CN108091607A - A kind of self-cleaning silicon wafer turnover mechanism - Google Patents
A kind of self-cleaning silicon wafer turnover mechanism Download PDFInfo
- Publication number
- CN108091607A CN108091607A CN201810021316.7A CN201810021316A CN108091607A CN 108091607 A CN108091607 A CN 108091607A CN 201810021316 A CN201810021316 A CN 201810021316A CN 108091607 A CN108091607 A CN 108091607A
- Authority
- CN
- China
- Prior art keywords
- self
- cylinder
- sliding panel
- gear
- clamping jaw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 46
- 230000007246 mechanism Effects 0.000 title claims abstract description 39
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 34
- 239000010703 silicon Substances 0.000 title claims abstract description 34
- 230000007306 turnover Effects 0.000 title claims abstract description 19
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000000428 dust Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810021316.7A CN108091607B (en) | 2018-01-10 | 2018-01-10 | Self-cleaning type silicon wafer overturning mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810021316.7A CN108091607B (en) | 2018-01-10 | 2018-01-10 | Self-cleaning type silicon wafer overturning mechanism |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108091607A true CN108091607A (en) | 2018-05-29 |
CN108091607B CN108091607B (en) | 2023-11-21 |
Family
ID=62181883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810021316.7A Active CN108091607B (en) | 2018-01-10 | 2018-01-10 | Self-cleaning type silicon wafer overturning mechanism |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108091607B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112893299A (en) * | 2021-03-04 | 2021-06-04 | 陈盛发 | Turnover type cleaning equipment for medical equipment |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1166348A (en) * | 1956-02-15 | 1958-11-05 | Ici Ltd | Metal drawing device |
JPH11354475A (en) * | 1998-06-03 | 1999-12-24 | Toshiba Mach Co Ltd | Wafer polishing device |
JP2001219391A (en) * | 1999-12-01 | 2001-08-14 | Ses Co Ltd | Substrate reversing device and substrate washing system |
US20050117966A1 (en) * | 2003-11-14 | 2005-06-02 | Herbert Steinbeck | Bolted connection of two components with alignment compensation in three dimensions |
CN2883341Y (en) * | 2005-12-27 | 2007-03-28 | 北京安力斯科技发展有限公司 | Water cooling self cleaning ultraviolet sterilizer |
JP2007273731A (en) * | 2006-03-31 | 2007-10-18 | Komatsu Machinery Corp | Wafer carrying hand |
TWM333964U (en) * | 2007-11-30 | 2008-06-11 | Chandox Prec Ind Co Ltd | An improved structure of vertical pneumatic chuck |
TWM349807U (en) * | 2008-07-15 | 2009-02-01 | Double Dynasty Co Ltd | Rivet fixing machine capable of removing shreds |
CN203062625U (en) * | 2012-12-14 | 2013-07-17 | 重庆诚硕科技有限公司 | Air cylinder pushed clamping device |
CN103522173A (en) * | 2013-09-29 | 2014-01-22 | 新昌县大成自动化设备有限公司 | Full-automatic inner diameter grinding machine of machine tool elastic chuck |
CN204216011U (en) * | 2014-10-23 | 2015-03-18 | 北京七星华创电子股份有限公司 | Silicon chip cleaning device |
CN204974545U (en) * | 2015-04-30 | 2016-01-20 | 中国石油化工股份有限公司 | Windlass steel cable belt cleaning device |
CN106111607A (en) * | 2016-08-30 | 2016-11-16 | 苏州市相城区姑苏线路板厂 | A kind of rotary pcb board automatic clearing apparatus |
CN106783683A (en) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleans swinging arm device |
CN107529286A (en) * | 2017-09-12 | 2017-12-29 | 苏州市吴通电子有限公司 | A kind of vertical pcb board contact cleaning device |
CN207800577U (en) * | 2018-01-10 | 2018-08-31 | 苏州聚晶科技有限公司 | A kind of self-cleaning silicon wafer turnover mechanism |
-
2018
- 2018-01-10 CN CN201810021316.7A patent/CN108091607B/en active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1166348A (en) * | 1956-02-15 | 1958-11-05 | Ici Ltd | Metal drawing device |
JPH11354475A (en) * | 1998-06-03 | 1999-12-24 | Toshiba Mach Co Ltd | Wafer polishing device |
JP2001219391A (en) * | 1999-12-01 | 2001-08-14 | Ses Co Ltd | Substrate reversing device and substrate washing system |
US20050117966A1 (en) * | 2003-11-14 | 2005-06-02 | Herbert Steinbeck | Bolted connection of two components with alignment compensation in three dimensions |
CN2883341Y (en) * | 2005-12-27 | 2007-03-28 | 北京安力斯科技发展有限公司 | Water cooling self cleaning ultraviolet sterilizer |
JP2007273731A (en) * | 2006-03-31 | 2007-10-18 | Komatsu Machinery Corp | Wafer carrying hand |
TWM333964U (en) * | 2007-11-30 | 2008-06-11 | Chandox Prec Ind Co Ltd | An improved structure of vertical pneumatic chuck |
TWM349807U (en) * | 2008-07-15 | 2009-02-01 | Double Dynasty Co Ltd | Rivet fixing machine capable of removing shreds |
CN203062625U (en) * | 2012-12-14 | 2013-07-17 | 重庆诚硕科技有限公司 | Air cylinder pushed clamping device |
CN103522173A (en) * | 2013-09-29 | 2014-01-22 | 新昌县大成自动化设备有限公司 | Full-automatic inner diameter grinding machine of machine tool elastic chuck |
CN204216011U (en) * | 2014-10-23 | 2015-03-18 | 北京七星华创电子股份有限公司 | Silicon chip cleaning device |
CN204974545U (en) * | 2015-04-30 | 2016-01-20 | 中国石油化工股份有限公司 | Windlass steel cable belt cleaning device |
CN106111607A (en) * | 2016-08-30 | 2016-11-16 | 苏州市相城区姑苏线路板厂 | A kind of rotary pcb board automatic clearing apparatus |
CN106783683A (en) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleans swinging arm device |
CN107529286A (en) * | 2017-09-12 | 2017-12-29 | 苏州市吴通电子有限公司 | A kind of vertical pcb board contact cleaning device |
CN207800577U (en) * | 2018-01-10 | 2018-08-31 | 苏州聚晶科技有限公司 | A kind of self-cleaning silicon wafer turnover mechanism |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112893299A (en) * | 2021-03-04 | 2021-06-04 | 陈盛发 | Turnover type cleaning equipment for medical equipment |
Also Published As
Publication number | Publication date |
---|---|
CN108091607B (en) | 2023-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20231023 Address after: 247100 Building D1, Environmental Protection Industrial Park, High tech Zone, Chizhou City, Anhui Province Applicant after: CHIZHOU HAILIN CLOTHING CO.,LTD. Applicant after: SUZHOU JUKING TECHNOLOGY Co.,Ltd. Address before: 215000 Shunle Road, Jujin Industrial Park, Taiping Street, Xiangcheng District, Suzhou City, Jiangsu Province Applicant before: SUZHOU JUKING TECHNOLOGY Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240201 Address after: 247100 Building D1, Environmental Protection Industrial Park, High tech Zone, Chizhou City, Anhui Province Patentee after: CHIZHOU HAILIN CLOTHING CO.,LTD. Country or region after: China Address before: 247100 Building D1, Environmental Protection Industrial Park, High tech Zone, Chizhou City, Anhui Province Patentee before: CHIZHOU HAILIN CLOTHING CO.,LTD. Country or region before: China Patentee before: SUZHOU JUKING TECHNOLOGY Co.,Ltd. |