CN107739581A - High thermal conductivity wave absorbing patch - Google Patents

High thermal conductivity wave absorbing patch Download PDF

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Publication number
CN107739581A
CN107739581A CN201710724856.7A CN201710724856A CN107739581A CN 107739581 A CN107739581 A CN 107739581A CN 201710724856 A CN201710724856 A CN 201710724856A CN 107739581 A CN107739581 A CN 107739581A
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layer
parts
wave
thermal conductivity
high thermal
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CN107739581B (en
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金闯
梁豪
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Taicang Sidike New Material Science and Technology Co Ltd
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Taicang Sidike New Material Science and Technology Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/066—Copolymers with monomers not covered by C08L33/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/048—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2293—Oxides; Hydroxides of metals of nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention discloses a kind of high thermal conductivity wave absorbing patch, including graphite flake, suction ripple layer and separated type material layer as reflecting layer, and the first adhesive layer is provided between the graphite flake, suction ripple layer；The second adhesive layer is provided between the suction ripple layer, separated type material layer；The suction ripple layer is composed of the following components：Wave-absorbing powder, butyl acrylate, acrylic acid, Isooctyl acrylate monomer, methyl methacrylate, vinyl acetate, the hydroxyl ethyl ester of methacrylic acid 2, Sodium Polyacrylate, methyl ethyl ketone peroxide；The wave-absorbing powder is composed of the following components：BaFe12O19, nickel sesquioxide, Nano graphite powder, naphthoic acid cobalt, unsaturated polyester (UP), acrylic compounds levelling agent.Wave absorbing patch of the present invention reaches 88% in the attenuation rate of 2 ~ 10GHz electromagnetic waves, and it is gluing to not only improve polymer, also mixed powder is uniformly dispersed in the polymer, so as to ensure that the reliability of electromagnetic performance.

Description

High thermal conductivity wave absorbing patch
Technical field
The invention belongs to technical field of electronic materials, more particularly to a kind of high thermal conductivity wave absorbing patch.
Background technology
With the development of electronics industry, increasing electric equipment products has come into the life of people, and these products The influence for the Electromagnetic Radiation on Environment brought also increasingly increases.The electromagnetic wave of electronic product release, other electronics of surrounding can be given Equipment belt carrys out electromagnetic interference, makes its operation irregularity；Health can also be damaged simultaneously.Therefore, research and development can weaken electricity The absorbing material of magnetic radiation, have become the heat subject of material science concern.
Absorbing material is a kind of material for referring to effectively absorb incident electromagnetic wave and make it decay, and it passes through different damages Incident electromagnetic wave is changed into heat energy or other form of energy to reach the purpose of suction ripple by consumption mechanism.In absorbing material, paster Type absorbing material thickness of thin, it is easy to use, for reducing electromagnetic radiation, preventing electromagnetic interference from having good effect, relatively it is adapted to Apply in electronic product.And the main trend of electronic product development is miniaturization, Highgrade integration, interiors of products space is relative It is narrow and small.Therefore, on the premise of absorbing property is ensured how by material manufacture enough to it is thin be the biggest problem that people face.
The content of the invention
The present invention provides a kind of high thermal conductivity wave absorbing patch, and the high thermal conductivity wave absorbing patch is in 2 ~ 10GHz electromagnetic waves Attenuation rate reach 88%, it is gluing to not only improve polymer, also mixed powder is uniformly dispersed in the polymer, so as to ensure The reliability of electromagnetic performance.
To reach above-mentioned purpose, the technical solution adopted by the present invention is：A kind of high thermal conductivity wave absorbing patch, including conduct The graphite flake in reflecting layer, ripple layer and separated type material layer are inhaled, the first adhesive layer is provided between the graphite flake, suction ripple layer；It is described Inhale and be provided with the second adhesive layer between ripple layer, separated type material layer；
The suction ripple layer is composed of the following components：
100 parts of wave-absorbing powder,
20 ~ 35 parts of butyl acrylate,
10 ~ 20 parts of acrylic acid,
20 ~ 35 parts of Isooctyl acrylate monomer,
10 ~ 30 parts of methyl methacrylate,
1 ~ 3 part of vinyl acetate,
0.1 ~ 1 part of 2-hydroxyethyl methacry-late,
0.5 ~ 2 part of Sodium Polyacrylate,
0.4 ~ 1 part of methyl ethyl ketone peroxide；
The wave-absorbing powder is composed of the following components：
BaFe12O19100 parts,
38 parts of nickel sesquioxide,
12 parts of Nano graphite powder,
19 parts of naphthoic acid cobalt,
52 parts of unsaturated polyester (UP),
40 parts of acrylic compounds levelling agent.
Further improved technical scheme is as follows in above-mentioned technical proposal：
1st, in such scheme, BaFe in the wave-absorbing powder12O19, nickel sesquioxide, Nano graphite powder and naphthoic acid cobalt be according to 10： 4：1：2 weight ratios mix.
2nd, in such scheme, the separated type material layer is off-style paper layer or release film layer.
3rd, in such scheme, first adhesive layer, the second adhesive layer are esters of acrylic acid adhesive layer.
4th, in such scheme, the unsaturated polyester (UP) synthesized by maleic anhydride, phthalic anhydride and propane diols and Into.
Because above-mentioned technical proposal is used, the present invention has following advantages compared with prior art：
1st, high thermal conductivity wave absorbing patch of the present invention, it is inhaled ripple layer and uses composite wave-absorbing powder BaFe12O19100 parts, three oxidations two 20 ~ 35 parts of nickel, Nano graphite powder, naphthoic acid cobalt and butyl acrylate, 10 ~ 20 parts of acrylic acid, 20 ~ 35 parts of Isooctyl acrylate monomer, first 0.1 ~ 1 part of base methyl acrylate 10 ~ 30, vinyl acetate 1 ~ 3,2-hydroxyethyl methacry-late synergy, have stronger electricity Electro-magnetic wave absorption characteristic, reach 88% in the attenuation rate of 2 ~ 10GHz electromagnetic waves, further add 0.5 ~ 2 part of Sodium Polyacrylate, peroxide Change 0.4 ~ 1 part of MEK, it is gluing to not only improve polymer, also mixed powder is uniformly dispersed in the polymer, so as to ensure The reliability of electromagnetic performance；Secondly, further it is equipped with unsaturated polyester (UP) in formula, acrylic compounds levelling agent improves whole suction The heat conductivility of ripple layer, be advantageous to, by heat expanding caused by electromagnetic wave, improve the stability and product service life of performance.
2nd, high thermal conductivity wave absorbing patch of the present invention, it includes the graphite flake as reflecting layer, inhales ripple layer and separated type material Layer, the first adhesive layer is provided between the graphite flake, suction ripple layer；Second is provided between the suction ripple layer, separated type material layer Adhesive layer；Material thickness is very thin, and general thickness is less than 0.8mm；The setting in reflecting layer can form multiple absorption, significantly improve The absorbing property of material；The setting of insulating barrier improves the outward appearance of wave absorbing patch, and makes it while effective electromagnetic wave absorption Improve its proof voltage breakdown effect.
Embodiment
With reference to embodiment, the invention will be further described：
Embodiment：A kind of high thermal conductivity wave absorbing patch, including graphite flake, suction ripple layer and separated type material layer as reflecting layer, The first adhesive layer is provided between the graphite flake, suction ripple layer；It is gluing that second is provided between the suction ripple layer, separated type material layer Layer；
The component for inhaling ripple layer and content are as shown in table 1：
Table 1
The wave-absorbing powder as shown in Table 2 content groups packet into：
Table 2
The thickness of above-mentioned first adhesive layer 5 is less than the thickness of the second adhesive layer 6, and the thickness of second adhesive layer 7 is less than the 3rd Adhesive layer 7.
The thickness ratio of above-mentioned PET insulating barriers 1 and layer of polypropylene foil 10 is 10：4~6.
Above-mentioned unsaturated polyester (UP) is synthesized by maleic anhydride, phthalic anhydride and propane diols and formed.
Embodiment is as shown in table 3 in the maximum reflection coefficient and effective bandwidth of 2 ~ 18GHz frequency ranges：
Table 3
Inhale ripple layer and the electromagnetic wave that electronic product discharges is converted into heat energy or the energy of other forms in a manner of electrical loss, magnetic loss etc. Amount reduces the effect of electromagnetic radiation to reach, and has preferable absorption in the range of 2 ~ 18GHz, can be by the reflection of electromagnetic wave of incidence Resorption ripple layer forms multiple absorption.
The above-mentioned thickness of PET insulating barriers 1 is 6 microns；The thickness ratio of the PET insulating barriers 1 and layer of polypropylene foil 10 is 10： 5。
Above-described embodiment has the preparation technology that ripple layer is inhaled in the Protection glue band for inhaling wave energy, comprises the following steps：
The first step：By BaFe12O19, nickel sesquioxide, Nano graphite powder, naphthoic acid cobalt, unsaturated polyester (UP), acrylic compounds levelling agent It is well mixed, and stir to form mixed powder in 84 ~ 86 DEG C of conditions；
Second step：By butyl acrylate, acrylic acid, Isooctyl acrylate monomer, methyl methacrylate, vinyl acetate, metering system Acid -2- hydroxyl ethyl esters, Sodium Polyacrylate mix with the mixed powder of the first step, and disperse 1 ~ 2 hour through high speed agitator, so as to mixed Conjunction is formed uniformly mixture；
3rd step：It is incubated after the mixture of second step is heated into 80 ~ 85 DEG C in a kettle, divides 1 ~ 3 time in insulating process Add methyl ethyl ketone peroxide and obtain and inhale ripple mixed liquor, the soaking time is 4 ~ 10 hours；
4th step：The suction ripple mixed liquor that 3rd step obtains is coated on substrate；
5th step：Baking is carried out to the suction ripple mixed liquor in the 4th step and forms suction ripple layer.
During using above-mentioned high thermal conductivity wave absorbing patch, there is stronger electromaganic wave absorbing property, in 2 ~ 10GHz electromagnetic waves Attenuation rate reach 88%, further add 0.5 ~ 2 part of Sodium Polyacrylate, 0.4 ~ 1 part of methyl ethyl ketone peroxide, not only improve polymerization Thing is gluing, also mixed powder is uniformly dispersed in the polymer, so as to ensure that the reliability of electromagnetic performance；Secondly, formula In be further equipped with unsaturated polyester (UP), acrylic compounds levelling agent improves the whole heat conductivility for inhaling ripple layer, be advantageous to electromagnetism Heat expanding caused by ripple, improve the stability and product service life of performance.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention The equivalent change or modification that Spirit Essence is made, it should all be included within the scope of the present invention.

Claims (5)

  1. A kind of 1. high thermal conductivity wave absorbing patch, it is characterised in that：Including the graphite flake as reflecting layer, inhale ripple layer and release material The bed of material, the first adhesive layer is provided between the graphite flake, suction ripple layer；The is provided between the suction ripple layer, separated type material layer Two adhesive layers；
    The suction ripple layer is composed of the following components：
    100 parts of wave-absorbing powder,
    20 ~ 35 parts of butyl acrylate,
    10 ~ 20 parts of acrylic acid,
    20 ~ 35 parts of Isooctyl acrylate monomer,
    10 ~ 30 parts of methyl methacrylate,
    1 ~ 3 part of vinyl acetate,
    0.1 ~ 1 part of 2-hydroxyethyl methacry-late,
    0.5 ~ 2 part of Sodium Polyacrylate,
    0.4 ~ 1 part of methyl ethyl ketone peroxide；
    The wave-absorbing powder is composed of the following components：
    BaFe12O19100 parts,
    38 parts of nickel sesquioxide,
    12 parts of Nano graphite powder,
    19 parts of naphthoic acid cobalt,
    52 parts of unsaturated polyester (UP),
    40 parts of acrylic compounds levelling agent.
  2. 2. high thermal conductivity wave absorbing patch according to claim 1, it is characterised in that：BaFe in the wave-absorbing powder12O19、 Nickel sesquioxide, Nano graphite powder and naphthoic acid cobalt are according to 10：4：1：2 weight ratios mix.
  3. 3. high thermal conductivity wave absorbing patch according to claim 1, it is characterised in that：The separated type material layer is release liners Layer or release film layer.
  4. 4. high thermal conductivity wave absorbing patch according to claim 1, it is characterised in that：First adhesive layer, the second glue Adhesion coating is esters of acrylic acid adhesive layer.
  5. 5. high thermal conductivity wave absorbing patch according to claim 1, it is characterised in that：The unsaturated polyester (UP) is by maleic Dicarboxylic anhydride, phthalic anhydride and propane diols synthesis form.
CN201710724856.7A 2015-05-21 2015-05-21 Heat-conducting wave-absorbing patch Active CN107739581B (en)

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CN201710724856.7A CN107739581B (en) 2015-05-21 2015-05-21 Heat-conducting wave-absorbing patch
CN201510260692.8A CN104893605B (en) 2015-05-21 2015-05-21 Electromagnetic shielding suction wave plate

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CN107739581A true CN107739581A (en) 2018-02-27
CN107739581B CN107739581B (en) 2020-03-10

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Application Number Title Priority Date Filing Date
CN201710724199.6A Active CN108617153B (en) 2015-05-21 2015-05-21 Wave-absorbing patch for weakening electromagnetic radiation
CN201710724241.4A Active CN108084906B (en) 2015-05-21 2015-05-21 Electromagnetic wave-absorbing plate for electric appliance product
CN201710724858.6A Active CN108093612B (en) 2015-05-21 2015-05-21 Wave-absorbing material for electromagnetic shielding
CN201510260692.8A Active CN104893605B (en) 2015-05-21 2015-05-21 Electromagnetic shielding suction wave plate
CN201710724243.3A Active CN108084907B (en) 2015-05-21 2015-05-21 Wave-absorbing patch for attenuating electromagnetic radiation
CN201710724856.7A Active CN107739581B (en) 2015-05-21 2015-05-21 Heat-conducting wave-absorbing patch
CN201710724245.2A Active CN108084908B (en) 2015-05-21 2015-05-21 Wave absorbing plate
CN201710724316.9A Active CN107743357B (en) 2015-05-21 2015-05-21 Wave absorbing plate for electronic product
CN201710724811.XA Active CN107858115B (en) 2015-05-21 2015-05-21 Patch type wave absorbing material

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CN115746362A (en) * 2022-09-09 2023-03-07 东莞市零度导热材料有限公司 Wave-absorbing heat-conducting fin and preparation method thereof

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CN107858115B (en) 2020-04-21
CN108093612A (en) 2018-05-29
CN108084907A (en) 2018-05-29
CN108084906A (en) 2018-05-29
CN108084907B (en) 2020-03-10
CN107858115A (en) 2018-03-30
CN108084906B (en) 2020-04-21
CN107743357B (en) 2020-03-10
CN108084908B (en) 2020-03-10
CN104893605B (en) 2017-10-27
CN107743357A (en) 2018-02-27
CN108084908A (en) 2018-05-29
CN108617153B (en) 2020-03-10
CN108617153A (en) 2018-10-02
CN107739581B (en) 2020-03-10
CN108093612B (en) 2020-06-09
WO2016184115A1 (en) 2016-11-24
CN104893605A (en) 2015-09-09

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