CN108060400B - 一种用于磁控溅射镀膜的粉体分散装置 - Google Patents
一种用于磁控溅射镀膜的粉体分散装置 Download PDFInfo
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Abstract
本专利涉及一种用于磁控溅射镀膜的粉体分散装置,包括侧壁(1)、托盘(2)、弹珠夹层(3)、振动系统(4)、弹簧(5)和底座(6)。所述托盘(2)上表面呈微锯齿型,所述弹珠夹层(3)安装于托盘(2)和振动系统(4)之间。在进行磁控溅射镀膜时,该粉体分散装置通过托盘(2)上的密集微锯齿和弹珠夹层(3)中弹珠的跳动,使粉体分散并使之持续翻滚,防止团聚,实现均匀致密的膜层。
Description
技术领域:
本发明涉及一种粉体分散装置,尤其涉及一种用于磁控溅射镀膜的粉体分散装置。
背景技术:
磁控溅射是物理气相沉积(Physical Vapor Deposition,PVD)的一种。一般的溅射法可被用于制备金属、半导体、绝缘体等多种材料,且具有设备简单、易于控制、镀膜面积大和附着力强等优点,而上世纪70年代发展起来的磁控溅射法更是实现了高速、低温、低损伤。因为是在低气压下进行高速溅射,必须有效地提高气体的离化率。磁控溅射通过在靶阴极表面引入磁场,利用磁场对带电粒子的约束来提高等离子体密度以增加溅射率。由于磁控溅射中轰击基材的电子能量较低,故往往可以得到表面平整度更佳的镀膜。
利用磁控溅射技术进行精细粉体表面改性镀膜是一项很有前景的工作,相比于化学液相沉积粉体镀膜,磁控溅射粉体镀膜具有工序简单,对环境无污染的优点;相比于传统的气相沉积方法,如蒸发镀方法,磁控溅射粉体镀膜膜层更为平整致密,能够呈现更优秀的效果。
由于粉体材料具有比表面积大,表面能大的特点,且在磁控溅射镀膜中随着金属/金属氧化物膜层的包覆其表面能会增大,粉体具有很强烈的团聚倾向以降低体系的表面能,因此粉体磁控溅射镀膜中一个核心痛点是粉体的分散。本发明旨在实现磁控溅射粉体镀膜中粉体的有效分散,防止粉体团聚,使粉体在磁控溅射工况下能够持续地翻滚,获得均匀致密的膜层。
发明内容:
本发明涉及一种用于磁控溅射镀膜的粉体分散装置,在进行磁控溅射镀膜时可以有效的使粉体分散并且持续翻滚,防止团聚,实现均匀致密的膜层。该分散装置包括侧壁(1)、托盘(2)、弹珠夹层(3)、振动系统(4)、弹簧(5)和底座(6)。
所述侧壁(1)防止粉体从盘中溢出。所述托盘(2)为圆形或方形,上表面呈密集微锯齿型,微锯齿可以对团聚的粉体进行物理击碎从而达到分散的目的。微锯齿高0.5~1.5mm,密度为20~40个/cm3。所述侧壁(1)比托盘(2)高出10~15cm。
所述弹珠夹层(3)安装于托盘(2)和振动系统(4)之间。当分散装置工作时弹珠在夹层中上下跳动不断敲打托盘,这样可以更有效缓解粉体粘附在托盘上的现象,防止粉体团聚,使粉体持续翻滚,通过磁控溅射获得均匀致密的膜层。其中弹珠夹层高3~6cm,弹珠直径0.5~2cm,25~400个/dm3。
所述振动系统(4)由两部振动电机提供均匀的上下振动,两部振动电机相对托盘(2)呈中心对称排布。
所述弹簧(5)起到缓冲作用,保证由振动系统(4)产生的振动力均匀的传送到托盘(2)和弹珠夹层(3)。所述底座(6)固定在磁控溅射镀膜机的真空腔体中,起到稳定整个粉体分散装置的作用。
磁控溅射镀膜靶材处于托盘(2)正上方20~30cm处。
本装置使用步骤如下:
①将用于磁控溅射镀膜的粉体加入托盘(2)中;
②开启振动系统(4),调节托盘(2)保持水平,振动系统(4)带动托盘(2)振动,弹珠夹层(3)中弹珠跳动,不断敲打托盘;
③设置工艺参数,进行粉体磁控溅射镀膜;
④关闭磁控溅射及振动电机电源。
在进行磁控溅射镀膜时,该粉体分散装置通过托盘(2)上表面的密集微锯齿和弹珠夹层(3)中弹珠的跳动,对粉体进行分散并使之持续翻滚,防止粉体团聚,实现粉体的均匀镀膜。
附图说明
图1为粉体分散装置图。
1.侧壁;2.振动盘;3.弹珠夹层;4.振动系统;5.弹簧;6.底座。
具体实施方式
实施例1:
托盘微锯齿高1mm,密度为30个/cm3,侧壁比托盘高出10cm。取500g石英砂置于圆形托盘中,开启振动电机,调节托盘保持水平,振动电机带动托盘振动,5cm高的弹珠夹层中弹珠跳动,不断敲打托盘。弹珠直径为1cm和2cm,100个/dm3。采用直流磁控溅射工艺溅射铝靶,本底压力6.7×10-3Pa,通入50Psi99.99%纯度氩气,5Psi99.99%纯度氧气,镀膜压力2.1×10-1Pa,溅射电流5A,镀膜时间10s。关闭磁控溅射及振动电机电源,得到镀铝石英砂。
对比例1
托盘微锯齿高1mm,密度为30个/cm3,侧壁比托盘高出10cm。取500g石英砂置于普通托盘中,采用直流磁控溅射工艺溅射铝靶,本底压力6.7×10-3Pa,通入50Psi99.99%纯度氩气,5Psi99.99%纯度氧气,镀膜压力2.1×10-1Pa,溅射电流5A,镀膜时间10s。关闭磁控溅射及振动电机电源,得到镀铝石英砂。
比较对比例1和实施例1的镀膜效果。对比例1的托盘中发生大量粉体团聚,石英砂表面的镀铝膜层不均匀,有部分石英砂表面只有部分镀铝膜层。在托盘的微锯齿及弹珠的作用下,实施例1的托盘中粉体分布均匀,石英砂表面镀铝膜层均匀紧密。
实施例2:
托盘微锯齿高1.5mm,密度为20个/cm3,侧壁比托盘高出15cm。取300g的方解石置于圆形托盘中,开启振动电机,调节托盘保持水平,振动电机带动托盘振动,6cm高的弹珠夹层中弹珠跳动,不断敲打托盘。弹珠直径为1.5cm和2cm,200个/dm3。采用直流磁控溅射工艺溅射铜靶,本底压力6.7×10-3Pa,通入50Psi99.99%纯度氩气,5Psi99.99%纯度氧气,镀膜压力2.1×10-1Pa,溅射电流5A,镀膜时间10s。关闭磁控溅射及振动电机电源,得到镀铜方解石。实施例3:
托盘微锯齿高0.5mm,密度为40个/cm3,侧壁比托盘高出10cm。取200g的三氧化二铝置于方形托盘中,开启振动电机,调节托盘保持水平,振动电机带动托盘振动,3cm高的弹珠夹层中弹珠跳动,不断敲打托盘。弹珠直径为0.5cm和1.5cm,150个/dm3。采用直流磁控溅射工艺溅射钛靶,本底压力6.7×10-3Pa,通入50Psi99.99%纯度氩气,5Psi99.99%纯度氧气,镀膜压力2.1×10-1Pa,溅射电流5A,镀膜时间10s。关闭磁控溅射及振动电机电源,得到镀钛三氧化二铝。
Claims (8)
1.一种用于磁控溅射镀膜的粉体分散装置,包括侧壁(1)、托盘(2)、弹珠夹层(3)、振动系统(4)、弹簧(5)和底座(6),其特征在于所述托盘(2)上表面呈微锯齿型,所述弹珠夹层(3)安装于托盘(2)和振动系统(4)之间。
2.根据权利要求1所述的一种用于磁控溅射镀膜的粉体分散装置,所述侧壁(1)比托盘(2)高出10~15cm。
3.根据权利要求1所述的一种用于磁控溅射镀膜的粉体分散装置,所述托盘(2)为方形或圆形。
4.根据权利要求1所述的一种用于磁控溅射镀膜的粉体分散装置,所述托盘(2)上表面的微锯齿高0.5~1.5mm,分布密度20~40个/cm3。
5.根据权利要求1所述的一种用于磁控溅射镀膜的粉体分散装置,所述弹珠夹层(3)高3~6cm。
6.根据权利要求1所述的一种用于磁控溅射镀膜的粉体分散装置,所述弹珠夹层(3)的弹珠直径0.5~2cm,分布密度25~400个/dm3。
7.根据权利要求1所述的一种用于磁控溅射镀膜的粉体分散装置,所述振动系统(4)含有两部振动电机。
8.根据权利要求7所述的一种用于磁控溅射镀膜的粉体分散装置,所述两部振动电机相对托盘(2)呈中心对称排布。
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