CN108084908B - Wave absorbing plate - Google Patents

Wave absorbing plate Download PDF

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Publication number
CN108084908B
CN108084908B CN201710724245.2A CN201710724245A CN108084908B CN 108084908 B CN108084908 B CN 108084908B CN 201710724245 A CN201710724245 A CN 201710724245A CN 108084908 B CN108084908 B CN 108084908B
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wave
absorbing
parts
layer
powder
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CN108084908A (en
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金闯
梁豪
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Taicang Sidike New Material Science and Technology Co Ltd
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Taicang Sidike New Material Science and Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/066—Copolymers with monomers not covered by C08L33/06 containing -OH groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/048—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2293—Oxides; Hydroxides of metals of nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate

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  • Chemical & Material Sciences (AREA)
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  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
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Abstract

The invention discloses a high-stability wave absorbing plate, which comprises a graphite sheet as a reflecting layer, a wave absorbing layer and a release material layer; the wave-absorbing layer consists of the following components: the wave-absorbing material comprises wave-absorbing powder, butyl acrylate, acrylic acid, isooctyl acrylate, methyl methacrylate, vinyl acetate, 2-hydroxyethyl methacrylate, sodium polyacrylate and methyl ethyl ketone peroxide; the wave-absorbing powder consists of the following components: BaFe12O19Nickel sesquioxide, nano graphite powder, cobalt naphthanate, unsaturated polyester and acrylic flatting agent; BaFe in the wave-absorbing powder12O19Nickel sesquioxide, nano graphite powder and cobalt naphthoate are mixed according to the weight ratio of 10: 4: 1: 2 parts by weight are mixed. The attenuation rate of the wave-absorbing patch in 2-10 GHz electromagnetic waves reaches 88%, so that the wave-absorbing patch is beneficial to polymer adhesion and heat generated by the electromagnetic waves is also beneficial to spreading.

Description

Wave absorbing plate
Technical Field
The invention belongs to the technical field of electronic materials, and particularly relates to a wave absorbing plate.
Background
With the development of the electronic industry, more and more electronic and electrical products have come into people's lives, and the influence of electromagnetic radiation brought by the products on the environment is increasing. Electromagnetic waves released by electronic products can bring electromagnetic interference to other surrounding electronic equipment, so that the electronic equipment works abnormally; and also can cause harm to human health. Therefore, the development of a wave-absorbing material capable of attenuating electromagnetic radiation has been a hot topic of material science attention.
The wave-absorbing material is a material capable of effectively absorbing incident electromagnetic waves and attenuating the incident electromagnetic waves, and the incident electromagnetic waves are converted into heat energy or other energy forms through different loss mechanisms so as to achieve the purpose of absorbing waves. Among the wave-absorbing materials, the patch type wave-absorbing material has the advantages of thin thickness, convenient use, good effect on reducing electromagnetic radiation and preventing electromagnetic interference, and is more suitable for being applied to electronic products. The mainstream trend of the development of electronic products is miniaturization and high integration, and the internal space of the products is relatively narrow. Therefore, it is the biggest problem to make the material thin enough to ensure the wave absorbing performance.
Disclosure of Invention
The invention provides a wave absorbing plate, wherein the attenuation rate of 2-10 GHz electromagnetic waves of the wave absorbing plate reaches 88%, so that the wave absorbing plate is beneficial to polymer adhesion, and mixed powder is uniformly dispersed in a polymer, so that the reliability of electromagnetic performance is ensured.
In order to achieve the purpose, the invention adopts the technical scheme that: a wave absorbing plate comprises a graphite sheet, a wave absorbing layer and a release material layer which are used as reflecting layers, wherein a first adhesive layer is arranged between the graphite sheet and the wave absorbing layer; a second adhesive layer is arranged between the wave absorbing layer and the release material layer;
the wave-absorbing layer consists of the following components: 100 parts of wave-absorbing powder, 20 parts of butyl acrylate, 10 parts of acrylic acid, 25 parts of isooctyl acrylate, 18 parts of methyl methacrylate, 1 part of vinyl acetate, 0.2 part of 2-hydroxyethyl methacrylate, 1.5 parts of sodium polyacrylate and 0.6 part of methyl ethyl ketone peroxide;
the wave-absorbing powder consists of the following components:
BaFe12O19100 parts of (a) a water-soluble polymer,
38-42 parts of nickel sesquioxide,
9-12 parts of nano graphite powder,
18-22 parts of cobalt naphthoate,
50-60 parts of unsaturated polyester,
40-50 parts of an acrylic leveling agent.
The technical scheme of further improvement in the technical scheme is as follows:
1. in the scheme, BaFe in the wave-absorbing powder12O19Nickel sesquioxide, nano graphite powder and cobalt naphthoate are mixed according to the weight ratio of 10: 4: 1: 2 parts by weightAnd (4) mixing.
2. In the above scheme, the release material layer is a release paper layer or a release film layer.
3. In the above scheme, the first adhesive layer and the second adhesive layer are both acrylate adhesive layers.
4. In the scheme, the unsaturated polyester is synthesized from maleic anhydride, phthalic anhydride and propylene glycol.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the wave absorbing layer of the wave absorbing plate adopts composite wave absorbing powder BaFe12O19100 parts of nickel oxide, nano graphite powder, 20-35 parts of cobalt naphthoate and butyl acrylate, 10-20 parts of acrylic acid, 20-35 parts of isooctyl acrylate, 10-30 parts of methyl methacrylate, 1-3 parts of vinyl acetate and 0.1-1 part of 2-hydroxyethyl methacrylate, has strong electromagnetic wave absorption property, has an attenuation rate of 88% at 2-10 GHz electromagnetic wave, is further added with 0.5-2 parts of sodium polyacrylate and 0.4-1 part of methyl ethyl ketone peroxide, is beneficial to polymer adhesion, and enables the mixed powder to be uniformly dispersed in the polymer, thereby ensuring the reliability of the electromagnetic property; and secondly, unsaturated polyester and an acrylic leveling agent are further added in the formula, so that the heat conductivity of the whole wave absorbing layer is improved, the heat generated by electromagnetic waves is favorably diffused, the stability of the performance is improved, and the service life of the product is prolonged.
2. The wave absorbing plate comprises a graphite sheet serving as a reflecting layer, a wave absorbing layer and a release material layer, wherein a first adhesive layer is arranged between the graphite sheet and the wave absorbing layer; a second adhesive layer is arranged between the wave absorbing layer and the release material layer; the material thickness is very thin, and the total thickness is less than 0.8 mm; the arrangement of the reflecting layer can form multiple absorption, so that the wave absorbing performance of the material is obviously improved; the arrangement of the insulating layer improves the appearance of the wave-absorbing patch, and the voltage breakdown resistance effect of the wave-absorbing patch is improved while the wave-absorbing patch effectively absorbs electromagnetic waves.
Detailed Description
The invention is further described below with reference to the following examples:
example (b): a wave absorbing plate comprises a graphite sheet, a wave absorbing layer and a release material layer which are used as reflecting layers, wherein a first adhesive layer is arranged between the graphite sheet and the wave absorbing layer; a second adhesive layer is arranged between the wave absorbing layer and the release material layer;
the components and contents of the wave-absorbing layer are shown in table 1:
TABLE 1
Examples
Wave-absorbing powder 100 portions of
Acrylic acid butyl ester 20 portions of
Acrylic acid 10 portions of
Acrylic acid isooctyl ester 25 portions of
Methacrylic acid methyl ester 18 portions of
Vinyl acetate 1 part of
2-Hydroxyethyl methacrylate 0.2 part
Polyacrylamide sodium salt 1.5 parts of
Methyl ethyl ketone peroxide 0.6 part
The wave-absorbing powder comprises the following components in percentage by weight shown in Table 2:
TABLE 2
Examples
BaFe12O19 100 portions of
Nickel oxide 38 portions of
Nano graphite powder 12 portions of
Cobalt naphthanate 19 portions of
Unsaturated polyester 52 portions of
Acrylic leveling agent 40 portions of
The thickness of the first adhesive layer is smaller than that of the second adhesive layer, and the thickness of the second adhesive layer is smaller than that of the third adhesive layer.
The thickness ratio of the PET insulating layer to the polypropylene film layer is 10: 4 to 6.
The unsaturated polyester is synthesized from maleic anhydride, phthalic anhydride and propylene glycol.
The maximum reflection coefficient and the effective bandwidth of the embodiments 1 to 4 in the frequency band of 2 to 18GHz are shown in Table 3:
TABLE 3
Figure DEST_PATH_IMAGE002
The wave absorbing layer converts electromagnetic waves released by electronic products into heat energy or energy in other forms in the modes of electric loss, magnetic loss and the like so as to achieve the effect of reducing electromagnetic radiation, has better absorption in the range of 2-18 GHz, and can reflect incident electromagnetic waves back to the wave absorbing layer to form multiple absorption.
The thickness of the PET insulating layer 1 is 6 microns; the thickness ratio of the PET insulating layer 1 to the polypropylene film layer 10 is 10: 5.
the preparation process of the wave absorbing layer in the protective adhesive tape with the wave absorbing function comprises the following steps:
the first step is as follows: mixing BaFe12O19Uniformly mixing nickel oxide, nano graphite powder, cobalt naphthanate, unsaturated polyester and an acrylic flatting agent, and stirring at 84-86 ℃ to form mixed powder;
the second step is that: mixing butyl acrylate, acrylic acid, isooctyl acrylate, methyl methacrylate, vinyl acetate, 2-hydroxyethyl methacrylate and sodium polyacrylate with the mixed powder in the first step, and dispersing for 1-2 hours by a high-speed stirrer to uniformly mix to form a mixture;
the third step: heating the mixture obtained in the second step to 80-85 ℃ in a reaction kettle, preserving heat, and adding methyl ethyl ketone peroxide for 1-3 times in the heat preservation process to obtain a wave-absorbing mixed solution, wherein the heat preservation time is 4-10 hours;
the fourth step: coating the wave-absorbing mixed liquid obtained in the third step on a substrate;
the fifth step: and baking the wave-absorbing mixed liquid in the fourth step to form a wave-absorbing layer.
When the wave absorbing plate is adopted, the wave absorbing plate has a strong electromagnetic wave absorption characteristic, the attenuation rate of 2-10 GHz electromagnetic waves reaches 88%, 0.5-2 parts of sodium polyacrylate and 0.4-1 part of methyl ethyl ketone peroxide are further added, so that the polymer is favorably glued, and the mixed powder is uniformly dispersed in the polymer, so that the reliability of the electromagnetic performance is ensured; and secondly, unsaturated polyester and an acrylic leveling agent are further added in the formula, so that the heat conductivity of the whole wave absorbing layer is improved, the heat generated by electromagnetic waves is favorably diffused, the stability of the performance is improved, and the service life of the product is prolonged.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (1)

1. A wave absorbing plate, characterized by: the composite material comprises a graphite flake, a wave absorbing layer and a release material layer which are used as reflecting layers, wherein a first adhesive layer is arranged between the graphite flake and the wave absorbing layer; a second adhesive layer is arranged between the wave absorbing layer and the release material layer;
the wave-absorbing layer consists of the following components: 100 parts of wave-absorbing powder, 20 parts of butyl acrylate, 10 parts of acrylic acid, 25 parts of isooctyl acrylate, 18 parts of methyl methacrylate, 1 part of vinyl acetate, 0.2 part of 2-hydroxyethyl methacrylate, 1.5 parts of sodium polyacrylate and 0.6 part of methyl ethyl ketone peroxide;
the wave-absorbing powder consists of the following components:
BaFe12O19100 parts of (a) a water-soluble polymer,
38-42 parts of nickel sesquioxide,
9-12 parts of nano graphite powder,
18-22 parts of cobalt naphthoate,
50-60 parts of unsaturated polyester,
40-50 parts of an acrylic leveling agent.
CN201710724245.2A 2015-05-21 2015-05-21 Wave absorbing plate Active CN108084908B (en)

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CN201710724245.2A CN108084908B (en) 2015-05-21 2015-05-21 Wave absorbing plate
CN201510260692.8A CN104893605B (en) 2015-05-21 2015-05-21 Electromagnetic shielding suction wave plate

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CN201510260692.8A Active CN104893605B (en) 2015-05-21 2015-05-21 Electromagnetic shielding suction wave plate
CN201710724858.6A Active CN108093612B (en) 2015-05-21 2015-05-21 Wave-absorbing material for electromagnetic shielding
CN201710724245.2A Active CN108084908B (en) 2015-05-21 2015-05-21 Wave absorbing plate
CN201710724241.4A Active CN108084906B (en) 2015-05-21 2015-05-21 Electromagnetic wave-absorbing plate for electric appliance product
CN201710724243.3A Active CN108084907B (en) 2015-05-21 2015-05-21 Wave-absorbing patch for attenuating electromagnetic radiation
CN201710724199.6A Active CN108617153B (en) 2015-05-21 2015-05-21 Wave-absorbing patch for weakening electromagnetic radiation
CN201710724316.9A Active CN107743357B (en) 2015-05-21 2015-05-21 Wave absorbing plate for electronic product
CN201710724856.7A Active CN107739581B (en) 2015-05-21 2015-05-21 Heat-conducting wave-absorbing patch
CN201710724811.XA Active CN107858115B (en) 2015-05-21 2015-05-21 Patch type wave absorbing material

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CN201510260692.8A Active CN104893605B (en) 2015-05-21 2015-05-21 Electromagnetic shielding suction wave plate
CN201710724858.6A Active CN108093612B (en) 2015-05-21 2015-05-21 Wave-absorbing material for electromagnetic shielding

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CN201710724241.4A Active CN108084906B (en) 2015-05-21 2015-05-21 Electromagnetic wave-absorbing plate for electric appliance product
CN201710724243.3A Active CN108084907B (en) 2015-05-21 2015-05-21 Wave-absorbing patch for attenuating electromagnetic radiation
CN201710724199.6A Active CN108617153B (en) 2015-05-21 2015-05-21 Wave-absorbing patch for weakening electromagnetic radiation
CN201710724316.9A Active CN107743357B (en) 2015-05-21 2015-05-21 Wave absorbing plate for electronic product
CN201710724856.7A Active CN107739581B (en) 2015-05-21 2015-05-21 Heat-conducting wave-absorbing patch
CN201710724811.XA Active CN107858115B (en) 2015-05-21 2015-05-21 Patch type wave absorbing material

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CN108084906B (en) 2020-04-21
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CN107739581B (en) 2020-03-10
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CN108617153A (en) 2018-10-02
CN108093612A (en) 2018-05-29
CN108617153B (en) 2020-03-10
CN108084906A (en) 2018-05-29
CN108084908A (en) 2018-05-29
WO2016184115A1 (en) 2016-11-24
CN107743357A (en) 2018-02-27
CN107858115B (en) 2020-04-21
CN107743357B (en) 2020-03-10
CN108093612B (en) 2020-06-09
CN107858115A (en) 2018-03-30
CN104893605B (en) 2017-10-27
CN108084907A (en) 2018-05-29

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