connection back, once moulds plastics to the base plate, the first plastic envelope that forms of moulding plastics is the same with layer and thickness with the pad subassembly, the outside cover of luminous chip is equipped with the translucent cover, and the translucent cover is fixed on the base plate, the translucent cover carries out the printing opacity to the light of luminous chip and handles, the translucent cover is for can only passing through infrared ray material to reach and utilize the infrared light to detect the purpose to the human body.
Description
Technical Field
The utility model relates to a technical field of encapsulation, in particular to temperature sensor and temperature-detecting equipment.
Background
Temperature sensors are widely used for temperature detection, such as forehead temperature guns. If a photoelectric device is used for detecting the temperature, infrared light is used for detecting the temperature of human body infrared radiation, and the device has good sensitivity and accuracy.
And for the cartridge structure, if when encapsulating the optoelectronic device, will reduce area greatly, but adopt the plastic envelope material to carry out sealing treatment, the plastic envelope material is light tight material, consequently can't carry out the printing opacity to emitting chip.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a temperature sensor and temperature-detecting equipment has improved temperature sensor's temperature detection's sensitivity and the degree of accuracy.
In order to achieve the above purpose, the utility model provides the following technical scheme:
in a first aspect, the present invention provides a temperature sensor, including: a substrate;
a light emitting chip on top of the substrate;
a bonding pad assembly connected with the light-emitting chip is formed on the substrate;
the first plastic packaging layer is arranged on the same layer as the welding pad component;
the transparent cover for transmitting infrared rays is fixed on the top of the substrate and covers the outside of the light-emitting chip;
and the second plastic packaging layer surrounds the periphery of the transparent cover.
The light-emitting chip on the top of the substrate is connected with the pad component formed on the substrate, after the connection of the light-emitting chip and the substrate is completed, the substrate is subjected to primary injection molding, a first plastic package layer formed by injection molding is identical to the pad component in layer and thickness, a transparent cover is covered outside the light-emitting chip and fixed on the substrate, the transparent cover is used for conducting light transmission treatment on light of the light-emitting chip and is made of a material which can only pass through infrared light, so that the purpose of detecting a human body by utilizing infrared light is achieved, after the fixation of the transparent cover is completed, secondary plastic package is conducted around the transparent cover, the transparent cover exposed at the top can enable light to be transmitted out, and the infrared light transmission effect is achieved.
Further, the height of the second plastic package layer is the same as that of the transparent cover.
Further, the material of the transparent cover is glass.
Further, the shape of the transparent cover is square.
Further, the transparent cover is fixed to the substrate through glue.
Further, the padassembly includes: a pad and a pin pad;
the light-emitting chip is fixedly connected with the bonding pad;
the pin bonding pad is electrically connected with the light-emitting chip.
Further, the pin bonding pad is connected with the light emitting chip through a bonding wire.
Further, the pin pad and the pad are arranged at an interval.
Further, the number of the pin pads is at least two.
In a second aspect, the present invention provides a pair of temperature detecting device, including: a temperature sensor as claimed in any one of the first aspect.
Drawings
Fig. 1 is a cross-sectional view of a temperature sensor according to an embodiment of the present invention;
fig. 2 is a top view of a temperature sensor according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a temperature sensor having a first plastic package layer according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a temperature sensor having a second plastic package layer according to an embodiment of the present invention.
Icon: 100-a light emitting chip; 200-a pad assembly; 210-a pad; 220-pin pad; 300-a first plastic packaging layer; 400-a transparent cover; 500-a second molding compound layer; 600-welding wires; 700-glue; 800-solder layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 to 4, an embodiment of the present invention provides a temperature sensor, including: a substrate;
a light emitting chip 100 on top of the substrate;
a pad assembly 200 connected to the light emitting chip 100 is formed on the substrate;
a first plastic encapsulation layer 300 disposed in the same layer as the pad assembly 200;
a transparent cover 400 for transmitting infrared rays is fixed on the top of the substrate and covers the light emitting chip 100;
and a second molding layer 500 surrounding the transparent cover 400.
It should be noted that, the light emitting chip 100 on the top of the substrate is connected to the pad assembly 200 formed on the substrate, after the connection between the light emitting chip 100 and the substrate is completed, the substrate is subjected to one-step injection molding, the first plastic package layer 300 formed by injection molding is the same layer and thickness as the pad assembly 200, the transparent cover 400 covers the outside of the light emitting chip 100, and the transparent cover 400 is fixed on the substrate, the transparent cover 400 performs light transmission processing on the light of the light emitting chip 100, the transparent cover 400 is made of a material which can only pass through infrared light, so as to achieve the purpose of detecting a human body by using infrared light, after the transparent cover 400 is fixed, secondary plastic packaging is performed around the transparent cover 400, and the transparent cover 400 exposed at the top can transmit light, so as to achieve the effect of transmitting infrared light.
In addition, in order to ensure the light emitting direction of the light emitting chip 100 and improve the light utilization rate, the height of the second plastic package layer 500 is the same as the height of the transparent cover 400, so that the second plastic package layer 500 completely covers the periphery of the transparent cover 400, and the light emitting chip 100 can only be transmitted from the top of the transparent cover 400 without being covered by the second plastic package layer 500.
Specifically, the transparent cover 400 is made of glass. The shape of the transparent cover 400 may be a square, and may be a rectangle or a square, as necessary.
In addition, the transparent cover 400 is fixed on the substrate through a dispensing process, and specifically, the transparent cover 400 is fixed on the substrate through glue 700.
In addition, the pad assembly 200 connected to the light emitting chip 100 herein includes: a pad 210 and a pin pad 220;
the light emitting chip 100 is fixedly connected to the bonding pad 210, specifically, the light emitting chip is soldered to the bonding pad, and a solder layer 800 is formed on the contact surface.
The lead pad 220 is electrically connected to the light emitting chip 100.
Specifically, the lead pad 220 is connected to the light emitting chip 100 by a bonding wire 600, and the lead pad 220 and the pad 210 are spaced apart from each other.
Here, the number of the lead pads 220 is at least two, and a specific lead pad 220 may be two and symmetrically disposed with respect to the pad 210.
About the utility model discloses temperature sensor's manufacturing process specifically as follows:
designing a substrate according to the circuit characteristics and the realization of product performance as starting points, defining the length, width and thickness of the substrate, and reasonably designing the layout of the light-emitting chips 100;
according to the size of the substrate, the layout design of the light emitting chips 100 and the arrangement of the transparent cover 400, the length, width and height of the temperature sensor and the design of the pad assembly 200 are determined, and finally the appearance of the temperature sensor provided by the embodiment of the invention is determined;
designing the positions and sizes of the bonding pad 210 and the pin bonding pad 220 in the bonding pad assembly 200 according to the temperature sensor, and designing the positions of the bonding wires 600 for connecting the pin bonding pad 220 with the light-emitting chip 100;
and designing a mold required by twice injection molding according to the plastic packaging mode of the temperature sensor.
The temperature sensor provided by the embodiment of the present invention firstly completes the assembly of the light emitting chip 100 and the substrate, and then completes the assembly of the bonding pad assembly 200 and the bonding wire 600 on the substrate;
after the bonding wires 600 are welded, an injection molding press, a mold and a plastic package material are used, the substrate is subjected to primary injection molding, then glue dispensing is carried out on the periphery of the light-emitting chip 100, and the contact position of the transparent cover 400 and the substrate is subjected to glue dispensing and fixing; and finally, carrying out secondary plastic package, embedding and packaging the temperature sensor, wherein the height of the second plastic package layer 500 is flush with that of the transparent cover 400 and can not cover the top of the glass cover, and finally, curing and forming the temperature sensor required by design.
In a second aspect, the present invention provides a pair of temperature detecting device, including: a temperature sensor according to any one of the first aspect.
It will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A temperature sensor, comprising: a substrate;
a light emitting chip on top of the substrate;
a bonding pad assembly connected with the light-emitting chip is formed on the substrate;
the first plastic packaging layer is arranged on the same layer as the welding pad component;
the transparent cover for transmitting infrared rays is fixed on the top of the substrate and covers the outside of the light-emitting chip;
and the second plastic packaging layer surrounds the periphery of the transparent cover.
2. The temperature sensor of claim 1, wherein the second molding layer has a height that is the same as a height of the transparent cover.
3. The temperature sensor of claim 1, wherein the material of the transparent cover is glass.
4. The temperature sensor of claim 1, wherein the transparent cover is square in shape.
5. The temperature sensor of claim 1, wherein the transparent cover is secured to the substrate by glue.
6. The temperature sensor of claim 1, wherein the pad assembly comprises: a pad and a pin pad;
the light-emitting chip is fixedly connected with the bonding pad;
the pin bonding pad is electrically connected with the light-emitting chip.
7. The temperature sensor of claim 6, wherein the pin pad and the light emitting die are connected by a wire bond.
8. The temperature sensor of claim 6, wherein the pin pad is spaced apart from the pad.
9. The temperature sensor of claim 6, wherein the number of pin pads is at least two.
10. A temperature detection apparatus, comprising: a temperature sensor according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020610689.0U CN211824746U (en) | 2020-04-21 | 2020-04-21 | Temperature sensor and temperature detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020610689.0U CN211824746U (en) | 2020-04-21 | 2020-04-21 | Temperature sensor and temperature detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211824746U true CN211824746U (en) | 2020-10-30 |
Family
ID=73143301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020610689.0U Active CN211824746U (en) | 2020-04-21 | 2020-04-21 | Temperature sensor and temperature detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211824746U (en) |
-
2020
- 2020-04-21 CN CN202020610689.0U patent/CN211824746U/en active Active
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