CN104893605B - Electromagnetic shielding suction wave plate - Google Patents
Electromagnetic shielding suction wave plate Download PDFInfo
- Publication number
- CN104893605B CN104893605B CN201510260692.8A CN201510260692A CN104893605B CN 104893605 B CN104893605 B CN 104893605B CN 201510260692 A CN201510260692 A CN 201510260692A CN 104893605 B CN104893605 B CN 104893605B
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- China
- Prior art keywords
- parts
- layer
- electromagnetic shielding
- wave
- wave plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010410 layer Substances 0.000 claims abstract description 51
- 239000012790 adhesive layer Substances 0.000 claims abstract description 20
- 229920006305 unsaturated polyester Polymers 0.000 claims abstract description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 15
- GNMQOUGYKPVJRR-UHFFFAOYSA-N nickel(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ni+3].[Ni+3] GNMQOUGYKPVJRR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 12
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 11
- 239000010439 graphite Substances 0.000 claims abstract description 11
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 8
- FUPMSLTYEIZSLZ-UHFFFAOYSA-N cobalt;naphthalene-1-carboxylic acid Chemical compound [Co].C1=CC=C2C(C(=O)O)=CC=CC2=C1 FUPMSLTYEIZSLZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims abstract description 7
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims abstract description 7
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 claims abstract description 6
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical group CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910002771 BaFe12O19 Inorganic materials 0.000 claims abstract description 6
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims abstract description 6
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims abstract description 6
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229940044192 2-hydroxyethyl methacrylate Drugs 0.000 claims description 5
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 3
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 3
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 claims description 3
- 150000002148 esters Chemical group 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 150000008065 acid anhydrides Chemical class 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000003786 synthesis reaction Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 abstract description 8
- 238000004026 adhesive bonding Methods 0.000 abstract description 5
- 239000011812 mixed powder Substances 0.000 abstract description 5
- -1 hydroxyl ethyl Chemical group 0.000 abstract description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract 1
- 239000011358 absorbing material Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N Methyl ethyl ketone Natural products CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/066—Copolymers with monomers not covered by C08L33/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/048—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2293—Oxides; Hydroxides of metals of nickel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | |
Wave-absorbing powder | 100 parts | 100 parts | 100 parts | 100 parts |
Butyl acrylate | 20 parts | 32 parts | 30 parts | 28 parts |
Acrylic acid | 10 parts | 15 parts | 18 parts | 20 parts |
Isooctyl acrylate monomer | 25 parts | 22 parts | 32 parts | 35 parts |
Methyl methacrylate | 18 parts | 26 parts | 12 parts | 28 parts |
Vinyl acetate | 1 part | 2.8 part | 1.8 part | 2 parts |
2-hydroxyethyl methacry-late | 0.2 part | 0.5 part | 0.8 part | 0.6 part |
Sodium Polyacrylate | 1.5 part | 2 parts | 1.2 part | 0.9 part |
Methyl ethyl ketone peroxide | 0.6 part | 0.9 part | 0.6 part | 0.8 part |
Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | |
BaFe12O19 | 100 parts | 100 parts | 100 parts | 100 parts |
Nickel sesquioxide | 38 parts | 40 parts | 42 parts | 40 parts |
Nano graphite powder | 12 parts | 10 parts | 9 parts | 10 parts |
Naphthoic acid cobalt | 19 parts | 20 parts | 22 parts | 20 parts |
Unsaturated polyester (UP) | 52 parts | 60 parts | 55 parts | 50 parts |
Acrylic compounds levelling agent | 40 parts | 50 parts | 48 parts | 42 parts |
Inhale ripple thickness degree | Maximum reflection coefficient(dB) | ≤ -8 dB effective bandwidths(GHz) | |
Embodiment 1 | 0.2mm | -21 | 2~13 |
Embodiment 2 | 0.4mm | -23 | 2~15 |
Embodiment 3 | 0.6mm | -30 | 2~16 |
Embodiment 4 | 0.8mm | -35 | 2~18 |
Claims (5)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710724199.6A CN108617153B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing patch for weakening electromagnetic radiation |
CN201510260692.8A CN104893605B (en) | 2015-05-21 | 2015-05-21 | Electromagnetic shielding suction wave plate |
CN201710724811.XA CN107858115B (en) | 2015-05-21 | 2015-05-21 | Patch type wave absorbing material |
CN201710724245.2A CN108084908B (en) | 2015-05-21 | 2015-05-21 | Wave absorbing plate |
CN201710724856.7A CN107739581B (en) | 2015-05-21 | 2015-05-21 | Heat-conducting wave-absorbing patch |
CN201710724858.6A CN108093612B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing material for electromagnetic shielding |
CN201710724241.4A CN108084906B (en) | 2015-05-21 | 2015-05-21 | Electromagnetic wave-absorbing plate for electric appliance product |
CN201710724316.9A CN107743357B (en) | 2015-05-21 | 2015-05-21 | Wave absorbing plate for electronic product |
CN201710724243.3A CN108084907B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing patch for attenuating electromagnetic radiation |
PCT/CN2015/099353 WO2016184115A1 (en) | 2015-05-21 | 2015-12-29 | Wave absorbing patch for electromagnetic shielding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510260692.8A CN104893605B (en) | 2015-05-21 | 2015-05-21 | Electromagnetic shielding suction wave plate |
Related Child Applications (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710724199.6A Division CN108617153B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing patch for weakening electromagnetic radiation |
CN201710724856.7A Division CN107739581B (en) | 2015-05-21 | 2015-05-21 | Heat-conducting wave-absorbing patch |
CN201710724811.XA Division CN107858115B (en) | 2015-05-21 | 2015-05-21 | Patch type wave absorbing material |
CN201710724316.9A Division CN107743357B (en) | 2015-05-21 | 2015-05-21 | Wave absorbing plate for electronic product |
CN201710724241.4A Division CN108084906B (en) | 2015-05-21 | 2015-05-21 | Electromagnetic wave-absorbing plate for electric appliance product |
CN201710724858.6A Division CN108093612B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing material for electromagnetic shielding |
CN201710724243.3A Division CN108084907B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing patch for attenuating electromagnetic radiation |
CN201710724245.2A Division CN108084908B (en) | 2015-05-21 | 2015-05-21 | Wave absorbing plate |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104893605A CN104893605A (en) | 2015-09-09 |
CN104893605B true CN104893605B (en) | 2017-10-27 |
Family
ID=54026581
Family Applications (9)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710724245.2A Active CN108084908B (en) | 2015-05-21 | 2015-05-21 | Wave absorbing plate |
CN201710724241.4A Active CN108084906B (en) | 2015-05-21 | 2015-05-21 | Electromagnetic wave-absorbing plate for electric appliance product |
CN201710724199.6A Active CN108617153B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing patch for weakening electromagnetic radiation |
CN201710724243.3A Active CN108084907B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing patch for attenuating electromagnetic radiation |
CN201710724316.9A Active CN107743357B (en) | 2015-05-21 | 2015-05-21 | Wave absorbing plate for electronic product |
CN201510260692.8A Active CN104893605B (en) | 2015-05-21 | 2015-05-21 | Electromagnetic shielding suction wave plate |
CN201710724856.7A Active CN107739581B (en) | 2015-05-21 | 2015-05-21 | Heat-conducting wave-absorbing patch |
CN201710724811.XA Active CN107858115B (en) | 2015-05-21 | 2015-05-21 | Patch type wave absorbing material |
CN201710724858.6A Active CN108093612B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing material for electromagnetic shielding |
Family Applications Before (5)
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CN201710724245.2A Active CN108084908B (en) | 2015-05-21 | 2015-05-21 | Wave absorbing plate |
CN201710724241.4A Active CN108084906B (en) | 2015-05-21 | 2015-05-21 | Electromagnetic wave-absorbing plate for electric appliance product |
CN201710724199.6A Active CN108617153B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing patch for weakening electromagnetic radiation |
CN201710724243.3A Active CN108084907B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing patch for attenuating electromagnetic radiation |
CN201710724316.9A Active CN107743357B (en) | 2015-05-21 | 2015-05-21 | Wave absorbing plate for electronic product |
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CN201710724856.7A Active CN107739581B (en) | 2015-05-21 | 2015-05-21 | Heat-conducting wave-absorbing patch |
CN201710724811.XA Active CN107858115B (en) | 2015-05-21 | 2015-05-21 | Patch type wave absorbing material |
CN201710724858.6A Active CN108093612B (en) | 2015-05-21 | 2015-05-21 | Wave-absorbing material for electromagnetic shielding |
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CN108084908B (en) * | 2015-05-21 | 2020-03-10 | 太仓斯迪克新材料科技有限公司 | Wave absorbing plate |
CN108834391B (en) * | 2018-07-25 | 2019-05-14 | 深圳市弘海电子材料技术有限公司 | A kind of novel FPC composite electromagnetic shielding film and preparation method thereof |
CN110065245A (en) * | 2019-05-06 | 2019-07-30 | 衡阳泰豪通信车辆有限公司 | A kind of integrated molding cabin structure and its forming method having stealthy function |
CN110494028A (en) * | 2019-08-22 | 2019-11-22 | 贵州师范大学 | A kind of preparation method of the human body electromagnetic shielding protection patch for touch-screen mobile phone |
CN113133292A (en) * | 2019-12-31 | 2021-07-16 | 航天长屏科技有限公司 | Electromagnetic wave-absorbing material and electromagnetic wave-absorbing patch |
CN113429694B (en) * | 2021-06-15 | 2022-07-26 | 广汽本田汽车有限公司 | Resin composition and preparation method and application thereof |
CN113784606B (en) * | 2021-09-29 | 2024-01-19 | 西安热工研究院有限公司 | Titanium carbide and cobalt-nickel alloy composite wave-absorbing material and preparation method thereof |
CN114213995B (en) * | 2021-12-14 | 2023-05-23 | 武汉康泰威新材料技术有限公司 | Multi-frequency wave-absorbing patch for offshore wind power project and preparation method |
CN114245699A (en) * | 2021-12-15 | 2022-03-25 | 苏州凡赛特材料科技有限公司 | Electromagnetic shielding film and preparation method thereof |
CN114437644A (en) * | 2021-12-31 | 2022-05-06 | 江苏吉腾新材料科技有限公司 | Composite heat dissipation shielding adhesive tape and preparation method thereof |
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CN115746362B (en) * | 2022-09-09 | 2023-07-14 | 东莞市零度导热材料有限公司 | Wave-absorbing heat-conducting sheet and preparation method thereof |
CN116052945B (en) * | 2023-03-07 | 2023-07-14 | 浙江华创视讯科技有限公司 | Cable assembly |
CN117547349B (en) * | 2024-01-10 | 2024-04-26 | 中国科学技术大学 | Laser interstitial thermotherapy device |
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CN201305050Y (en) * | 2008-10-29 | 2009-09-09 | 北京航空航天大学 | Automatic deflation wall-climbing robot vibration adsorption foot |
CN103740233A (en) * | 2014-01-08 | 2014-04-23 | 南京信息工程大学 | Micrometer wave absorbing coating material and preparation method thereof |
CN103923337A (en) * | 2014-04-30 | 2014-07-16 | 湖南兆恒材料科技有限公司 | Composite polymethacrylimide foam wave absorption material |
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CN107743357A (en) | 2018-02-27 |
CN108617153A (en) | 2018-10-02 |
CN104893605A (en) | 2015-09-09 |
CN107739581A (en) | 2018-02-27 |
CN108084907A (en) | 2018-05-29 |
CN107743357B (en) | 2020-03-10 |
CN107858115B (en) | 2020-04-21 |
CN108084906B (en) | 2020-04-21 |
CN108084908A (en) | 2018-05-29 |
CN108084907B (en) | 2020-03-10 |
CN108617153B (en) | 2020-03-10 |
CN108093612A (en) | 2018-05-29 |
CN107858115A (en) | 2018-03-30 |
CN108093612B (en) | 2020-06-09 |
CN108084908B (en) | 2020-03-10 |
CN108084906A (en) | 2018-05-29 |
WO2016184115A1 (en) | 2016-11-24 |
CN107739581B (en) | 2020-03-10 |
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