CN108091607B - Self-cleaning type silicon wafer overturning mechanism - Google Patents
Self-cleaning type silicon wafer overturning mechanism Download PDFInfo
- Publication number
- CN108091607B CN108091607B CN201810021316.7A CN201810021316A CN108091607B CN 108091607 B CN108091607 B CN 108091607B CN 201810021316 A CN201810021316 A CN 201810021316A CN 108091607 B CN108091607 B CN 108091607B
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- Prior art keywords
- self
- base
- plate
- cleaning
- silicon wafer
- Prior art date
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- 238000004140 cleaning Methods 0.000 title claims abstract description 44
- 230000007246 mechanism Effects 0.000 title claims abstract description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 31
- 239000010703 silicon Substances 0.000 title claims abstract description 31
- 230000007704 transition Effects 0.000 claims abstract description 15
- 238000009826 distribution Methods 0.000 claims abstract description 12
- 230000007306 turnover Effects 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 17
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
Abstract
The invention discloses a self-cleaning silicon wafer overturning mechanism which comprises a base, a fixed seat, an air cylinder, a sliding plate, a support, a servo motor, a first gear, a rotating shaft, a second gear, a transition plate, a clamping jaw air cylinder and a self-cleaning mechanism, wherein the air cylinder can push the support fixedly connected with the sliding plate to move forwards, when the sliding plate triggers a first proximity switch, compressed air is pumped into a flow distribution box through an air inlet pipe, the compressed air is blown out through a flow distribution hole, two self-cleaning mechanisms mutually clean dust on a base plate, then the clamping jaw air cylinder drives the two self-cleaning mechanisms to fold so as to clamp a silicon wafer, then the air cylinder resets, and after the sliding plate triggers a second proximity switch, the servo motor drives the rotating shaft to rotate 180 degrees through the first gear so as to drive the clamping jaw air cylinder for clamping the silicon wafer to overturn 180 degrees. The device simple structure can overturn the silicon chip automatically, and the backing plate of self-cleaning centre gripping silicon chip earlier prevents because the backing plate is not clean secondary pollution that produces moreover when overturning.
Description
Technical Field
The invention relates to a mechanical device, in particular to a self-cleaning silicon wafer overturning mechanism.
Background
In the production of semiconductor devices, silicon wafers are subjected to strict cleaning, trace pollution can also cause device failure, the cleaning aim is to remove surface pollution impurities, the pollution removing method comprises physical cleaning and chemical cleaning, the physical cleaning mainly adopts a scrubbing or scrubbing method to remove the surface impurities of the silicon wafers, in the actual production process, the silicon wafers are often required to be turned 180 degrees when being cleaned, and the traditional method adopts manual turning, so that the efficiency is low and secondary pollution is possible. In view of the above drawbacks, it is necessary to design a self-cleaning silicon wafer turnover mechanism.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the self-cleaning silicon wafer overturning mechanism is provided for solving the problems that the efficiency is low and secondary pollution is possibly caused when the silicon wafer is overturned manually.
In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides a self-cleaning formula silicon chip tilting mechanism, includes base, fixing base, cylinder, sliding plate, support, servo motor, first gear, pivot, second gear, transition board, clamping jaw cylinder, self-cleaning mechanism, the fixing base be located base upper end left side, the fixing base pass through the bolt and link to each other with the base, the cylinder be located the fixing base left side, the cylinder link to each other with the fixing base through the bolt, the sliding plate be located base upper end left side and be located the cylinder right side, the sliding plate link to each other with the cylinder screw thread, the support be located the sliding plate top, support and sliding plate pass through the bolt and link to each other, servo motor be located the support left side, first gear be located the servo motor right side, first gear link to each other with servo motor key, the pivot run through the support, pivot and support rotate and link to each other, the second gear be located first gear lower extreme and run through by the pivot, the second gear link to each other with first gear engagement and link to each other with the key, the transition board be located the cylinder right side, the transition piece is located the transition piece and the transition piece is located the clamping jaw 2, the transition piece is the transition piece with the screw thread that the cylinder is connected with the clamping jaw.
The invention is further improved as follows:
further, the base is also provided with a guide rail, the guide rail is positioned at the upper end of the base, and the guide rail is connected with the base through a bolt.
Furthermore, the base is also provided with a positioning block, the positioning block is positioned on the right side of the upper end of the base, and the positioning block is connected with the base through a bolt.
Further, the positioning block is further provided with a first proximity switch, the first proximity switch penetrates through the positioning block, and the first proximity switch is connected with the positioning block through threads.
Further, the fixing seat is also provided with a second proximity switch, the second proximity switch penetrates through the fixing seat, and the second proximity switch is connected with the fixing seat through threads.
Further, the sliding plate is also provided with a sliding block, the sliding block is positioned at the bottom of the sliding plate and is penetrated by the guide rail, the sliding block is connected with the sliding plate through a bolt, and the sliding block can slide left and right along the guide rail.
Further, self-cleaning mechanism still include connecting plate, be equipped with reposition of redundant personnel case, the backing plate in a plurality of reposition of redundant personnel holes, connecting plate and clamping jaw cylinder's clamping jaw link firmly, the reposition of redundant personnel case be located the connecting plate lower extreme, reposition of redundant personnel case and connecting plate pass through the bolt and link to each other, the backing plate be located the reposition of redundant personnel case lower extreme, backing plate and reposition of redundant personnel case bond and link to each other, the reposition of redundant personnel hole be located the reposition of redundant personnel case lower extreme.
Further, the split flow box is also provided with an air inlet pipe, the air inlet pipe is positioned at the upper end of the split flow box, and the air inlet pipe is connected with the split flow box through threads.
Compared with the prior art, the self-cleaning silicon wafer overturning mechanism has the advantages that the air cylinder can push the support fixedly connected with the sliding plate to move forwards, the first proximity switch is used for setting an overturning starting station, namely, when the sliding plate triggers the first proximity switch, compressed air is pumped into the shunt box through the air inlet pipe and blown out through the shunt hole, the self-cleaning mechanism is arranged on the clamping jaw of the clamping jaw air cylinder in a symmetrical mode, therefore, the self-cleaning mechanism is also symmetrically arranged, when the compressed air is blown out through the shunt hole, two self-cleaning mechanisms mutually clean dust on the base plate, then the clamping jaw air cylinder drives the two self-cleaning mechanisms to fold, so that the silicon wafer is clamped, then the air cylinder resets, and when the sliding plate triggers the second proximity switch, the servo motor drives the rotating shaft fixedly connected with the second gear to rotate 180 degrees through the first gear, so that the clamping jaw air cylinder clamping the silicon wafer is driven to overturn 180 degrees. The device simple structure can overturn the silicon chip automatically, and the backing plate of self-cleaning centre gripping silicon chip earlier prevents because the backing plate is not clean secondary pollution that produces moreover when overturning.
Drawings
FIG. 1 shows a front view of the present invention
FIG. 2 is a schematic view showing the structure of the self-cleaning mechanism of the present invention
In the figure: the self-cleaning device comprises a base 1, a fixed seat 2, an air cylinder 3, a sliding plate 4, a support 5, a servo motor 6, a first gear 7, a rotating shaft 8, a second gear 9, a transition plate 10, a clamping jaw air cylinder 11, a self-cleaning mechanism 12, a guide rail 101, a positioning block 102, a first proximity switch 103, a second proximity switch 201, a sliding block 401, a connecting plate 1201, a distribution box 1202, a base plate 1203, a distribution hole 1204 and an air inlet pipe 1205.
Detailed Description
As shown in fig. 1 and 2, the self-cleaning silicon wafer overturning mechanism comprises a base 1, a fixed seat 2, an air cylinder 3, a sliding plate 4, a support 5, a servo motor 6, a first gear 7, a rotating shaft 8, a second gear 9, a transition plate 10, a clamping jaw air cylinder 11 and a self-cleaning mechanism 12, wherein the fixed seat 2 is positioned at the left side of the upper end of the base 1, the fixed seat 2 is connected with the base 1 through bolts, the air cylinder 3 is positioned at the left side of the fixed seat 2, the air cylinder 3 is connected with the fixed seat 2 through bolts, the sliding plate 4 is positioned at the left side of the upper end of the base 1 and positioned at the right side of the air cylinder 3, the sliding plate 4 is connected with the air cylinder 3 through threads, the support 5 is positioned at the top of the sliding plate 4, the support 5 is connected with the sliding plate 4 through bolts, the servo motor 6 is positioned at the left side of the upper end of the support 5, the servo motor 6 is connected with the support 5 through bolts, the first gear 7 is positioned on the right side of the servo motor 6, the first gear 7 is connected with a servo motor 6 key, the rotating shaft 8 penetrates through the support 5, the rotating shaft 8 is rotationally connected with the support 5, the second gear 9 is positioned at the lower end of the first gear 7 and is penetrated by the rotating shaft 8, the second gear 9 is meshed with the first gear 7 and is connected with the rotating shaft 8 key, the transition plate 10 is positioned on the right side of the rotating shaft 8, the transition plate 10 is connected with the rotating shaft 8 by threads, the clamping jaw cylinder 11 is positioned on the outer side of the transition plate 10, the clamping jaw cylinder 11 is connected with the transition plate 10 by threads, the number of the self-cleaning mechanisms 12 is 2, the self-cleaning mechanisms are respectively fixedly connected with the clamping jaws of the clamping jaw cylinder 1, the base 1 is also provided with a guide rail 101, the guide rail 101 is positioned at the upper end of the base 1, the guide rail 101 is connected with the base 1 by bolts, the base 1 is also provided with a positioning block 102, the positioning block 102 is positioned on the right side of the upper end of the base 1, the positioning block 102 is connected with the base 1 through bolts, the positioning block 102 is also provided with a first proximity switch 103, the first proximity switch 103 penetrates through the positioning block 102, the first proximity switch 103 is connected with the positioning block 102 through threads, the fixed seat 2 is also provided with a second proximity switch 201, the second proximity switch 201 penetrates through the fixed seat 2, the second proximity switch 201 is connected with the fixed seat 2 through threads, the sliding plate 4 is also provided with a sliding block 401, the sliding block 401 is positioned at the bottom of the sliding plate 4 and penetrated by the guide rail 101, the sliding block 401 is connected with the sliding plate 4 through bolts, the sliding block 401 can slide left and right along the guide rail 101, the self-cleaning mechanism 12 further comprises a connecting plate 1201, a flow dividing box 1202 provided with a plurality of flow dividing holes and a base plate 1203, the connecting plate 1201 is fixedly connected with the clamping jaw of the clamping jaw cylinder 11, the split box 1202 is positioned at the lower end of the connecting plate 1201, the split box 1202 is connected with the connecting plate 1201 through bolts, the backing plate 1203 is positioned at the lower end of the split box 1202, the backing plate 1203 is bonded and connected with the split box 1202, the split hole 1204 is positioned at the lower end of the split box 1202, the split box 1202 is also provided with an air inlet pipe 1205, the air inlet pipe 1205 is positioned at the upper end of the split box 1202, the air inlet pipe 1205 is in threaded connection with the split box 1202, the self-cleaning silicon wafer turnover mechanism is characterized in that the cylinder 3 can push the support 5 fixedly connected with the sliding plate 4 to move forwards, the first proximity switch 103 is used for setting a turnover starting station, namely when the sliding plate 4 triggers the first proximity switch 103, compressed air is pumped into the split box 1202 through the air inlet pipe 1205, and the compressed air is blown out through the split hole 1204, since the self-cleaning mechanisms 12 are installed on the clamping jaws of the clamping jaw air cylinders 11 and the clamping jaws are symmetrically arranged, the self-cleaning mechanisms 12 are symmetrically arranged, when compressed air is blown out through the diversion holes 1204, the two self-cleaning mechanisms 12 mutually clean dust on the base plate 1203, then the clamping jaw air cylinders 11 drive the two self-cleaning mechanisms 12 to fold so as to clamp a silicon wafer, then the air cylinders 3 are reset, and when the sliding plate 4 triggers the second proximity switch 201, the servo motor 6 drives the rotating shaft 8 fixedly connected with the second gear 9 to rotate 180 degrees through the first gear 7 so as to drive the clamping jaw air cylinders 11 holding the silicon wafer to turn 180 degrees. The device has simple structure, can automatically turn over the silicon wafer, and automatically cleans the backing plate 1203 holding the silicon wafer during turning over, thereby preventing secondary pollution caused by unclean backing plate 1203.
The present invention is not limited to the above-described specific embodiments, and various modifications may be made by those skilled in the art without inventive effort from the above-described concepts, and are within the scope of the present invention.
Claims (5)
1. The self-cleaning silicon wafer overturning mechanism is characterized by comprising a base, a fixed seat, an air cylinder, a sliding plate, a support, a servo motor, a first gear, a rotating shaft, a second gear, a transition plate, a clamping jaw air cylinder and a self-cleaning mechanism, wherein the fixed seat is positioned on the left side of the upper end of the base; the self-cleaning mechanism also comprises a connecting plate, a flow distribution box provided with a plurality of flow distribution holes and a base plate, wherein the connecting plate is fixedly connected with clamping jaws of the clamping jaw cylinder, the flow distribution box is positioned at the lower end of the connecting plate, the flow distribution box is connected with the connecting plate through bolts, the base plate is positioned at the lower end of the flow distribution box, the base plate is connected with the flow distribution box in an adhesive manner, and the flow distribution hole is positioned at the lower end of the flow distribution box; the split box is also provided with an air inlet pipe, the air inlet pipe is positioned at the upper end of the split box, and the air inlet pipe is connected with the split box through threads; the base is also provided with a guide rail, the guide rail is positioned at the upper end of the base, and the guide rail is connected with the base through a bolt.
2. The self-cleaning silicon wafer overturning mechanism as recited in claim 1, wherein the base is further provided with a positioning block, the positioning block is positioned on the right side of the upper end of the base, and the positioning block is connected with the base through a bolt.
3. The self-cleaning silicon wafer overturning mechanism as recited in claim 2, wherein the positioning block is further provided with a first proximity switch, the first proximity switch penetrates through the positioning block, and the first proximity switch is connected with the positioning block through threads.
4. The self-cleaning silicon wafer turnover mechanism of claim 1, wherein the fixing base is further provided with a second proximity switch, the second proximity switch penetrates through the fixing base, and the second proximity switch is connected with the fixing base through threads.
5. The self-cleaning silicon wafer overturning mechanism as recited in claim 1, wherein the sliding plate is further provided with a sliding block, the sliding block is positioned at the bottom of the sliding plate and penetrated by the guide rail, the sliding block is connected with the sliding plate through a bolt, and the sliding block can slide left and right along the guide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021316.7A CN108091607B (en) | 2018-01-10 | 2018-01-10 | Self-cleaning type silicon wafer overturning mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021316.7A CN108091607B (en) | 2018-01-10 | 2018-01-10 | Self-cleaning type silicon wafer overturning mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108091607A CN108091607A (en) | 2018-05-29 |
| CN108091607B true CN108091607B (en) | 2023-11-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810021316.7A Active CN108091607B (en) | 2018-01-10 | 2018-01-10 | Self-cleaning type silicon wafer overturning mechanism |
Country Status (1)
| Country | Link |
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| CN (1) | CN108091607B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112893299A (en) * | 2021-03-04 | 2021-06-04 | 陈盛发 | Turnover type cleaning equipment for medical equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108091607A (en) | 2018-05-29 |
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Effective date of registration: 20231023 Address after: 247100 Building D1, Environmental Protection Industrial Park, High tech Zone, Chizhou City, Anhui Province Applicant after: CHIZHOU HAILIN CLOTHING CO.,LTD. Applicant after: SUZHOU JUKING TECHNOLOGY Co.,Ltd. Address before: 215000 Shunle Road, Jujin Industrial Park, Taiping Street, Xiangcheng District, Suzhou City, Jiangsu Province Applicant before: SUZHOU JUKING TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20240201 Address after: 247100 Building D1, Environmental Protection Industrial Park, High tech Zone, Chizhou City, Anhui Province Patentee after: CHIZHOU HAILIN CLOTHING CO.,LTD. Country or region after: China Address before: 247100 Building D1, Environmental Protection Industrial Park, High tech Zone, Chizhou City, Anhui Province Patentee before: CHIZHOU HAILIN CLOTHING CO.,LTD. Country or region before: China Patentee before: SUZHOU JUKING TECHNOLOGY Co.,Ltd. |