CN104890320B - The shielding pad pasting of high thermal conductivity coefficient - Google Patents

The shielding pad pasting of high thermal conductivity coefficient Download PDF

Info

Publication number
CN104890320B
CN104890320B CN201510275472.2A CN201510275472A CN104890320B CN 104890320 B CN104890320 B CN 104890320B CN 201510275472 A CN201510275472 A CN 201510275472A CN 104890320 B CN104890320 B CN 104890320B
Authority
CN
China
Prior art keywords
parts
adhesive layer
layer
thermal conductivity
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510275472.2A
Other languages
Chinese (zh)
Other versions
CN104890320A (en
Inventor
金闯
梁豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sidike New Materials Jiangsu Co Ltd
Original Assignee
Sidike New Materials Jiangsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sidike New Materials Jiangsu Co Ltd filed Critical Sidike New Materials Jiangsu Co Ltd
Priority to CN201510275472.2A priority Critical patent/CN104890320B/en
Publication of CN104890320A publication Critical patent/CN104890320A/en
Application granted granted Critical
Publication of CN104890320B publication Critical patent/CN104890320B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric

Abstract

The present invention discloses a kind of shielding pad pasting of high thermal conductivity coefficient, including PET insulating barriers, metal level, suction ripple layer and separated type material layer;The first adhesive layer is provided between PET insulating barriers and metal level, the second adhesive layer is provided between the metal level and suction ripple layer;The suction ripple layer is made up of component:100 parts of wave-absorbing powder, 25 ~ 35 parts of butyl acrylate, 12 ~ 15 parts of acrylic acid, 20 ~ 35 parts of Isooctyl acrylate monomer, 10 ~ 30 parts of methyl methacrylate, 1 ~ 3 part of vinyl acetate, 0.1 ~ 1 part of 2 hydroxyl ethyl ester of methacrylic acid, 0.5 ~ 2 part of Sodium Polyacrylate, 0.4 ~ 1 part of methyl ethyl ketone peroxide, the wave-absorbing powder is composed of the following components:100 parts of barium ferrite powder, 18 ~ 25 parts of nickel sesquioxide, 8 ~ 12 parts of Nano graphite powder, 8 ~ 12 parts of cobalt chloride, 60 ~ 70 parts of unsaturated polyester (UP), 40 ~ 50 parts of neopelex.Present invention, avoiding the excessively concentration of heat, be conducive to heat diffusion, also avoid causing film to upwarp due to temperature rise, improve the stability of properties of product.

Description

The shielding pad pasting of high thermal conductivity coefficient
Technical field
The invention belongs to technical field of electronic materials, more particularly to a kind of high thermal conductivity coefficient shielding pad pasting.
Background technology
The development of electronics and communications industry is advanced by leaps and bounds, and increasing electric equipment products enters the life of common people It is living.These products also bring a distinct issues, i.e. electromagnetic radiation while people's quality of life is improved.Electronics The electromagnetic wave that product is discharged, can bring electromagnetic interference to other electronic equipments of surrounding, make its operation irregularity;Simultaneously also can be right Health causes harm.
For at present, miniaturization, Highgrade integration are the main trend of electronic product development, the inner space of these products It is relatively narrow and small.In absorbing material, patch-type absorbing material thickness of thin is easy to use, for reducing electromagnetic radiation, preventing electromagnetism from doing Good effect is disturbed, has been compared and is suitably applied in electronic product.Therefore, thickness of thin, light weight are designed and developed, suitable for narrow and small The patch-type electromagnetic wave absorbent material in space, as the direction that those skilled in the art make great efforts.
The content of the invention
The present invention provides a kind of shielding pad pasting of high thermal conductivity coefficient, and the shielding pad pasting of this high thermal conductivity coefficient improves metal level The utilization rate of reflection of electromagnetic, significantly improves the absorbing property of Protection glue band, and avoids the excessively concentration of heat, is conducive to Heat diffusion, also avoids causing film to upwarp due to temperature rise, improves the stability of properties of product.
To reach above-mentioned purpose, the technical solution adopted by the present invention is:A kind of shielding pad pasting of high thermal conductivity coefficient, including PET insulating barriers, metal level, suction ripple layer and separated type material layer;The first adhesive layer, institute are provided between PET insulating barriers and metal level State and the second adhesive layer is provided between metal level and suction ripple layer, it is gluing to be provided with the 3rd between the suction ripple layer and separated type material layer Layer;
The suction ripple layer is composed of the following components:
100 parts of wave-absorbing powder,
25 ~ 35 parts of butyl acrylate,
12 ~ 15 parts of acrylic acid,
20 ~ 35 parts of Isooctyl acrylate monomer,
10 ~ 30 parts of methyl methacrylate,
1 ~ 3 part of vinyl acetate,
0.1 ~ 1 part of 2-hydroxyethyl methacry-late,
0.5 ~ 2 part of Sodium Polyacrylate,
0.4 ~ 1 part of methyl ethyl ketone peroxide,
2 ~ 3 parts of polyacrylate dispersion;
The wave-absorbing powder is composed of the following components:
100 parts of barium ferrite powder,
18 ~ 25 parts of nickel sesquioxide,
8 ~ 12 parts of Nano graphite powder,
8 ~ 12 parts of cobalt chloride,
60 ~ 70 parts of unsaturated polyester (UP),
40 ~ 50 parts of neopelex.
Further improved technical scheme is as follows in above-mentioned technical proposal:
1st, in such scheme, in the wave-absorbing powder carbonyl iron dust, nickel sesquioxide, Nano graphite powder and cobalt chloride according to 10:5:0.8:1.2 weight ratios mix.
2nd, in such scheme, the PET thickness of insulating layer is less than 10 microns.
3rd, in such scheme, it is gluing that first adhesive layer, the second adhesive layer and the 3rd adhesive layer are esters of acrylic acid Layer.
4th, in such scheme, the thickness of the thickness less than the second adhesive layer of first adhesive layer, second adhesive layer Thickness be less than the 3rd adhesive layer.
Because above-mentioned technical proposal is used, the present invention has following advantages compared with prior art:
1. the shielding pad pasting of high thermal conductivity coefficient of the present invention, it inhales ripple layer using composite wave-absorbing powder carbonyl iron dust, three oxidations 25 ~ 35 parts of two nickel, Nano graphite powder, cobalt chloride and butyl acrylate, 12 ~ 15 parts of acrylic acid, 20 ~ 35 parts of Isooctyl acrylate monomer, Methyl methacrylate 10 ~ 30, vinyl acetate 1 ~ 3,0.1 ~ 1 part of synergy of 2-hydroxyethyl methacry-late, with stronger Electromaganic wave absorbing property, 87% is reached in the attenuation rate of 2 ~ 10GHz electromagnetic waves, further 0.5 ~ 2 part of Sodium Polyacrylate of addition, mistake 0.4 ~ 1 part of MEKP, 2 ~ 3 parts of polyacrylate dispersion, it is gluing to not only improve polymer, also causes mixed powder in polymerization It is uniformly dispersed in thing, it is to avoid wave-absorbing powder reunion;So as to ensure that the reliability of electromagnetic performance;Secondly, in formula further It is equipped with unsaturated polyester (UP), neopelex and improves the whole heat conductivility for inhaling ripple layer, is conducive to producing electromagnetic wave Heat expanding, improve the stability and product service life of performance.
2. the shielding pad pasting of high thermal conductivity coefficient of the present invention, its mixed powder first passes through 100 parts of barium ferrite powder, three oxidations Two 50 ~ 60 parts of nickel, 5 ~ 10 parts of Nano graphite powder, 10 ~ 15 parts of cobalt chloride, 60 ~ 70 parts of unsaturated polyester (UP), neopelex 40 ~ 50 parts of acquisitions, are conducive to polytype powder to be thoroughly mixed to form specific wave-absorbing powder of the invention, improve magnetic loss Performance, the performance for making it have electrical loss and magnetic loss concurrently, widens absorption band;Secondly, which raises metal layer reflection electromagnetic field Utilization rate, the setting of metal level can form repeatedly absorption, significantly improve the absorbing property for inhaling ripple film;Insulating barrier and PET The intensity that material is improve using one side of film layer, is on the other hand also greatly improved the effect that its proof voltage punctures.
Brief description of the drawings
Accompanying drawing 1 is the shielding film structure schematic diagram of high thermal conductivity coefficient of the present invention.
In the figures above:1st, PET insulating barriers;2nd, metal level;3rd, ripple layer is inhaled;4th, separated type material layer;5th, the first adhesive layer;6、 Second adhesive layer;7th, the 3rd adhesive layer;8th, prismatic protrusions portion.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment the invention will be further described:
Embodiment 1:A kind of shielding pad pasting of high thermal conductivity coefficient, including PET insulating barriers 1, metal level 2, inhale ripple layer 3 and release Material layer 4;The first adhesive layer 5 is provided between PET insulating barriers 1 and metal level 2, is set between the metal level 2 and suction ripple layer 3 There is the second adhesive layer 6, the 3rd adhesive layer 7 is provided between the suction ripple layer 3 and separated type material layer 4.
The component and content for inhaling ripple layer 3 is as shown in table 1:
Table 1
Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4
100 parts of wave-absorbing powder 100 parts 100 parts 100 parts 100 parts
25 ~ 35 parts of butyl acrylate 25 parts 32 parts 30 parts 28 parts
12 ~ 15 parts of acrylic acid 12 parts 15 parts 14 parts 11 parts
20 ~ 35 parts of Isooctyl acrylate monomer 25 parts 22 parts 32 parts 35 parts
10 ~ 30 parts of methyl methacrylate 18 parts 26 parts 12 parts 28 parts
1 ~ 3 part of vinyl acetate 1 part 2.8 parts 1.8 parts 2 parts
0.1 ~ 1 part of 2-hydroxyethyl methacry-late 0.2 part 0.5 part 0.8 part 0.6 part
0.5 ~ 2 part of Sodium Polyacrylate 1.5 parts 2 parts 1.2 parts 0.9 part
0.4 ~ 1 part of methyl ethyl ketone peroxide 0.6 part 0.9 part 0.6 part 0.8 part
2 ~ 3 parts of polyacrylate dispersion 2.6 parts 2 parts 2.2 parts 3 parts
The content groups as shown in Table 2 of the wave-absorbing powder are grouped into:
Table 2
Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4
Barium ferrite powder 100 parts 100 parts 100 parts 100 parts
Nickel sesquioxide 20 parts 22 parts 20 parts 25 parts
Nano graphite powder 10 parts 8 parts 10 parts 9 parts
Cobalt chloride 10 parts 12 parts 10 parts 12 parts
Unsaturated polyester (UP) 60 parts 68 parts 65 parts 62 parts
Neopelex 40 parts 50 parts 48 parts 42 parts
The above-mentioned thickness of PET insulating barriers 1 is 6 microns;First adhesive layer 5, the second adhesive layer 6 and the 3rd adhesive layer 7 are equal It is esters of acrylic acid adhesive layer.
Embodiment 1 ~ 4 is as shown in table 3 in the maximum reflection coefficient and effective bandwidth of 2 ~ 18GHz frequency ranges:
Table 3
Inhale wave plate thickness Maximum reflection coefficient(dB) ≤ -8 dB effective bandwidths(GHz)
Embodiment 1 0.2mm -20 2~10
Embodiment 2 0.4mm -22 2~10
Embodiment 3 0.6mm -28 2~11
Embodiment 4 0.8mm -34 2~12
Inhale ripple layer and the electromagnetic wave that electronic product discharges is converted into heat energy or other forms with modes such as electrical loss, magnetic losses Energy the effect of electromagnetic radiation is reduced to reach, have preferably absorption in the range of 2 ~ 18GHz, can be by incident electromagnetic wave Reflection resorption ripple layer is formed and repeatedly absorbed.
The above-mentioned thickness of PET insulating barriers 1 is 6 microns;The PET insulating barriers 1 are 10 with the thickness ratio of layer of polypropylene foil 10: 5。
Above-described embodiment inhales the preparation technology of ripple layer 3, comprises the following steps:
The first step:By 100 parts of barium ferrite powder, 18 ~ 25 parts of nickel sesquioxide, 8 ~ 12 parts of Nano graphite powder, cobalt chloride 8 ~ 12 parts, 60 ~ 70 parts of unsaturated polyester (UP), 40 ~ 50 parts of neopelex be well mixed, and in 84 ~ 86 DEG C of conditions stirring shapes Into mixed powder;
Second step:By 25 ~ 35 parts of butyl acrylate, 12 ~ 15 parts of acrylic acid, 20 ~ 35 parts of Isooctyl acrylate monomer, metering system Sour methyl esters 10 ~ 30, vinyl acetate 1 ~ 3,0.1 ~ 1 part of 2-hydroxyethyl methacry-late, 0.5 ~ 2 part of Sodium Polyacrylate, polyacrylic acid 2 ~ 3 parts of ester emulsion mixes with the mixed powder of the first step, and disperses 1 ~ 2 hour through high speed agitator, so that well mixed form Mixture;
3rd step:It is incubated after the mixture of second step is heated into 80 ~ 85 DEG C in a kettle., point 1 in insulating process ~ Add for 3 times 0.4 ~ 1 part of methyl ethyl ketone peroxide to obtain and inhale ripple mixed liquor, the soaking time is 4 ~ 10 hours;
4th step:The suction ripple mixed liquor that 3rd step is obtained is coated on substrate;
5th step:Baking is carried out to the suction ripple mixed liquor in the 4th step and forms suction ripple layer.
Using above-mentioned high thermal conductivity coefficient shielding pad pasting when, it is gluing to not only improve polymer, also causes mixed powder poly- It is uniformly dispersed in compound, so as to ensure that the reliability of electromagnetic performance;Secondly, unsaturated polyester (UP), ten are further equipped with formula Dialkyl benzene sulfonic acids sodium improves the whole heat conductivility for inhaling ripple layer, is conducive to the heat expanding for producing electromagnetic wave, improves The stability and product service life of performance.
The above embodiments merely illustrate the technical concept and features of the present invention, its object is to allow person skilled in the art Scholar will appreciate that present disclosure and implement according to this that it is not intended to limit the scope of the present invention.It is all according to the present invention The equivalent change or modification that Spirit Essence is made, should all be included within the scope of the present invention.

Claims (5)

1. the shielding pad pasting of a kind of high thermal conductivity coefficient, it is characterised in that:Including PET insulating barriers(1), metal level(2), inhale ripple layer (3)With separated type material layer(4);PET insulating barriers(1)With metal level(2)Between be provided with the first adhesive layer(5), the metal level (2)With suction ripple layer(3)Between be provided with the second adhesive layer(6), the suction ripple layer(3)With separated type material layer(4)Between be provided with 3rd adhesive layer(7);
The suction ripple layer(3)It is composed of the following components:
100 parts of wave-absorbing powder,
25 ~ 35 parts of butyl acrylate,
12 ~ 15 parts of acrylic acid,
20 ~ 35 parts of Isooctyl acrylate monomer,
10 ~ 30 parts of methyl methacrylate,
1 ~ 3 part of vinyl acetate,
0.1 ~ 1 part of 2-hydroxyethyl methacry-late,
0.5 ~ 2 part of Sodium Polyacrylate,
0.4 ~ 1 part of methyl ethyl ketone peroxide,
2 ~ 3 parts of polyacrylate dispersion;
The wave-absorbing powder is composed of the following components:
100 parts of barium ferrite powder,
18 ~ 25 parts of nickel sesquioxide,
8 ~ 12 parts of Nano graphite powder,
8 ~ 12 parts of cobalt chloride,
60 ~ 70 parts of unsaturated polyester (UP),
40 ~ 50 parts of neopelex.
2. the shielding pad pasting of high thermal conductivity coefficient according to claim 1, it is characterised in that:Barium iron oxygen in the wave-absorbing powder Body powder, nickel sesquioxide, Nano graphite powder and cobalt chloride are according to 10:2:1:1 weight ratio mixes.
3. the shielding pad pasting of high thermal conductivity coefficient according to claim 1, it is characterised in that:The PET insulating barriers(1)Thickness Less than 10 microns.
4. the shielding pad pasting of high thermal conductivity coefficient according to claim 1, it is characterised in that:First adhesive layer(5), Two adhesive layers(6)With the 3rd adhesive layer(7)It is esters of acrylic acid adhesive layer.
5. the shielding pad pasting of high thermal conductivity coefficient according to claim 1, it is characterised in that:First adhesive layer(5)'s Thickness is less than the second adhesive layer(6)Thickness, second adhesive layer(7)Thickness be less than the 3rd adhesive layer(7).
CN201510275472.2A 2015-05-26 2015-05-26 The shielding pad pasting of high thermal conductivity coefficient Active CN104890320B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510275472.2A CN104890320B (en) 2015-05-26 2015-05-26 The shielding pad pasting of high thermal conductivity coefficient

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510275472.2A CN104890320B (en) 2015-05-26 2015-05-26 The shielding pad pasting of high thermal conductivity coefficient

Publications (2)

Publication Number Publication Date
CN104890320A CN104890320A (en) 2015-09-09
CN104890320B true CN104890320B (en) 2017-06-30

Family

ID=54023474

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510275472.2A Active CN104890320B (en) 2015-05-26 2015-05-26 The shielding pad pasting of high thermal conductivity coefficient

Country Status (1)

Country Link
CN (1) CN104890320B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104875441B (en) * 2015-05-26 2017-10-27 江苏斯迪克新材料科技股份有限公司 Use for electronic products shielding protection film
CN106893516A (en) * 2017-04-01 2017-06-27 合肥达悦电子科技有限公司 Shading shielding tape
CN107760217A (en) * 2017-10-30 2018-03-06 东莞市大忠电子有限公司 A kind of high heat conduction isolation strip for transformer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102020899B (en) * 2010-11-26 2012-05-30 中国人民解放军第三军医大学 Composite coating electromagnetic shielding paint and composite coating electromagnetic shielding material prepared therefrom
CN103740233B (en) * 2014-01-08 2016-04-20 南京信息工程大学 A kind of millimeter wave wave-absorbing coating material and preparation method thereof
CN103923337B (en) * 2014-04-30 2016-06-08 湖南兆恒材料科技有限公司 Polymethacrylimide composite foam absorbing material
CN104202956A (en) * 2014-09-01 2014-12-10 斯迪克新型材料(江苏)有限公司 Pressure-sensitive adhesive film with anti-jamming function

Also Published As

Publication number Publication date
CN104890320A (en) 2015-09-09

Similar Documents

Publication Publication Date Title
CN104893605B (en) Electromagnetic shielding suction wave plate
CN104039121A (en) Wave-absorbing magnetic-conductive shielding film and manufacture method thereof
CN105034483B (en) Shielding pad pasting with heat sinking function
CN104890320B (en) The shielding pad pasting of high thermal conductivity coefficient
CN104875441B (en) Use for electronic products shielding protection film
CN104892829B (en) For electromagnetic-field-shielded absorbing material
CN204183968U (en) Composite electromagnetic wave absorbing film
CN106280346B (en) Multifunction electronic product protective film
CN106280345B (en) Pressure sensitive adhesive tape suction wave plate
CN104999735B (en) Composite film-stuck with shielding electromagnetic field function
CN106281072A (en) The pressure-sensitive pad pasting of anti-electromagnetic-radiation type
CN104893606A (en) Broadband wave-absorbing film
CN106279512A (en) The absorbing material of shielding electromagnetic wave
CN204385118U (en) High reliability protective tapes
CN205486006U (en) But mouse pad of absorbed radiation
CN204490786U (en) For the compound adhesive tape of communication product
CN117925146A (en) Low-frequency electromagnetic shielding glue and preparation method and application method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant